Datasheet
36 V High Performance, High Reliability
2ch DC Brush Motor Driver
BD62221MUV
General Description
Key Specifications
BD62221MUV is a built in 2 channel H-bridge motor
driver for 2 DC brush motors or 1 stepper motor. This
driver can facilitate low power consumption by direct
PWM control or PWM constant current control.
There are built in protection circuits in this IC. It is
possible to output an abnormal detection signal that
notifies each protection circuit operation, which
contributes to set high reliability.
Input Voltage Range:
8 V to 28 V
Rated Output Current (Continuous): 2.0 A/Phase
Rated Output Current (Peak Value): 3.0 A/Phase
Operating Temperature Range: -25 °C to +85 °C
Output ON Resistance:
0.55 Ω (Typ)
Package
VQFN032V5050
W (Typ) x D (Typ) x H (Max)
5.0 mm x 5.0 mm x 1.0 mm
Features
Single Power Supply Input (Rated Voltage of 36V)
Rated Output Current: 2.0A/Phase
Rated Output Current (Peak): 3.0 A/Phase
Low ON Resistance DMOS Output
Forward, Reverse, Brake, Open Function
Power Save Function
Direct PWM Control
PWM Constant Current Control
(Current Limit Function)
Peak Current Limit
(Current Limit Function)
Built-in Spike Noise Cancel Function
(External Noise Filter is Unnecessary)
Driver for 2 DC Brush Motor
Driver for 1 Stepper Motor
FULL STEP and HALF STEP Functionality
(Driving Stepper Motor)
µSTEP Drive Functionality by External DAC
(Driving Stepper motor)
Built-in Logic Input Pull-Down Resistor
Cross Conduction Prevention Circuit
Output Detection Signal during Abnormal States
Thermal Shutdown Circuit (TSD)
Over Current Protection Circuit (OCP)
Under Voltage Lock Out Circuit (UVLO)
Over Voltage Lock Out Circuit (OVLO)
Protects Against Malfunction when Power Supply is
Disconnected (Ghost Supply Prevention Function)
Adjacent Pins Short Protection
Microminiature, Ultra-thin and High Heat-radiation
(Exposed Metal Type) Package
Typical Application Circuit
VREF1
VREF2
CR
SELECT
IN1A
IN1B
VCC1
OUT1A
OUT1B
M
RNF1
RNF1S
VCC2
Applications
PPC, Multi-function Printer, Laser Printer, Inkjet
Printer, Photo Printer, FAX, Mini Printer and etc.
〇Product structure : Silicon integrated circuit
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TSDDET
OCPDET1
OCPDET2
IN2A
IN2B
OUT2A
OUT2B
PS
TEST
GND
RNF2
RNF2S
GND
M
〇This product has no designed protection against radioactive rays.
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BD62221MUV
Pin Configuration
Block Diagram
VREF1
17 RNF2S
18 RNF2
19 OUT2B
20 NC
21 GND
22 OUT1B
23 RNF1
24 RNF1S
[TOP VIEW]
31
RNF1S
VREF2
2
TSDDET
4
OCPDET1
3
OCPDET2
27
VCC1
25
OUT1A
22
OUT1B
23
RNF1
24
RNF1S
14
VCC2
16
OUT2A
19
OUT2B
Regulator
1/8
32
1/8
RNF2S
OUT1A 25
16 OUT2A
NC 26
15 NC
30
SELECT
8
IN1A
9
IN1B
10
TSD
OCP
OSC
OVLO
UVLO
NC 28
13 NC
GND 29
12 IN2B
CR 30
FORWARD
REVERSE
BRAKE
OPEN
11 IN2A
VREF1 31
10 IN1B
EXP-PAD
VREF2 32
11
IN2B
12
8
IN1A
FORWARD
REVERSE
BRAKE
OPEN
PS
7
18
RNF2
TEST
6
17
RNF2S
GND
29
21
GND
SELECT
7
PS
6
TEST
5
NC
4
OCPDET1
3
OCPDET2
2
TSDDET
NC
1
9
IN2A
Pre Driver
14 VCC2
Control Logic
VCC1 27
CR
Blank Time
PWM Control
Pin Descriptions
Pin
No.
Pin Name
Pin
No.
Pin Name
1
NC
17
RNF2S
2
TSDDET
18
RNF2
3
OCPDET2
19
OUT2B
4
OCPDET1
20
NC
5
NC
No connection
21
GND
6
TEST
Pin for testing
(Used by connecting with GND)
22
OUT1B
7
PS
Power save pin
23
RNF1
8
SELECT
Mode selecting pin
24
RNF1S
9
IN1A
H bridge control pin
25
OUT1A
10
IN1B
H bridge control pin
26
NC
11
IN2A
H bridge control pin
27
VCC1
12
IN2B
H bridge control pin
28
NC
13
NC
No connection
29
GND
14
VCC2
Power supply pin
30
CR
15
NC
No connection
31
VREF1
Current limit value setting pin
16
OUT2A
H bridge output pin
32
VREF2
Current limit value setting pin
-
EXP-PAD
-
-
Function
No connection
Output signal pin
to detect abnormal states
Output signal pin
to detect abnormal states
Output signal pin
to detect abnormal states
The EXP-PAD of the product
connect to GND.
