BD62222HFP

For brush motors H-bridge driver BD62222HFP  Overview BD62222HFP is full bridge driver for brush motor applications. This IC can operate at a wide range of power-supply voltages (from 6V to 27V), supporting output currents of up to 2.5A. MOS transistors in the output stage allow for PWM signal control. The replacement is also easy because of the pin compatible with BD623XHFP series. No.09007EAT04  Features 1) Built-in one channel driver 2) Low standby current 3) Supports PWM control signal input (20kHz to 100kHz) 4) Cross-conduction prevention circuit 5) Four protection circuits provided: OCP, OVP, TSD and UVLO  Applications VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; car audios; car navigation systems; OA equipments  Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground) Parameter Supply voltage Output current All other input pins Operating temperature Storage temperature Power dissipation Junction temperature Symbol VCC IOMAX VIN TOPR TSTG Pd Tjmax Ratings 30 2.5 * 1 Unit V A V °C °C W °C -0.3 ~ VCC -40 ~ +85 -55 ~ +150 1.4 * 150 2 *1 Do not, exceed Pd or ASO. *2 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/°C above 25°C.  Operating conditions (Ta=25°C) Parameter Supply voltage Symbol VCC Ratings 6 ~ 27 Unit V www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 1/10 2009.10 - Rev.A BD62222HFP  Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=24V) Limits Parameter Supply current Stand-by current Input high voltage Input low voltage Input bias current Output ON resistance Input frequency range Symbol Min. ICC ISTBY VIH VIL IIH RON FMAX 0.9 2.0 30 0.5 20 Min. 1.4 0 50 1.0 Min. 2.7 10 0.8 100 1.5 100 mA µA V V µA Ω kHz VIN=5.0V Limits Technical Note Conditions Forward / Reverse / Brake Stand-by IO=1.0A, vertically total FIN / RIN  Block diagram and pin configuration BD62222HFP VCC 1 PROTECT Table 1 BD62222HFP 7 FIN 3 CTRL RIN 5 VCC Pin 1 2 Name VCC OUT1 FIN GND RIN OUT2 VCC GND Function Power supply Driver output Control input (forward) Ground Control input (reverse) Driver output Power supply Ground 4 FIN GND 2 OUT1 6 OUT2 GND 3 4 5 6 7 FIN Fig.1 BD62222HFP Note: Use all VCC pin by the same voltage. Fig.2 HRP7 package VCC OUT2 RIN GND FIN OUT1 VCC www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 2/10 2009.10 - Rev.A BD62222HFP  Electrical characteristic curves (Reference data) 2.0 8 -40°C 25°C 85°C 6 1.5 Technical Note Stand-by Current: I STBY [µA] Circuit Current: Icc [mA] Internal Logic: H/L [-] _ 1.0 - 40°C 25°C 85°C -40°C 25°C 85°C 1.5 4 0.5 1.0 85°C 25°C -40°C 0.5 6 12 18 24 30 Supply Voltage: Vcc [V] 2 0.0 0 6 12 18 24 30 36 Supply Voltage: Vcc [V] -0.5 0.8 1.2 1.6 2 Input Voltage: VIN [V] Fig.3 Supply current 1.0 Internal signal: Release [V] _ 85°C 25°C -40°C 9 Fig.4 Stand-by current 36 Internal signal: Release [V] _ 85°C 25°C -40°C 6 Fig.5 Input threshold voltage Input Bias Current: I IH [mA] 0.8 27 0.6 18 0.4 3 85°C 25°C -40°C 9 0.2 0.0 0 6 12 18 24 30 Input Voltage: VIN [V] 0 4.5 5 5.5 6 Supply Voltage: VCC [V] 0 27 29 31 33 Supply Voltage: VCC [V] Fig.6 Input bias current 2.5 Output Voltage: VCC- VOUT [V] 2 Fig.7 Under voltage lock out 1.5 -40°C 25°C 85°C 1.5 Fig.8 Over voltage protection Output Voltage: VCC-VOUT [V] Internal Logic: H/L [-] _ 2 85°C 25°C -40°C 85°C 25°C -40°C 1.0 1.5 1 0.5 1 0.5 0.0 0.5 0 0 0.5 1 1.5 2 2.5 Output Current: IOUT [A] 0 0 0.5 1 1.5 2 2.5 Output Current: IOUT [A] -0.5 3.5 3.7 3.9 Load Current [A] 4.1 4.3 Fig.9 Output high voltage 2 85°C 25°C -40°C 1.5 2 Fig.10 High side body diode Fig.11 Over current protection (H side) 1.5 Output Voltage: V OUT [V] Output Voltage: VOUT [V] 1.5 Internal Logic: H/L [-] _ -40°C 25°C 85°C 85°C 25°C -40°C 1.0 1 1 0.5 0.5 0.5 0.0 0 0 0.5 1 1.5 2 2.5 Output Current: IOUT [A] 0 0 0.5 1 1.5 2 2.5 Output Current: IOUT [A] -0.5 3.7 3.9 4.1 Load Current [A] 4.3 4.5 Fig.12 Output low voltage Fig.13 Low side body diode Fig.14 Over current protection (L side) www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 3/10 2009.10 - Rev.A BD62222HFP  Functional descriptions 1) Operation modes Table 2 Logic table FIN a b c d e f L H L H PWM L RIN L L H H L PWM OUT1 Hi-Z* H L L H __________ Technical Note OUT2 Hi-Z* L H L __________ Operation Stand-by (idling) Forward (OUT1 > OUT2) Reverse (OUT1 < OUT2) Brake (stop) Forward (PWM control) Reverse (PWM control) PWM H PWM * Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. a) Stand-by mode In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50µs before shutting down all circuits. b) Forward mode This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than the brake mode) to save power and reduce consumption. OFF M OFF OFF ON M OFF OFF M ON ON ON OFF M OFF OFF OFF OFF ON ON a) Stand-by mode b) Forward mode c) Reverse mode d) Brake mode Fig.15 Four basic operations (output stage) www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 4/10 2009.10 - Rev.A BD62222HFP Technical Note e) f) PWM control mode The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z". The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground. ON M OFF OFF ON M OFF ON OFF OFF Control input : H Control input : L Fig.16 PWM control operation (output stage) FIN RIN OUT1 OUT2 Fig.17 PWM control operation (timing chart) 2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns, nominal) at the transition. 