Datasheet
LDO Regulators with Voltage Detector
500 mA Output LDO Regulator
with Voltage Detector
BD42754FP2-C BD42754FPJ-C
General Description
Key Specifications
BD42754FP2-C, BD42754FPJ-C are voltage regulators
featuring 45 V absolute maximum voltage with 1ch
Reset and offers the output current of 500 mA while
limiting the low quiescent current.
These regulators are therefore ideal for applications
requiring a direct connection to the battery and a low
current consumption. A reset signal is generated for an
output voltage VO of Typ 4.62 V.
The reset delay time can be programmed by the external
capacitor.
AEC-Q100 qualified(Note 1)
Qualified for Automotive Applications
Input Voltage Range:
-0.3V to +45V
Low Quiescent Current:
75 μA (Typ)
Output Load Current:
500 mA (Max)
Output Voltage:
5.0 V ±2 %
Reset Detect Voltage Accuracy: 4.50 V to 4.75 V
(Typ 4.62 V)
Over Current Protection (OCP)
Thermal Shut Down (TSD)
(Note 1:Grade1)
Features
Package
Low ESR Ceramic Capacitors Applicable for Output.
Low Drop Voltage: PDMOS Output Transistor
Power On and Under-Voltage Reset
Programmable Reset Time by External Capacitor.
FP2: TO263-5
W (Typ) × D (Typ) × H (Max)
10.16 mm × 15.10 mm × 4.70 mm
FPJ: TO252-J5
6.60 mm × 10.10 mm × 2.38 mm
Applications
Onboard vehicle device
(Engine ECU, Body-Control, Car Stereos, Satellite
Navigation system, etc.)
Figure 1. Package image
Typical Application Circuit
VCC and VO pin capacitors: 0.1 μF ≤ CIN (Typ), 6 μF ≤ CO (Min)
Please refer to the "Selection of Components Externally Connected" for the selection of VCC and VO capacitors.
VIN
VCC
VO
CIN
5V Output
CO
RO
CT
GND
RO
Reset Output
CCT
Figure 2. Application Circuit
○Product structure:Silicon monolithic integrated circuit
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Datasheet
BD42754FPJ-C
Pin Configurations
TO263-5
(TOP VIEW)
FIN
1 2
3 4
TO252-J5
(TOP VIEW)
FIN
5
1 2 3 4
5
Figure 3. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
1
VCC
2
RO
3
GND
Function
Supply Voltage Input
Reset Output; Open-Collector output.
Ground; Pin3 internally connected to FIN.
4
CT
Reset Delay; connect capacitor to GND for setting delay time.
5
VO
5V Output;
FIN
FIN
FIN; FIN internally connected to Pin3.
Block Diagram
Figure 4. Block Diagram
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Datasheet
BD42754FPJ-C
Block Descriptions
Block Name
Function
Reference
Reference Voltage
Error Amplifier
Error Amplifier
TSD
Thermal Shutdown
OCP
Over Current Protection
The OCP protects the device from damage caused by over
current.
UVLO
Under Voltage Lock Out
The UVLO prevents malfunction of the reset block in case of
very low output voltage which is supply voltage of the reset.
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Description of Blocks
The Reference generates the Reference Voltage.
The Error Amplifier amplifies the difference between the feed
back voltage of the output voltage and the reference voltage.
The TSD protects the device from overheating.
If the chip temperature (Tj) reaches ca. 175 °C (Typ),
the output is turned off.
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Datasheet
BD42754FPJ-C
Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
VCC Voltage
VCC
-0.3 to +45.0
V
RO Voltage
VRO
-0.3 to +18.0
V
VO Voltage
VO
-0.3 to +7.0
V
Junction Temperature Range
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
(Caution)
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction
of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). Therefore, if any
special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such
as adding fuses, should be considered.
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Supply Voltage
(IO ≤ 300mA)
VCC
5.5
45.0
V
Supply Voltage
(IO ≤ 500mA)
VCC
5.9
45.0
V
VCC
3.0
-
V
Output Current
IO
0
500
mA
Operating Ratings Temperature
Ta
-40
125
°C
Start-Up
Voltage(Note 1)
(Note 1) When IO=0mA.
