Wireless Power Consortium / Qi Compliant series
Wireless Power Receiver IC
BD57011AGWL
General Description
Key Specifications
BD57011AGWL is stand-alone integrated IC for wireless
power receiver. The device is composed fully
synchronous rectifier circuit in low-impedance FETs, Qi
compliant packet controller, Adjustable low-dropout, and
open-drain output terminal to communicate the power
transmitter by amplitude modulation.
BD57011AGWL applies to 5W-power mobile application
based on WPC ver. 1.2.
Variable Output Voltage:
4.3V to 5.3V(16steps)
Maximum Input Voltage:
20V(Max)
Maximum Input/Output Current:
1.1A(Max)
AC Input Frequency:
100kHz to 210kHz
Operating Temperature Range:
-30°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
3.36mmx2.62mmx0.57mm
(0.4mm pitch)
UCSP50L3C (42Pin)
Features
Low Impedance FET in Rectifier
High Efficiency Fully Synchronous Rectifier
Maximum Input Voltage is 20V
WPC / Qi ver1.2 BPP(Baseline Power Profile)
Support
Adjustable Voltage at Low-dropout(16steps)
Open-Drain Output Terminal for Modulation
TX-RX Coil Position Gap Alarm
Applications
WPC compliant Device
Smart Phones
Cell Phones
Hand-held Mobile Devices
Typical Application Circuit
ADGATE
ADDET
RECT
BOOT1
COMM1
CLAMP1
AC1
OUT
Power
OUTSET
ILIM
FOD2
FOD
System
Load
(Charger
And
Battery)
AC/DC
Half Bridge
Driver
Controller
BOOT2
PG
COMM2
CTRL
CLAMP2
Voltage
&
Current
Sensing
Transmitter(TX)
EN1
Rectification
Voltage
Control
Qi packet
Controller
Voltage
&
Current
Sensing
Load
Feedback
POSSET
AC2
BD57011AGWL
Receiver(RX)
EN2
GND
BD57011AGWL
Figure 2. Product position in Wireless
Power Supply System
Figure 1. Typical application circuit
Product structure : Silicon monolithic integrated circuit
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This product has no designed protection against radioactive rays
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limit
Unit
RECT, AC1, AC2, COMM1, COMM2,
CLAMP1, CLAMP2 Voltage
VINOUT_H
-0.3 to +20
V
BOOT1, BOOT2 Voltage
VINOUT_H2
-0.3 to +26
V
BOOT1 to AC1, BOOT2 to AC2 Voltage
VBOOT_AC
-0.3 to +7
V
ADDET, ADGATE Voltage
VAD_MAX
-0.3 to +28
V
OUT, OUTSET, POSSET, ILIM, CTRL,
EN1, EN2, PG Voltage
VINOUT_L
-0.3 to +7
V
FOD, FOD2 Voltage
VINOUT_L2
-0.3 to +3.6
V
IMAX
1.5(Note 1)
A
IMAX_PG
15
mA
Tstg
-55 to +150
°C
Pd
1.38(Note 2)
W
Input/Output Rating Current
PG pin Rating Current
Storage Temperature Range
Power Dissipation
(Note 1) Applied to AC1, AC2, RECT and GND with the proviso that all multi-pin should connect to common pattern.
