BD63241FV-E2

Datasheet DC Brushless Fan Motor Drivers Three-phase Full-Wave 1Hall Fan Motor Driver BD63241FV General description BD63241FV is the 1chip driver composed a motor drive of power DMOS FET. It realize quietness, low vibration drive at the time of a more stable start movement and motor movement by rotor position sensing only with external 1 Hall sensor and make output current sine wave drive. Key Specifications „ Operating Supply Voltage Range: 5.0V to 16.0V „ Operating Temperature Range: -40°C to +100°C Package SSOP-B16 Features „ Small Package „ Integrated Power DMOS FET Driver „ Full-Sine drive of 1 Hall Sensor Detection „ Direct PWM Input „ Auto lead angle control „ Fix lead angle control „ Soft-Start of Sine Wave Drive „ Quick Start „ Signal Output FG W (Typ.) x D (Typ.) x H (Max.) 5.00mm x 6.40mm x 1.35mm Application „ Refrigerator, and consumer equipment ,etc SSOP-B16 Typical Application Circuit Connection motor GND - PWM FG O/P H+ SOSC HB SS H- HPST COM VCC RNF W U V REF 1pin PWM + M ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Pin Configuration Pin Description (TOP VIEW) Pin No. Pin Name Function REF 1 16 GND 1 REF Reference voltage terminal PWM 2 15 FG 2 PWM Output duty control terminal H+ 3 14 SOSC 3 H+ Hall + input terminal HB 4 13 SS 4 HB Hall bias terminal H- 5 12 HPST 5 H- Hall – input terminal COM 6 11 VCC 6 COM Motor central tap terminal RNF 7 10 W 7 RNF Output current detecting resistor connecting terminal U 8 9 V 8 U Motor drive output U terminal 9 V Motor drive output V terminal 10 W Motor drive output W terminal 11 VCC Power supply terminal 12 HPST Hybrid phase setting terminal 13 SS 14 SOSC 15 FG 16 GND Figure1. Pin configuration Capacitor for Soft-Start current charge connecting terminal Oscillating capacitor connecting terminal for open sine drive Signal output terminal FG Ground terminal Block Diagram REF 1 REF LOCK PROTECT TSD UVLO 16 GND REF QUICK START PWM 2 SIGNAL OUTPUT H+ 3 15 FG 14 SOSC TOSC Vcl HB 4 HALL BIAS CONTROL 13 SS LOGIC REF HALL COMP H- 5 COM 6 12 HPST BEMF COMP 11 Vcc PRE DRIVER RNF 7 Vcc Vcc Vcc U 8 10 W 9 V Figure 2. Block diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Absolute maximum ratings Parameter Symbol Limit Unit Power Supply Voltage [VCC] VCC 20 V Power Dissipation Pd 0.875 W Operating Temperature Range Topr -40 to +100 °C Storage Temperature Range Tstg -55 to +150 °C Motor Drive Output Voltage [U, V, W] VO 20 V Motor Drive Output Current [U, V, W] IO 1.0 (Note 2) A FG Output Voltage VFG 20 V FG Output Current IFG 10 mA REF Output Current Ability IREF 10 mA HB Output Current Ability IHB 10 mA Input Voltage1 [COM] VIN1 18 V Input Voltage2 [PWM, HPST, SS] VIN2 7 V Input Voltage3 [H+, H-] VIN3 7 V Input Voltage4 [RNF] VIN4 4.5 V Tj 150 °C Maximum Junction Temperature (Note 1) Derating in done 7.0 mW/°C for operating above Ta≧25°C (Mount on 2-layer 70.0mm x 70.0mm GND board) (Note 2) This value is not exceed Pd and ASO Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended operating condition Parameter Symbol Limit Unit Power Supply Voltage [VCC] VCC 5.0 to 16 V Input Voltage1 [COM] VIN1 5.0 to 16 V Input Voltage2 [PWM, HPST, SS] VIN2 0 to VREF V Input Voltage3 [H+, H-] VIN3 0 to VHB V Input frequency (PWM) FPWM 20 to 50 kHz www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Electrical characteristics (Unless otherwise specified Ta=25°C, Vcc=12V) Parameter Symbol Limit Unit Conditions Min Typ Max ICC 3.6 6 8.4 mA Hall Input Hysteresis Voltage + VHYS+ 5 10 15 mV Hall Input Hysteresis Voltage - VHYS- -15 -10 -5 mV REF Voltage VREF 4.65 5.00 5.35 V IREF=-5mA Hall Bias Voltage VHB 1.00 1.25 1.50 V IHB=-5mA SOSC High Voltage VSOSCH 0.8 1.0 1.2 V SOSC Low Voltage VSOSCL 0.3 0.5 0.7 V SOSC Charge Current ICSOSC -46 -40 -34 µA VSOSC=0.75V SOSC Discharge Current IDSOSC 34 40 46 µA VSOSC=0.75V PWM Input High Voltage VPWM 2.5 - - V PWM Input Low Voltage VPWM - - 0.8 V PWM Input Current IPWM -75 -50 -25 µA VCL 120 150 180 mV ISS -2.4 -1.8 -1.2 µA FG Output Low Voltage