Standard LDO Regulators
Standard Fixed Output
LDO Regulators with Shutdown Switch
No.11022EBT01
BD33C0AWFP, BD50C0AWFP
●Description
The BDXXC0AWFP Series is low-saturation regulator.
This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal damage due to overloading.
●Features
1) Output Current: 1A
2) Output Voltage: 3.3V／5.0V
2) High Output Voltage Precision : ±1%
3) Low saturation with PDMOS output
4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits
5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading
6) Low ESR Capacitor
7) TO252-5 packaging
●Applications
Audiovisual equipments, FPDs, televisions, personal computers or any other consumer device
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Vcc
-0.3 ~ +35.0
V
VCTL
-0.3 ~ +35.0
V
Pd
1.3
W
Operating Temperature Range
Topr
-40 ~ +105
℃
Storage Temperature Range
Tstg
-55 ~ +150
℃
Tjmax
+150
℃
Supply Voltage
*1
Output Control Voltage
Power Dissipation (TO252-5)
Maximum Junction Temperature
*2
*1 Not to exceed Pd.
*2 TO252-5:Reduced by 10.4mW / ℃ over Ta = 25℃, when mounted on glass epoxy board: 70mm×70mm×1.6mm.
NOTE : This product is not designed for protection against radioactive rays.
●Operating conditions (Ta=25℃)
Parameter
Symbol
Min.
Max.
Unit
Supply Voltage
Vcc
Vo+1V
26.5
V
Output Control Voltage
VCTL
0
26.5
V
Io
0
1.0
A
Output Current
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1/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Electrical characteristics
■BD33C0AWFP(Unless otherwise specified, Ta=25℃, Vcc=8.3V,VCTL=5V,Io=0mA)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Shut Down Current
Isd
－
0
10
µA
Bias Current
Ib
－
0.5
1.0
mA
Output Voltage
Vo
3.267
3.300
3.333
V
Io=200mA
Dropout Voltage
ΔVd
－
0.4
0.7
V
Vcc=Vo×0.95, Io=500mA
Ripple Rejection
R.R.
45
55
－
dB
*1
f=120Hz,ein =1Vrms,
Io=100mA
Line Regulation
Reg.I
－
20
60
mV
Vo+1V→25V
Load Regulation
Reg.L
－
V
Io=5mA→1A
Tcvo.1
－
+0.04
－
%/℃
Io=5mA,Tj=-40～-20℃
Tcvo.2
－
±0.005
－
%/℃
Io=5mA,Tj=-20～+105℃
CTL ON Mode Voltage
VthH
2.0
－
－
V
ACTIVE MODE
CTL OFF Mode Voltage
VthL
－
－
0.8
V
OFF MODE
CTL Bias Current
ICTL
－
25
50
µA
Temperature Coefficient of
Output Voltage
*1
Vo×0.010 Vo×0.020
Conditions
VCTL=0V
ein : Input Voltage Ripple
■BD50C0AWFP(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=0mA)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Shut Down Current
Isd
－
0
10
µA
Bias Current
Ib
－
0.5
1.0
mA
Output Voltage
Vo
4.950
5.000
5.050
V
Io=200mA
Dropout Voltage
ΔVd
－
0.3
0.5
V
Vcc=Vo×0.95, Io=500mA
Ripple Rejection
R.R.