(Note 2) Derate by 11mW/°C when operating above Ta=25°C (
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VRECT
0
-
15
V
VAC1, VAC2
-
-
15
V
Capacitance between RECT and GND
CRECT
20
-
-
µF
Operating Ambient Temperature Range
Topr
-30
-
+85
°C
Rectified Voltage Range
AC1, AC2 Input Peak Voltage Range
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BD57011AGWL
Electrical Characteristics
(Unless otherwise specified, Ta=25°C, VRECT=5.0V)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Whole Chip
Operating Circuit Current 1
IRECT1
-
28
40
mA
VRECT=5.0V, OUT off
Operating Circuit Current 2
IRECT2
-
2.4
4.8
mA
VRECT=5.5V, OUT on
IOUT
-
20
40
µA
VOUT=5.0V, VRECT=0V
VRECT_UVLO
2.5
2.6
2.7
V
VRECT:0V to 5V
150
300
450
mV
VRECT:5V to 0V
14.5
15
15.5
V
VRECT:10V to 18V
60
130
260
mV
VRECT:18V to 10V
Quiescent Current
(wireless charging is disable)
Protection Block
RECT Under Voltage Lockout
Hysteresis on UVLO
RECT Over Voltage Lockout
Hysteresis on OVLO
VRECT_UVLO
HYS
VRECT_OVLO
VRECT_OVLO
HYS
OUTPUT Block
Regulated Output Voltage
VOUT
4.93
5.0
5.07
V
ILOAD=100mA, RSET=27k
OUT Load Regulation
dVOUT
-
100
200
mV
ILOAD=0-500mA
VPG
-
300
500
mV
ISINK=5mA
ILEAK_PG
-
-
2
µA
VPG=7V
IILIM
9.7
10
10.3
µA
RADJ=100k
Highest Value of Resistance for
ILIM Setting
RADJMAX
-
-
150
k
Maximum Output Current Limit
I LOADMAX
-
-
1.5
A
FOD pin Leak Current
ILEAK_FOD
-
-
2
µA
VFOD=2V
FOD2 pin Leak Current
I LEAK_FOD2
-
-
2
µA
VFOD2=2V
RON_COMM
-
2.8
4.2
fCOMM
1.92
2
2.08
kHz
ILEAK_COMM
-
-
2
µA
PG Output Block
Open Drain Ability on PG pin
PG pin Leak Current
ILIM / FOD block
ILIM Source Current
Maximum ILIM deliver
within 1ms
COMM Block
Comm1 and Comm2 ON
Resistance
Driving Frequency on COMM
Signal
COMM pin Leak Current
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Electrical Characteristics
continued
(Unless otherwise specified, Ta=25°C, VRECT=5.0V)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
CLAMP Block
Clamp1 and Clamp2 ON
Resistance
RON_CLAMP
-
3.8
5.7
CLAMP pin Leak Current
ILEAK_CLAMP
-
-
2
µA
VCLAMP=20V
VADDET
3.4
3.6
3.8
V
VADDET:0V to 5V
VHYS_AD
200
400
600
mV
VADDET:5V to 0V
VADDET_OV
6.6
6.8
7.0
V
VADDET:5V to 7V
VHYS_AD_OV
100
200
400
mV
VADDET:7V to 5V
I ADGATE
-
80
160
µA
VADDET=5V
VINL_EN
-
-
0.4
V
VINH_EN
1.3
-
-
V
REN
100
200
400
Adapter Detection Block
Adapter Input Detection
Threshold Voltage
Adapter Input Detection
Hysteresis Voltage
Adapter Input Overvoltage
Detection Voltage
Adapter Input Overvoltage
Detection Hysteresis Voltage
ADDET pin Input Current
EN1, EN2 and CTRL Input Block
Input Low Threshold for EN1,
EN2 and CTRL
Input High Threshold for EN1,
EN2 and CTRL
EN1, EN2 and CTRL Pull Down
Resistance
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Typical Performance Curves
RECT
OUT Voltage
Figure 3. OUT Voltage [V] vs. Temp. [°C]
(RSET
Figure 4. OUT Voltage [V] and RECT Voltage [V]
vs. ILOAD [A] (RSET
Iload
RECT
OUT
Figure 5. System Efficiency [%] vs. Output Power [W]
(RSET
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Figure 6. Startup Waveform (RSET
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Pin Configuration
Top view
Bottom View
Figure 7. Pin configuration
Pin Description
Pin No.
