BD63001AMUV-E2

Datasheet Three-Phase Brushless Motor Predriver BD63001AMUV General Description Key Specifications ◼ ◼ ◼ ◼ ◼ ◼ BD63001AMUV is a Three-Phase Brushless Motor Predriver that uses upper Pch and lower Nch MOS transistor for an external output power transistor. It generates a driving signal from the Hall sensor and drives PWM through the input control signal. In addition, the supply voltage that can be applied is 12V or 24V, it has various controls and built-in protection functions, making it useful for a variety of purposes. Since the IC adopts small packages, it can be used on small diameter motors. Power Supply Voltage Rating: 3 3 V Operating temperature range: -40°C to +85°C Predriver Output Current Rating(Continuous) : ±30mA Predriver Output Current Rating(Peak) (Note 1) : ±200mA The Current Limit Detect Voltage: 0.2V±10% UVLO Lockout Voltage: 3.7V(Typ) (Note1) tw≤1µs, 50kHz Package W(Typ) x D(Typ) x H(Max) Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Built-in 120° Commutation Logic Circuit Drives Upper Pch, Lower Nch MOS transistor PWM control system /DC control system CW/CCW Function FG Output (1FG Output) Current Limit Protection Circuit (CL) Overheat Protection Circuit (TSD) Under Voltage Protection Circuit (UVLO) Over Voltage Protection Circuit (OVLO) Motor Lock Protection (MLP) VQFN024V4040 4.00mm x 4.00mm x 1.00mm Application ◼ ◼ OA apparatus Other general public welfare apparatus Typical Application Circuits 0.1µF VCC VREG VCC=24V VM 1 8 19 7 HV 0.01µF 0.01µF HUP 13 HUN 14 HVP 15 HVN 16 HWP HW 0.01µF HWN R1 UH Q1 R2 0.1µF HU R4 UL R5 C2 C1 R3 R1 10 VH 9 VL 12 WH 11 WL Q1 R2 17 18 R5 C2 C1 R3 R1 2 M 3～ R4 Q1 R2 CW C1 R3 R4 R5 C2 HLSW BRKB 24 3 6 RCL R6 C2 PWMB Rref 22 VREG FGO DCIN 10k 23 21 PWM OSC 20 20k 4 LPE 5 GND Figure 1. Application Circuit in HLSW=OPEN ("H") 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 〇This product has no designed protection against radioactive rays 1/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Typical Application Circuits - continued VM 0.1µF VCC VREG 19 HUP 13 HUN 14 HVP 15 HVN 16 1 8 0.1µF 7 HU 0.01µF HV 0.01µF HWP HW 0.01µF HWN 17 18 CW UH R1 UL R2 C1 C2 10 VH R1 9 VL R2 C1 M 3～ C2 2 12 WH R1 11 WL R2 C1 C2 HLSW BRKB 24 3 6 RCL R3 C3 PWMB Rref 22 VREG 10k FGO DCIN 23 21 PWM OSC 20 20k 4 LPE 5 GND Figure 2. Application Circuit in HLSW="L" 0.1µF VCC VREG VCC=5V VM 1 R1 8 19 HV 0.01µF 0.01µF HUP 13 HUN 14 HVP 15 HVN 16 HWP HW 0.01µF HWN R4 UH R2 UL R3 C1 R1 10 VH 9 VL R4 Q1 R5 17 18 2 M 3～ R2 R3 C1 R1 12 WH 11 WL R4 R5 CW Q1 R5 7 HU C1 Q1 R2 R3 HLSW BRKB 24 3 6 RCL R6 C2 PWMB Rref 22 VREG FGO DCIN 10k 23 21 PWM OSC 20 20k 4 LPE 5 GND Figure 3. Application Circuit in VCC=VREG www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Application ...................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuits ............................................................................................................................................................. 1 Pin Configuration/Block Diagram .................................................................................................................................................... 4 Pin Description................................................................................................................................................................................ 4 Absolute Maximum Ratings ............................................................................................................................................................ 5 Recommended Operating Conditions ............................................................................................................................................. 5 Thermal Resistance) ....................................................................................................................................................................... 6 Function Description ....................................................................................................................................................................... 7 Protection Circuit .......................................................................................................................................................................... 10 Electrical Characteristic ................................................................................................................................................................ 