3) Output protection circuits a) Under voltage lock out (UVLO) circuit To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.3V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. b) Over voltage protection (OVP) circuit When the power supply voltage exceeds 31V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 29V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 5/10 2009.10 - Rev.A BD62222HFP Technical Note c) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150°C nominal). Thus, it is a self-returning type circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. d) Over current protection (OCP) circuit To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel. Threshold I out 0 CTRL Input I nternal status Monitor / Timer ON mon. OFF off timer ON Fig.18 Over current protection (timing chart) ASO (Area of Safety Operation) ~Reference data~ 10 T ON =10ms T ON =1ms T ON =100ms T ON 100µs T ON =100ms 10 T ON =10ms T ON =1ms T ON 100µs 2.5 2.5 IDS [A] 1 IDS [A] 1 0.1 1 10 30 100 0.1 1 10 30 100 VDS [V] V DS [V] Fig.19 ASO curve (Ta=25°C) Fig.20 ASO curve (Tj=150°C) When the current of extent where OCP circuit does not operate keeps flowing, i.e.) ground faults, power supply line faults and load short circuits, it might not be able to protect it with the over current protection circuit. www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 6/10 2009.10 - Rev.A BD62222HFP  Thermal design 10.0 iv) 4 layers PCB(copper foil: 70mm x 70mm) iii) 2 layers PCB (copper foil: 70mm x 70mm) ii) 2 layers PCB (copper foil: 15mm x 15mm) i) 1 layer PCB (copper foil: 10.5mm x 10.5mm) Mounted on ROHM standard PCB (70mm x 70mm x 1.6mm FR4 glass-epoxy board) Technical Note 8.0 iv) 7.3W Table 3 Thermal resistance Board Board (4) θ j-a [°C/W] 17.1 22.7 54.4 89.3 Pd [W] 6.0 iii) 5.5W 4.0 ii) 2.3W Board (3) Board (2) Board (1) 50 75 100 125 150 2.0 i) 1.4W 0.0 0 25 AMBIENT TEMPERATURE [°C] * Transient thermal resistance is measured data only; values are not guaranteed. Fig.21 Thermal derating curve (HRP7 package) Thermal design needs to meet the following operating conditions. In creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below. 1. The ambient temperature Ta must be 85°C or below 2. The junction temperature Tj must be 150°C or below The junction temperature Tj can be determined using the following equation. Tj ≈ Ta + θ j-a x Pc [°C] The power consumption Pc can be determined using the following equation. Refer to page 3 about VON(H) and VF(H). Pc ≈ (IOUT x RON) x D + IOUT x (VON(H) + VF(H)) x (1 - D) + VCC x ICC [W] Example) Conditions: Ta=50°C, VCC=24V, Iout=0.5A, D (on duty)=100%. The power consumption of the IC and the junction temperature are as follows: 2 Pc ≈ 0.5 x 1.0 + 24 x 1.4m = 283.6mW Tj ≈ 50 + 89.3 x 283.6m = 75.3 [°C] 2 Where the Tjmax parameter is 150°C and the derating is set to 80 percents, the maximum ambient temperature Tamax is determined as follows. Ta ≤ Tjmax x 0.8 - θ j-a x Pc ≈ 94.7 [°C] In this example, thermal design can be considered satisfactory (meaning that there are no problems in thermal design), since the system meets the operating temperature conditions. www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 7/10 2009.10 - Rev.A BD62222HFP Interfaces VCC Technical Note FIN RIN 100k 100k OUT1 OUT2 GND Fig.22 FIN / RIN Fig.23 OUT1 / OUT2  Notes for use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) Power supply lines Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 8/10 2009.10 - Rev.A BD62222HFP Technical Note 8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. 10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1μF between output and GND. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Switching noise When the operation mode is in PWM control, PWM switching noise may effects to the control input pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each control input pin and ground. 13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Pin A Resistor Pin A N N P+ P P+ N N P+ N P P + Pin B C B E Transistor (NPN) Pin B B N C E P substrate Parasitic element GND P substrate Parasitic element GND GND GND Parasitic element Other adjacent elements Appendix: Example of monolithic IC structure Ordering part number B D 6 Type 2 2 2 2 H F P - T R ROHM part number Package HFP: HRP7 Packaging spec. TR: Embossed taping www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 9/10 2009.10 - Rev.A BD62222HFP HRP7 9.395±0.125 (MAX 9.745 include BURR) 1.017±0.2 Technical Note Tape 1.905±0.1 Embossed carrier tape 2000pcs TR The direction is the 1pin of product is at the upper right when you hold 8.82±0.1 (5.59) Quantity Direction of feed 1.523±0.15 0.835±0.2 10.54±0.13 8.0±0.13 (7.49) ( reel on the left hand and you pull out the tape on the right hand 1pin ) 0.8875 12 34 5 6 7 +5.5° 4.5° −4.5° 0.73±0.1 +0.1 0.27 -0.05 S 0.08±0.05 1.27 0.08 S Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 10/10 2009.10 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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