BD63015EFV-E2

Datasheet Three Phase Brushless Motor Driver BD63015EFV General Description Key Specifications        BD63015EFV is a three phase sinusoidal brushless motor driver. The rating of the power supply is 36V and that of current rating is 1.5A (peak current, 2A). PWM driving signals are generated by the three hall sensors. Input DC voltage signal can control the rotation speed, also, you can control by the power voltage. As the various control circuit and the protection circuit are built-in, this IC can fit the various applications. It can be used for the small diameter motor module because of the small package. Power Supply Voltage Rating: 36V Output Continuous Current Rating: 1.5A Output Peak Current Rating: 2A(Note 1) Operating Temperature Range: -40°C to +105°C Current Limit Detect Voltage: 0.2V±10% Output ON Resistors (Total): 0.6Ω(Typ) UVLO Voltage: 6V(Typ) (Note 1) Pulse width tw≤1ms, duty=20% pulse) Package HTSSOP-B20 W(Typ) x D(Typ) x H(Max) 6.50mm x 6.40mm x 1.00mm Features            Sinusoidal Drive Low ON Resistors DMOS Output (Pch / Nch) PWM Output FG Output (3FG) Built-in Current Limit Circuit (CL) Built-in Thermal Shut Down Circuit (TSD) Built-in Over Current Protection Circuit (OCP) Built-in Under Voltage Lock Out Circuit (UVLO) Built-in Over Voltage Lock Out Circuit (OVLO) Built-in Motor Lock Protection Circuit, Automatic Restart type (MLP) Built-in HALL error Protection Circuit (HALLERR) Applications  Various types of Air Conditioning Fan Motor (FAN, Exhaust FAN, Air Cleaner FAN etc.)  Various types of Cooler Fan Motor Typical Application Circuit Figure 1. Application Circuit 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 〇This product has no designed protection against radioactive rays 1/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications........................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Pin Configuration ............................................................................................................................................................................ 3 Block Diagram ................................................................................................................................................................................ 3 Pin Description................................................................................................................................................................................ 3 Absolute Maximum Ratings ............................................................................................................................................................ 4 Thermal Resistance ........................................................................................................................................................................ 5 Recommended Operating Conditions ............................................................................................................................................. 5 Description of Blocks ...................................................................................................................................................................... 6 (1) Regulator Output Pin (VREG) ........................................................................................................................................... 6 (2) Controlling Rotation Speed Input Pin (DCIN) .................................................................................................................... 6 (3) Soft Start / Soft Stop Setting Pin (SSB) ............................................................................................................................. 7 (4) HALL Input (HALL: HUP, HUN, HVP, HVN, HWP, HWN) .................................................................................................. 7 (5) FG Output Pin (FGO) ........................................................................................................................................................ 8 (6) Power Supply Pin (VCC) .................................................................................................................................................. 8 (7) Ground Pin (GND) ............................................................................................................................................................ 8 (8) Driver Output Pin (U, V, W) ............................................................................................................................................... 8 (9) Resistor Connected Pin for Detecting Output Current (RNF) ........................................................................................... 8 (10) Comparator Input Pin for Detecting Output Current (RCL) ............................................................................................... 8 (11) TEST Pin (TEST1, TEST2) ............................................................................................................................................... 