Pin Name
I/O
A1
TEST3
-
Test pin3 for shipment inspection / This pins deal with open
A2
AC1
In
AC input1
A3
BOOT1
In
Bootstrap capacitor1 connect for driving FET
A4
OUT
Out
Adjustable Output
A5
OUT
Out
Adjustable Output
A6
COMM1
Out
Modulation Control Output1
A7
TEST2
-
Test pin2 for shipment inspection / This pins deal with open
B1
GND
-
Rectifier and Analog Ground
B2
AC1
Out
AC input1
B3
AC1
Out
AC input1
B4
OUTSET
In/Out
B5
OUT
Out
Adjustable Output
B6
CLAMP1
Out
AC1 Clamp Protection
B7
PG
Out
Open drain Output for inform the output is enabled
C1
GND
-
Rectifier and Analog Ground
C2
AC1
In
AC input1
C3
RECT
Out
C4
EN1
In
C5
ADGATE
Out
C6
ILIM
In/Out
C7
GND
-
Rectifier and Analog Ground
D1
GND
-
Rectifier and Analog Ground
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Function
Resistor connecting pin for output voltage setting
Rectifier Output
Input that decide to enable/disable wireless and wired charging
External Power Pass Gate Driver
Connect current limit level setting resistor
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Pin Description
continued
Pin No.
Pin Name
I/O
D2
AC2
In
D3
RECT
Out
Rectifier Output
D4
RECT
Out
Rectifier Output
D5
EN2
In
Input that decide to enable/disable wireless and wired charging
D6
ADDET
In
Adapter Voltage Detection
D7
CTRL
In
Input pin to send End Power Transfer packet/ abnormal
temperature or termination signal.
E1
GND
-
Rectifier and Analog Ground
E2
AC2
In
AC input2
E3
AC2
In
AC input2
E4
RECT
Out
E5
FOD
In
E6
CLAMP2
Out
E7
FOD2
In
Foreign Object Detecting adjust pin2
F1
GND
-
Rectifier and Analog Ground
F2
AC2
In
AC input2
F3
BOOT2
Out
Bootstrap capacitor2 connect for driving FET
F4
RECT
Out
Rectifier Output
F5
POSSET
In/Out
F6
COMM2
Out
F7
TEST1
-
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Function
AC input2
Rectifier Output
Foreign Object Detecting adjust pin1
AC2 Clamp Protection
Resistor connecting pin for the Position Gap alarm.
Modulation Control Output2
Test pin1 for shipment inspection / This pins deal with open
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Block Diagram
Figure 8. Block diagram
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Description of Block
1. Rectifier block
According to electromagnetic induction phenomena, electromotive force occurs in a secondary side coil in inputting AC
signal into the both ends of a primary side (TX) coil. Full-wave rectification by switching operation is realized by detecting
output current from the coil generated from the above-mentioned operation, making on/off the built-in FET connected to the
AC1 and the AC2 pin, outputting current to RECT, and charging the RECT pin external capacity.
The detecting a coil current is to compare the AC pin voltage (FET Ron x I COIL) with GND level. The on/off signal of built-in
FET is generated based on this detection signal. The on/off timing of L side FET and H side FET is monitored, and
penetration current is prevented.
The bootstrap drive system which sets the H side and L side to Nch FET is adopted for high efficiency. Therefore, the
capacitor for voltage maintenance is needed between the BOOT1 (BOOT2) pin and the AC1 (AC2) pin.
2. Low Drop Out (LDO) block
The OUT pin output voltage can be freely set up by external resistance. It assumes that system load (PMIC) including a
charger is connected to the OUT pin. In order to suppress heating on the whole set, it recommends carrying out an OUT
setup near the full charge voltage of the Li-ion battery.
An error signal is returned to the TX side so that the input-and-output difference of RECT and OUT may become the
minimum.
An input-and-output difference is made small, so that load is large, and heating of IC simple substance is suppressed.
The relation between IOUT and desired point (voltage which the RECT pin voltage converges) is as follows.
Figure 9. RECT desired point
Output voltage becomes settled uniquely in the resistance (E24 series) connected to the OUTSET pin.
It can choose from the 16 following steps.