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Function
Input pin of
current detection comparator
Connection pin of
resistor for output current detection
H bridge output pin
No connection
Ground pin
H bridge output pin
Connection pin of
resistor for output current detection
Input pin of
current detection comparator
H bridge output pin
No connection
Power Supply pin
No connection
Ground pin
Connection pin of
CR for setting chopping frequency
-
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BD62221MUV
Function Explanation
1
VCCx(Note 1)/Power supply pin
Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low
impedance. VCCx voltage may have great fluctuation, so please connect the bypass capacitor (100 μF to 470 μF) as
close as possible to the pin. Adjust in such a way that the VCC voltage is stable. Please increase the capacitance if
needed, especially when large current or motors that have great back electromotive force are used.
In addition, to reduce the power supply’s impedance in wide frequency bandwidth, parallel connection of multi-layered
ceramic capacitor (0.01 µF to 0.1 µF) is recommended. Extreme care must be observed to make sure that the VCCx
voltage does not exceed the rating even for a moment. VCC1 & VCC2 are shorted inside IC, so please be sure to
short VCC1 & VCC2 externally when using. If used without shorting, malfunction or destruction may occur because of
concentration of current routes etc., so please make sure that they are shorted when in use.
Moreover, there is a built-in clamp component in the output pin to prevent electrostatic destruction. If sudden pulse or
surge voltage of more than the maximum absolute rating is applied, the clamp component operates which can result to
destruction. Please be sure to not exceed the maximum absolute rating. It is effective to mount a Zener diode with
maximum absolute rating. Also, diode is inserted between VCCx pin and GND pin to prevent electrostatic destruction.
If reverse voltage is applied between VCCx pin and GND pin, there is a danger of IC destruction so please be careful.
(Note 1) x = 1, 2
2
GND/Ground pin
In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, please
connect it in such a way that the wiring impedance from this pin is made as low as possible to achieve the lowest
electrical potential no matter what operating state it may be.
Design the pattern so that it does not have a common impedance with other GND patterns.
3
PS/Power save pin
The PS pin can make circuit in standby state and make motor output OPEN.
When PS = L to H, be careful because there is a delay of 40 μs (Max) before it is returned from standby state to normal
state and the motor output becomes ACTIVE.
PS
State
4
L
STANDBY
H
ACTIVE
INxA(Note 2), INxB(Note 2)/H bridge control pin
It decides output logic for H bridge.
Input
Output
OUTxB(Note 2)
State
PS
INxA
INxB
OUTxA(Note 2)
L
X(Note 3)
X(Note 3)
OPEN
OPEN
STANDBY
H
L
L
OPEN
OPEN
STOP
H
H
L
H
L
FORWARD
H
L
H
L
H
REVERSE
H
H
H
L
L
BRAKE
(Note 2) x = 1, 2
(Note 3) X = H or L
5
OUT1A,OUT1B,OUT2A,OUT2B/H bridge output pin
Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low
impedance. It is also effective to add a Schottky diode if output has great positive or negative fluctuation when large
current is applied. For example, a counter electromotive voltage etc. is great.
Moreover, there is a built-in clamp component in the output pin to prevent electrostatic destruction. If sudden pulse or
surge voltage of more than the maximum absolute rating is applied, the clamp component operates which can result to
destruction. Please be sure to not exceed the maximum absolute rating.
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Function Explanation – continued
6
RNFx(Note 1)/ Connection pin of resistor for output current detection
Insert current detecting resistor of 0.1 Ω to 0.2 Ω between RNFX and GND.
The power consumption of current detecting resistor (W) can be calculated by the motor output current value (I OUT)
and resistance for current detecting resistor (R).
𝑊 = 𝐼𝑂𝑈𝑇 2 × 𝑅
Where:
𝑊
𝐼𝑂𝑈𝑇
𝑅
:
:
:
[W]
is the power consumption of current detecting resistor [W]
is the motor output current value [A]
is the current-detecting resistor [Ω]
To avoid exceeding the rated power consumption of the resistor, consider its power consumption.
In addition, design it in such a way it that it has low impedance and does not have a common impedance with other
GND patterns because motor’s drive current flows through this pattern from the RNF X pin to current-detecting resistor
to GND.
Do not exceed the rating because there is the possibility of circuits’ malfunction etc., if the RNFX voltage has exceeded
the maximum rating (0.7 V). If the RNFX pin is open, then there is the possibility of such malfunction as output current
does not flow either, so do not let it open.
(Note 1) x = 1, 2
7
RNFxS(Note 2)/Input pin of current detection comparator
RNFxS pin, which is the input pin of current detection comparator, is independently arranged in order to decrease the
lowering of current-detection accuracy caused by the wire impedance inside the IC of RNFx pin. Therefore, please
make sure to connect RNFx pin and RNFxS pin together when using PWM constant current control.
In addition, in case of interconnection, the lowering of current-detection accuracy caused by the impedance of board
pattern between RNFx pin and the current-detecting resistor can be decreased because the wires from RNFxS pin is
connected near the current-detecting resistor.
Moreover, please design the pattern in such a way that there is no noise spike.
(Note 2) x = 1, 2
8
VREFx(Note 3)/Current limit value setting pin
This is the pin to set the output current value for PWM constant current control or peak current limit.
The output current value can be set by VREFx(Note 3) voltage and current-detecting resistor (RNFx(Note 3) resistor).
𝐼𝑂𝑈𝑇 =
𝑉𝑅𝐸𝐹𝑥
8
Where:
𝐼𝑂𝑈𝑇
𝑉𝑅𝐸𝐹𝑥
𝑅𝑁𝐹𝑥
:
:
:
1
× 𝑅𝑁𝐹𝑥
[A]
is the motor output current value [A]
is the voltage of current limit value setting pin [V]
is the current-detecting resistor [Ω]
Please avoid using it with VREFx pin open. If VREFx pin is open, there is possibility of malfunctions as the setting
current increases and a large current flows etc. This is caused by unstable input and increasing VREFx voltage.