11 Typical Performance Curves ......................................................................................................................................................... 12 Timing Chart ................................................................................................................................................................................. 13 State Transition Diagram .............................................................................................................................................................. 15 I/O Equivalent Circuits .................................................................................................................................................................. 16 Attention for Operation .................................................................................................................................................................. 17 Operational Notes ......................................................................................................................................................................... 18 Ordering Information ..................................................................................................................................................................... 20 Marking Diagram .......................................................................................................................................................................... 20 Physical Dimension, Tape and Reel Information ........................................................................................................................... 21 Revision History ............................................................................................................................................................................ 22 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Pin Configuration Block Diagram VCC (TOP VIEW) 1 VREG VREG 19 VREG HWN HWP HVN HVP HUN HUP Internal Reg 18 17 16 15 14 13 VREG 19 HUP 12 WH PWMOSC 20 11 WL DCIN 21 10 VH 9 PWMB 22 3 4 5 6 GND RCL UL LPE 7 BRKB HLSW 24 CW UH VCC 8 2 14 HVP 15 16 HWP 17 HWN 18 PRE DRIVER LOGIC UH 7 UL 10 VH 9 VL 12 WH 11 WL 6 CW 2 BRKB 3 24 HLSW VL FGO 23 1 13 HUN HVN 8 6 RCL 23 FGO 4 LPE PWMB 22 PWM OSC 20 TSD UVLO Internal OSC 21 DCIN Figure 4. Pin Configuration OVLO PWM OSC 5 GND Figure 5. Block Diagram Pin Description Pin No. Pin Name 1 VCC Power Supply 13 HUP U Phase Hall Input＋ 2 CW CW/CCW Input (H:CW, L:CCW) 14 HUN U Phase Hall Input－ 3 BRKB Brake Input (negative logic) 15 HVP V Phase Hall Input＋ 4 LPE Motor Lock Protection Setting (H/M/L input) 16 HVN V Phase Hall Input－ 5 GND Ground 17 HWP W Phase Hall Input＋ 6 RCL Detect Voltage Input for Over-Current 18 HWN W Phase Hall Input－ 7 UL Output UL 19 VREG Regulator Output 8 UH Output UH 20 PWMOSC 9 VL Output VL 21 DCIN 10 VH Output VH 22 PWMB 11 WL Output WL 23 FGO 12 WH Output WH 24 HLSW Function www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Pin No. 4/22 Pin Name Function Setting PWM Oscillator Frequency DC Input PWM Input (negative logic) FG(1 phase output) Upper MOS Gate Output Switch TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Limit Unit VCC -0.3 to +33.0 V Predriver Output Voltage V(UH,VH,WH) -0.3 to +VCC V Predriver Output Voltage V(UL,VL,WL) -0.3 to +10.5 V FGO Terminal Voltage VFGO -0.3 to +7.0 V Other Input and Output Terminal Voltages VI/O -0.3 to +5.5 V Predriver Output Current (Continuous) IOUT1 ±30 mA Power Supply Voltage Predriver Output Current (Peak) IOUT2 FGO Output Current IFGO 5 mA VREG Output Current IVREG -30 mA Operating Temperature Range Topr -40 to +85 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax 150 °C Junction Temperature ±200 (Note 1) mA (Note 1) tw≤1µs,50kHz Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Symbol Min Typ Max Unit Supply Voltage VCC1 6 24 28 V Supply Voltage(VREG=VCC) VCC2 4.5 5 5.5 V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 3) 2s2p (Note 4) θJA 150.6 37.9 °C/W ΨJT 20 9 °C/W VQFN024V4040 Junction to Ambient Junction to Top Characterization Parameter (Note 2) (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70µm (Note 4)Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70µm 74.2mm x 74.2mm 35µm 74.2mm x 74.2mm 70µm