Step
OUT setting[V]
RSET[k ] (E24)
0
4.30
180
1
4.35
120
2
4.40
91
3
4.45
75
4
4.50
62
5
4.55
56
6
4.60
47
7
4.65
43
8
4.70
39
9
4.75
36
10
4.80
33
11
4.90
30
12
5.00
27
13
5.10
24
14
5.20
22
15
5.30
20
Figure 10. OUTSET circuit
An OUTSET terminal cannot be used by OPEN. Be sure to connect a resistor and use it.
Moreover, you can t change OUTSET setting during operation.
You need to apply a load after OUT output due to OCP limitation.
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Description of Block
continued
3. A/D Converter block
The Analog to Digital translation of the various analog signals which serve as a candidate for operation in the case of packet
generation is carried out. The A/D converter has adopted successive approximation register.
This converter is completed inside IC and cannot be controlled from the outside.
4. Controller block
The packet based on Qi standard (ver1.2) of WPC (Wireless Power Consortium) is controlled.
The packet to support becomes as follows about an End Power Transfer packet (EPT).
End Power transfer
value
reason
support
condition
0x00
Unknown
Sent
Adapter Input detection
0x01
Charge Complete
Sent
Charge Complete
0x02
Internal Fault
Sent
Internal abnormal temperature, ILIM abnormal setting,
OUTSET abnormal setting
0x03
Over Temperature
Sent
External abnormal temperature
0x04
Over Voltage
Not Sent
-
0x05
Over Current
Not Sent
-
0x06
Battery Failure
Not Sent
-
0x07
Reserved
Not Sent
-
0x08
No Response
Sent
No convergence to RECT desired point
5. Adapter detection block
BD57011AGWL includes the detective function of the cable power supply of the 5V system.
If it detects that the ADDET pin became 3.6V (Typ) or more, since priority is given to an adapter (cable charge), wireless
power supply will be stopped (End Power Transfer output), and an OUT output will be stopped.
It checks that OUT voltage is 0.7V or less, and makes the PMOS opposite switch of an adapter line turn on (ADGATE:H to
L).
The sequence of operation at the time of adapter detection is as follows.
Figure 11. Adapter detection
If set to ADDET 6.8V, it will be in an OVP detection state and will carry out the instant stop of the PMOS of a power path
regardless of the existence of wireless power supply.
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Description of Block
continued
6. External control input (EN1, EN2 and CTRL).
Active/non-active of wireless supply and wired (adapter) supply can be set up by EN1 and EN2.
It becomes the standard when (EN1=L, EN2=H) setting uses wireless charge, so both wireless power supply and adapter
control are active. When both powers come, priority is given to adapter (wired power), wireless power is stopped according
to the sequence explained in adapter detection block, and the electrical connection of the path from an adapter is carried out.
When EN1 turn to H, End Power Transfer (0x01:Charge Complete) packet outputs, so wireless power supply will be
stopped.
It is as follows if these are summarized in a table.
EN1
EN2
Result
Both wireless power supply and adapter control are active. Priority is given to the supply
L
H
from an adapter. That is, if an adapter input is carried out during wireless power supply,
wireless power immediately stop and only an adapter carry out.
H
H
Both an adapter and wireless power supply are non-active.
That is, in this mode, power is not supplied from OUT.
The CTRL pin becomes an external temperature abnormal signal input.
Please input H signal to suspend wireless power supply system compulsorily by unusual generation of heat of a set, etc.
End Power Transfer (0x03:Over Temperature) is outputted.
7. ILIM setup
The current limit value of the OUT pin can be set up by resistance
connected to the ILIM pin.
The relation between setting resistance and limit current (ILIM) becomes
as the following formula.
RADJ is total value of RLIM, RFOD2 and RFOD.
E.g. ILIM=1A setup at the time of RADJ=100k .
If RADJ sets 150k or over (ILIM setting 1.5A or over),
IC outputs EPT packet (internal fault).
