BD5431EFS

1/4 STRUCTURE: PRODUCT: TYPE: PACKAGE: FEATURES: 1) 2) 3) 4) 5) 6) Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker BD5431EFS HTSSOP-A44 Differential Analog / PWM inputs High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply is suddenly shut off High quality muting performance is realized by using the soft-switching technology Incorporates a master/slave function that enables synchronous operation when several units are used simultaneously Allows the internal PWM sampling clock frequency to be adjusted ○Absolute maximum ratings (Ta=25℃) Item Supply voltage Power dissipation Input voltage for signal pin Input voltage for control pin Input voltage for clock pin Operating temperature range Storage temperature range Maximum junction temperature Symbol Vcc Pd VIN VCONT VOSC Topr Tstg Tjmax Limit +20 2.0 4.5 -0.2 ～ +7.2 -0.2 ～ Vcc+0.2 -0.2 ～ +7.2 -40 ～ +85 -55 ～ +150 +150 Unit V W W V V V ℃ ℃ ℃ Conditions Pin7、8、15、16、29、30、37、38、40 ※1 ※2 ※3 ※4 Pin1、2、3、4 ※1 Pin20、24 ※1 Pin23 ※1 ※1 The voltage that can be applied, based on GND(Pin11, 12, 33, 34, 43) ※2 Do not, however exceed Pd and Tjmax=150℃. ※3 70mm×70mm×1.6mm, FR4, 1-layer glass epoxy board (Copper on bottom layer 0%) Derating in done at 16mW/℃ for operating above Ta＝25℃. There are thermal vias on the board. ※4 70mm×70mm×1.6mm, FR4, 2-layer glass epoxy board (Copper on bottom layer 100%) Derating in done at 36mW/℃ for operating above Ta＝25℃. There are thermal vias on the board. ○Operating conditions (Ta＝25℃) Item Supply voltage Load impedance ※5 ※ Do not, however exceed Pd. No radiation-proof design Symbol Vcc RL Limit +10 ～ +16.5 4 ～ 16 Unit V Ω Conditions Pin7、8、15、16、29、30、37、38、40 ※1 ※5 REV. B 2/4 ○Electrical characteristics （Unless otherwise specified Ta=25℃, Vcc=12V, f=1kHz differential analog input、 Rg=0Ω, RL=8Ω, MUTEX=H, MS=L） Limit Item Symbol Unit Conditions Min Typ Max Whole circuit Circuit current 1 (Sampling mode) ICC1 25 50 mA Circuit current 2 (Mute mode) ICC2 10 20 mA MUTEX=L Control circuit H level input voltage L level input voltage Audio circuit Voltage gain Maximum output power 1 Maximum output power 2 Total harmonic distortion Crosstalk Output noise voltage (Sampling mode) Residual noise voltage (Mute mode) Internal sampling clock frequency ※1 VIH VIL Gv PO1 PO2 THD CT VNO VNOM FOSC 2.3 0 22 60 180 23.5 10 17 0.1 75 60 1 250 12 0.8 25 160 10 320 V V dB W W % dB μVrms μVrms kHz MUTEX, MS MUTEX, MS Po=1W, 20log(Vout/Vin) RL=8Ω, THD+n=10% ※1 RL=4Ω, THD+n=10% ※1 PO=1W, BW=20Hz～20kHz ※1 PO=1W, Rg=0Ω, BW=IHF-A Rg=0Ω, BW=IHF-A MUTEX=L, Rg=0Ω, BW=IHF-A These items show the typical performance of device and depend on board layout, parts, power supply. The standard value is in mounting device and parts on surface of ROHM’s board directly. ○Package outline Type BD5431EFS Lot No. (UNIT: mm) PKG: HTSSOP-A44 Drawing No.: EX195-5002 REV. B 3/4 ○Block diagram ○Pin No. / Pin name Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pin name IN2N IN2P IN1N IN1P N.C. BSP1P VCCP1P OUT1P GNDP1 OUT1N VCCP1N BSP1N WARNING ERROR MUTEX N.C. N.C. Pin No. 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 Pin name N.C. GNDA FILA FILP VCCA BSP2P VCCP2P OUT2P GNDP2 OUT2N VCCP2N BSP2N VHOLD TM ROSC MS OSC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 N.C. 22 N.C. WARNING ERROR MUTE CONTROL Output Short Protection Protection & Logic Under Voltage Protection High Temperature Protection Power-off Detector SOFT MUTE Ramp Generator Clock Control DRIVER 1N DRIVER 2N DRIVER 1P DRIVER 2P N.C. PWM1 PWM2 N.C. 44 GNDA FILA FILP VCCA 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 N.C. ： Non Connection. REV. B 4/4 ○Operation Notes （1） Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. （2） Power supply lines As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. （3） GND potential Ensure a minimum GND pin potential in all operating conditions. （4） Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. Class-D power amplifier is High efficiency and low heat generation by comparison with conventional Analog power amplifier. However, In case it is operated continuously by maximum output power, Power dissipation(Pdiss) may exceed package dissipation. Please consider about heat design that Power dissipation(Pdiss) does not exceed Package dissipation(Pd) in average power(Poav). （Tjmax ：Maximum junction temperature=150℃、Ta ：Peripheral temperature[℃]、θja ：Thermal resistance of package[℃/W]、Poav：Average power[W]、η：Efficiency） Package dissipation: Pd （W） = （Tjmax - Ta）／θja Power dissipation: Pdiss（W） = Poav * （1／η- 1） （5） Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. （6） Thermal shutdown circuit This product is provided with a built-in thermal shutdown circuit. When the thermal shoutdown circuit operates, the output transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃, and is not intended to protect and secure an electrical appliance. （7） Shorts between pins and misinstallation When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is misinstalled and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and a GND. （8） Power supply on/off In case power supply is started up, MUTEX（Pin20）always should be set LOW, And in case power supply is shut down, it should be set LOW likewise. Then it is possible to eliminate pop noise when power supply is turned on/off. And also, all power supply terminals should start up and shut down together. （9） WARNING terminal(Pin18), ERROR terminal(Pin19) A WARNING flag is outputted when Under Voltage Protection and High Temperature Protection are operated. A Error flag is outputted when Output Short Protection and Output DC Voltage Protection are operated. These flags are the function which the condition of this product is shown in. The use which aimed at the protection except for this product is prohibition. （10） N.C. terminal(Pin5, 21, 22, 44) N.C. terminal(Non Connection Pin) does not connect to the inside circuit. Therefore, please open or connect to GND. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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