www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Function Description 1. Commutation Logic This IC adopts a 120° commutation mode, and the truth table is as follows: (1) HLSW=”H” or OPEN CW (CW=”H” or OPEN) HU HV CCW (CW=”L”) HW UH UL VH VL WH WL UH UL VH VL WH WL FGO H L H L PWM H L L L H L L PWM L L L H L L L PWM L L H L H L L L L PWM L H H L L L L PWM H L L L H L L PWM L L H L H L L PWM L L L PWM H L L L Hi-z L H H H L L L L PWM L PWM L L H L Hi-z L L H L L H L L PWM L L L PWM H L Hi-z WL FGO (2) HLSW=”L” CW (CW=”H” or OPEN) HU HV CCW (CW=”L”) HW UH UL VH VL WH WL UH UL VH VL WH H L H H PWM L L H L L L H PWM H L L H L L H PWM H L L L L L H L H PWM L H H L H L H PWM L L H L L L H PWM L L H L L L H PWM H L H PWM L L H L Hi-z L H H L L H L H PWM H PWM H L L L Hi-z L L H H L L L H PWM H L H PWM L L Hi-z (Note) When PWMB=”H”, PWM=”L”, When PWMB=”L”, PWM=”H” Caution: In the following sentence, Upper side predriver output is under the condition of HLSW=OPEN (or “H”). In HLSW=”L”, the output H/L of Upper side predriver becomes the reverse. 2. Regulator Output Terminal (VREG) This is a constant output voltage terminal of 5V (Typ). It is recommended to connect capacitors of 0.01µF to 1µF. Please be careful that VREG current should not exceed the maximum ratings in case it will be used for supply voltage of hall elements. 3. PWM Input Terminal (PWMB) Speed can be controlled by inputting Duty of PWM signal into PWMB (negative logic). When PWMB=”L”, lower side predriver output that corresponds to the Hall input logic is “H”. In addition, PWMB terminal is pulled up to VREG through a resistance of 100kΩ(Typ) ±30kΩ. When using PWM input, please use it with DC input under 1V (Typ) or short to GND. PWMB 4. H or OPEN L L H DC Input Terminal (DCIN) Speed can be controlled by the DC signal to input into DCIN. PWM signal becomes 100% duty at DCIN=3.0V (Typ) and becomes 0% duty at DCIN= 1.0V (Typ). When using DC input, please use it with PWMB input “H” or OPEN. DCIN 5. Lower Side Predriver Output Logic Duty 1V(Typ) 0% 3V(Typ) 100% PWMOSC Input Terminal (PWMOSC) When using DC input, the PWM frequency fPWM [kHz] is fixed by an external resistor R [kΩ] connected to PWMOSC. FPWM [kHz] = 400/R www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Function Description – continued 6. 7. 8. CW/CCW Input Terminal (CW) Rotation direction can be switched with CW terminal. When CW=”H” or OPEN, the direction is CW. When CW=”L”, the direction is CCW. However, we do not recommend changing the direction of rotation while the motor is rotating. This is because if direction of rotation is changed while rotating, the rotation speed becomes equal to the hall frequency, which is less than approximately 40Hz (Typ). After a short brake, the rotation direction will switch to a new setting. In addition, CW terminal is pulled up to VREG through a resistance of 1010kΩ (Typ) ±300kΩ. CW Direction H or OPEN CW L CCW Brake Input Terminal (BRKB) Motor rotation can be quickly stopped by BRKB terminal (negative logic). When BRKB=”L”, all upper side predriver outputs are “H” and all lower side predriver outputs are “L” (short brake). When BRKB=”H” or OPEN, then the short brake action is released. In addition, BRKB terminal is pulled up to VREG through a resistance of 100kΩ (Typ) ±30kΩ. BRKB Operation H or OPEN Normal L Short brake Hall Input (HALL: HUP, HUN, HVP, HVN, HWP, HWN) Hall input amplifier inside the IC is designed with a hysteresis (±12mV(Typ)) in order to prevent false trigger due to noise. Always set correct bias current for the Hall element so that the amplitude of Hall input voltage will be over the minimum input voltage (VHALLMIN). It is recommended to connect a ceramic capacitor with about 100pF to 0.01µF value between the input terminals of the Hall amplifier. The in-phase input voltage range (VHALLCM1:0V to VREG-1.7V, VHALLCM2:0V to VREG) is designed for Hall input amplifier, set within this range when applying bias to the Hall element. Moreover, “H” or “L” of HU, HV ,HW in Commutation Logic means the following. HU HV HW HUP HUL HVP HVN HWP HWN H L H H L L H H L H L L H L L H L H H H L H L H L L H L H L L H H L L H L H H L H H L H L L L H L H L H H L When HU, HV ,HW become all “H” or all “L”, a circuit will detect these Hall input abnormalities and make all upper side predriver outputs “L” and all lower side predriver output “L”. 