Please take note of the input voltage range because if voltage of over 3 V is applied on VREFx pin, there is also a
danger that large current flows in the output and OCP or TSD will operate.
Also, when selecting the resistance value please take into consideration the outflow current (Max 2 μA) produced by
resistance division. The minimum current, which can be controlled by VREFx voltage, is determined by motor coil’s L &
R values and minimum ON time. There is a minimum ON time in PWM drive.
(Note 3) x = 1, 2
9
SELECT/Mode selecting pin
This is the pin to select a mode under Current Limit Function. It allows you to select PWM Constant Current Control
(Refer to page 10), and Peak Current Limit (Refer to page 12).
SELECT
Mode
L
PWM Constant Current Control
H
Peak Current Limit
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Function Explanation – continued
10
CR/Connection pin of CR for setting chopping frequency
This is the pin to set the switching frequency of the output for PWM constant current control. Please connect the
external C (330 pF to 680 pF) and R (10 kΩ to 150 kΩ) between this pin and GND. Please refer to page 10.
Please connect the external components to GND in such a way that the interconnection does not have impedance in
common with other GND patterns. In addition, please create the pattern design in such a way to keep such sudden
pulses as square wave etc. away and that there is no noise spike. Please mount the two components of C and R if
PWM constant current control is being used. This is because normal PWM constant current control cannot be used if
CR pin is open or it is biased externally. When not using PWM constant current control, connect this pin to GND.
11
TSDDET, OCPDET1, OCPDET2/Output signal pin to detect abnormal states
TSDDET, OCPDET1 and OCPDET2 outputs low signal when Over Current Protection (OCP) or Thermal Shutdown
(TSD) operates. Even if Under Voltage Lock Out (UVLO) or Over Voltage Lock Out (OVLO) operates, TSDDET,
OCPDET1 and OCPDET2 signal doesn’t turn low (i.e. high). This pin is an open drain type, so please set the pull up
resistor (5 kΩ to 100 kΩ) to power supply less than 7 V (i.e. 5 V or 3.3 V). If not using this pin, please connect it to
GND.
Pin Name
Detection Protection Circuit
State
Output
TSDDET
TSD
OCPDET1
1ch H Bridge OCP
OCPDET2
2ch H Bridge OCP
OFF
H
ON
L
OFF
H
ON
L
OFF
H
ON
L
12
TEST/Pin for testing
It is a pin to use at the time of an IC shipment test. Use it in GND connection.
In addition, malfunctions may be caused by application without grounding.
13
NC/No connection
This pin is unconnected electrically with IC internal circuit.
14
IC Back Metal
VQFN032V5050 package has a metal for heat dissipation on the back of the IC. Since it is assumed to be used by
applying heat dissipation treatment to this metal, always GND on the substrate connect with the plane and solder, and
use the GND pattern widely to ensure sufficient heat dissipation area. In addition, the backside metal is short and the
back of the IC chip, so it has become a GND potential. Because there is a possibility of malfunction and destruction
when it is short and the potential other than GND, never pass the wiring pattern other than GND on the back of the IC.
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BD62221MUV
Protection Circuits
1
Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises 175 °C
(Typ) or more, the motor output becomes open. Also, when the temperature returns to 150 °C (Typ) or less, it
automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added
externally, heat overdrive can lead to destruction.
2
Over Current Protection (OCP)
This IC has a built-in over current protection circuit as a provision against destruction when the motor outputs are
shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to
OPEN condition when the regulated current flows for 4 μs (Typ). It returns with power reactivation or a reset by the PS
pin. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such
as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be
designed to take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return
by power reactivation or a reset by the PS pin, then OCP operates repeatedly and the IC may generate heat or
otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, the motor outputs are
shorted each other or VCC-motor output or motor output-GND is shorted., if the output pin voltage jumps up and the
absolute maximum values can be exceeded after the over current has flowed, there is a possibility of destruction. Also,
when current which is the output current rating or more and the OCP detection current or less flows, the IC can heat up
to Tjmax = 150 °C exceeds and can deteriorate, so current which or more the output rating should not be applied.
3
Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage is low. When the applied voltage to the VCC X(Note 1) pin goes 5 V (Typ) or less, the motor output is set to
open. This switching voltage has a 1 V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this
circuit does not operate during power save mode. Also, the electrical angle is reset when he UVLO circuit operates.
(Note 1) x = 1, 2
4
Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VCCX(Note 2) pin goes 32 V (Typ) or more, the motor output is set to OPEN.
This switching voltage has a 1 V (Typ) hysteresis and a 4 μs (Typ) mask time to prevent false operation by noise etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum
value for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be
aware that this circuit does not operate during power save mode.
(Note 2) x = 1, 2
5
Protects against malfunction when power supply is disconnected (Ghost Supply Prevention Function)
If a control signal(Note 3) is input when there is no power supplied to this IC, there is a function which prevents a
malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction
prevention diode from these input pins to the VCCX(Note 4). Therefore, there is no malfunction of the circuit even when
voltage is supplied to these input pins while there is no power supply.
(Note 3) control signal = PS, IN1A, IN1B, IN2A, IN2B, VREF1, VREF2, SELECT
(Note 4) x = 1, 2
6
Operation Under Strong Electromagnetic Field
The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction
is found when using the IC in a strong electromagnetic field.
