Datasheet
For Air-Conditioner Fan Motor
3-Phase Brushless Fan Motor
Controller
BD62018AFS
General Description
Key Specifications
Duty Control Voltage Range:
Phase Control Range:
Maximum Junction Temperature:
This controller synthesizes the optimal driving signal from
hall sensor signals, and outputs the synthesized signal to
control the external power transistor. The replacement is
also easy because of its pin compatibility with
BD62011AFS. This controller provides optimum motor
drive for a wide variety of applications, and enables
motor unit standardization.
Features
Package
180° Sinusoidal Commutation Logic
PWM Control (Upper and lower arm switching)
Phase control supported from 0° to +40° at 1° intervals
Rotational Direction Switch
FG signal output with pulse number switch (4 or 12)
VREG Output (5V/30mA)
Protection Circuits Provided: OCP, TSD, UVLO, MLP
and the external fault input
2.1V to 5.4V
0° to +40°
+150°C
W(Typ) x D(Typ) x H(Max)
SSOP-A24
10.0mm x 7.8mm x 2.1mm
Applications
Air Conditioners; Air Purifiers; Water Pumps;
Dishwashers; Washing Machines
SSOP-A24
Typical Application Circuit
FG
Q1
VREG
R1
VSP
R8
DTR
R9
C14
C7
C13
C1
C2~C4
R2
HW HV
R2'
VREG
C8
HU
R5
C11
M
C5
R4
R3
C9
C10
R7
VCC
GND
D1
C6
C12
R6
VDC
Figure 1. Application Circuit Example
〇Product structure : Silicon monolithic integrated circuit
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BD62018AFS
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Block Diagram and Pin Configuration ............................................................................................................................................. 3
Pin Description................................................................................................................................................................................ 3
Description of Blocks ...................................................................................................................................................................... 4
Controller Outputs and Operation Mode Summary ......................................................................................................................... 7
Absolute Maximum Ratings .......................................................................................................................................................... 8
Thermal Resistance ........................................................................................................................................................................ 8
Recommended Operating Conditions ............................................................................................................................................ 8
Electrical Characteristics ............................................................................................................................................................... 9
Typical Performance Curves (Reference Data) ............................................................................................................................ 10
Timing Chart ............................................................................................................................................................................... 16
Application Example ..................................................................................................................................................................... 18
Parts List ....................................................................................................................................................................................... 18
I/O Equivalent Circuits .................................................................................................................................................................. 19
Operational Notes ......................................................................................................................................................................... 20
Ordering Information ..................................................................................................................................................................... 22
Marking Diagrams......................................................................................................................................................................... 22
Physical Dimension, Tape and Reel Information .......................................................................................................................... 23
Revision History ............................................................................................................................................................................ 24
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BD62018AFS
Block Diagram and Pin Configuration
VCC
3
VCC
VREG
HU
HV
HW
UVLO
TSD
VDC
VREG
HUP
21
10
HUN
UH
20
9
UL
8
VH
HVP
19
HVN
18
7
VL
HWP
17
6
WH
HWN
16
5
WL
FG
14
4
RCL
LOGIC
FGS
13
12
FIB
3
FILTER
6
6
VREG
A/D
11
V/I
VSP
RT
GND
RT
VCC
RCL
WL
WH
VL
VH
UL
UH
FIB
CCW
VREG
VREG
CCW
DRIVER
Gate Driver & MOSFET
22
VREG
15
23
PC
24
PCT
TEST
2
PCT
PC
VREG
HUP
HUN
HVP
HVN
HWP
HWN
VSP
FG
FGS
SINUSOIDAL
WAVE GENE.
OSC
1
GND
Figure 3. Pin Configuration
(Top View)
Figure 2. Block Diagram
Pin Description
No.
Name
1
GND
2
RT
3
Function
No.