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Datasheet
BD42754FPJ-C
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
80.7
20.3
°C/W
ΨJT
8
2
°C/W
θJA
136
23
°C/W
ΨJT
17
3
°C/W
TO263-5
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
TO252-J5
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Thermal Via(Note 5)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Pitch
1.20mm
Diameter
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.
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Datasheet
BD42754FPJ-C
Electrical Characteristics (LDO)
( Unless Otherwise Specified, Tj = -40 °C to +150 °C, VCC = 13.5 V, IO = 0 mA, Typ is the value when Tj = 25 °C )
Parameter
Symbol
Limits
Min
Typ
Max
Unit
Conditions
Circuit Current
ICC
-
75
150
μA
Output Voltage 1
VO
4.90
5.00
5.10
V
Output Voltage 2
VO
4.90
5.00
5.10
V
Dropout Voltage
∆Vd
-
0.25
0.5
V
Load Regulation
Reg.L
-
10
30
mV
IO = 10 mA to 250 mA
Line Regulation
Reg.I
-15
-
15
mV
VCC = 8 V to 16 V, IO = 5 mA
Current Limit
IOCP
500
-
-
mA
Ripple Rejection
R.R.
-
60
-
dB
Thermal Shutdown Temperature
TTSD
-
175
-
°C
IO = 0 mA
5 mA ≤ IO ≤ 400 mA
6 V ≤ VCC ≤ 28 V
5 mA ≤ IO ≤ 200 mA
6 V ≤ VCC ≤ 40 V
VCC = 4.75 V, IO = 300 mA
f = 120 Hz, ein = 1 Vrms,
IO = 100 mA
Electrical Characteristics (RESET)
( Unless Otherwise Specified, Tj = -40 °C to +150 °C, VCC = 13.5 V, IO = 0 mA, Typ is the value when Tj = 25 °C )
Parameter
Symbol
Limits
Min
Typ
Max
Unit
Conditions
Reset Detection Threshold
VRT
4.50
4.62
4.75
V
Reset Detection Hysteresis
VRHY
20
60
100
mV
CT Upper-side Threshold
VCTH
-
1.18
-
V
CT Lower-side Threshold
VCTL
-
0.25
-
V
CT Charge Current
ICT
-
8.8
-
μA
VCT = 0.5 V
Delay Time L→H
tPOR
10
14
18
ms
CCT = 0.1 μF(Note 1)
RO L Voltage
VROL
-
-
0.4
V
RO pull-up resister ≥ 4.7 kΩ
VO ≥ 1V
(Note 1) TPOR can be varied by changing the CT capacitance value(TPOR_ADJ). ( 0.001µF to 10 µF available )
CT capacitor : 0.1µF ≤ CCT ≤ 10 μF
TPOR_ADJ (ms) ≈ TPOR ( the reset delay time at CCT = 0.1 µF ) × CCT (μF) / 0.1
example: When CCT= 1µF, 100ms ≤ TPOR ≤ 180 ms
CT capacitor : 0.001µF ≤ CCT < 0.1 μF
TPOR_ADJ (ms) ≈ TPOR ( the reset delay time at CCT = 0.1 µF ) × CCT (μF) / 0.1 ±0.1
example: When CCT= 0.01µF, 0.9ms ≤ TPOR ≤ 1.9 ms
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Datasheet
BD42754FPJ-C
6
6
5
5
Output Voltage : VO [V]
Output Voltage : VO [V]
Typical Performance Curve (Unless Otherwise Specified, Tj = 25 °C, VCC = 13.5 V)
4
3
2
4
3
2
Tj = -40℃
1
1
0
0
Tj = 25℃
Tj = 125℃
0
10
20
30
40
0
2
4
6
8
10
Supply Voltage : VCC [V]
Supply Voltage : VCC [V]
Figure 5. Output Voltage vs Supply Voltage
(RL = 25 Ω)
Figure 6. Output Voltage vs Supply Voltage
(at Low Supply Voltage, RL = 25 Ω)
5.2
1200
Tj = -40 °C
Tj = 25 °C
1000
Circuit Current :ICC [μA]
Output Voltage : VO [V]
5.1
5.0
4.9
4.8
Tj = 125 °C
800
600
400
4.7
200
4.6
0
-40
0
40
80
0
120
10
20
30
40
Supply Voltage : VCC [V]
Junction Temperature : Tj [℃]
Figure 7. Output Voltage vs Temperature
(RL = 1 kΩ)
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RL=No load
Figure 8. Circuit Current vs Supply Voltage
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Datasheet
BD42754FPJ-C
Typical Performance Curve - continued
120
120
Circuit Current :ICC [μA]
150
Circuit Current :ICC [μA]