8 (12) Sequence of control signal ............................................................................................................................................... 9 Protection Circuits ......................................................................................................................................................................... 10 (1) Current Limit Circuit (CL circuit) ...................................................................................................................................... 10 (2) Thermal Shut Down Circuit (TSD Circuit) ....................................................................................................................... 10 (3) Over Current Protection Circuit (OCP Circuit) ................................................................................................................. 10 (4) Under Voltage Lock Out Circuit (UVLO Circuit) .............................................................................................................. 10 (5) Over Voltage Lock Out Circuit (OVLO circuit) ................................................................................................................. 10 (6) Motor Lock Protection Circuit (MLP Circuit) .................................................................................................................... 10 Electrical Characteristics............................................................................................................................................................... 11 Timing Chart ................................................................................................................................................................................. 12 State Transition Diagram............................................................................................................................................................... 13 I/O Equivalence circuits ................................................................................................................................................................ 14 Operational Notes ......................................................................................................................................................................... 15 Ordering Information ..................................................................................................................................................................... 17 Marking Diagrams ......................................................................................................................................................................... 17 Physical Dimension and Packing Information ............................................................................................................................... 18 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Pin Configuration Block Diagram (TOP VIEW) VREG VREG 10 VREG ○ 18 VCC W 1 20 V RNF 2 19 U RCL 3 18 VCC HUP 4 17 TEST2 HUN 5 16 FGO HVP 6 15 SSB VREG HUP 4 HUN 5 19 U VREG HVP 6 HVN 7 HWP 8 HWN 9 7 14 Internal Reg 6 VREG 2 RNF 4 TEST1 13 HVN 20 V 1 W VREG EXP-PAD PRE DRIVER LOGIC VREG LPE VREG VREG 3 RCL VREG HWP 8 13 TEST1 HWN 9 12 GND VREG 10 11 DCIN SSB 15 16 FGO VREG VREG TEST2 17 TSD, OCP UVLO, OVLO OSC VREG VREG DCIN 11 A/D VREG 14 LPE 12 GND Figure 2. Pin Configuration Figure 3. Block Diagram Pin Description Pin No 1 Pin Name Function Pin No 11 Pin Name Function DCIN Controlling rotation speed input W W phase output 2 RNF Resistor for detecting output current connecting Input 12 GND Ground 3 RCL Comparator of detecting output current input 13 TEST1 Test input (for shipment) 4 HUP U phase hall input + 14 LPE Motor lock protection setting input 5 HUN U phase hall input - 15 SSB Soft start / Soft stop setting input 6 HVP V phase hall input + 16 FGO FG output (3FG) 7 HVN V phase hall input - 17 TEST2 Test input (for shipment) 8 HWP W phase hall input + 18 VCC Power supply / Motor power supply 9 HWN W phase hall input - 19 U U phase output 10 VREG Regulator output 20 V V phase output - EXPPAD The EXP-PAD of the center of product connect to GND. - - - www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Absolute Maximum Ratings (Ta = 25°C) Item Symbol Limit Unit VCC -0.3 to +36.0 V VLPE, VSSB -0.3 to +5.5 V VDCIN -0.3 to +12.0 V VHUP, VHUN,VHVP, VHVN, VHWP, VHWN -0.3 to +5.5 V TEST1 Input Voltage VTEST1 -0.3 to +5.5 V TEST2 Input Voltage VTEST2 -0.3 to +36.0 V Driver Output Voltage VU, VV, VW, -0.3 to +36.0 V FGO Voltage VFGO -0.3 to +7.0 V RNF Voltage VRNF 0.7 V VREG Output Current IVREG -30 mA FGO Output Current IFGO 5 mA Driver Output Current (Continuous) IOUT(DC) 1.5 A/phase Driver Output Current (Peak)(Note 1) IOUT(PEAK) 2.0 A/phase Tstg -55 to +150 °C Tjmax 150 °C Power Supply Voltage Control Input Voltage (LPE, SSB) Controlling Rotation Speed Input Voltage Hall Input Voltage Storage Temperature Range Maximum Junction Temperature (Note 1) Pulse width tw≤1ms, duty=20% pulse Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Thermal Resistance (Note 1) Parameter Thermal Resistance (Typ) Symbol Unit 1s(Note 3) 2s2p(Note 4) θJA 143.0 26.8 °C/W ΨJT 8 4 °C/W HTSSOP-B20 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. (Note 4)Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top Thermal Via(Note 5) Pitch Diameter 1.20mm Φ0.30mm 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm (Note 5) This thermal via connects with the copper pattern of all layers. Recommended Operating Conditions Item Symbol Min Typ Max Unit Supply Voltage VCC 8 12 28 V Operating Temperature Topr -40 25 +105 °C www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Description of Blocks (1) Regulator Output Pin (VREG) This is the Pin regulated 5V (Typ). Set the capacitors of 0.1µF to 1µF. If using VREG for the bias power supply for HALL elements, don’t exceed the ratings of VREG current. The rating for the max RPM [%] (2) Controlling Rotation Speed Input Pin (DCIN) Rotation Speed can be controlled by inputting DC signal into DCIN and changing the PWM duty of driver output. If VCC is used for controlling the rotation speed, set DCIN = VREG. When DCIN≤1V (Typ), all of the driver outputs are controlled to “L”. DCIN Pin is pulled down to GND by the resistor of 200kΩ±60kΩ. 100% 0 1 4 DCIN [V] Figure 4. DCIN voltage vs rotation speed The voltage of DCIN is input into the LOGIC circuit through the A/D inside IC. It sets the duty and makes signals of driver outputs demanding DCIN voltage. A/D samples DCIN voltage repeatedly and updates the set point. The set point is updated when it changes over ±1LSB from the previous point and when the next set point is in ±1LSB of itself three times.(The time is 1ms(Typ)). Only the setting point of initial value is updated by the first sampling. The A/D has 8 bit digital value and the power supply is VREG. 1LSB is about 19.5mV (5V/256,8bit). If VREG fluctuates, the rotation speed fluctuates, too. So stabilize VREG. It is better that DCIN is inputted the voltage divider of VREG. Figure 5. A/D sampling operation www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Description of Blocks - continued (3) Soft Start / Soft Stop Setting Pin (SSB) The circuit of Soft Start and Soft Stop (SS mode) is built in to save the start/stop current. Soft Start and Soft Stop mode is set by inputting VSSBL(Note 1). When SSB is VSSBH(Note 1), only CL circuit save the start and stop current. Don’t change SSB pin voltage during operating because of the incorrect operation. SSB pin is pulled up to VREG by the resistors of 100kΩ±30kΩ. With regard to the bias current, see the table of Electrical Characteristics shown P11. (Note 1)See the table of Electrical Characteristics shown P11. SSB H or OPEN L Table1. SSB Pin Function Operation Disable SS mode Enable SS mode An example of SS mode operation is shown in the following. This operation is enable at starting, stopping, and changing the rotation speed. (The times shown in Figure 6 are typical value) same slope at speed up same slope at speed down The rating for the max RPM[%] 100% DCIN Voltage 0% 0.88s 7s VREG VREG/2 0V t：time Input speed down signal Input speed down signal Input DCIN signal Input speed up signal It takes 0.88s from 0% to 100%. It takes 7s from 100% to 0%. Figure 6. Soft start / Soft stop operation (4) HALL Input Pin (HALL: HUP, HUN, HVP, HVN, HWP, HWN) HUP, HUN, HVP, HVN, HWP, HWN is the input pin of HALL comparator in IC. The hysteresis voltage (±15mV(Typ) (Note 2)) is set in HALL comparator to prevent the incorrect operation by the noise. Set the bias current of HALL elements the minimum input voltage (VHALLMIN(Note 2)) or more. Also set the ceramic capacitors about 1000pF to 0.01uF between the inputs of HALL comparator. As HALL comparator has the range of In-phase Input Voltage (VHALLCM(Note 2)), set the bias current of HALL elements in VHALLCM. All of the driver outputs are Hi-Z by the error detection circuit of HALL inputs signals when all of the outputs of HALL comparator (HU, HV, and HW) are ”H” or “L”. In addition, if one of the outputs of HALL comparator keeps “H” or “L” on a certain time, all of the driver outputs are Hi-Z for 5s(Typ), “a certain time” shows the period which positive/negative edge of the other outputs are counted 32 times. This circuit is automatic restarted if the HALL signals return to the normal state after 5s and HU, HV and HW are judged correctly. (This detection repeats every 5s.) Pay attention to the positon of HALL elements for fear that the efficiency and the silence characteristic become worse. (Note 2)See the table of Electrical Characteristics shown P11 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Description of Blocks - continued (5) FG Output Pin (FGO) 3FG signal which is synthesize from the HALL signals is output from FGO. Set FGO pulled up by the resistors about 10kΩ to 100kΩ because FGO is the pin of open-drain. Pay attention not to exceed the voltage rating and current