VFGL - 0.3 0.4 V IFG=5mA FG Output Leak Current IFGL - - 10 µA VFG=20V Lock Detection ON Time tON1 0.6 1 1.6 s Lock Detection OFF Time tOFF 3.3 5 8.3 s Output High Voltage VOH - 0.15 0.2 V IO= -0.3A, for Vcc Voltage Output Low Voltage VOL - 0.09 0.16 V IO= 0.3A HPST Input Current IHPST -35 -25 -15 µA VHPST=0V AUTO Mode VHPST1 3.85 - 5.00 V 25° Mode VHPST2 2.6 - 3.65 V 10° Mode VHPST3 1.35 - 2.40 V 0° Mode VHPST4 0 - 1.15 V Circuit Current VPWM=0V Current Limit Voltage SS Charge Current About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Application Example Stabilization of REF voltage REF 1 0.1µF to Input Direct PWM PWM Hall bias is set according to the amplitude of hall element output and hall input voltage range. REF LOCK PROTECT TSD UVLO QUICK START 2 SIGNAL OUTPUT 3 15 Protection of FG open-drain HB 4 HALL BIAS H- 13 Soft-Start time setting SS 0.47µF to 2.2µF REF CONTROL Sync-Startup time setting Its necessary to choose the best capacitor value for optimum start-up operation SOSC 14 220pF to 2200pF TOSC HALL COMP SIG FG 0Ω to Vcl H − GND REF PWM H+ 0Ω to 16 LOGIC 12 5 Setting of Lead angle control HPST Noise measure of substrate COM 6 BEMF COMP Vcc 4.7µF to ＋ 11 PRE DRIVER RNF W 7 Vcc Vcc Vcc 10 Against reverse FAN connector for provision 0.22Ω to U Detect current to limit motor current, pay attention to wattage. Because large current is present. 8 9 V Provision for Vcc-rise by kick-back the bypass capacitor, diode must be routed Vcc terminal as near as possible. Absolute Output Voltage 20V Absolute Output Current 1.0A Figure 3. Application Substrate design note a) IC power, motor outputs, and motor ground lines are made as fat as possible. b) IC ground (signal ground) line arranged near to (–) land. c) The bypass capacitor is arrangement near to VCC pin. d) When substrates of outputs are noisy, add capacitor as needed. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Typical Performance Curves1 (Reference data) 10 6 Operating range Operating range Operating Operating range range 8 5 REF voltage: VREF[V] Circuit current: Icc[mA] 100°C 25°C 6 -40°C 95°C 25°C 4 –25°C 95°C 25°C 4 –25°C 100°C 25°C -40°C 3 2 0 2 0 5 10 15 20 0 5 Supply voltage: Vcc[V] 20 Figure 5. REF Voltage 2.0 Operating range Operating range Operating range SOSC H/L voltage: VSOSCH/VSOSCL[V] –25°C 25°C -40°C 95°C 25°C 100°C –25°C 5.0 REF voltage: VREF[V] 15 Supply voltage: Vcc[V] Figure 4. Circuit current 6.0 10 25°C 4.0 95°C 3.0 2.0 1.5 –25°C 100°C 25°C 25°C -40°C 95°C 1.0 100°C 25°C -40°C 0.5 0.0 0 2 4 6 8 10 Output source current: IREF[mA] 5 10 15 20 Supply voltage: Vcc[V] Figure 6. REF Voltage current ability (Vcc=12V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 7. SOSC High/Low Voltage 6/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Typical Performance Curves2 (Reference data) 0.8 Operating range 100°C 25°C -40°C 40 Operating range 0 95°C -40°C 25°C 25°C –25°C 100°C -40 Operating range 0.6 FG low voltage: VFG [V] SOSC Charge/ Sischarge current: ICSOSC/ IDSOSC[uA] 80 –25°C 25°C 0.4 95°C 100°C 25°C -40°C 0.2 -80 0.0 0 5 10 15 20 0 2 4 Supply voltage: Vcc[V] 6 8 10 FG sink current: IFG[mA] Figure 8. SOSC charge/discharge current Figure 9. FG Low Voltage (Vcc=12V) 10.0 0.8 Operating range 8.0 0.4 FG leak current: IFGL[uA] FG low voltage: VFG[V] 0.6 95°C 100°C 25°C 25°C –25°C -40°C 0.2 6.0 2.2V 5V 5.5V 4.0 2.0 100°C 25°C -40°C 0.0 0.0 0 2 4 6 8 10 5 10 15 20 Supply voltage: Vcc[V] FG sink current: IFG[mA] Figure 10. FG low voltage (Ta25℃) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 11. FG leak current 7/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Typical Performance Curves3 (Reference data) 0 4 Operating range Operating range –25°C -40 -40°C 25°C 25°C 95°C -60 100°C SS charge current: Isscha[uA] PWM input current : IPWM[uA] -20 3 2 100°C 25°C 95°C -40°C 25°C 1 -80 –25°C 0 -100 0 5 10 15 Supply Voltage : Vcc[V] 20 0 5 15 20 Supply voltage: Vcc[V] Figure 12. PWM input current Figure 13. SS charge current 0.30 300 Operating range