BD6025GU_09

1/4 Structure Product Name Silicon Monolithic Integrated Circuit Power supply for CCD camera / White LED driver / RGB LED driver for mobile phone Type BD6025GU A system power supply for the CCD camera module Built-in white LED driver and RGB LED driver Features o ○Absolute Maximum Ratings (Ta=25 C) Parameter Symbol Rating Unit Condition Maximum Applied Voltage 1 VMAX1 20(*1) V Maximum Applied Voltage 2 VMAX2 16(*2) V Maximum Applied Voltage 3 VMAX3 15(*3) V Maximum Applied Voltage 4 VMAX4 -13.5(*4) V Maximum Applied Voltage 5 VMAX5 6(*5) V Power Dissipation Pd 2413(*6) mW o Operating Temperature Range Topr -30 to 85 C o Storage Temperature Range Tstg -55 to 150 C (*1) VPLUS11, VPLUS12, SBD, SBDSENS, VPLUS2 pin (*2) CAMP, CAMPS pin (*3) LEDR, LEDG, LEDB, BKLED, FLED1 pin (*4) VNEG, CAMN, CAMNS pin (*5) Except Note1~Note4 pin (*6) Power dissipation deleting is 19.3mW/ oC, when it’s used in over 25 oC. (It’s deleting is on the board that is ROHM’s standard)） o ○Recommended operating conditions (VBAT≥VIO, Ta=-30 to 85 C) Rating Min. Typ. Max. VBAT input voltage VBAT 2.7 3.6 4.5 VIO input voltage VIO 1.62 3.3 This product isn’t designed to protect itself against radioactive rays. Parameter Symbol Unit V V Condition REV. C 2/4 ○Electrical Characteristics o Unless otherwise specified, Ta=25 C, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V Parameter Circuit Current VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 VBAT Circuit current 5 Symbol IQ1 IQ2 IQ3 IQ5 Min. - Spec Typ. 0.5 0.1 6.2 11 Max. 3.0 3.0 9.3 16 Unit µA µA µA µA Condition RSTB=0V RSTB=0V, VIO=0V REGVCC ON (Energy save mode) REGVCC ON (Energy save mode) REG1 ON (Energy save mode) REG2 ON (Energy save mode) REGVCC ON (Nomal Mode) VBAT Circuit current 8 IQ8 - 17 26 mA SWREG1 ON (Vo=14V, Io=1mA) (Add 30h=01h, Add 80h=01h) REGCP ON, REGCN ON SWREG1 ( DC/DC for White LED and Power supply for Camera ) FLED1 drive current 3 IFLED13 27.0 30.0 33.0 BKLED drive current 3 IBKLED3 27.0 30.0 33.0 SWREG2 ( DC/DC for RGB LED ) LEDR Drive current ILEDR22 135 150 165 (Large current) LEDG Drive current ILEDG22 135 150 165 (Large current) LEDB Drive current ILEDB22 135 150 165 (Large current) REGCP (15V/13V/12V LDO) Output voltage 1 Output voltage 2 Output voltage 3 REGCN VO151 VO152 VO153 14.5 12.5 11.5 15.0 13.0 12.0 15.5 13.5 12.5 mA mA mA mA mA Add=80h Data=1Eh Add=90h Data=1Eh Add=A0h Data=0Ch Add=50h Data=1Eh Add=A0h Data=0Ah Add=60h Data=1Eh Add=A0h Data=09h Add=70h Data=1Eh V V V Io=60mA, VPLUS12=16V REGCPVSEL1=0, REGCPVSEL2=0 Io=60mA, VPLUS12=15V REGCPVSEL1=1, REGCPVSEL2=0 Io=60mA, VPLUS12=15V REGCPVSEL1=1, REGCPVSEL2=1 (-8V/-7.5/-7V LDO) VO81 VO82 VO83 VO12 VO22 -8.5 -8.0 -7.5 3.04 1.74 -8.0 -7.5 -7.0 