45
55
－
dB
*1
f=120Hz,ein =1Vrms,
Io=100mA
Line Regulation
Reg.I
－
20
60
mV
Vo+1V→25V
Load Regulation
Reg.L
－
V
Io=5mA→1A
Tcvo.1
－
+0.04
－
%/℃
Io=5mA,Tj=-40～-20℃
Tcvo.2
－
±0.005
－
%/℃
Io=5mA,Tj=-20～+105℃
CTL ON Mode Voltage
VthH
2.0
－
－
V
ACTIVE MODE
CTL OFF Mode Voltage
VthL
－
－
0.8
V
OFF MODE
CTL Bias Current
ICTL
－
25
50
µA
Temperature Coefficient of
Output Voltage
*1
Vo×0.010 Vo×0.020
Conditions
VCTL=0V
ein : Input Voltage Ripple
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2/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Electrical characteristic curves (Reference data)
■BD33C0AWFP(Unless otherwise specified, Ta=25℃, Vcc=8.3V,VCTL=5V,Io=0mA)
0.6
0.4
0.2
18
6
15
5
OUTPUT VOLTAGE : Vo [V]
STANBY CURRENT： Isd [µA]
0.8
[mA]
12
0.0
9
6
3
0
5
4
3
2
1
0
Fig.3 Line Regulation
(Io=0mA)
800
700
600
4
500
3
400
300
2
200
1
100
0
0
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE： Vcc [V]
400
800
1200
1600
2000
200
400
600
800
OUTPUT CURRENT： IO [mA]
Fig.5 Load Regulation
80
6
OUTPUT VOLTAGE ： Vo [V]
60
50
40
30
20
5
4
3
2
1
10
0
-40
0
1000000
-20
0
20
40
60
80
100
1.0
0.8
0.6
0.4
0.2
0.0
0
200
AMBIENT TEMPERATURE： Ta[℃]
FREQUENCY： f [Hz]
100
400
600
800
1000
OUTPUT CURRENT： Io [mA]
Fig.9 Circuit Current
(lo=0mA→1000 mA)
Fig.8 Output Voltage
Temperature Characteristics
Fig.7 Ripple Rejection
(lo=100mA)
1000
Fig.6 Dropout Voltage
(Vcc=Vo×0.95V)
(lo=0mA→1000mA)
70
100000
0
OUTPUT CURRENT： IO[mA]
Fig.4 Line Regulation
(Io=500mA)
RIPPLE REJECTI ON ： R.R. [dB]
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE： Vcc [V]
0
10000
1
DROPOUT VOLTAGE ： ΔVd [mV]
5
OUTPUT VOLTAGE ： Vo [V]
OUTPUT VOLTAGE ： Vo [V]
6
1000
2
Fig.2 Shut Down Current
6
100
3
0
Fig.1 Circuit Current
10
4
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE： Vcc [V]
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE： Vcc [V]
CIRCUIT CURRENT： Ib+IFEEDBACK_R [mA]
CIRCUIT CURRENT： Ib+IFEEDBACK_R
1.0
6
6
5
5
80
70
60
50
40
30
20
OUTPUT VOLTAGE ： Vo [V]
OUTPUT VOLTAGE ： Vo [V]
CIRCUIT CURRENT： I CTL[µA]
90
4
3
2
1
4
3
2
1
10
0
0
0 2 4 6 8 10 12 14 16 18 20 22 24
CONTROL VOLTAGE： VCTL[V]
Fig.10 CTL Voltage vs CTL Current
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0
0 2 4 6 8 10 12 14 16 18 20 22 24
CONTROL VOLTAGE： VCTL[V]
Fig.11 CTL Voltage vs Output Voltage
3/12
130
140 150 160 170 180 190
AMBIENT TEMPERATURE： Ta [℃]
Fig.12 Thermal Shutdown
Circuit Characteristics
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Electrical characteristic curves (Reference data)
■BD50C0AWFP (Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=0mA)
0.8
0.6
0.4
0.2
18
6
15
5
OUTPUT VOLTAGE : Vo [V]
STANBY CURRENT： Isd [µA]
CIRCUIT CURRENT: Ib+IFEEDBACK_R [mA]