Operating range Operating range 0.25 Output Hi voltage: VOH[V] 250 Current limit voltage: Vcl [mV] 10 200 100°C 25°C -40°C 150 95°C 25°C –25°C 100 0.20 100°C 0.15 –25°C 0.10 25°C 95°C 25°C -40°C 0.05 50 0.00 0 0 5 10 15 20 100 200 300 Output source current: IO[mA] Supply voltage: Vcc[V] Figure 14. Current limit voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 15. Output Hi Voltage (Vcc=12V) 8/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV 0.30 0.30 0.25 0.25 Output Lo voltage: VOL[V] Output Hi voltage: VOH[V] Typical Performance Curves4 (Reference data) 0.20 5V 12V 16V 0.15 0.10 0.20 0.15 100°C 0.10 25°C -40°C 0.05 0.05 0.00 0.00 0 100 200 0 300 100 200 300 Output sink current: IO[mA] Output source current: IO[mA] Figure 16. Output Hi Voltage (Ta=25℃) Figure 17 Output Lo Voltage (Vcc=12V) 0.30 2.5 Operating range 2.0 0.20 HB voltage: VHB[V] Output Lo voltage: VOL[V] 0.25 0.15 5V 12V 16V 0.10 1.5 100°C 25°C -40°C 1.0 0.5 0.05 0.0 0.00 0 100 200 300 0 5 10 15 Output sink current: IO[mA] Supply voltage: Vcc[V] Figure 18 Output Lo Voltage (Ta=25℃) Figure 19 HB Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 20 Datasheet BD63241FV Typical Performance Curves5 (Reference data) 0 Operating range HPST input current : IHPST[uA] -10 -20 -40°C 25°C -30 100°C -40 -50 -60 0 5 10 15 Supply Voltage : Vcc[V] 20 Figure 20. HPST input current www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Description of Function Operation 1) 1 Hall Full-Sine Drive BD63241FV is a motor driver IC for Full-Sine driving a three-phase brushless DC motor with 1 hall sensor. 1.1 1Hall detection Full-Sine drive Full-Sine Synchronized start-up way with 1Hall detection,synchronized start-up mechanism outputs output logic forcibly by using standard synchronized signal (sync signal) and makes motor forward drive. This assistance of motor start-up Full-Sine drive as constant cycle is synchronized driving mechanism. Synchronized frequency is standard synchronized signal. *1Hall placement Please place 1Hall element so that phase relations of Hall signal(In HALL signal, the logic links H+ signal) and U phase BEMF voltage are as Figure.21 Hall detection driving timing chart. STAGE ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ 11 12 ① Position [ deg.] 0 60 120 180 240 300 360 ③ ⑤ ⑦ ⑨ 11 ① 60 120 180 240 300 360 U phase W phase V phase U phase BEMF Output voltage U Output voltage V Output voltage W HALL signal 30° Figure 21. Hall detection driving timing chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV 1.2 Start-up mechanism (Automatic 1 Hall Full-Sine start-up mechanism) Automatic 1Hall Full-Sine drive start-up Automatic 1Hall Full-Sine drive start-up is start method that outputs Full-Sine wave of internal setting. BD63241FV lets a motor accelerate in gradually raising frequency of output Full-Sine wave set by internal table. BD63241FV has section to compare Hall input signal (=rotation speed signal) with output drive timing. If phase of Hall input signal advances for output driving timing, driving section shifts to normal Hall driving section. (In addition, automatic Full-Sine start-up section has limitation. Driving section shifts to normal Hall driving section over 27times electrical cycles in automatic Full-Sine start-up.) Initial output waiting section Start-up has initial output waiting section at first. In initial output waiting section, output is fixed to specific phase selected by Hall signal. Then section shifts to automatic Full-Sine start-up section. Output U Output V Output W Motor current U Motor current V Motor current W ICC Initial output Automatic sin start-up section waiting section ( open sin driving) Hall driving section 6th ∼27th （ｘElectric360°） ⇒Judgment section Figure 22. Automatic Full-Sine start-up and Hall detection driving timing Table 1. Judgment for each section of automatic Full-SIne start-up Driving section judgment Initial output waiting section Driving Section shifts to Automatic sine start-up section after 400msec.