Name
Signal ground
24
PCT
Carrier frequency setting pin
23
PC
VCC
Power supply
22
VREG
4
RCL
Over current sense pin
21
HUP
Hall input pin phase U+
5
WL
Low side driver output phase W
20
HUN
Hall input pin phase U-
6
WH
High side driver output phase W
19
HVP
Hall input pin phase V+
7
VL
Low side driver output phase V
18
HVN
Hall input pin phase V-
8
VH
High side driver output phase V
17
HWP
Hall input pin phase W+
9
UL
Low side driver output phase U
16
HWN
Hall input pin phase W-
10
UH
High side driver output phase U
15
VSP
Duty control voltage input pin
11
FIB
External fault input (Low active)
14
FG
12
CCW
Direction switch (H:CCW)
13
FGS
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Function
VSP offset voltage output pin
Phase control input pin
Regulator output
FG signal output
FG pulse # switch (H:12, L:4)
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BD62018AFS
Description of Blocks
1. Commutation Logic
When the hall cycle is about 5-Hz or less (e.g. when the motor starts up), the commutation mode is 120° square wave
drive with upper and lower switching (no lead angle). The controller monitors the hall cycle, and switches to 180°
sinusoidal commutation drive when the hall cycle reaches or exceeds about 5-Hz. Once switched to 180° sinusoidal
commutation drive, the controller keeps the operation until the hall cycle is less than about 2-Hz. When the hall cycle is
less than about 2-Hz, the controller switches to 120° square wave drive. Refer to the timing charts in Figures 31 and 32.
Table 1. 120° Commutation (Six-State) Truth Table (CW)
HU
H
H
H
L
L
L
HV
HW
L
L
H
H
H
L
H
L
L
L
H
H
UH
L
VH
PWM
L
L
L
L
PWM
L
PWM
L
L
PWM
WH
L
PWM
PWM
L
L
L
UL
VL
WL
--------------------
H
PWM
H
L
L
PWM
--------------------
H
--------------------
PWM
--------------------
PWM
PWM
H
L
L
H
--------------------
L
L
--------------------
PWM
H
2. Duty Control
The switching duty can be controlled by forcing DC voltage with value from VSPMIN to VSPMAX to the VSP pin. When the
VSP voltage is higher than VSPTST, the controller forces PC pin voltage to ground (Testing mode, maximum duty and no
lead angle). The VSP pin is pulled down internally by a 200 kΩ resistor. Therefore, note the impedance when setting the
VSP voltage with a resistance voltage divider.
3. Carrier Frequency Setting
The carrier frequency setting can be freely adjusted by connecting an external resistor
between the RT pin and ground. The RT pin is biased to a constant voltage, which
determines the charge current to the internal capacitor. Carrier frequencies can be set
within a range from about 16 kHz to 50 kHz. Refer to the formula to the right.
f OSC [kHz]
400
RT [ k ]
4. FG Signal Output
The FG signal is output from the FG pin. Refer to the timing charts in Figures
31 and 32. The FG signal is generated from the hall signal.
It is recommended to pull up FGS pin to VREG voltage when malfunctioning
because of the noise.
FGS
No. of pulse
H
12
L
4
CCW
Direction
H
CCW
L
CW
5. Direction of Motor Rotation Setting
The direction of rotation may be switched by the CCW pin. When CCW pin is
“H” or open, the motor rotates at CCW direction. When the real direction is
different from the setting, the commutation mode is 120° square wave drive
(no lead angle). It is recommended to pull up CCW pin to VREG voltage
when malfunctioning because of the noise.
6. Hall Signal Comparator
The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements
should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, VHALLMIN.
We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 µF, between the differential input pins of
the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range V HALLCM.
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Description of Blocks - continued
7. Output Duty Pulse Width Limiter
Pulse width duty is controlled during PWM switching in order to ensure the operation of external power transistor. The
controller doesn’t output pulse of less than tMIN (0.8µs minimum). Dead time is forcibly provided to prevent external power
transistors from turning-on simultaneously in upper and lower side in driver output (for example, UH and UL) of each arm.
This will not overlap the minimum time tDT (1.6µs minimum). Because of this, the maximum duty of 120° square wave
drive at start up is 90% (typical).