3.1 1.8 -7.5 -7.0 -6.5 3.16 1.86 V V V V V Io=50mA, VNEG=-10V REGCNVSEL1=0, REGCNVSEL2=0 Io=50mA, VNEG=-10V REGCNVSEL1=1/0, REGCNVSEL2=1 Io=50mA, VNEG=-9V REGCNVSEL1=1, REGCNVSEL2=0 Output voltage 1 Output voltage 2 Output voltage 3 REG1 (3.0V/3.1V LDO) Output voltage 2 REG2 (1.2V/1.8V LDO) Output voltage 3 Io=150mA, REG1VSEL=1,REG1MD=1 Io=100mA, REG2VSEL=H,REG2MD=1 REV. C 3/4 ○External dimensions ○Terminals PIN A1 T1 GND2 VBAT1 LEDR GND3 LEDB CAMN VNEG GND6 T2 VPLUS2 GND1 VBAT2 TRSW2 LEDG GND4 CAMNS GND5 GND7 VPLUS12 SENSP2 GND14 PIN Name PIN C9 C10 D1 D2 D9 D10 E1 E2 E9 E10 F1 F2 F9 F10 G1 G2 G9 G10 H1 H2 H9 H10 PIN Name CAMPS CAMP REG2CNT SENSN2 TESTO REG2O VBAT8 TESTVCC VBAT4 VBAT3 LEDCTL REG1CNT VREF REG1O RSTB CLK SBDSENS IREF DATA STRB GND8 VBAT5 PIN J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 K1 K2 K3 K4 K5 K6 K7 K8 K9 K10 VIO TESTI REG2VSEL VCC GND12 FLED1 TRSW1 SENSP1 GND9 SBD T4 GND13 VBAT7 BKLED GND11 VBAT6 GND10 VPLUS11 SENSN1 T3 PIN Name Type A2 BD6025GU A3 A4 A5 LOT No. A6 A7 A8 A9 A10 B1 B2 B3 B4 B5 B6 (Ф0.15) INDEX POST B7 B8 B9 B10 C1 C2 VCSP85H5 (64PIN) ○Block diagram (Unit : mm) VBAT1～8 SWREG1 Driver TRSW2 SWREG2 PWM Comp +-+ OSC OSC -+ ERR Amp ERR Amp +Current Limiter Over Voltage DET + VPLUS11 TRSW1 Driver SENSP1 + - PWM Comp Current Limiter Over Voltage DET + SENSP2 + - SENSN1 SENSN2 VPLUS2 SEL LEDB SEL LEDG LEDR BKLED FLED1 TESTO VREF Reference Voltage Reference Current LDO 2.45V VREF VPLUS12 IREF IREF VCC VPLUS11 CPU I/F Power Supply Clamp LDO SBD SBDSENS RSTB VIO REG1CNT REGCP LDO 15V/13V/12V REGCN LDO -8V/-7.5V/-7V REG1 LDO 3.0V/3.1V REG2 LDO 1.2V/1.8V VNEG REG2CNT VPLUS12 CPU I/F CAMP CAMPS REG2VSEL VNEG CPU I/F Level CLK Shift CPU I/F DATA STRB Control Logic CPU I/F CAMN CAMNS REG1O REG2O LEDCTL T1 T2 TESTI TESTVCC T3 T4 GND1～14 REV. C 4/4 ○Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD)circuit. A thermal shutdown circuit works when the junction temperature is beyond detection temperature. Then, a part of the LSI or all is made a state of off. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) LDO Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it has the possibility that a operation becomes unstable. (11) DC/DC converter Please select the low DCR inductors to decrease power loss for DC/DC converter. Please choose the external parts not to exceed "Maximum Ratings" of the coil, the switching transistor, the diode and the resistance for the electric current detection". (12) Other cautions on use Please consult supplementary documents such as technical notebook, function manual and application notebook of this LSI. REV. C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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