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Description of Block
continued
8. FOD adjust setting
In order to implement FOD (Foreign Object Detection) function that Qi compliant ver1.2 makes rules, it is necessary to
compute received power strictly and to compare with the transmitted power from the TX side. The FOD and FOD2 pin is
used for the received power fine tuning. These parameters adjust a lost (e.g. LC loss) which is not understood inside IC.
The relation between received power (PPR) and FOD, FOD2 pin input voltage becomes as the following formula.
is a parameter for slope adjust, proportional to FOD2 voltage. is a parameter for offset adjust, proportional to FOD
voltage.
A Function f (RECT, IOUT) is a value calculating in IC, nearly proportional to output power.
Setting example presents. It necessary to coordinated with RFOD, RFOD2 and ILIM setting resistor.
In the case of setting; ILIM=1A, =1.2, =-0.2W, Solving the following simultaneous equations, the value of FOD setting
resistors is obtained.
In this case, RFOD=2.4k , RFOD2=7.4k , RILIM=90.2k .
The configuration described above is a reference value. Must be adjusted by the considering external factors (the presence
or absence of the metal for absorbing the magnetic flux, such as a battery) and the surrounding environment of the coil
material, the coil shape, and the distance to the Tx coil.
9. POSSET setting
The height of the RECT voltage at a start-up is judged, and position gap of the XY direction between TX coil and RX coil is
detected. The threshold (Vth, pos) of whether to take out alarm with the resistance connected to the POSSET pin can be
decided. When RECT voltage is lower than Vth, pos, a pulse is outputted 5 times from the PG pin at the time of an OUT
output.
The relation between setting resistance and detection threshold voltage (Vth, pos) becomes as the following formula.
RPOS is the POSSET pin connection resistance. E.g. Vth, pos=2.8V setup at the time of RPOS=100k .
In the case of nullification for this function, set R POS=120 .
Figure 12. Position Gap alarm
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Application Example
1. Recommended Diagram
Figure 13. Typical application circuit
2. Parts list
Part Name
Recommended Value
Unit
Recommended Part
Maker
LRX
12
µH
WR-482350-15M2-G
TDK Co., Ltd.
CS1
0.068
µF
GRM188B11E683JA01#
MURATA Co., Ltd.
CS2
0.068
µF
GRM188B11E683JA01#
MURATA Co., Ltd.
CS3
0.068
µF
GRM188B11E683JA01#
MURATA Co., Ltd.
CP1
1500
pF
GRM155B11E152KA01#
MURATA Co., Ltd.
CP2
680
pF
GRM155B11E681KA01#
MURATA Co., Ltd.
CBOOT1, CBOOT2
0.01
µF
GRM155R61E103KA01#
MURATA Co., Ltd.
CCOMM1, CCOMM2
0.033
µF
GRM155B31E333KA87#
MURATA Co., Ltd.
CCLAMP1, CCLAMP2
0.47
µF
GRM155R61E474KE01#
MURATA Co., Ltd.
CRECT1
0.1
µF
GRM155R61E104KA87#
MURATA Co., Ltd.
CRECT2
10
µF
GRM188R61E106KA73#
MURATA Co., Ltd.
CRECT3
10
µF
GRM188R61E106KA73#
MURATA Co., Ltd.
COUT1
0.1
µF
GRM155R61E104KA87#
MURATA Co., Ltd.
COUT2
2.2
µF
GRM155B31A225KE95#
MURATA Co., Ltd.
CILIM
No Mount (dummy)
CADDET
1.0
µF
GRM155R6YA105KE11#
MURATA Co., Ltd.
RSET
27
k
MCR006YLPD2702
ROHM Co., Ltd.
RILIM
100
k
MCR006YLPD1003
ROHM Co., Ltd.
RFOD
10
k
MCR006YLPD1002
ROHM Co., Ltd.
RFOD2
3.6
k
MCR006YLPD3601
ROHM Co., Ltd.
RPOS
56
k
MCR006YLPD5602
ROHM Co., Ltd.