1.0
12
9
6
3
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE： Vcc [V]
5
4
3
2
1
Fig.14 Shut Down Current
Fig.15 Line Regulation
(Io=0mA)
600
4
3
2
1
400
800
1200
1600
OUTPUT CURRENT： IO[mA]
300
200
100
2000
80
CIRCUIT CURRENT： Ib+IFEEDBACK_R
[mA]
OUTPUT VOLTAGE ： Vo [V]
60
50
40
30
20
5
0.8
4
0.6
3
0.4
2
0.2
1
10
0
-40
0
1000
10000
100000
1000000
0.0
-20
0
20
40
60
80
100
0
200
400
600
800
OUTPUT CURRENT： Io [mA]
AMBIENT TEMPERATURE： Ta[℃]
FREQUENCY： f [Hz]
Fig.19 Ripple Rejection
(lo=100mA)
Fig.20 Output Voltage
Temperature Characteristics
100
1000
1.0
6
100
200
400
600
800
OUTPUT CURRENT： IO [mA]
Fig.18 Dropout Voltage
(Vcc=Vo×0.95V)
(lo=0mA→1000mA)
70
10
0
Fig.17 Load Regulation
Fig.16 Line Regulation
(Io=500mA)
1000
Fig.21 Circuit Current
(lo=0mA→1000 mA)
6
6
5
5
OUTPUT VOLTAGE ： Vo [V]
90
80
70
60
50
40
30
20
OUTPUT VOLTAGE ： Vo [V]
RIPPLE REJECTI ON ： R.R. [dB]
400
0
0
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE: Vcc [V]
CIRCUIT CURRENT: I CTL[µA]
500
0
0
1
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE: Vcc [V]
DROPOUT VO LTAG E ： △Vd [mV]
5
OUTPUT VOLTAGE ： Vo [V]
OUTPUT VOLTAGE : Vo [V]
6
2
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE： Vcc [V]
Fig.13 Circuit Current
6
3
0
0
0.0
4
4
3
2
1
4
3
2
1
10
0
0
0 2 4 6 8 10 12 14 16 18 20 22 24
CONTROL VOLTAGE： VCTL[V]
Fig.22 CTL Voltage vs CTL Current
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0 2 4 6 8 10 12 14 16 18 20 22 24
CONTROL VOLTAGE： VCTL[V]
Fig.23 CTL Voltage vs Output Voltage
4/12
0
130
140
150
160
170
180
190
AMBIENT TEMPERATURE： Ta [℃]
Fig.24 Thermal Shutdown
Circuit Characteristics
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Measurement circuit for reference data Measurement circuit for reference data
■BDXXC0AWFP (
):Vo=5.0V
A
Vo
Vcc
(1.0μF)
2.2μF
(1.0μF)
2.2μF
1μF
N.C.
CTL
Vo
Vcc
(1.0μF)
2.2μF
1μF
CTL
GND
N.C.
Measurement Circuit of Fig.1 and Fig.13
1μF
CTL
GND
A
5V
Vo
Vcc
GND
N.C.
V
5V
Measurement Circuit of Fig.2 and Fig.14
Measurement Circuit of Fig.3 and Fig.15
V
Vo
Vcc
(1.0μF)
2.2μF
(1.0μF)
2.2μF
1μF
CTL
N.C.
GND
Vo
Vcc
V
1μF
CTL
GND
Vo
Vcc
(1.0μF)
2.2μF
A
N.C.
10V
1μF
CTL
GND
A
N.C.
4.75V
500mA
5V
5V
Measurement Circuit of Fig.4 and Fig.16
(1.0μF)
2.2μF
～
CTL
Measurement Circuit of Fig.5 and Fig.17
Vo
Vcc
1Vrms
GND
N.C.
5V
Vo
Vcc
(1.0μF)
2.2μF
1μF
CTL
Measurement Circuit of Fig.6 and Fig.18
GND
N.C.
Vo
Vcc
(1.0μF)
2.2μF
1μF
CTL
V
10V
GND
N.C.
1μF
10V
100mA
10V
5V
5V
5V
A
Measurement Circuit of Fig.7 and Fig.19
Vo
Vcc
(1.0μF)
2.2μF A
Measurement Circuit of Fig.8 and Fig.20
GND
Vo
Vcc
(1.0μF)
2.2μF
1μF
CTL
N.C.
10V
Measurement Circuit of Fig.9 and Fig.21
(1.0μF)
2.2μF
1μF
CTL
GND
N.C.
Vo
Vcc
V
1μF
CTL
GND
N.C.