150
90
60
30
90
60
30
0
0
0
100
200
300
400
500
-40
0
80
120
Junction Temperature : Tj [℃]
Output Current : IO [mA]
Figure 9. Circuit Current vs Output Current
Figure 10. Circuit Current vs Temperature
1000
6
5
800
Tj = -40 °C
4
Output Current : IO [mA]
Output Voltage: VO [V]
40
Tj = 25 °C
Tj = 125 °C
3
2
600
400
200
1
0
0
0.00
0.20
0.40
0.60
0.80
1.00
-40
1.20
40
80
120
Junction Temperature : Tj [℃]
Output Current : IO [mA]
Figure 11. Output Voltage vs Output Current
(Over Current Protection)
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Figure 12. Output Current vs Temperature
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Datasheet
BD42754FPJ-C
Typical Performance Curve - continued
600
90
Tj = -40℃
70
Tj = 125℃
Ripple Rejection: R.R. [dB]
Dropout
Voltage
∆Vd[mV]
[mV]
Drop Voltage
: △: Vd
80
Tj = 25℃
500
400
300
200
100
60
50
40
30
Tj = -40 °C
20
Tj = 25 °C
10
0
0
100
200
300
400
Tj = 125 °C
0
500
0.01
0.10
Output Current : IO [mA]
1.00
10.00
100.00
Frequency : f [kHz]
Figure 13. Dropout Voltage vs Output Current
(VCC = 4.75 V)
Figure 14. Ripple Rejection
(ein=1Vrms, IOUT=100mA)
6
6
Tj = -40℃
5
5
Tj = 25℃
RO Voltage : VRO [V]
Output Voltage:VO [V]
Tj = 125℃
4
3
2
4
3
2
1
1
0
0
100
125
150
175
0
200
2
3
4
5
6
VO voltage
Voltage :: VVOO[V]
[V]
Junction Temperature : Tj [℃]
Figure 15. Output Voltage vs Temperature
(Thermal Shutdown)
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Figure 16. RO Voltage vs VO Voltage
(RO: 10 kΩ pull-up to VO)
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Datasheet
BD42754FPJ-C
Typical Performance Curve - continued
Reset
Detection Threshold : V [V]
Output Detecting Voltage : VRTRT[V]
4.8
18
PowerOn
OnReset
Reset Time
Time :: TtPOR [ms]
Power
POR [ms]
4.7
4.6
4.5
4.4
4.3
16
14
12
10
-40
0
40
80
120
-40
0
40
80
120
Junction Temperature : Tj [℃]
Junction Temperature : Tj [℃]
Figure 17. Reset Detection Threshold vs Temperature
(RO: 10 kΩ pull-up to VO)
Figure 18. Power on Reset Time vs Temperature
(CCT = 0.1 µF)
10000
Power On Reset Time : tPOR [ms]
Power On Reset Time : TPOR [ms]
1000
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
CT Capacitance : CCT [μF]
Figure 19. Power on Reset Time vs CT Capacitance
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Measurement Circuit for Typical Performance Curve
VO
VCC
VO
VCC
VCC
VO
A
A
CT
RO
GND
RL
0.1 µF
4.7 µF
CT
V
10 µF
4.7 µF
Measurement Circuit for
Figure. 5, 6, 7, 8, 10, 15
RO
GND
A
0.1 µF
A
CT
RO
GND
10µF
4.7 µF
Measurement Circuit for
Figure.9
0.1 µF
10 µF
Measurement Circuit for
Figure.11, 12
V
VCC
VO
VCC
VO
CT
RO
VCC
VO
CT
RO
A
CT
RO
10kΩ
RL
1Vrms
GND
GND
GND
M
V
4.7µF
0.1 µF
10 µF
4.7µF
Measurement Circuit for
Figure.13
VCC
VO
CT
RO
0.1µF
4.7µF
10 µF
0.1 µF
Measurement Circuit for
Figure.16, 17
Measurement Circuit for
Figure.14
10kΩ
GND
Monitor
Monitor
CCT
Measurement Circuit for
Figure.18, 19
Figure 20. Measurement Circuit for Typical Performance Curves
Timing Chart
VCC
VO
VCT
VRO
Figure 21. Timing Chart
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(1)
(2)
VREC = VRT + VRHY
VRU = 2V to 3.5 V
TSZ02201-0GAG0AN00650-1-2
07.Mar.2017 Rev.002
BD42754FP2-C
Datasheet
BD42754FPJ-C
Power Dissipation
■TO263-5
10.0
IC mounted on ROHM standard board based on JEDEC.