RPG
3
k
MCR006YLPJ3001
ROHM Co., Ltd.
PMOS1, PMOS2
Ron < 100m
TT8J2TR
ROHM Co., Ltd.
The above parts are those at the time of evaluation, and as for the coil, other coils made by TDK and wurth are also under
consideration, so please contact us.
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Timing Chart
Start up sequence
Figure 14. Start up sequence
Power Dissipation
(UCSP50L3C Package)
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual
operating conditions.
1.38W
* 54mm x 62mm x 1.6mm Glass Epoxy Board
Figure 15. Power Dissipation Curve (Pd-Ta Curve)
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I/O Equivalence Circuit
RECT, AC1, AC2, BOOT1, BOOT2, GND pin
ADDET, ADGATE pin
OUT
ADDET
ADGATE
OUT pin
COMM1, COMM2 pin
CLAMP1, CLAMP2 pin
ILIM pin
OUTSET, POSSET pin
PG pin
EN1, EN2, CTRL pin
FOD, FOD2 pin
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Operation Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage
below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the
ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. T
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply
or ground line.
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
16/20
TSZ02201-0B1B0AK00020-1-2
28.Jun.2018 Rev.004
BD57011AGWL
Operational Notes
continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 16. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the
Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered
down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if
the TJ falls below the TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in
applications characterized by continuous operation or transitioning of the protection circuit.
16. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics may be
affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent
the chip from being exposed to light.
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
17/20
TSZ02201-0B1B0AK00020-1-2
28.Jun.2018 Rev.004
BD57011AGWL
Ordering Information
B
D
5
7
0
1
1
A
Part Number
G
W
L
Package
GWL: UCSP50L3C
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
1PIN MARK
Part Number Marking
5 7 0 1 1 A
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
LOT Number
18/20
TSZ02201-0B1B0AK00020-1-2
28.Jun.2018 Rev.004
BD57011AGWL
Physical Dimension Tape and Reel Information
Package Name
UCSP50L3C(BD57011AGWL)
(UNIT: mm)
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
Direction of
feed
2,500pcs
E2
The direction is the pin 1 of product is at the upper left when
you hold reel on the left hand and you pull out the tape on the
right hand
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
19/20
TSZ02201-0B1B0AK00020-1-2
28.Jun.2018 Rev.004
BD57011AGWL
Revision History
Date
Revision
Changes
01.Sep.2016
001
04.Oct.2017
002
31.Jan.2018
003
28.Jun.2018
004
New Release
Page.1 Correct written error (Operating Temperature Range)
Modified terms based on latest specification
Remove Key Specifications
Addition of notation of number of pins
Page.2 Correct written error (Operating Temperature Range) , Change of
notation of recommended operating condition
Page.6 Correct written error (CTRL pin function), Changing notation of terminal
description
Page.7 Changing notation of terminal description
Page.8 Correct written error (Rectifier block)
Page.9 Correct written error (Adapter detection block)
Page.11 Correct written error (FOD adjust setting)
Page.12 Annotation is added to the margin of the parts list
Page.17 Add description of status of document
Page.2
Addition of Caution 2
Page.3-4 Correction of notation (change from lower case to upper case),
correct written error
Page.5
Correct written error (RILIM)
Page.6-7 Top View Added, Bottom View drawing correction, add explanation
that the TEST pin is open and used for the pin description.
Page.9-12 Correction of nation (change from lower case to upper case),
Correct written error
Page.13
Correct written error (part number), addition of part name
Page.14-15 Correction of nation
Page.16-17 Changing the description of the
,
delete about the Thermal C
,
modification of other notation
Page.6
Top View and Bottom View drawing correction
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
20/20
TSZ02201-0B1B0AK00020-1-2
28.Jun.2018 Rev.004
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property ( Specific Applications ), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASS
CLASS b
CLASS
CLASS
CLASS
CLASS
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or
Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl 2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
(EXEWLIIX
General Precaution
Notice – WE
Rev.001