9. FG Output Terminal (FGO) 1FG signal that is controlled by hall signal is output from FGO terminal. In addition, because FG terminal is an open drain terminal, use a resistor of about 10kΩ to 100kΩ pulled up to supply voltage. In that case, please be careful that FGO voltage or current should never exceed rating. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Function Description – continued 10. Power Supply Terminal (VCC) (1) When IC is operated in 4.5V to 5.5V, VCC is short to VREG and connected to the power supply. In 6V to 28V, connect a power source only to VCC. (2) Stabilize VCC voltage by placing a bypass capacitor near the terminal, as much as possible, in case VCC voltage might change considerably by motor BEMF and PWM switching. Increase capacitance of the capacitor as necessary when drawing large current and motor with large BEMF. Please be careful that VCC voltage never exceeds ratings. (3) It is recommended to place a laminated ceramic capacitor of around 0.01µF to 0.1µF in parallel in order to decrease the impedance of power supply broadband. (4) VCC terminal has a clamp element for preventing ESD damage. If applying a steep pulse signal and voltage such as it surges more than the ratings, this clamp element operates, which might be a cause of destruction. It is effective to put a ener diode that corresponds to VCC absolute maximum ratings. Please note that IC might be destroyed when the backward voltage is applied to VCC and GND terminals. 11. Ground Terminal (GND) Wiring impedance from this terminal should be as low as possible to reduce noise of switching current and stabilizing basic voltage inside the IC; and the impedance should also be the lowest potential in any operating condition. In addition, please do pattern design to not have the common impedance as the other GND pattern 12. Predriver Output Terminal (UH, UL, VH, VL, WH, WL) By a driving signal produced with internal logic, the driving signal to an external output power transistor is output. Upper Gate functional voltage is VCC and Lower Gate functional voltage is 9.5V (Typ). Also when VCC=5V, Lower Gate functional voltage is VCC-0.2V (Typ). Additionally, When driver output converts “L” to “H” or “H” to “L”, dead time (1µs(Typ)) can be set to prevent simultaneous ON of external upper and lower FET. 13. Comparator Input Terminal for Detecting Output Current (RCL) When operating with current limit, please be sure to connect RNF and RCL. In addition, please do not have the same impedance as other GND patterns by using low impedance wiring, since motor drive current flows into the RCL terminal resistor for detecting current to GND. Please design pattern considering wiring that is less influenced by noise. Additionally, when RCL terminal is shorted to GND, large current might flow due to a lack of normal current limit operation. 14. H Side Output Logic Switching Terminal (HLSW) By changing HLSW, the gate logic of the upper output is changed. In HLSW=”L”, the gate logic of upper output is inverted. In addition, HLSW terminal is pulled up to VREG through a resistance of 200kΩ (Typ) ±60kΩ. 15. Control Signal Sequence It is recommended that input control signals DCIN, PWMB, CW terminals are turned ON after inputting VCC. If LPE terminal is set to “H” or “M” at startup, please take note that if motor rotation cannot be detected within the set time (edge of FG signal cannot be input), then the MLP circuit starts and motor fails to start. The order of priority is to set control signal and IC internal signal. Please refer to the following table. Priority of Control Signal Priority Input / Internal Signals 1st UVLO 2nd BRKB,CW,PWMB↓,DCIN 3rd TSD,MLP,HALLERR 4th OVLO 5th BRKB 6th CL 7th PWM,CW,HLSW,DCIN (Note)  means rising and falling edges of signal. For signal name, please refer to state transition diagram. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Protection Circuit (1) Current Limit Circuit (CL Circuit) Current limit of output (Current limit: CL) can be realized by changing the voltage of the output current with a resistor, and then by inputting the voltage into the RCL terminal. In order to avoid error detection of current detection comparator by RCL spike noise that occurs at output ON, mask time is set. Current detection is invalid during mask time after RCL voltage becomes more than 0.2V (Typ). Then all lower side predriver outputs are “L”, and they are returned automatically after the specified time (32µs (Typ)). This operation is not synchronized with PWM signal that is input into PWMB terminal. Moreover, if it happens that the noise is longer than the 0.5µs (Typ) internal mask time, set mask time using external low pass filter. (2) Thermal Shutdown Circuit (TSD Circuit) When chip temperature of driver IC rises and exceeds the set temperature (175°C (Typ)), the thermal shut down circuit (Thermal Shut Down: TSD) activates. At this time, all the upper side predriver outputs become “L” and all the lower side predriver outputs become “L”. In addition, the TSD circuit is designed with a hysteresis (25°C (Typ)), therefore, when the chip temperature drops, it will return to normal working condition. However, the purpose of the TSD circuit is to protect driver IC from a thermal breakdown, therefore, temperature of this circuit will be over working temperature when it is started up. Thus, thermal design should have sufficient margin, avoid continuous use and action of the circuit as a precaution. (3) Under Voltage Lock Out Circuit (UVLO Circuit) There is a built-in under voltage lock out circuit (Under Voltage Lock Out: UVLO circuit) used to ensure the lowest power supply voltage for drive IC to work and to prevent error action of the IC. When VCC voltage declines to VUVL (3.7V (Typ)), all the upper side predriver outputs become “L” and all the lower side predriver outputs become “L”. At the same time, UVLO circuit is designed with hysteresis, so when VCC voltage reaches more than V UVH (4.15V (Typ)), it will operate at normal working condition. (4) Over Voltage Lock Out Circuit (OVLO Circuit) There is a built-in over voltage lock out circuit (Over Voltage Lock Out: OVLO) used to prevent rise of VCC when motor is decelerating. When VCC is over VOVH (31V (Typ)), a certain time (4ms (Typ)) of short brake action is conducted. What’s more, because OVLO circuit is designed with hysteresis, when VCC is below VOVL (30V (Typ)), it can return to normal working condition after a certain time of short brake action. (5) Motor Lock Protection Circuit (MLP Circuit) There is a built-in motor lock protection circuit (Motor Lock Protection: MLP). The ON/OFF of MLP circuit and monitoring time can be set by the LPE terminal. In monitoring Hall signals, when the LPE = “H” and Hall signal logic does not change in more than 1.1sec (Typ) or LPE =”M” and Hall signal logic does not change in more than 2.2sec (Typ), all the upper side predriver outputs are locked “L” and all the lower side predriver outputs are locked “L”. There are four ways to release the latch (a) The latch is released by Switching BRKB logic (b) The latch is released by Switching CW logic. (c) After PWMB = “H” or OPEN state and is detected for 15ms (Typ), latch can be released by falling edges of subsequent PWMB. (d) After DCIN = GND or under 1V (Typ) state is detected for 15ms (Typ), latch can be released by rising edges of subsequent PWMB. However, when LPE = “L”, MLP circuit does not work during short brake action (including switching rotation direction) or TSD. LPE terminal is pulled up to VREG through a resistance of 100kΩ (Typ) ±30 kΩ. LPE Monitoring Time H or OPEN 1.1sec(Typ)±30% M 2.2sec(Typ)±30% L Disable www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Electrical Characteristic (Unless otherwise specified Ta=25°C, VCC=24V) Parameter Symbol Limit Min Typ Max Unit Conditions [Whole] Circuit Current ICC - 2.5 5.0 mA VREG Voltage VREG 4.5 5.0 5.5 V IVREG = -10mA Upper Side High Voltage VOHH VCC-0.6 VCC-0.2 VCC V IOUT = -5mA Upper Side Low Voltage VOHL 0 0.2 0.6 V Lower Side High Voltage1 VOLH1 8.1 9.5 10.5 V Lower Side High Voltage2 VOLH2 VCC-0.6 VCC-0.2 VCC V IOUT = 5mA IOUT = -5mA, No load capacitance VCC = 5V, IOUT = 5mA Lower Side Low Voltage VOLL 0 0.2 0.6 V IOUT = 5mA IHALL -2.0 -0.1 +2.0 µA VHALL = 0V VHALLCM 0 - VREG-1.7 V VHALLCM 0 - VREG V Minimum Input Voltage VHALLMIN 50 - - mVP-P Hysteresis ΔVHALL 15 24 40 mV [Predriver Output] [Hall Input] Input Bias Current Phase Input Voltage Range 1 Phase Input Voltage Range 2 HYS Level + VHALLHY+ 5 12 22 mV HYS Level - VHALLHY- -22 -12 -5 mV IBRKB -80 -50 -30 µA VBRKBH 2.0 - VREG V Voltage Input L VBRKBL 0 - 0.8 V Minimum Input Pulse Width tPLSMIN1 1 - - msec ICW -8 -5 -3 µA VCWH 2.0 - VREG V In one side bias (When Hall IC is used) [Input of Control : BRKB] Input Current Voltage Input H VBRKB = 0V [Input of