①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
②6.16 W
6.0
4.0
①1.55 W
2.0
0.0
0
25
50
75
100
125
Ambient Temperature: Ta [°C]
②: 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.
150 Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.
Condition①: θJA = 80.7 °C/W, ΨJT (top center) = 8 °C/W
Condition②: θJA = 20.3 °C/W, ΨJT (top center) = 2 °C/W
Figure 22. TO263-5 Package Data
■TO252-J5
10.0
IC mounted on ROHM standard board based on JEDEC.
①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
6.0
②5.43 W
4.0
2.0
①0.92 W
0.0
0
25
50
75
100
125
Ambient Temperature: Ta [°C]
②: 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.
150 Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.
Condition①: θJA = 136 °C/W, ΨJT (top center) =17 °C/W
Condition②: θJA = 23 °C/W, ΨJT (top center) = 3 °C/W
Figure 23. TO252-J5 Package Data
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Thermal Design
This product exposes a frame on the back side of the package for thermal efficiency improvement.
Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current.
Refer to power dissipation curves illustrated in Figure 22, 23 when using the IC in an environment of Ta ≥ 25 °C. Even if the
ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be
very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is
based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient
margins in the thermal design by the following method is used to calculate the junction temperature Tj.
Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj from ambient temperature Ta.
Tj = Ta + PC × θJA
Tj
: Junction Temperature
Ta
: Ambient Temperature
: Power Consumption
PC
θJA
: Thermal Impedance
(Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj from Top Center of Case’s (mold)
Temperature TT.
Tj = TT + PC × ΨJT
Tj
: Junction Temperature
TT
: Top Center of Case’s (mold) Temperature
PC
: Power consumption
: Thermal Impedance
ΨJT
(Junction to Top Center of Case)
The following method is used to calculate the power consumption Pc (W).
Pc = (VCC - VO) × IO + VCC × Icc
PC
: Power Consumption
: Input Voltage
VCC
VO
: Output Voltage
: Load Current
IO
Icc
: Circuit Current
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BD42754FP2-C
Datasheet
BD42754FPJ-C
・Calculation Example (TO263-5)
If VCC = 13.5 V, VO = 5.0 V, IO = 200 mA, Icc = 75 μA, the power consumption Pc can be calculated as follows:
PC = (VCC - VO) × IO + VCC × Icc
= (13.5 V - 5.0 V) × 200 mA + 13.5 V × 75 μA
= 1.7 W
At the ambient temperature Tamax = 85°C, the thermal impedance (Junction to Ambient)θJA = 20.3 °C / W(4-layer PCB),
Tj = Tamax + PC × θJA
= 85 °C + 1.7 W × 20.3 °C / W
= 119.5 °C
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 8 °C / W( 1-layer PCB ),
Tj = TT + PC × ΨJT
= 100 °C + 1.7 W × 8 °C / W
= 113.6 °C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
・Calculation Example (TO252-J5)
If VCC = 13.5 V, VO = 5.0 V, IO = 200 mA, Icc = 75 μA, the power consumption Pc can be calculated as follows:
PC = (VCC - VO) × IO + VCC × Icc
= (13.5 V - 5.0 V) × 200 mA + 13.5 V × 75 μA
= 1.7 W
At the ambient temperature Tamax = 85°C, the thermal impedance (Junction to Ambient)θJA = 23 °C / W(4-layer PCB),
Tj = Tamax + PC × θJA
= 85 °C + 1.7 W × 23 °C / W
= 124.1°C
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 17 °C / W(1-layer PCB),
Tj = TT + PC × ΨJT
= 100 °C + 1.7 W × 17°C / W
= 128.9 °C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pads.