8. Phase Control Setting
The driving signal phase can be advanced to the hall signal for phase control. The lead angle is set by forcing DC voltage
to the PC pin. The input voltage is converted digitally by a 6-bit A/D converter, in which internal VREG voltage is assumed
to be full-scale, and the converted data is processed by a logic circuit. The lead angle can be set from 0° to +40° at 1°
intervals, and updated fourth hall cycle of phase W falling edge. Phase control function only operates at sinusoidal
commutation mode. However, the controller forces PC pin voltage to ground (no lead angle) during testing mode. The
VSP offset voltage (Figure 27) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The
internal bias current is determined by PCT voltage and the resistor value (VPCT / RPCT), and mixed to PC pin. As a result,
the lead angle setting is followed with the duty control voltage, and the performance of the motor can be improved. Select
the RPCT value from 50 kΩ to 200 kΩ in the range on the basis of 100 kΩ, because the PCT pin current capability is a 100
µA or less.
VPCT = VSP-VSPMIN
VSP
VSPMIN
PCT
L.A.
VPCT
RPCT
L.A.
PC
ADC
RPCL
RPCT
VSP
Figure 4. Phase Control Setting Example 1
VREG
VPCT = VSP-VSPMIN
VSP
VSPMIN
PCT
L.A.
VPCT
RPCT
L.A.
RPCH
PC
ADC
RPCL
RPCT
VSP
Figure 5. Phase Control Setting Example 2
9. Overcurrent Protection (OCP) Circuit
The over current protection circuit can be activated by connecting a low value resistor for current detection between the
external output stage ground and the controller IC ground. When the RCL pin voltage reaches or surpasses the threshold
value, the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus initiating the overcurrent
protection operation. When the RCL pin voltage swings below the ground, it is recommended to insert a resistor (1.5 kΩ or
more) between RCL pin and current detection resistor to prevent malfunction. Since this protection circuit is not a latch
type, it returns to normal operation (synchronizing with the carrier frequency) once the RCL pin voltage falls below the
threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when
a short pulse of less than tRCL is present at the input.
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Description of Blocks - continued
10. Under Voltage Lock Out (UVLO) Circuit
To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions,
an UVLO circuit is built into this controller. When the power supply voltage falls to VUVL and below, the controller forces all
driver outputs low. When the voltage rises to VUVH and above, the UVLO circuit ends the lock out operation and returns the
chip to normal operation.
The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release
operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes VUVH or
more.
11. Thermal Shutdown (TSD) Circuit
The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (175°C nominal).
At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit, the chip
returns to normal operation when the junction temperature falls below the preset temperature (150°C nominal). The TSD
circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its
operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not use
the IC in an environment where activation of the circuit is assumed.
12. Motor Lock Protection (MLP) Circuit
When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal
doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to
normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage VSPMIN, and note that
the motor cannot start up when the controller doesn’t detect the motor rotation by the minimum duty control.
13. External Fault Signal Input Pin (FIB pin, Low Active)
The FIB pin can force all controller driver outputs low at any time. The FIB pin is pulled up to VREG internally by a 100 kΩ
resistor. Therefore, an open drain output can be connected directly. It is recommended to pull up FIB pin to VREG voltage
when this function is not used and malfunctioning because of the noise.
14. Hall Signal Wrong Input Detection
Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high
or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the
abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and
latches the state. It is released if the duty control voltage VSP is forced to ground level once.
15. VREG Output
The internal voltage regulator VREG is output for the bias of the
hall element and the phase control setting. However, when using
the VREG function, be aware of the IOMAX value. If a capacitor is
connected to the ground in order to stabilize output, a value of 1 µF
or more should be used. In this case, be sure to confirm that there is
no oscillation in the output.
VCC
VREG
R1
HUP
HU
HUN
HV
HVN
HW
HWN
HVP
HWP
Controller IC
Figure 6. VREG Output Pin Application Example
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Controller Outputs and Operation Mode Summary
Detected direction
Forward (CW:U~V~W, CCW:U~W~V)
Reverse (CW:U~W~V, CCW:U~V~W)
Conditions
Hall sensor frequency
5Hz ≤
< 2Hz
VSP < VSPMIN
(Duty off)
Normal
operation
VSPMIN < VSP < VSPMAX
(Control range)
VSPTST < VSP
(Testing mode)
Overcurrent
< 2Hz
5Hz ≤
Upper and lower arm off
120°
Upper and lower
switching
180° sinusoidal
Upper and lower switching
180° sinusoidal
Upper and lower switching
(No lead angle)
120°
Upper and lower
switching
Upper arm off
120°
Upper switching
Upper and lower arm off
TSD
Protect
operation
External input
Upper and lower arm off
UVLO
Motor lock
Upper and lower arm off and latch
Hall sensor abnormally
(Note)
(Note)
The controller monitors both edges of three hall sensors for detecting period.