rating of FGO because of the destruction of IC. (6) Power Supply Pin (VCC) Make VCC line low impedance (thick and short) because the Motor current flows. VCC might be changed considerably by MOTOR BEMF and PWM switching, so place the bypass capacitors as near as possible between VCC and GND pin. When the Motor generates large current or big BEMF, add the value of capacitors. Also, set the ceramic capacitors about 0.01µF to 1µF to decrease the impedance of power supply broadband. Pay attention not to exceed the rating for a moment. Also, the device against ESD exists on VCC pin, so if the serge voltage which is the rating or more, this ESD device operates and so IC may destroy. Don’t exceed the rating. It is so useful to add the Zener diode whose breakdown voltage is slightly lower than the rating. In addition, if the voltage input in reverse, IC may destroy because of the ESD device between VCC and GND. (7) Ground Pin (GND) Make GND line as thick and short as possible to decrease the switching noise and stabilize the reference voltage inside IC and set GND the lowest voltage for a moment. Also, design that GND of IC should not have the common impedance. (8) Driver Output Pin (U, V, W) Pay attention about the following points in using driver output.  Wiring of U, V, and W should be thick and short (low impedance) because the motor current flows.  IC might destroy because the diodes against ESD operates when the serge pulse signal or the voltage which is the rating or more input into the pins. Don’t exceed the rating. When the driver outputs change considerably toward positive and negative (for ex. BEMF voltage is so big), IC operates abnormally or destroys. In the above case, add the Schottky diode to the driver output pin. (9) Resistor for Detecting Output Current Connecting Input Pin (RNF) Insert resistor for detecting current 0.15Ω to 0.7Ω between RNF and GND. Pay attention that the power consumption of resistor for detecting output current (multiply IOUT2 by R[W]) doesn’t be exceeded the rating of the resistor. Because the Motor current flows, make the low impedance between RNF pin and GND. Also it should not have the common impedance. If RNF voltage exceeds the rating, IC might malfunction or be destroyed, so don’t exceed the rating. When RNF pin is shorted to GND, large current flows due to a lack of normal current limit operation. Pay attention that OCP or TSD might operate in that case. Similarly, if RNF Pin is OPEN, output current might not flow, and it causes malfunction. (10) Comparator of Detecting Output Current Input Pin (RCL) RCL pin (the pin that the input of the current detect comparator) exists independently in order to avoid the deterioration of current detect accuracy by wire impedance inside IC of RNF pin. Therefore, when operating current limit, be sure to connect RNF pin and RCL pin. Moreover, it is possible to reduce the deterioration of current detect accuracy that is caused by the impedance of board pattern between RNF pin and resistor for detecting current, to connect wiring from RCL pin most adjacent to resistor for detecting current. Design the PCB pattern considering wiring that is less influenced by noise. Additionally, when RCL pin is shorted to GND, IC can’t operate normally and so the large current might flow. Pay attention that OCP or TSD might operate in that case. (11) TEST Pin (TEST1, TEST2) TEST pin is for the shipping inspection. Short to GND at normally use. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Description of Blocks - continued (12) Sequence of control signal It is recommended to input the signal into LPE after VCC. If LPE is input before VCC, IC operates correctly. However in the case of LPE is “H” or “M”, pay attention that Motor can’t be started if the Motor rotation can’t be detected in the setting time. IC has the priority between the control signals and the protection signals. See the following table. Table2. Priority of control signals Priority Input / Internal Signals 1st UVLO 2nd OCP, TSD 3rd OVLO 4th MLP, HALLERR 5th CL www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Protection Circuits (1) Current Limit Circuit (CL circuit) To change from the output current to the voltage by the resistor between RNF and GND and to input that voltage into RCL work as Current Limit (CL circuit). CL has the mask time to avoid the false detection because of the spike noise when the output turns ON. Current limit doesn’t work in the mask time that RCL become 0.2V (Typ) or more. In the case of SSB is “H”, all of the driver outputs turn “L” and it returns by itself after a certain time (1µs(Typ)). In the case of SSB is “L”, the Motor torque is saved, after RCL voltage is 0.2V (Typ) or less, it turns to the normal operation. In both of case the mask time of CL operation is 0.6µs (Typ). (2) Thermal Shut Down Circuit (TSD Circuit) TSD (Thermal Shut Down: TSD) operates when the chip temperature is 175°C (Typ) or more and all of the driver outputs turn to Hi-Z. TSD circuit has the hysteresis (25°C (Typ)) so