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Selection of Components Externally Connected
・VCC Pin Capacitor
Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and GND pin. We recommend using
ceramic capacitor generally featuring good high frequency characteristic. When selecting a ceramic capacitor,
please consider about temperature and DC - biasing characteristics. And please place capacitors near VCC – GND
pin as close as possible. When input impedance is high, e.g. in case there is distance from battery, line voltage drop
needs to be prevented by large capacitor. Select the capacitance according to the line impedance between the
power smoothing circuit and the VCC pin. Selection of the capacitance also depends on the applications. Verify the
application and allow sufficient margins in the design. We recommend using a capacitor with excellent voltage and
temperature characteristics.
・Output Pin Capacitor
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend
using a ceramic capacitor with a capacitance of 6 μF or higher. In selecting the capacitor, ensure that the
capacitance of 6 μF or higher is maintained at the intended applied voltage and temperature range. Due to changes
in temperature the capacitor's capacitance can fluctuate possibly resulting in oscillation.
In actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and
load impedance. Therefore sufficient verification of the final operating environment is needed. When selecting a
ceramic capacitor, we recommend using X7R or better components with excellent temperature and DC - biasing
characteristics and high voltage tolerance.
In case of the transient input voltage and the load current fluctuation, output voltage may fluctuate. In case this
fluctuation can be problematic for the application, connect low ESR capacitor (capacitance > 6 μF, ESR < 1 Ω) in
paralleled to large capacitor with a capacitance of 13 μF or higher and ESR of 5 Ω or lower. Electrolytic and tantalum
and conductive polymer capacitors can be used as large capacitor. When selecting an electrolytic capacitor, please
consider about increasing ESR and decreasing capacitance at cold temperature.
We recommend placing the capacitor near output pin as close as possible.
I/O Equivalence Circuits
1 VCC
2 RO
VCC
100 Ω (Typ)
IC
4 CT
5 VO
20 kΩ (Typ)
1500 kΩ
(Typ)
6 Ω (Typ)
500 kΩ
(Typ)
Figure 24. I / O equivalence circuits
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Application Examples
・Applying positive surge to the VCC
If the possibility exists that surges higher than 45 V will be applied to the VCC, a Zener Diode should be placed between
the VCC and GND as shown in the figure below.
VCC
VO
GND
Figure 25. Application Example 1
・Applying negative surge to the VCC
If the possibility exists that negative surges lower than the GND are applied to the VCC, a Shottky Diode should be place
between the VCC and GND as shown in the figure below.
Figure 26. Application Example 2
・Implementing a Protection Diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and shutdown, a protection diode should be placed as shown in the figure below.
Figure 27. Application Example 3
・Reverse Polarity Diode
In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, while the external capacitor is charged, the A point shorts to the GND. Use a
capacitor with a capacitance with 1000 μF or less. We also recommend using reverse polarity diodes in series or a
bypass between VO pins and the VCC.
Reverse Polarity Diode
Bypass Diode
A
Figure 28. Application Example 4
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. Power dissipation is the value when the IC is mounted on a 114.3mm x
76.2mm x 1.57mm/1.6mm glass epoxy board. And in case this exceeds, take the measures like enlarge the size of
board; make copper foil area for heat dissipation big; and do not exceed the power dissipation.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Operational Notes – Continued
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
11. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Ordering Information
B
D
4
2
7
Part Number
5
4
x
x
Package
FP2: TO263-5
FPJ: TO252-J5
x
-
C
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
TO263-5 (TOP VIEW)
Part Number Marking
B D 4 2 7 5 4
LOT Number
1Pin
TO252-J5 (TOP VIEW)
Part Number Marking
B D 4 2 7 5 4
LOT Number
1Pin
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BD42754FP2-C
Datasheet
BD42754FPJ-C
Physical Dimension Tape and Reel Information
Package Name
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TSZ22111 • 15 • 001
TO263-5
20/22
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07.Mar.2017 Rev.002
BD42754FP2-C
Datasheet
BD42754FPJ-C
Package Name
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.© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TO252-J5
21/22
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07.Mar.2017 Rev.002
BD42754FP2-C
Datasheet
BD42754FPJ-C
Revision History
Date
Revision
Changes
19.Dec.2016
001
New Release
07.Mar.2017
002
TO252-J5 PKG was added
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD42754FP2-C - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD42754FP2-C
TO263-5F
500
500
Taping
inquiry
Yes