Phase control function only operates at sinusoidal commutation mode. However, the controller forces no lead angle during the testing mode.
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Absolute Maximum Ratings (Tj=25°C)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VCC
20(Note 1)
V
Duty Control Voltage
VSP
-0.3 to +20
V
All Others
VI/O
-0.3 to +5.5
V
Driver Outputs
IOMAX(OUT)
±15(Note 1)
mA
Monitor Output
IOMAX(FG)
±5(Note 1)
mA
IOMAX(VREG)
-40(Note 1)
mA
Tstg
-55 to +150
°C
Tjmax
150
°C
VREG Output
Storage Temperature Range
Maximum Junction Temperature
(Note) All voltages are with respect to ground unless otherwise specified.
(Note 1) Do not, however, exceed ASO.
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC
is operated over the absolute maximum ratings.
Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 4)
2s2p(Note 5)
Unit
SSOP-A24
Junction to Ambient
θJA
104.4
54.1
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
7
6
°C/W
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
Recommended Operating Conditions (Tj=25°C)
Parameter
Supply Voltage
Junction Temperature
Symbol
Min
Typ
Max
Unit
VCC
10
15
18
V
Tj
-40
-
+110
°C
(Note) All voltages are with respect to ground unless otherwise specified.
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Electrical Characteristics (Unless otherwise specified VCC=15V and Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Supply Current
ICC
2.0
3.0
5.0
mA
VREG Voltage
VREG
4.5
5.0
5.5
V
IO=-30mA
Output High Voltage
VOH
VREG-0.60
VREG-0.20
VREG
V
IO=-5mA
Output Low Voltage
VOL
0
0.14
0.60
V
IO=5mA
Dead Time
tDT
1.6
2.0
2.4
µs
Minimum Pulse Width
tMIN
0.8
1.0
1.2
µs
Power Supply
Driver outputs
Hall Comparators
Input Bias Current
IHALL
-2.0
-0.1
+2.0
µA
Common Mode Input
VHALLCM
0
-
VREG-1.5
V
Minimum Input Level
VHALLMIN
50
-
-
mVp-p
Hysteresis Voltage P
VHALLHY+
5
13
23
mV
Hysteresis Voltage N
VHALLHY-
-23
-13
-5
mV
ISP
15
25
35
µA
Duty Minimum Voltage
VSPMIN
1.8
2.1
2.4
V
Duty Maximum Voltage
VSPMAX
5.1
5.4
5.7
V
Testing Operation Range
VIN=0 V
Duty Control
Input Bias Current
VIN=5V
VSPTST
8.2
-
18
V
Minimum Output Duty
DMIN
1.2
1.8
2.4
%
fOSC=18kHz
Maximum Output Duty
DMAX
-
100
-
%
fOSC=18kHz
VIN=0V
Mode switch and the external input - FGS, CCW and FIB
Input Bias Current
IIN
-70
-50
-30
µA
Input High Voltage
VINH
3
-
VREG
V
Input Low Voltage
VINL
0
-
1
V
Hysteresis Voltage
VINHY
0.2
0.5
0.8
V
Output High Voltage
VMONH
VREG-0.40
VREG-0.08
VREG
V
IO=-2mA
Output Low Voltage
VMONL
0
0.06
0.40
V
IO=2mA
VIN=0V
Monitor Output - FG
Overcurrent protection
Input Bias Current
IRCL
-30
-20
-10
µA
Threshold Voltage
VRCL
0.48
0.50
0.52
V
Noise Masking Time
tRCL
0.8
1.0
1.2
µs
Phase Control
Minimum Lead Angle
PMIN
-
0
1
deg
VPC=0V
Maximum Lead Angle
PMAX
39
40
-
deg
VPC=2/3·VREG
fOSC
16
18
20
kHz
RT=22kΩ
Release Voltage
VUVH
8.5
9.0
9.5
V
Lockout Voltage
VUVL
7.5
8.0
8.5
V
Hysteresis Voltage
VUVHY
0.5
1.0
1.5
V
Carrier Frequency Oscillator
Carrier Frequency
Under Voltage Lock Out
(Note) All voltages are with respect to ground unless otherwise specified.
