BD48HW0G-CTR

Nano EnergyTM Datasheet Voltage Detector (Reset) IC Series for Automotive Application High Voltage Dual Output ADJ Type Window Voltage Detector (Reset) IC BD48HW0G-C General Description Key Specifications ROHM's window voltage detector ICs are highly accurate, with low current consumption feature that uses CMOS process. It has dual N-channel open drain output. Detection voltage can be control by external resistors. ◼ Over Voltage Detection: ◼ Under Voltage Detection: ◼ Ultra-Low Current Consumption: Special Characteristics Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ 1.277 V (Typ) 1.277 V (Typ) 500 nA (Typ) ◼ Detection Voltage Accuracy: Nano Energy™ AEC-Q100 Qualified(Note 1) Functional Safety Supportive Automotive Products Under and Over Voltage Monitor Free Detection Voltage Setting by External Resistors Nch Open Drain Output Very Small, Lightweight and Thin Package SSOP6 Package is Similar to SOT-23-6 (JEDEC) ±0.75 % Package W (Typ) x D (Typ) x H (Max) 2.9 mm x 2.8 mm x 1.25 mm SSOP6: (Note 1) Grade 1 Application All Automotive Devices That Requires Voltage Detection Typical Application Circuit VDD2 VSENSE VDD1 RL R1 VDD UVIN UVB R2 CI OVIN CI GND OVB RST Microcontroller R3 GND Nano Energy™ is a trademark or a registered trademark of ROHM Co., Ltd. 〇Product structure : Silicon integrated circuit www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Pin Configuration SSOP6 TOP VIEW OVB 6 VDD 5 1 2 UVB GND OVIN 4 3 UVIN Pin Description Pin No. 1 2 3 4 5 6 Pin Name UVB GND UVIN OVIN VDD OVB Function Under voltage detection output pin GND Under voltage input Over voltage input Power supply voltage Over voltage detection output pin Block Diagram VDD (Note) UVB UVIN (Note) Vref OVB (Note) (Note) OVIN (Note) GND (Note) Parasitic Diode www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol VDD VUVIN VOVIN VUVB VOVB Power Supply Voltage UVIN Pin Voltage OVIN Pin Voltage UVB Pin Voltage OVB Pin Voltage UVB Pin Output Current OVB Pin Output Current Limit -0.3 to +42 -0.3 to +7 -0.3 to +7 (GND - 0.3) to +42 (GND - 0.3) to +42 40 40 +125 -55 to +125 IOUVB IOOVB Tjmax Tstg Maximum Junction Temperature Storage Temperature Range Unit V mA °C °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) θJA 376.5 185.4 °C/W ΨJT 40 30 °C/W SSOP6 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Operating Supply Voltage UVIN Pin Voltage OVIN Pin Voltage Operating Temperature Pull Up Resistance www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Symbol VDD VUVIN VOVIN Topr RL 3/20 Min 1.8 0 0 -40 10 Typ 12.0 +25 100 Max 40.0 6.0 6.0 +125 1,000 Unit V V V °C kΩ TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Function Explanation 1. Nano Energy™ Nano Energy™ is a combination of technologies which realizes ultra low quiescent current operation. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Electrical Characteristics (Unless otherwise specified Ta = -40 °C to +125 °C, VDD = 1.8 V to 40 V) Parameter Under Voltage Detection Voltage Over Voltage Detection Voltage Hysteresis Voltage Circuit Current UVIN input current OVIN input current UVB Operating Voltage Range (Note 1) OVB Operating Voltage Range (Note 1) UVB “Low” Output Voltage OVB “Low” Output Voltage UVB L→H Propagation Delay Time OVB L→H Propagation Delay Time UVB H→L Propagation Delay Time OVB H→L Propagation Delay Time Symbol Condition Min Limit Typ Max Unit VIT- VUVIN = H→L 1.2674 1.277 1.2866 V VIT+ VOVIN = L→H 1.2674 1.277 1.2866 V VHYS IDD IUVIN IOVIN VUVIN = 6 V VOVIN = 6 V - 1.0 - - 500 1 1 2,000 - % nA nA nA VOPLUVB VOLUVB ≤ 0.4 V, RL = 100 kΩ 1.8 - - V VOPLOVB VOLOVB ≤ 0.4 V, RL = 100 kΩ 1.8 - - V VOLUVB VOLOVB VUVIN < VIT-, VDD = 1.8 V, ISINK = 2.0 mA VOVIN > VIT+, VDD = 1.8 V, ISINK = 2.0 mA - - 0.4 0.4 V V tPLHUVB VUVB = GND→0.9 x VDD, VDD = 12 V - 17 40 μs tPLHOVB VOVB = GND→0.9 x VDD, VDD = 12 V - 17 40 μs tPHLUVB VUVB = VDD→0.1 x VDD, VDD = 12 V - 12 35 μs tPHLOVB VOVB = VDD→0.1 x VDD, VDD = 12 V - 12 35 μs RL: Pull-up resistor connected between UVB, OVB and power supply. (Note 1) When VDD is less than VOPLUVB, VOPLOVB, outputs are unstable. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Typical Performance Curves Figure 1. Circuit Current vs Operating Supply Voltage Figure 2. Circuit Current vs Temperature Figure 3. Detection Voltage vs Operating Supply Voltage (Ta = 25 °C) Figure 4. Detection Voltage vs Temperature (VDD = 12 V) (Note) The above data are measurement value of typical sample; it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Typical Performance Curves – continued Figure 5. Hysteresis Voltage vs Operating Supply Voltage (Ta = 25 °C) Figure 6. Hysteresis Voltage vs Temperature (VDD = 12 V) Figure 7. Operating Voltage vs Temperature Figure 8. “Low” Output Current vs Drain-Source Voltage (VDD = 1.8 V, Ta = 25 °C) (Note) The above data are measurement value of typical sample; it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Typical Performance Curves – continued Figure 9. “Low” Output Current vs Temperature (VDD = 1.8 V, VDS = 0.1 V) Figure 10. L→H Propagation Delay Time vs Operating Supply Voltage (Ta = 25 °C) Figure 11. L→H Propagation Delay Time vs Temperature (VDD = 12 V) Figure 12. H→L Propagation Delay Time vs Operating Supply Voltage (Ta = 25 °C) (Note) The above data are measurement value of typical sample; it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Typical Performance Curves – continued Figure 13. H→L Propagation Delay Time vs Temperature (VDD = 12 V) (Note) The above data are measurement value of typical sample; it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Timing Chart The following shows the change of the output voltages when operating supply voltage (VDD) and SENSE pin Voltage (VSENSE) sweep. VDD VSENSE VDD RL R1 CVDD UVB UVIN CI R2 Vref OVB OVIN CI RL R3 CL GND CL Figure 14. Set-up diagram VDD VOPL: Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 20. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Functional Safety “ISO 26262 Process Compliant to Support ASIL-*” A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in the datasheet. “Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)” A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet. “Functional Safety Supportive Automotive Products” A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety. Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Ordering Information B D 4 8 H W 0 G - Package G: SSOP6 C T R Product Rank C: for Automotive Packaging and forming specification TR: Embossed tape and reel Marking Diagram Part Number Marking G E SSOP6 (TOP VIEW) LOT Number Pin 1 Mark www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Physical Dimension and Packing Information Package Name www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP6 19/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 BD48HW0G-C Revision History Date Revision 14.Feb.2022 001 New Release 13.Jul.2022 002 Clerical corrections 03.Feb.2023 003 P-5 Change detection voltage symbol www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Changes 20/20 TSZ02201-0GAG2G600120-1-2 03.Feb.2023 Rev.003 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. 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However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. 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Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001