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BD62221MUV
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Supply Voltage
Input Voltage for Control
Pin(Note 1)
Symbol
Rating
Unit
VCC
-0.2 to +36.0
V
VIN
-0.2 to +5.5
V
Input Voltage for VREFx(Note 2) Pin
VVREF
-0.2 to +5.5
V
RNFx(Note 2)
VRNF
0.7
V
Output Current (Continuous)
IOUT
2.0(Note 3)
A/Phase
Output Current (Peak Value)
IOUTPEAK
3.0(Note 3)(Note 4)
A/Phase
Tstg
-25 to +150
°C
Tjmax
+150
°C
Maximum Voltage
Storage Temperature Range
Maximum Junction Temperature
(Note 1) Input Voltage for Control Pin = PS, IN1A, IN1B, IN2A, IN2B, VREF1, VREF2, SELECT
(Note 2) x = 1, 2
(Note 3) Do not exceed Tjmax = 150 °C
(Note 4) Pulse width tw ≤ 1ms, duty 20ms
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VCC
8
24
28
V
Operating Temperature
Topr
-25
+25
+85
°C
Maximam Output Current (Continuous)
IOUT
-
-
1.4(Note 5)
A/Phase
(Note 5) Do not exceed Tjmax = 150 °C
Thermal Resistance (Note 6)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 8)
2s2p(Note 9)
θJA
90.5
24.8
°C/W
ΨJT
9
5
°C/W
VQFN032V5050
Junction to Ambient
Junction to Top Characterization
Parameter(Note 7)
(Note 6) Based on JESD51-2A (Still-Air), using a BD62221MUV Chip.
(Note 7) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 8) Using a PCB board based on JESD51-3.
(Note 9) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Thermal Via(Note 10)
Pitch
Diameter
1.20 mm
Φ0.30 mm
2 Internal Layers
Bottom
Top
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 10) This thermal via connects with the copper pattern of all layers.
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BD62221MUV
Electrical Characteristics (Unless otherwise specified VCC = 24 V, Ta = 25 °C)
Item
Symbol
Min
Typ
Max
Unit
Condition
ICCST
-
0
10
µA
PS = L
ICC
-
2.0
5.0
mA
PS = H, VREFx(Note 1) = 3 V
H-level Input Voltage
VINH
2.0
-
-
V
L-level Input Voltage
VINL
-
-
0.8
V
H-level Input Current
IINH
35
50
100
μA
VIN = 5 V
L-level Input Current
IINL
-10
0
-
µA
VIN = 0 V
Output ON Resistance
RON
-
0.55
0.75
Ω
IOUT = ±1.0 A
(Sum of upper and lower)
Output Leak Current
ILEAK
-
-
10
μA
[Whole]
Circuit Current at Standby
Circuit Current
[Control Logic
Input(Note 2)]
[Output(Note 3)]
[Output to Detect Abnormal States(Note 4)]
Output L Voltage
Output Leak Current
VDET
-
300
600
mV
TSDDET = 6 mA(Note 5)
OCPDET1 = 6 mA(Note 5)
OCPDET2 = 6 mA(Note 5)
IDET_LEAK
-
-
10
μA
TSDDET = 5 V
OCPDET1 = 5 V
OCPDET2 = 5 V
IRNFS
-2.0
-0.1
-
μA
RNFxS = 0 V
[Current Control]
RNFxS(Note 1) Input Current
RNFx(Note 1)
Input Current
VREFx(Note 1) Input Current
VREFx(Note 1)
IRNF
-80
-40
-
μA
RNFx = 0 V
IVREF
-2.0
-0.1
-
μA
VREFx = 0 V
Input Voltage Range
VVREF
0
-
3.0
V
Minimum ON Time (Cancel Time)
tONMIN
0.7
1.5
3.0
μs
RNFxS(Note 1) Comparator Threshold
VCTH
0.356
0.375
0.394
V
VREFx(Note 1) = 3 V
(Note 1) x = 1, 2
(Note 2) Control Logic Input = PS, IN1A, IN1B, IN2A, IN2B, SELECT
(Note 3) Output = OUT1A, OUT1B, OUT2A, OUT2B
(Note 4) Output to Detect Abnormal States = TSDDET, OCPDET1, OCPDET2
(Note 5) Input Current
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BD62221MUV
External PWM Control
This series can drive motors by IN1A, IN1B, IN2A, and IN2B input directly from the microcomputer (up to 5 μs pulse width).
Decay mode can be SLOW DECAY or FAST DECAY.
The control sequence example and the current decay route are shown below:
1
SLOW DECAY (Forward Rotation)
Input
Output
INxB(Note 1)
OUTxA(Note 1)
OUTxB(Note 1)
State
PS
INxA(Note 1)
H
H
L
H
L
ON
H
H
H
L
L
SLOW DECAY
H
H
L
H
L
ON
H
H
H
L
L
SLOW DECAY
H
H
L
H
L
ON
INxB(Note 2)
OUTxA(Note 2)
(Note 1) x = 1, 2
2
FAST DECAY (Forward Rotation)
Input
Output
State
PS
INxA(Note 2)
OUTxB(Note 2)
H
H
L
H
L
ON
H
L
H
L
H
FAST DECAY
H
H
L
H
L
ON
H
L
H
L
H
FAST DECAY
H
H
L
H
L
ON
(Note 2) x = 1, 2
SLOW DECAY
ON→OFF
FAST DECAY
OFF→OFF
ON→OFF
M
OFF→ON
OFF→ON
M
ON→ON
OFF→ON
ON→OFF
Output ON
Current Decay
Figure 1. Route of Regenerative Current during Current Decay
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BD62221MUV
PWM Constant Current Control
This function can limit the peak current or switching current in driving DC brush motor.