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Typical Performance Curves (Reference Data)
4
5.4
VREG voltage : VREG [V]
Circuit Current : ICC [mA]
+25°C
+110°C
-40°C
3
2
1
+110°C
+25°C
-40°C
0
9
12
15
18
5.2
5.0
4.8
4.6
21
9
12
Supply Voltage : VCC [V]
18
21
Supply Voltage : VCC [V]
Figure 7. Quiescence Current
Figure 8. VREG vs VCC
5.4
0.0
Output Drop Voltage : ΔVOH [V]
+25°C
+110°C
-40°C
VREG Voltage : VREG [V]
15
5.2
5.0
4.8
4.6
-0.4
-0.8
-1.2
-40°C
+25°C
+110°C
-1.6
0
10
20
30
40
Output Current : IOUT [mA]
4
8
12
16
Output Current : IOUT [mA]
Figure 9. VREG Drive Capability
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Figure 10. High Side Output Voltage
(XH, XL)
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Typical Performance Curves (Reference Data) - continued
1.6
0.00
Input Bias Current : IHALL [µA]
Output Voltage : VOL [V]
+110°C
+25°C
-40°C
1.2
0.8
0.4
-0.05
-0.10
-0.15
+110°C
+25°C
-40°C
0.0
-0.20
0
4
8
12
16
0
Output Current : IOUT [mA]
2
3
4
Input Voltage : VIN [V]
Figure 11. Low Side Output Voltage
(XH, XL)
Figure 12. Hall Comparator Input Bias Current
(HXP, HXN)
6
200
+110°C
+25°C
-40°C
Input Bias Current : ISP [µA]
5
Internal Output Voltage : [V]
1
4
3
2
1
150
100
50
+110°C
+25°C
-40°C
0
+110°C
+25°C
-40°C
0
-1
-30
-15
0
15
0
30
10
15
20
VSP Voltage : VSP [V]
Differential Voltage : VHUP-VHUN [mV]
Figure 13. Hall Comparator Hysteresis Voltage
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Figure 14. VSP Input Bias Current
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Typical Performance Curves (Reference Data) - continued
100
1.5
Internal Logic Value : H/L [-]
Output Duty : DSP [%]
80
60
40
+110°C
+25°C
-40°C
20
0
1.0
0.5
0.0
+110°C
+25°C
-40°C
-0.5
0
2
4
6
8
0
VSP Voltage : VSP [V]
10
15
20
VSP Voltage : VSP [V]
Figure 15. Output Duty vs VSP Voltage
Figure 16. Testing Mode Threshold Voltage
0.0
0.8
+110°C
+25°C
-40°C
Output Voltage : VOL [V]
Output Drop Voltage : ΔVOH [V]
5
-0.2
-0.4
-0.6
-40°C
+25°C
+110°C
2
4
Output Current : IOUT [mA]
6
Figure 17. High Side Output Voltage
(FG)
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0.4
0.2
-0.8
0
0.6
0.0
0
2
4
Output Current : IOUT [mA]
6
Figure 18. Low Side Output Voltage
(FG)
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BD62018AFS
Typical Performance Curves (Reference Data) - continued
60
1.5
Internal Logic Value : H/L [-]
Input Bias Current : IIN [µA]
50
40
30
20
10
0
1.0
0.5
0.0
-0.5
0
1
2
3
4
5
1.7
Input Voltage : VIN [V]
1.9
2.1
2.3
2.5
2.7
2.9
Input Voltage : VIN [V]
Figure 19. Input Bias Current
(CCW, FIB)
Figure 20. Input Threshold Voltage
(CCW, FIB)
30
1.5
+110°C
+25°C
-40°C
1.0
Internal Logic Value : H/L [-]
RCL Input Bias Current : IRCL [µA]
+110°C
+25°C
-40°C
+110°C
+25°C
-40°C
+110°C
+25°C
-40°C
20
10
0
0
1
2
3
4
5
RCL Input Voltage : VRCL [V]
0.0
+110°C
+25°C
-40°C
-0.5
0.48
0.49
0.50
0.51
0.52
Input Voltage : VRCL [V]
Figure 21. RCL Input Bias Current
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0.5
Figure 22. RCL Input Threshold Voltage
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BD62018AFS
Typical Performance Curves (Reference Data) - continued
60
1.5
Internal Logic Value : H/L [-]