V
10V
10V
5V
Measurement Circuit of Fig.10 and Fig.22
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Measurement Circuit of Fig.11 and Fig.23 Measurement Circuit of Fig.12 and Fig.24
5/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Block Diagrams
GND
FIN
VREF:Bandgap Reference
OCP:Over Current Protection Circuit
VREF
TSD:Thermal Shut Down Circuit
Driver
Driver:Power Transistor Driver
R1,R2:Feed back Resister
R2
OCP
R1
TSD
3
1
2
3
4
5
CTL
Vcc
N.C.
Vo
N.C.
Fig.25
Pin No.
Pin Name
Function
1
CTL
Output Control Pin
2
Vcc
Power Supply Pin
3
N.C.
N.C. Pin
4
Vo
5
N.C.
N.C. Pin
Output Pin
Fin
GND
GND
●TOP VIEW〈Package dimension〉
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© 2011 ROHM Co., Ltd. All rights reserved.
6/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Input / Output Equivalent Circuit Diagrams
CTL Pin
Vcc Pin
200kΩ
Vcc
1kΩ
CTL
IC
200kΩ
Vo Pin
Vcc
15 kΩ
34kΩ(BD33C0AWFP)
56.6kΩ(BD50C0AWFP)
Vo
10kΩ
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7/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Thermal Design
5
Mounted on a Rohm standard board
Board size : 70 ㎜×70 ㎜×1.6 ㎜
Copper foil area :7 ㎜×7 ㎜
③4.80
4
POWER DISSIPATON:Pd[W]
4
POWER DISSIPATON:Pd[W]
5
Mounted on a Rohm standard board
Board size : 70 ㎜×70 ㎜×1.6 ㎜
Copper foil area :7 ㎜×7 ㎜
TO252-5θja=96.2(℃/W)
3
2
1.30
1
0
①2-layer board
(back surface copper foil area :15 ㎜×15 ㎜)
②2-layer board
(back surface copper foil area :70 ㎜×70 ㎜)
③4-layer board
(back surface copper foil area :70 ㎜×70 ㎜)
②3.50
3
①:θja=67.6℃/W
②:θja=35.7℃/W
③:θja=26.0℃/W
①1.85
2
1
0
0
25
50
75
100
125
150
0
25
AMBIENT T EMPERAT URE:Ta[℃]
50
75
100
125
150
AMBIENT T EMPERAT URE:Ta[℃]
Fig.26
Fig.27(Reference data)
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.26 and Fig.27.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC
at temperatures less than the maximum junction temperature Tjmax.
Fig.26 and Fig.27 show the acceptable loss and heat reducing characteristics of the TO252-5 package. Even when the
ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please
operate the IC at temperatures less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows :(Fig.27③)
Pc=(Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd≧Pc
Solving this for load current Io in order to operate within the acceptable loss,
Io≦
Pd－Vcc×Ib
(Please refer to Fig.9,21 for Ib.)
Vcc:
Vo:
Io:
Ib:
Ishort:
Input voltage
Output voltage
Load current
Circuit current
Short current
Vcc－Vo
It is then possible to find the maximum load current IoMax with respect to the applied voltage Vcc at the time of thermal
design.
Calculation Example)
Io≦
When Ta=85℃
BD33C0AWFP:Vcc=8.3V,Vo=3.3V
BD50C0AWFP:Vcc=10V,Vo=5.0V
2.496－10×Ib
Fig.27③:θja=26.0℃/W → -38.4mW/℃
25℃=4.80W → 85℃=2.496W
5
Io≦498.2mA
(Ib:0.5mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Ib+Ishort)
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(Please refer to Fig.5,17 for Ishort.)
8/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Notes for use
1.
Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open
mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,
consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2.
Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.
3.
GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.
4.
Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground
caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND
voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5.
Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result
in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by
poor soldering or foreign objects) may result in damage to the IC.
6.
Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in
applications where strong electromagnetic fields may be present.
7.
Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC
to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8.
Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.
Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc)
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
Package Power dissipation
Power dissipation
9.
: Pd (W)=(Tjmax－Ta)/θja
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Vcc pin
Insert a capacitor(Vo≧5V:capacitor≧1µF ~ , Vo＜5V:capacitor≧2.2µF ~)between the Vcc and GND pins.
The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels.
Electric capacitance
IC
Ceramic capacitors,Low ESR capacitors
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9/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
10.