Control : CW] Input Current Voltage Input H Voltage Input L Minimum Input Pulse Width VCWL 0 - 0.8 V tPLSMIN2 1 - - msec VCW = 0V [Input of Control : HLSW] Input Current IIN -40 -25 -15 µA Voltage Input H VHLWSHH 2.0 - VREG V VHLSW = 0V Voltage Input L VHLSWL 0 - 0.8 V ILPE -80 -50 -30 µA Input Voltage “H” VLPH 0.8×VREG - VREG V Input Voltage “M” VLPM 0.4×VREG - 0.6×VREG V Input Voltage “L” VLPL 0 - 0.2×VREG V External R Inflow Current IRHG -30 -20 -10 µA R = 20kΩ Oscillator Frequency fPWM 14 20 26 kHz R = 20kΩ VPWMB = 0V [Input of Control : LPE] Input Current VLPE = 0V [Input of Control : PWMOSC] [Input of Control : PWMB] Input Current IPWMB -80 -50 -30 µA Voltage Input H VPWMBH 2.0 - VREG V Voltage Input L VPWMBL 0 - 0.8 V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Electrical Characteristic – continued (Unless otherwise specified Ta=25°C, VCC=24V) Parameter Symbol Limit Min Typ Max Unit Conditions [Input of Control : DCIN] Input Bias Voltage VBIAS -1 0 1 µA VDCIN = 0V Input Voltage 1 VDCIN1 0.75 1 1.25 V 0% Output duty cycle Input Voltage 2 VDCIN2 2.75 3 3.25 V 100% Output duty cycle VICM 0 - VREG-1.7 V VFGOL 0 0.1 0.3 V VCL 0.18 0.20 0.22 V Release Voltage VUVH 3.95 4.15 4.35 V Lock Out Voltage VUVL 3.5 3.7 3.9 V Release Voltage VOVL 28.0 30.0 32.0 V Lockout Voltage VOVH 29.0 31.0 33.0 V Phase Input Voltage Range [FGO] Output Voltage L I = 2mA [Current Limit : RCL] Detect Voltage [UVLO] [OVLO] Typical Performance Curves Lower Side H Voltage (Maximum) [V] Lower side H Voltage(Maximum)[V] 12.0 11.5 11.0 10.5 10.0 9.5 9.0 1 10 100 1,000 10,000 ExternalFET FETInput InputCapacitance capacitance Value value[pF] External [pF] Figure 6. Predriver Lower Side H Voltage (Maximum) vs External FET Input Capacitance Value (VCC=24V, PWMB: 20 kHz, 50%) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Timing Chart CW Direction (CW="H" or OPEN) HLSW="H" HU HV HW UH UL PWM PWM PWM PWM VH PWM VL PWM PWM PWM WH PWM WL External FET U PWM External FET V External FET W PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM FG OUTPUT FGO Figure 7. Timing Chart 1 *In HLSW=”L”, the output H/L of UH, VH, WH becomes the reverse. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Timing Chart – continued CCW Direction (CW="L") HLSW="H" HU HV HW UH PWM UL PWM PWM PWM VH VL PW M PWM PWM PW M PWM WH WL PWM External FET U PWM PWM External PW FET V M External FET W PWM PWM PWM PWM PWM PWM PWM PWM PWM PW M PWM PWM PWM FG OUTPUT FGO Figure 8. Timing Chart 2 *In HLSW=”L”, the output H/L of UH, VH, WH becomes the reverse. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV State Transition Diagram CW BRKB DIR change Short brake UH/VH/WH : H UL/VL/WL : L fHALL>40Hz UH/VH/WH : L UL/VL/WL : L (MLP=RESET) (MLP=RESET) fHALL Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 12. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 17. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Ordering Information B D 6 3 0 0 1 A M U V - Package MUV: VQFN024V4040 Part Number E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN024V4040 (TOP VIEW) Part Number Marking 63001 LOT Number 1PIN MARK Part Number Marking 63001 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Package Orderable Part Number VQFN024V4040 20/22 BD63001AMUV-E2 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN024V4040 21/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Revision History Date Revision 23.Mar.2016 001 30.May.2016 002 28.Dec.2020 003 Changes New Release P6 Notation change of Thermal resistance “Footprints and Traces” 74.2mm2 (Square) ⇒ 74.2mm x 74.2mm P18 Thermal Consideration Pd ⇒ maximum junction temperature Updated packages and part numbers www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Ordering Information B D 6 3 0 0 1 A M U V - Z Package MUV: VQFN24V4040A Part Number E2 Packaging and forming specification E2: Embossed tape and reel Production site Z: Added Marking Diagram VQFN24V4040A (TOP VIEW) Part Number Marking 63001 LOT Number 1PIN MARK Part Number Marking 63001 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Package Orderable Part Number VQFN24V4040A BD63001AMUV-ZE2 22-2/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 BD63001AMUV Physical Dimension and Packing Information Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN24V4040A 22-3/22 TSZ02201-0P1P0B001390-1-2 28.Dec.2020 Rev.003 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001