Input Bias Current : IIN [µA]
50
+110°C
+25°C
-40°C
+110°C
+25°C
-40°C
+110°C
+25°C
-40°C
40
30
20
10
1.0
0.5
0.0
-0.5
0
0
1
2
3
4
1.7
5
1.9
2.1
2.3
2.5
2.7
2.9
Input Voltage : VIN [V]
Input Voltage : VIN [V]
Figure 23. Input Bias Current
(FGS)
Figure 24. Input Threshold Voltage
(FGS)
6
1.5
1.0
UH Voltage : VUH [V]
Internal Logic Value : H/L [-]
5
0.5
4
-40°C
+110°C
+25°C
3
+110°C
-40°C
+25°C
2
0.0
1
0
-0.5
125
150
175
200
7.5
8.0
8.5
9.0
9.5
10.0
Supply Voltage : VCC [V]
Junction Temperature : Tj [°C]
Figure 25. Thermal Shut Down
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7.0
Figure 26. Under Voltage Lock Out
(VCC)
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BD62018AFS
Typical Performance Curves (Reference Data) - continued
5
4
PC Voltage : VPC [V]
PCT Voltage : VPCT [V]
4
3
2
+110°C
+25°C
-40°C
3
2
1
1
+110°C
-40°C
+25°C
0
0
0
1
2
3
4
5
6
0
7
2
3
4
PCT Voltage : VPCT [V]
VSP Voltage : VSP [V]
Figure 27. VSP vs PCT Offset Voltage
Figure 28. PCT vs PC Linearity
(RPCT=RPC=100kΩ)
60
30
Frequency : fOSC [kHz]
+110°C
+25°C
-40°C
50
Phase : LA [deg]
1
40
30
20
+110°C
+25°C
-40°C
25
20
15
10
0
10
0.0
0.2
0.4
0.6
0.8
1.0
VPC/VREG (Normalized) : [V/V]
18
22
26
30
External Resistor : RT [kΩ]
Figure 29. PC Voltage Normalized vs Lead Angle
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14
Figure 30. Carrier Frequency vs RT
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BD62018AFS
Timing Chart (CW)
Hall signals
HALL U
HALL V
HALL W
Spin up (Hall period: 5Hz/2Hz)
UH
VHPWM
WH
PWM
PWM
UL
PWM
PWM
PWM
PWM
VLPWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
CW direction (lead=0deg)
UH
VH
WH
UL
VL
WL
CW direction (lead=30deg)
UH
VH
WH
UL
VL
WL
FG output
FG(12pulses)
FG(4pulses)
Figure 31. Timing Chart (Clockwise)
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BD62018AFS
Timing Chart (CCW)
Hall signals
HALL U
HALL V
HALL W
Spin up (Hall period: 5Hz/2Hz)
UH
PWM
PWM
VHPWM
PWM
WH
UL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
VLPWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
CCW direction (lead=0deg)
UH
VH
WH
UL
VL
WL
CCW direction (lead=30deg)
UH
VH
WH
UL
VL
WL
FG output
FG(12pulses)
FG(4pulses)
Figure 32. Timing Chart (Counter Clockwise)
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BD62018AFS
Application Example
FG
Q1
VREG
R1
VSP
R8
DTR
IC1
R9
C14
C7
C13
C1
C2~C4
R2
HW HV
VREG
C8
HU
R5
C11
R2'
M
C5
R3
R4
C9
C10
R7
VCC
GND
D1
C6
IC2
C12
R6
VDC
Figure 33. Application Example (180° Sinusoidal Commutation Driver, CCW="H", FGS="H")
Parts List
Parts
Value
Manufacturer
Type
Parts
Value
Ratings
Type
IC1
-
ROHM
BD62018AFS
IC2
-
ROHM
BM6202FS
C1
0.1µF
50V
Ceramic
C2
2200pF
50V
Ceramic
R1
1kΩ
ROHM
R2
150Ω
ROHM
MCR18EZPF1001
C3
2200pF
50V
Ceramic
MCR18EZPJ151
C4
2200pF
50V
Ceramic
R3
22kΩ
R4
100kΩ
ROHM
MCR18EZPF2202
C5
10µF
50V
Ceramic
ROHM
MCR18EZPF1003
C6
10µF
50V
Ceramic
R5
51kΩ
ROHM
MCR18EZPF5102
C7
1µF
50V
Ceramic
R6
0.5Ω
ROHM
MCR50JZHFL1R50 // 3
C8
1µF
50V
Ceramic
R7
10kΩ
ROHM
MCR18EZPF1002
C9
1µF
50V
Ceramic
R8
0Ω
ROHM
MCR18EZPJ000
C10
0.1µF
50V
Ceramic
R9
0Ω
ROHM
MCR18EZPJ000
C11
1µF
50V
Ceramic
Q1
-
ROHM
DTC124EUA
C12
100pF
50V
Ceramic
D1
-
ROHM
KDZV20B
C13
0.1µF
630V
Ceramic
C14
0.1µF
50V
Ceramic
