BD6023AGU

1/4 Structure Product Name Silicon Monolithic Integrated Circuit Power supply for CCD camera / White LED driver / RGB LED driver of mobile phone Type BD6023AGU A system power supply for the CCD camera module Built-in white LED driver for the LCD back light and RGB LED driver Features o ○Absolute Maximum Ratings (Ta=25 C) Parameter Symbol Rating Maximum Applied Voltage 1 VMAX1 20(*1) Maximum Applied Voltage 2 VMAX2 16(*2) Maximum Applied Voltage 3 VMAX3 15(*3) Maximum Applied Voltage 4 VMAX4 -13.5(*4) Maximum Applied Voltage 5 VMAX5 6(*5) Power Dissipation Pd 2500(*6) Operating Temperature Range Topr -30 to 85 Storage Temperature Range Tstg -55 to 150 (*1) VPLUS11, VPLUS12, VPLUS2 pin (*2) CAMP pin (*3) LEDR, LEDG, LEDB, BKLED, FLED1, FLED2 pin (*4) VNEG11, VNEG12, CAMN pin (*5) Except *1~ *4 pin o o (*6) Power dissipation deleting is 20mW/ C, when it’s used in over 25 C. It’s deleting is on the board that is ROHM’s standard. o ○Recommended operating conditions (Ta=-30 to 85 C) Unit V V V V V mW o C o C Condition Rating Min. Typ. Max. VBAT power supply voltage VBAT 2.7 3.6 4.5 VIO power supply voltage VIO 1.62 3.0 3.3 This product isn’t designed to protect itself against radioactive rays. Parameter Symbol Unit V V Condition REV. C 2/4 ○Electrical Characteristics o Unless otherwise specified, Ta=25 C, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V Parameter Circuit Current VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 VBAT Circuit current 5 Symbol IQ1 IQ2 IQ3 IQ5 Min. - Spec Typ. 0.5 0.1 6.2 11 Max. 3.0 3.0 9.3 16 Unit µA µA µA µA Condition RSTB=0V RSTB=0V, VIO=0V REGVCC ON (Energy save mode) REGVCC ON (Energy save mode) REG1 ON (Energy save mode) REG2 ON (Energy save mode) REGVCC ON (Normal Mode) SWREG1 ON (Vo=14V, Io=1mA) VBAT Circuit current 8 IQ8 - 26 39 mA SWREG3 ON (Vo=-10V, Io=1mA) (Add 30h=01h, Add 80h=01h) REGCP ON, REGCN ON SWREG1 (DC/DC for white LED and power supply for Camera ) FLED1 drive current 3 IFLED13 27.0 30.0 33.0 FLED2 drive current 3 IFLED23 27.0 30.0 33.0 BKLED drive current 3 IBKLED3 27.0 30.0 33.0 SWREG2 (DC/DC for RGB LED ) LEDR Drive current ILEDR22 135 150 165 (Large current) LEDG Drive current ILEDG22 135 150 165 (Large current) LEDB Drive current ILEDB22 135 150 165 (Large current) REGCP (15V/13V LDO) Output voltage 1 Output voltage 2 REGCN VO151 VO152 14.5 12.5 15.0 13.0 15.5 13.5 mA mA mA mA mA mA Add=80h Data=1Eh Add=80h Data=3Eh Add=90h Data=1Eh Add=A0h Data=0Ch Add=50h Data=1Eh Add=A0h Data=0Ah Add=60h Data=1Eh Add=A0h Data=09h Add=70h Data=1Eh V V Io=60mA, REGCPVSEL=0, VPLUS12=16V Io=60mA, REGCPVSEL=1, VPLUS12=14V (-8V/-7.5/-7V LDO) VO81 VO82 VO83 -8.5 -8.0 -7.5 -8.0 -7.5 -7.0 -7.5 -7.0 -6.5 V V V Io=100mA, VNEG12=-10V REGCNVSEL1=0, REGCNVSEL2=0 Io=100mA, VNEG12=-10V REGCNVSEL1=1/0, REGCNVSEL2=1 Io=100mA, VNEG12=-9V REGCNVSEL1=1, REGCNVSEL2=0 Output voltage 1 Output voltage 2 Output voltage 3 Constant current drive CURSENS pin control voltage 3 REG1 (3.0V/3.1V LDO) Output voltage 1 Output voltage 2 REG2 (1.8V/2.5V LDO) Output voltage 1 Output voltage 2 ICUR3 VO11 VO12 VO21 VO22 0.57 2.94 3.04 1.74 2.45 0.60 3.00 3.10 1.80 2.50 0.63 3.06 3.16 1.86 2.55 V V V V V Add=E0h, Data=FFh Io=150mA, REG1VSEL=0, REG1MD=1 Io=150mA, REG1VSEL=1, REG1MD=1 Io=100mA, REG2VSEL=L, REG2MD=1 Io=100mA, REG2VSEL=H, REG2MD=1 REV. C 3/4 ○External dimensions Type ○Terminals PIN A1 A2 T1 GND2 VBAT1 LEDR GND3 LEDB CAMN GND5 CAMP T2 VPLUS2 GND1 VBAT2 TRSW2 LEDG GND4 VNEG12 GND6 GND7 VPLUS12 SENSN2 SENSP2 PIN Name PIN C9 C10 D1 D2 D9 D10 E1 E2 E9 E10 F1 F2 F9 F10 G1 G2 G9 G10 H1 H2 H9 H10 PIN Name TESTO REG2O REG1CNT REG2CNT VBAT3 VBAT4 CUR CURSENS IREF REG1O LEDCTL REGVCCCNT SENSP3 VREF RSTB CLK VBAT5 VBAT6 DATA STRB VNEG11 TRSW3 PIN J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 K1 K2 K3 K4 K5 K6 K7 K8 K9 K10 VIO TESTI REG2VSEL VCC FLED2 FLED1 TRSW1 SENSP1 SENSN1 GND8 T4 GND11 VBAT8 BKLED GND10 VBAT7 GND9 VPLUS11 SENSN3 T3 PIN Name BD6023GU A A3 A4 A5 A6 LOT No. A7 A8 A9 A10 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 C1 C2 VCSP85H5 (64PIN) ○Block diagram (Unit : mm) VBAT1～8 SWREG1 PWM Comp ++ Current Limiter Over Voltage DET + -+ ERR Amp ERR Amp -+ OSC OSC +Current Limiter Over Voltage DET + Driver SWREG2 PWM Comp TRSW1 Driver TRSW2 SENSP2 SENSN2 VPLUS2 SENSP1 + - SENSN1 VPLUS11 VPLUS12 SEL LEDB LEDG LEDR SEL BKLED FLED1 TESTO VREF IREF Reference Voltage Reference Current LDO 2.45V VREF FLED2 IREF SWREG3 Current Limiter SENSP3 + VCC SENSN3 Power Supply Driver + REGVCCCNT VIO REG1CNT REG2CNT REG2VSEL Level TRSW3 Over Voltage DET PWM Comp + OSC ERR Amp + VNEG11 VNEG12 REGCP VPLUS12 CPU I/F VNEG12 Control CPU I/F LDO 15V/13V CLK DATA STRB RSTB LEDCTL TESTI T1 T2 T3 T4 Shift CAMP REGCN LDO -8V/-7.5V/-7V CAMN Logic CPU I/F REG1 LDO 3.0V/3.1V REG1O REG2 CPU I/F LDO 1.8V/2.5V REG2O + 8BIT DAC CUR CURSENS GND1～11 REV. C 4/4 ○Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) LDO Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it has the possibility that a operation becomes unstable. (11) DC/DC converter Please select the low DCR inductors to decrease power loss for DC/DC converter. (12) Other cautions on use Please consult supplementary documents such as technical notebook, function manual and application design guide of this LSI. REV. C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). 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