In addition, it can drive bipolar stepper motor by PWM constant current control.
1
Current Control Operation
When the output transistor is turned on, the output current increases. The output current is converted to voltage due to
the connected external resistance to the RNFX(Note 1) pin. When the voltage on the RNFX pin reaches the voltage value
set by the VREFx(Note 1) input voltage, the current limit comparator operates and enters current decay mode. Output
turns on again after changing CR pin to charge from discharge. The process repeats itself with chopping period
(tCHOP).
(Note 1) x = 1, 2
2
Cancel Time (Fixed in Internal Circuit)
In order to avoid misdetection of current detection comparator due to RNFx(Note 2) spike noise that may occur when the
output turns ON, the IC has the minimum ON time tONMIN (Cancel Time). The current detection is invalid from the output
transistor turned on to 1.5 μs (Typ). This allows for constant-current drive without the need for an external filter.
(Note 2) x = 1, 2
CR Timer
The external capacitor and resistor connected to the CR pin is repeatedly charged and discharged between the V CRH
and VCRL levels. The CR pin voltage decides in IC and it is V CRL = 0.4 V, VCRH = 1.0 V respectively. When the output
current reaches the current limit during this period, then the IC enters decay mode. The CR continues to discharge
during this period until it reaches VCRL, at which point the IC output is switched back ON.
The current output and the CR pin begin charging simultaneously. The CR charge time (t CHARGE) and discharge time
(tDISCHARGE) are set by external components, according to the following formulas. The total of t CHARGE and tDISCHARGE
yield the chopping period, tCHOP.
𝑅 ′ ×𝑅
𝑉
−0.4
𝑡𝐶𝐻𝐴𝑅𝐺𝐸 ≒ 𝐶 × 𝑅′ +𝑅 × 𝑙𝑛 (𝑉𝐶𝑅−1.0)
𝐶𝑅
𝑡𝐶𝐻𝐴𝑅𝐺𝐸
𝐶
𝑅
𝑅′
𝑉𝐶𝑅
:
:
:
:
:
is the minimum ON-time [s]
is the capacitance of the CR Pin [F]
is the resistance of the CR Pin [Ω]
is the CR Pin internal impedance 5 kΩ (Typ)
is the CR Pin voltage [V]
𝑅
𝑉𝐶𝑅 = 𝑉 × 𝑅′ +𝑅
𝑉
:
is the internal regulator voltage 5 V (Typ)
:
[s]
0.20
0.15
0.00
0
500
1000
𝐶 [pF]
1500
2000
Figure 2. CR Coefficient for Calculation of
Discharge Time
is the CR discharge time. [s]
Refer to the right graph.
𝑡𝐶𝐻𝑂𝑃 = 𝑡𝐶𝐻𝐴𝑅𝐺𝐸 + 𝑡𝐷𝐼𝑆𝐶𝐻𝐴𝑅𝐺𝐸
𝑡𝐶𝐻𝑂𝑃
0.25
0.05
1+𝛼
:
:
0.30
0.10
[V]
𝑡𝐷𝐼𝑆𝐶𝐻𝐴𝑅𝐺𝐸 ≒ 𝐶 × 𝑅 × 𝑙𝑛 ( 0.4 )
𝑡𝐷𝐼𝑆𝐶𝐻𝐴𝑅𝐺𝐸
𝛼
[s]
𝛼 [V]
3
[s]
is the chopping period. [s]
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3
CR Timer – continued
Spike Noise
Current Detection Value
Output Current
0 mA
Current Detection Value
RNFx(Note 1) Voltage
GND
VCRH=1.0 V (Typ)
CR Voltage
VCRL=0.4 V (Typ)
Charge Time
tCHARGE
Discharge Time
tDISCHARGE
Chopping Period
tCHOP
GND
Minimum ON Time
tONMIN
Figure 3. Timing Chart of CR Voltage, RNFx Voltage and Output Current
Setting range: C (330 pF to 680 pF), R (10 kΩ to 150 kΩ)
(Note 1) x = 1, 2
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Peak Current Limit
This function can limit the peak current including over current when DC brush motor is locked.
The timing when the IC output switches back ON can be controlled by a microcomputer and etc., to synchronize the timing
with PWM input to INxA(Note 1) or INxB(Note 1).
(Note 1) x = 1, 2
1
Current Control Operation
The output current increases when the motor is locked. This output current is converted to voltage by the connected
external resistor to the RNFX(Note 2) pin. When the voltage on the RNFX pin reaches the voltage value set by the
VREFx(Note 2) input voltage, the current limit comparator operates and enters current decay mode. Then, output turns
on again after changing PWM logic input to INxA or INxB to “FORWARD” or “REVERSE”.
(Note 2) x = 1, 2
2
Cancel Time (Fixed in Intenal Circuit)
In order to avoid misdetection of current detection comparator due to RNFx(Note 3) spike noise that may occur when the
output turns ON, the IC has the minimum ON time tONMIN (Cancel Time). The current detection is invalid from the output
transistor turned on to 1.5 μs (Typ). This allows for constant-current drive without the need for an external filter.
(Note 3) x = 1, 2
3
Timing Chart
This function can be used when driving with either INxA or INxB fixed to H, while the other is with PWM input. The
timing chart in each drive state is shown below.