HX
-
-
Hall elements
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BD62018AFS
I/O Equivalent Circuits
VCC
VREG
VREG
100k
VSP
RT
VREG
100k
250k
RCL
2k
Figure 34. RT
Figure 35. RCL
Figure 36. VSP
VREG
VREG
HUP
HUN
HVP
HVN
HWP
HWN
UH,VH,WH
UL,VL,WL
FG
Figure 38. XH, XL, FG
VREG
Figure 37. VREG, VCC
2k
Figure 39. HXP, HXN
VREG
VREG
100k
FGS
2k
2k
CCW
PC
FIB
2k
PCT
Figure 40. FGS, CCW, FIB
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Figure 41. PC, PCT
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BD62018AFS
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins
that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back
EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause
the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics,
supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground
voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the
IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage
from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin
shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional
solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply
or ground line.
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20/24
TSZ02201-0P1P0CB02020-1-2
22.Jan.2018 Rev.001
BD62018AFS
11. Regarding the Input Pin of the IC
Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins
that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the
IC.
When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is judged
that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be implemented
with this product or its application circuits, it is important to take physical safety measures, such as providing
voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or
ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited
with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.
This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as
applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Resistor
Transistor(NPN)
Pin B
Pin A
E
Pin A
C
P
N
P+ N
Pin B
B
C
N
P+ N
Parasitic
Elements
N
P+
N
P
N
B
P+ N
E
P Substrate
Parasitic
Elements
N
P Substrate
GND
Parasitic
Elements
GND
GND
N Region
close-by
Parasitic
Elements
Figure 42. Example of IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation
(ASO).
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BD62018AFS
Ordering Information
B D
6
2
0
1
Parts Number
8
A
F S
Package
FS : SSOP-A24
-
E
2
Packaging specification
E2 : Embossed tape and reel
Marking Diagrams
SSOP-A24(TOP VIEW)
Part Number Marking
BD62018FS
LOT Number
A
Pin 1 Mark
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TSZ22111 • 15 • 001
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BD62018AFS
Physical Dimension, Tape and Reel Information
Package Name
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TSZ22111 • 15 • 001
SSOP-A24
23/24
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22.Jan.2018 Rev.001
BD62018AFS
Revision History
Date
Revision
22.Jan.2018
001
Changes
New Release
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TSZ22111 • 15 • 001
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
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