（If hall signal is switched between intital output waiting section, 400msec counter is reset.） If phase of hall input signal advances for output driving timing between 6times ∼ 27times electrical cycles in automatic Full-Sine start-up, driving section shifts to normal hall driving section. Automatic sine start-up section Driving section shifts to normal hall driving section over 27times electrical cycles in automatic sine start-up. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV 1.3 Rotation speed setting of Automatic Full-Sine start-up section Driving rotation speed in Automatic Full-Sine start-up section rises by internal start-up setting. Internal start-up setting is set by frequency of SOSC terminal (SOSC frequency can be adjusted by changing external capacitor) In Fig. 23, this setting is shown. Setting table for automatic driving Frequency of SOSC is set fast Frequency of SOSC is set slow RPM 27times N times of automatic driving period Figure 23. About setting table for automatic Full-Sine start-up section ・Adjusting of rotation speed setting Rotation speed setting is adjusted by the following expressions A （5 times electrical cycles from start-up: start of phase judgment section ） A[rpm] = SOSC[kHz] x 10 B (27times electrical cycles from start-up : the upper limit of automatic Full-Sine start-up section ) A[rpm] = SOSC[kHz] x 89.3 Setting table for automatic driving B RPM A 5times 27times N times of automatic driving period Figure 24. Adjusting for automatic Full-Sine start-up setting table www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV 1.4 Synchronized time (SOSC) The SOSC terminal starts a self-oscillation by connecting a capacitor between the SOSC terminal and GND terminal. Start-up frequency can be adjusted by changing external capacitor. When the capacitor value is small, rotation speed setting of automatic sine start-up section becomes fast. It is necessary to choose the best capacitor value for optimum start-up operation. Relationship between external capacitor and SOSC frequency is shown in below. Icsosc SOSC SOSC Sig. to internal LOGIC SOSC OSCILLATOR IDsosc Figure 25. SOSC Capacitor and IC internal circuit Equation Sosc = 2 x C SOSCVSOSC I CSOSC :SOSC pin capacitor value VSOSC :SOSC pin Hi voltage – Lo voltage= 0.5V (typ.) I :SOSC pin charge and discharge current SOSC Capacitor SOSC frequency (Csosc) [pF] (Fsosc) [kHz] 330 121.2 Example CSOSC = 1000pF. SOSC frequency = 40kHz (typ.). SOSC period = 25us. 470 85.1 1000 40.0 1.5 U, V, W phase and FG output signals The timing charts of the output signals from the U, V and W phases as well as the FG terminal is shown (Figure 9). The three phases are driving in the order of U, V and W phases. About FG signal output, assuming that a three-slot tetrode motor is used, two pulse outputs of FG are produced for one motor cycle. Figure 26. Timing chart of U, V, W, FG output signal (lead angle 0°) Table 2. Truth table of normal operation Output pattern Motor output Motor output U Motor output V 1 PWM L Motor output W PWM 2 PWM L→PWM PWM→L 3 PWM PWM L 4 PWM→L PWM L→PWM 5 L PWM PWM 6 L→PWM PWM→L PWM * About the output pattern, It changes in the flow of “1→2→3 ∼ 6→1”.H; High, L; Low www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV FG signal is masked between 5th of electrical cycles automatic Full-Sine start-up section . FG start( from 6th Start-up of output electric 360°) Output U Output V Output W ＳＯＵＴ FG (FG signal) FG FGoutput signal output section (4,6&8pole) FG mask section Figure 27. About FG mask section 2) Lock Protection Feature, Automatic Recovery Circuit To prevent passing a coil current on any phase when a motor is locked, it is provided with a function, which can turn Low all output or a certain period of time (TOFF typ. 5.0s) and then automatically restore itself to the normal operation. During the motor rotation, Hall signal input detects hall signal switching continuously. And Hall signal input doesn’t detect when a motor is locked. When the