3.1 FORWARD-BRAKE
The timing chart in driving with FORWARD-BRAKE (INxA fixed to H and PWM input to INxB) is shown in Figure 4.
When INxA is H and INxB is L, OUTxA(Note 4) and OUTxB(Note 4) become FORWARD logic if the output current
doesn’t reach the current setting value. On the other hand, OUTxA and OUTxB become BRAKE logic if the
output current increases due to locked motor, and reaches the current setting value. Then, INxB becomes H, and
the IC output switches back ON at the next fall timing of INxB.
FORWARD
BRAKE
BRAKE
FORWARD
BRAKE
BRAKE
FORWARD
BRAKE
H
INｘA
L
H
INｘB
L
VCC
OUTｘA
GND
VCC
OUTxB
The Output Current
Increases
by Motor Locked etc..
GND
Current Detection Value
Spike Noise
Output Current
0 mA
Current Detection Value
RNFｘ(Note 4) Voltage
GND
Switching
Back ON
Current
Detection
Minimun ON Time
tONMIN
(Note 4) x = 1, 2
Figure 4. FORWARD-BRAKE Timing Chart
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3
Timing Chart – continued
3.2 REVERSE-BRAKE
The timing chart in driving with REVERSE-BRAKE (PWM input to INxA and INxB fixed to H) is shown in Figure 5.
When INxA is L and INxB is H, OUTxA(Note 1) and OUTxB(Note 1) become REVERSE logic, if the output current
doesn’t reach the current setting value. If the output current increase by motor locked and reaches the current
detection value, OUTxA and OUTxB become BRAKE logic. On the other hand, OUTxA and OUTxB become
BRAKE logic if the output current increases due to locked motor, and reaches the current setting value. Then,
INxA becomes H, and the IC output switches back ON at the next fall timing of INxA.
REVERSE
BRAKE
BRAKE
REVERSE
BRAKE
BRAKE
REVERSE
BRAKE
H
INｘA
L
H
INｘB
L
VCC
OUTｘA
GND
VCC
OUTxB
The Output Current
Increases
by Motor Locked etc..
GND
Current Detection Value
Spike Noise
Output Current
0 mA
Current Detection Value
RNFｘ(Note 1) Voltage
GND
Switching
Back ON
Current
Detection
Minimun ON Time
tONMIN
(Note 1) x = 1, 2
Figure 5. REVERSE-BRAKE Timing Chart
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BD62221MUV
Control Sequence of Stepper Motor
The following sequence can control the stepper motor by FULL STEP or HALF STEP mode.
The control sequence example and the torque vector are shown below.
1
FULL STEP Control Sequence
1
2
3
4
H
IN1A
100 %
OUT1A
L
H
IN1B
L
H
4
1
IN2A
L
H
OUT2B
OUT2A
IN2B
L
3
100 %
2
1ch IOUT
-100 %
100 %
OUT1B
2ch IOUT
-100 %
2
IN1A
IN1B
IN2A
IN2B
OUT1A
OUT1B
OUT2A
OUT2B
1
H
L
H
L
H
L
H
L
2
L
H
H
L
L
H
H
L
3
L
H
L
H
L
H
L
H
4
H
L
L
H
H
L
L
H
HALF STEP Control Sequence
1
2
3
4
5
6
7
8
H
IN1A
OUT1A
100 %
L
H
IN1B
1
L
H
8
2
IN2A
L
H
OUT2B
7
3
OUT2A
IN2B
L
6
100 %
4
5
1ch IOUT
-100 %
100 %
OUT1B
2ch IOUT
-100 %
IN1A
IN1B
IN2A
IN2B
OUT1A
OUT1B
OUT2A
OUT2B
1
H
L
L
L
H
L
OPEN
OPEN
2
H
L
H
L
H
L
H
L
3
L
L
H
L
OPEN
OPEN
H
L
4
L
H
H
L
L
H
H
L
5
L
H
L
L
L
H
OPEN
OPEN
6
L
H
L
H
L
H
L
H
7
L
L
L
H
OPEN
OPEN
L
H
8
H
L
L
H
H
L
L
H
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BD62221MUV
µSTEP Drive for Stepper Motor
Output current of channel 1 and channel 2 can be determined by VREFx(Note 1). 1ch and 2ch output logic can be done by
INxA(Note 1), INxB(Note 1). Therefore, linear voltage input by external DAC to VREFx enables to drive stepper motor in µSTEP
mode.
(Note 1) x = 1, 2
IN1A
IN1B
IN2A
IN2B
VREF1
VREF2
1ch IOUT
2ch IOUT
Figure 6. µSTEP Control Sequence and Output Current
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BD62221MUV
Power Dissipation
Please confirm that the IC’s chip temperature Tj is not over 150 °C. Consider the IC’s power consumption (W), thermal
resistance (°C/W) and ambient temperature (Ta). When Tj = 150 °C is exceeded, the functions as a semiconductor do not
operate and problems such as parasitic and leaks occur. Constant use under these conditions leads to deterioration and
eventually destruction of the IC. Tjmax = 150 °C must be strictly obeyed under all circumstances.
1
Thermal Calculation
The IC’s consumed power can be estimated roughly with the power supply voltage (V CC), circuit current (ICC), output
ON-Resistance (RONH, RONL) and motor output current value (IOUT). The calculation method during external PWM drive,
SLOW DECAY is shown here:
When using both channel 1 and channel 2, calculate for each H bridge.