Output pin
It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable
capacitance values range from 1µF to 1000µF. Ceramic capacitors can be used as long as their ESR value is low
enough to prevent oscillation (0.001Ω to 20Ω). Abrupt fluctuations in input voltage and load conditions may affect the
output voltage. Output capacitance values should be determined only through sufficient testing of the actual
application.
●BD33C0AWFP
Vo=3.3V
Vcc=4.3V～25V
Io=0A～1A
Ta=-40℃～+105℃
Vcc=4.3V～25V(BD33C0AWFP)/6V～25V(BD50C0AWFP)
Ta=-40℃～+105℃
Cin=2.2μF～100μF Cout=1μF～100μF
100
●BD50C0AWFP
Vo=5V
Vcc=6V～25V
Io=0A～1A
Ta=-40℃～+105℃
100
100
Unstable operating region
Stable operating region
0.1
Stable operating region
10
0.01
2.2
0.001
1
Cin（μF）
1
Cin（μF）
Cout_ESR(Ω）
10
10
Stable operating region
Unstable
operating region
0
200
400
600
800
1000
1
1
10
Io(mA)
100
1
Cout_ESR vs Io(reference data)
10
100
Cout(μF)
Cout（μF）
Cin vs Cout(reference data)
Vo
Vcc
BD33C0AWFP(4.3V～25V)
BD50C0AWFP(6V～25V)
Cin
BD33C0AWFP (2.2μF～)
BD50C0AWFP (1.0μF～)
Cout(1.0μF～)
CTL
GND
N.C.
ESR
Io(ROUT)
(0.001Ω～)
VCTL
(5V)
※Operation Notes 10
Measurement circuit
11.
CTL pin
Do not make voltage level of chip enable pin keep floating level, or in between VthH and VthL. Otherwise, the output
voltage would be unstable or indefinite.
12.
For a steep change of the Vcc voltage
Because MOS FET for output Transistor is used when an input voltage change is very steep, it may evoke large current.
When selecting the value of external circuit constants, please make sure that the operation on the actual application
takes these conditions into account.
13.
For an infinitesimal fluctuations of output voltage.
At the use of the application that infinitesimal fluctuations of output voltage caused by some factors (e.g. disturbance
noise, input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g.
insert the filter, etc.).
14.
Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output
capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit
output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous or transitive operation of the
protection circuits.
15.
Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used
after this function has activated, or in applications where the operation of this circuit is assumed.
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© 2011 ROHM Co., Ltd. All rights reserved.
10/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
16.
Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent
reverse current flow, or insert bypass diodes between Vcc and each pin.
17.
Positive voltage surges on VCC pin
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V
on the VCC pin.
Vcc
GND
18.
Negative voltage surges on VCC pin
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on
the VCC pin.
Vcc
GND
19.
Output protection diode
Loads with large inductance components may cause reverse current flow during startup or shutdown. In such cases, a
protection diode should be inserted on the output to protect the IC.
20.
Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating
parasitic diodes and/or transistors. For example (refer to the figure below):
○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in
mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these
diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate)
should be avoided.
Transistor (NPN)
Resistor
B
(Pin B)
(Pin A)
(Pin B)
C
E
B
N
P
P+
N
P
P+
N
P+
N
P+
GND
Parasitic elements
or transistors
N
P substrate
Parasitic elements
GND
E
P
N
N
C
(Pin A)
Parasitic elements
or transistors
GND
Parasitic elements
Example of Simple Monolithic IC Architecture
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© 2011 ROHM Co., Ltd. All rights reserved.
11/12
2011.10 - Rev.B
Technical Note
BD33C0AWFP, BD50C0AWFP
●Ordering part number
B
Part No.
D
X
X
Output voltage
C
0
A
Current capacity
33: 3.3V output C0A:Output 1A
50:5.0V～
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© 2011 ROHM Co., Ltd. All rights reserved.
W
F
P
Shutdown switch Package
W : With switch FP : TO252
None : Without
switch
12/12
-
E
2
Packaging specification
E2: Embossed tape and reel
2011.10 - Rev.B
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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