Hall signal switching is not detected for a predetermined period of time, it is judged that the motor is locked. BD63241FV has 2 lock judgment conditions (start-up, normal driving) a) Lock Protection in Start-up(Ton typ. 1.0s） When hall signal switching is not detected during first 1.0sec (Ton) in initial output waiting section & automatic sine start-up section, it is judged that the motor is locked. (But if Output driving period of Automatic sine start-up doesn’t reach until a half period, this judgment is extended until a half period.) In Fig. 11, the timing chart is shown. start of automatic sin start-up section Hall signal re-start Hall detecting No detection Output U Output V Lo output ( short brake mode) Output W ＳＯＵＴ FG (FG signal) Ton1 (1sec) Toff ( Lock detect off section 5sec) Ton1 (1sec) Figure 28. Lock protection operation in start-up www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV a) Lock Protection in normal hall driving When the Hall signal switching (detection in the falling edge) is not detected between 400msec in normal hall driving section, it is judged that the motor is locked. In Fig. 12, the timing chart is shown. Motor stop re-start Hall detecting Hall signal Output U Output V Lo output ( short brake mode) Output W ＳＯＵＴ FG (FG signal) Hall driving Ton2 (normal driving) (400msec) Toff ( Lock detect off section 5sec) Ton1 (1sec) Figure 29. Lock protection operation in normal hall driving 3) UVLO（Under voltage lock out circuit） In the operation area under the guaranteed operating power supply voltage of 16V (typ.), the transistor on the output can be turned OFF at a power supply voltage of 3.9V (typ.). A hysteresis width of 300mV is provided and a normal operation can be performed at 4.2V(typ.). This function is installed to prevent unpredictable operations, such as a large amount of current passing through the output, by means of intentionally turning OFF the output during an operation at a very low power supply voltage which may cause an abnormal function in the internal circuit. About turning off a output voltage at UVLO, It becomes a OFF mode. (Upper MOS FET and Under MOS FET are turned OFF.) 4) Current limit A current passing through the motor coil can be detected on the output current detection resistance to prohibit a current flow larger than a current limit value (motor output off).The current limit value is determined by setting of the IC internal limit(Vcl) :150mV (typ.),and the output current detection resistance value using the following in below equation. Io[A] = Vcl[V] / R1[Ω] = 150[mV] / 0.2[Ω] =0.750[A] PR[W] = Vcl[V] x Io[A] = 150[mV] x 0.75[A] = 0.19[W] Vcc U When no-use current limit function, RNF terminal is shorted GND. Connect detect current resistance(current limit Enable) OK V W Open setting (prohibit,motor GND terminal) NG GND short setting (current limit Disable) OK − R1 Io RNF Motor large current GND line Vcl SS C1 RNF RNF RNF IC small signal GND line Figure30 . Current limit function, RNF terminal setting Icss GND SOFT START & CURRENT LIMIT COMP Figure 31. small signal and large current GND line In Figure31, IC small signal GND line should be separated Motor large current GND line connected R1.Same as soft start Capacitor.(Pay attention to design board(b)) item reference) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV 5) Soft start Connect capacitor (Softstart Enable) OK To prevent lush current, slowly up to rotation speed, when motor start in VCC on, quick start, restart lock detect on etc. Soft start time set by SS terminal connected CAP to charge current. No use soft start, SS terminal set open. 1uF is recommended for setting value at first, or 0.47uF-2.2uF. Open setting (Softstart Disable) OK SS SS Soft start function, SS terminal setting Figure 32. Soft start function, SS terminal setting ON Vcc Idle judgement OFF Tss Current limit Iss Coil current 0A VCC ON Figure 33. Characteristic of motor output current at soft-start setting separate In Figure 31, SS terminal charge