𝑊𝑉𝐶𝐶 = 𝑉𝐶𝐶 × 𝐼𝐶𝐶
𝑊𝑉𝐶𝐶
𝑉𝐶𝐶
𝐼𝐶𝐶
:
:
:
[W]
Consumed power of the VCC [W]
Power supply voltage [V]
Circuit current [A]
𝑊𝐷𝑀𝑂𝑆 = 𝑊𝑂𝑁 + 𝑊𝐷𝐸𝐶𝐴𝑌
[W]
𝑊𝑂𝑁 = (𝑅𝑂𝑁𝐻 + 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 ×
𝑜𝑛_𝑑𝑢𝑡𝑦
100
𝑊𝐷𝐸𝐶𝐴𝑌 = (2 × 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × (1 −
𝑊𝐷𝑀𝑂𝑆
𝑊𝑂𝑁
𝑊𝐷𝐸𝐶𝐴𝑌
𝑅𝑂𝑁𝐻
𝑅𝑂𝑁𝐿
𝐼𝑂𝑈𝑇
𝑜𝑛_𝑑𝑢𝑡𝑦
:
:
:
:
:
:
:
BD62221MUV
100
)
[W]
Upper P-Channel DMOS
ON-Resistance RONH[Ω] (Typ)
0.33
𝑊𝑇𝑂𝑇𝐴𝐿 = 𝑊𝑉𝐶𝐶 + 𝑊𝐷𝑀𝑂𝑆
[W]
𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑊_𝑡𝑜𝑡𝑎𝑙
[°C]
:
:
:
:
𝑜𝑛_𝑑𝑢𝑡𝑦
Consumed power of the output DMOS [W]
Consumed power during output ON [W]
Consumed power during current decay [W]
Upper P-Channel DMOS ON-Resistance [Ω]
Lower N-Channel DMOS ON-Resistance [Ω]
Motor output current [A]
PWM on duty [%]
Model Number
𝑊𝑇𝑂𝑇𝐴𝐿
𝑇𝑗
𝑇𝑎
𝜃𝑗𝑎
[W]
Lower N-Channel DMOS
ON-Resistance RONL[Ω] (Typ)
0.22
Consumed total power of IC [W]
Junction temperature [°C]
ambient temperature [°C]
Thermal resistance value [°C/W]
However, the thermal resistance value θja [°C/W] differs significantly depending on circuit board conditions. The
calculated values above are only theoretical. For actual thermal design, please perform sufficient thermal evaluation
for the application board used, and create the thermal design with enough margin to not exceed Tjmax = 150 °C.
Although not normally used, if the IC is to be used under specific or strict heat conditions, please consider attaching an
external Schottky diode between the motor output terminal and GND to decrease heat from the IC.
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Power Dissipation – continued
2
Temperature Monitoring
In respect of BD62221MUV, there is a way to directly measure the approximate chip temperature by using the TEST
pin with a protection diode for prevention from electrostatic discharge. However, temperature monitor way is used only
for evaluation and experimenting, and must not be used in actual usage conditions.
Process 1 Measure the pin voltage when a current of I DIODE = 50 μA flows from the TEST pin to the GND, without
supplying VCC to the IC. This measurement is for measuring the VF voltage of the internal diode.
Process 2 Measure the temperature characteristics of this pin voltage. (V F has a linear negative temperature factor
against the temperature.) With the results of these temperature characteristics, chip temperature can be
calibrated from the TEST pin voltage.
Process 3 Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be
approximated from the results of Process 2.
-Vf [mV]
TEST
Internal Circuit
IDIODE
V
25
150
Chip Temperature Tj [°C]
Figure 7. Model diagram for measuring chip temperature
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BD62221MUV
Application Example
1
Constant Voltage Control or Direct PWM Control
When using the fault output function
⇒Pull up resistor 5 kΩ to 100 kΩ.
When not using the fault output
function
⇒Connect to GND.
Refer to page 5.
3.3 V or 5.0 V 3.3 V or 5.0 V 3.3 V or 5.0 V
10 kΩ
10 kΩ
VREF1
2
31
Regulator
1/8
4
RNF1S
VREF2
3
10 kΩ
TSDDET
OCPDET1
OCPDET2
32
1/8
RNF2S
CR
SELECT
30
Blank Time
PWM Control
TSD
OCP
OSC
OVLO
UVLO
27
8
VCC1
100 µF
Control logic input pin.
Refer to page 3.
9
IN1B
10
FORWARD
REVERSE
BRAKE
OPEN
22
Pre Driver
IN1A
Control Logic
Control logic input pin.
Input PWM signal (up to 5 μs
pulse width) at external PWM
control.
Refer to page 3, 9 for detail.
25
23
24
14
FORWARD
REVERSE
BRAKE
OPEN
IN2A
11
IN2B
12
PS
TEST
7
18
6
17
29
21
GND
16
19
OUT1A
0.1 µF
M
OUT1B
RNF1
RNF1S
VCC2
OUT2A
M
Bypass capacitor.
Setting range is
100 µF to 470 µF (electrolytic)
0.01µF to 0.1 µF (multilayer ceramic
etc.)
Refer to page 3 for detail.
Be sure to short VCC1 & VCC2.
OUT2B
RNF2
RNF2S
GND
Terminal for testing
Connect to GND.
Refer to page 5.
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Application Example – continued
2
PWM Constant Current Control
Sets the current limit value.
Input range: 0 V to 3 V
Refer to page 4 for detail.
Refer to page 18.