if the chip temperature is down, it operates normally. The purpose of the TSD circuit is to protect driver IC from thermal breakdown. The temperature is over the rating when TSD operates. Thus, it must have sufficient margin against TSD, and don’t use continuously by TSD as a precondition. (3) Over Current Protection Circuit (OCP Circuit) OCP (Over Current Protection: OCP) circuit prevent from the destruction of shorted between the output pins and VCC/GND shorted. The outputs are latched to Hi-Z when the output current exceeds the current rating and reaches the OCP current. OCP can be reset by UVLO. It must have sufficient margin against OCP and pay attention not to use continuously by OCP as a precondition because the output current exceeds the current rating when OCP operates. Also when the outputs shorted to GND or shorted between the outputs, OCP operation might be reset by UVLO operation of VCC or VREG. So consider fully. (4) Under Voltage Lock Out Circuit (UVLO Circuit) UVLO (Under Voltage Lock Out: UVLO) circuit prevent the false operation from under voltage which driver IC can operate. When VCC declines to VUVL (6V (Typ)), all of the outputs turn to Hi-Z. UVLO circuit has hysteresis (1V (Typ)), so when VCC reaches VUVH (7V (Typ)) or more, it operates normally. Also when VREG is 4V (Typ) or less, UVLO operates. (5) Over Voltage Lock Out Circuit (OVLO circuit) Over voltage lock out circuit (Over Voltage Lock Out: OVLO) is built in for the purpose to save the lifted voltage at the rotation speed down. All of the driver outputs turn “L” if LPE is “H” or “L” and VCC is VOVH2 (31V (Typ)) or more, if LPE is “M” and VCC is VOVH1 (16V (Typ)) or more. OVLO circuit has the hysteresis. In the case of VOVH2, it operates normally VOVL2 (30.5V (Typ)) or less. In the case of VOVH1, it operates normally VOVL1 (15V (Typ)) or less. (6) Motor Lock Protection Circuit (MLP Circuit) Motor lock protection circuit (Motor Lock Protection: MLP) is built in. Enable/Disable of MLP and OVLO threshold can be set by LPE pin. All of the driver outputs are Hi-Z when the outputs of HALL comparator keep “H” or “L” during 1.1s (Typ) at LPE is "H" or "M". It restarts after 5s (Typ). When LPE is "L", MLP circuit does not work. LPE pin is pulled up by VREG through a resistance of 100kΩ±30kΩ. LPE Table3. LPE Pin Function Monitoring Time OVLO Threshold H or OPEN 1.1s±30% VOVH2, VOVL2 M 1.1s±30% VOVH1, VOVL1 L Disable VOVH2, VOVL2 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC =12V) Item Symbol Limit Min Typ Max Unit Conditions [Whole] Circuit Current ICC - 8 16 mA VREG Voltage VREG 4.75 5.0 5.25 V IVREG=-10mA Output On Resistance RON - 0.6 1.1 Ω IOUT=±1.5A (sum of High/Low side) Carrier Frequency FPWM 20 22.7 25 kHz IHALL -2.0 -0.1 +2.0 µA VHALLCM 0 - VREG-1.8 V Minimum Input Voltage VHALLMIN 65 - - mVp-p HYS Level + VHALLHY+ 3 15 30 mV HYS Level - VHALLHY- -30 -15 -3 mV IDCIN 12.5 25 40 µA Min Duty Input Voltage VMIN 0.75 1 1.25 V Max Duty Input Voltage VMAX 3.75 4 4.25 V [Driver Output] [HALL Input] Input Bias Current Range of In-phase Input Voltage VHALL=0V [Control Input: DCIN] Input Bias Current VDCIN=VREG [Control Input: SSB] Input Current ISSB -80 -50 -30 µA Voltage Input H VSSBH 2.0 - VREG V VSSB=0V Voltage Input L VSSBL 0 - 0.8 V ILPE -80 -50 -30 µA Input Voltage "H" VLPEH 0.8xVREG - VREG V Input Voltage "M" VLPEM 0.4xVREG - 0.6xVREG V Input Voltage "L" VLPEL 0 - 0.2xVREG V VFGOL 0 0.1 0.25 V VCL 0.18 0.20 0.22 V Release Voltage VUVH 6.3 7.0 7.7 V Lock Out Voltage VUVL 5.4 6.0 6.6 V Release Voltage1 VOVL1 13.5 15.0 16.5 V LPE=”M” Lockout Voltage1 VOVH1 14.5 16.0 17.5 V LPE=”M” Release Voltage2 VOVL2 28.5 30.5 33.5 V LPE=”H” or “L” Lockout Voltage2 VOVH2 29.0 31.0 34.0 V LPE=”H” or “L” [Control Input: LPE] Input Current VLPE=0V [FG Output: FGO] Output Voltage L IFGO=2mA [Current Limit] Detect Voltage [UVLO] [OVLO] www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Timing Chart HU HV HW U V W IU IV IW FGO Figure 7. Timing Chart www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV State Transition Diagram Driver Outputs: Hi-Z UVLO and TSD and OVLO and 3HALLERR (All of the protection released) UVLO or TSD or OVLO or 3HALLERR (Each protection operated) DCIN≥1V(Typ) and CL released (SSB="H") MLP or 1HALLERR operated Driver Outputs: Hi-Z (Auto Restart) MLP and 1HALLERR Protection released Normal Operation DCIN Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 9. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Ordering Information B D 6 3 0 1 5 E F V Package EFV: HTSSOP-B20 Part Number - E2 Packaging and forming specification E2: Embossed tape and real Marking Diagrams HTSSOP-B20 (TOP VIEW) Part Number Marking D 6 3 0 1 5 LOT Number Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTSSOP-B20 18/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 BD63015EFV Revision History Date Rev. 13.Feb.2018 001 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release 19/19 TSZ02201-0S3S0CZ00040-1-2 13.Feb.2018 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001