current (Icss) is 1.8uA (typ.), Set SS terminal connect Capacitor (C1) , lead to that current time(Tss) in below equation. Icss1 is reduced 1/15, SS terminal charge current (Icss) in internal IC. Tss[s] = (C1[F] x Iss[A] x R1[Ω]) / Icss1[A] (ex.) Assuming that C1 = 1.0[µF], Iss = 1.5[A], R1 = 0.1[Ω] then, soft-start time is 1.25[s] (When R1=0.1Ω,current limit =1.5A) Tss[s] = (1.0[µF] x 1.5[A] x 0.1[Ω]) / (1.9/15) [uA] = 1.25 [s] 6) Auto lead angle control and Fix lead angle control at HPST terminal By the setting of the HPST terminal, Lead angle setting is accomplished. Set by the following tables, set it by the resistance division from REF terminal. Table 3. lead angle mode HPST terminal voltage (V) Auto 3.85 - 5.0 25° 10° 1.35 - 2.4 0° 0 - 1.2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 *HPST terminal is open, auto setting 2.6 - 3.65 17/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Safety measure 1. Reverse connection protection diode Reverse connection of power results in IC destruction as shown in Figure34a. When reverse connection is possible, reverse connection protection diode must be added between power supply and VCC. Normal connection After reverse connection destruction prevention Reverse power connection Vcc Vcc Vcc I/O Circuit I/O Circuit Block Circuit Block GND I/O Block GND GND Internal circuit impedance is high Æ Amperage small Large current flows Æ Thermal destruction Figure.34a Flow of current when power is connected reversely No destruction 2. Measure against VCC voltage rise by back electromotive force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply. ON ON Phase Switching ON ON Figure. 34b Vcc voltage and output voltage rise by back electromotive When you use reverse connection protection diode, Please connect Zenner diode, or capacitor. Do not exceed absolute maximum ratings Vcc=20V. ON ON Figure.34c effect of the rise in voltage by connecting Zenner diode, or capacitor 3. Problem of GND line PWM switching Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum. Vcc Motor Controller M Driver GND PWM input NG Figure 34d. GND line PWM switching prohibited www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Figure 35a. shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj – Ta) / P [°C/W] Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistanceθja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Figure 35b. shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70[mm]×70[mm] ×1.6[mm] (copper foil area below 3[%])) 1000 874.7 750 Pd[mW] θja = (Tj – Ta) / P [°C/W] θjc = (Tj – Tc) / P [°C/W] θja=142.9 [°C/W] 500 250 0 25 50 75 100 125 150 Ta[°C] *Reduce by 7.0mW/℃ over 25℃ （On 70.0mmX70.0mmX1.6mm glass epoxy board） Figure 35a. Thermal resistance Figure 35b.Thermal derating curve Equivalent circuit ( resistor is reference value ) 1) Vcc,GND terminal 2) PWM terminal 3) HPST terminal REF REF 4) H+,H- terminal REF Vcc 200kΩ 100kΩ 1kΩ HPST H+ 1kΩ 1kΩ 10kΩ PWM H- GND 1kΩ 1kΩ 1kΩ 5) REF terminal 6) SOSC terminal Vcc 7) SS terminal 8) FG terminal Vcc Vcc 40kΩ REF 1kΩ 53kΩ 1kΩ SS FG 10Ω 30Ω SOSC 9) COM terminal 10) U,V,W,RNF terminal 11) HB terminal Vcc Vcc COM Vcc V U W 500Ω 2kΩ 30kΩ 30kΩ Vcc Vcc 30kΩ RNF HB 47kΩ 13kΩ www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 74.2mm x 74.2mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 36. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Datasheet BD63241FV Ordering Information B D 6 3 2 4 1 - E2 Part Number Packaging and forming specification E2: Embossed tape and reel Physical dimension tape and reel information SSOP-B16 5.0±0.2 9 0.3Min. 4.4±0.2 6.4±0.3 16 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 8 0.10 1.15±0.1 0.15±0.1 0.1 0.65 1pin 0.22±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. Marking diagram SSOP-B16 (TOP VIEW) 6 3 2 4 1 Part Number LOT Number 1PIN Mark www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/22 TSZ02201-0H1H0B101200-1-2 3.Mar.2015 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001