3.3 V or 5.0 V 3.3 V or 5.0 V 3.3 V or 5.0 V
3.3 V or 5.0 V
4.7 kΩ
VREF1
10 kΩ
2
31
Regulator
1/8
3.3 V or 5.0 V
4
1.2 kΩ
RNF1S
4.7 kΩ
VREF2
3
10 kΩ
10 kΩ
TSDDET
OCPDET1
OCPDET2
32
1/8
1.2 kΩ
RNF2S
CR
SELECT
470 pF
TSD
OCP
OSC
OVLO
UVLO
30
Refer to page 18.
27
8
VCC1
0.1 µF
100 µF
9
IN1B
10
IN2A
Refer to page 18.
Refer to page 18.
22
23
24
14
FORWARD
REVERSE
BRAKE
OPEN
11
16
IN2B
12
PS
TEST
7
18
6
17
29
21
GND
Refer to page 18.
FORWARD
REVERSE
BRAKE
OPEN
Pre Driver
Set the chopping frequency.
Setting range is
C:330 pF to 680 pF
R:10 kΩ to 150 kΩ
Refer to page 5, 10 for detail.
IN1A
25
Control Logic
82 kΩ
Blank Time
PWM Control
19
OUT1A
M
OUT1B
RNF1
RNF1S
0.125 Ω
VCC2
OUT2A
Current detection setting
resistor.
0.1 Ω to 0.3 Ω
Refer to page 4 for detail.
M
OUT2B
RNF2
RNF2S
0.125 Ω
GND
Current detection setting
resistor
0.1 Ω to 0.3 Ω
Refer to page 4 for detail.
3
Peak Current Limit
Sets the current limit value.
Input range: 0 V to 3 V
Refer to page 4 for detail.
3.3 V or 5.0 V 3.3 V or 5.0 V 3.3 V or 5.0 V
3.3 V or 5.0 V
4.7 kΩ
VREF1
10 kΩ
2
31
Regulator
1/8
3.3 V or 5.0 V
4
1.2 kΩ
RNF1S
4.7 kΩ
VREF2
3
10 kΩ
10 kΩ
TSDDET
OCPDET1
OCPDET2
Refer to page 18.
32
1/8
1.2 kΩ
RNF2S
3.3 V or 5.0 V
CR
SELECT
Blank Time
PWM Control
TSD
OCP
OSC
OVLO
UVLO
30
Refer to page 18.
27
8
VCC1
100 µF
Refer to page 18.
Refer to page 18.
9
IN1B
10
FORWARD
REVERSE
BRAKE
OPEN
22
Pre Driver
IN1A
25
Control Logic
Control logic input pin.
Set the motor output and return
timing.
Input PWM signal (up to 5 μs pulse
width).
Refer to page 3, 9, 12 for detail.
23
24
14
FORWARD
REVERSE
BRAKE
OPEN
IN2A
11
IN2B
12
PS
TEST
7
18
6
17
29
21
GND
16
19
OUT1A
0.1 µF
M
OUT1B
RNF1
RNF1S
0.125 Ω
VCC2
OUT2A
Current detection setting
resistor.
0.1 Ω to 0.3 Ω
Refer to page 4 for detail.
M
OUT2B
RNF2
RNF2S
0.125 Ω
GND
Current detection setting
resistor
0.1 Ω to 0.3 Ω
Refer to page 4 for detail.
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BD62221MUV
I/O Equivalent Circuits
Pin
No.
Pin Name
7
PS
Equivalent Circuits
PS
IN1A
IN1B
IN2A
IN2B
SELECT
Pin
No.
Pin Name
25
OUT1A
22
OUT1B
16
OUT2A
19
OUT2B
23
RNF1
9
IN1A
10
IN1B
11
IN2A
12
IN2B
8
SELECT
18
RNF2
24
RNF1S
31
VREF1
OUT1A
OUT2A
OUT1B
OUT2B
10 kΩ
100 kΩ
RNF1S
RNF2S
17
Equivalent Circuits
5 kΩ
RNF1
RNF2
VREF1
VREF2
RNF2S
Internal Regulator
32
VREF2
2
TSDDET
Internal
Circuit
10 kΩ
10 kΩ
5 kΩ
TSDDET
OCPDET1
OCPDET2
30
CR
5 kΩ
TEST
6
4
OCPDET1
3
OCPDET2
-
-
5 kΩ
CR
TEST
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10 kΩ
50 kΩ
20/25
TSZ02201-0S2S0C300220-1-2
30.Apr.2020 Rev.001
BD62221MUV
Operational Notes
1
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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21/25
TSZ02201-0S2S0C300220-1-2
30.Apr.2020 Rev.001
BD62221MUV
Operational Notes – continued
10
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 8. Example of Monolithic IC Structure
11
Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12
Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13
Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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TSZ22111 • 15 • 001
22/25
TSZ02201-0S2S0C300220-1-2
30.Apr.2020 Rev.001
BD62221MUV
Ordering Information
B
D
6
2
2
2
1
M
U
V
-
Package
MUV: VQFN032V5050
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN032V5050 (TOP VIEW)
Part Number Marking
D62221
LOT Number
Pin 1 Mark
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TSZ22111 • 15 • 001
23/25
TSZ02201-0S2S0C300220-1-2
30.Apr.2020 Rev.001
BD62221MUV
Physical Dimension and Packing Information
Package Name
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© 2020 ROHM Co., Ltd. All rights reserved.
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VQFN032V5050
24/25
TSZ02201-0S2S0C300220-1-2
30.Apr.2020 Rev.001
BD62221MUV
Revision History
Date
Revision
30.Apr.2020
001
Changes
New Release
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TSZ22111 • 15 • 001
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30.Apr.2020 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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