Datasheet
DC Brushless Fan Motor Drivers
Three-phase Full-wave
Fan Motor Driver
BD63242FV
General Description
Key Specifications
BD63242FV is a 1chip driver composed of a Power
DMOS FET Motor Driver. It features a sensor-less drive
which does not require a hall device as a position
detection sensor. Furthermore, it introduces by making
output current a sine-wave that achieves silent operation
and low vibration.
Operating Supply Voltage Range: 5.0 V to 16.0 V
Operating Temperature Range: -40 °C to +100 °C
Package
W(Typ) x D(Typ) x H(Max)
5.00 mm x 6.40 mm x 1.35 mm
SSOP-B16
Features
Small Package
Driver Including Power DMOS FET
Sensor-less Full Sine Drive
Speed Controllable by DC/PWM Input
Minimum Output Duty Setting (Only on DC Voltage
Input Speed Control.)
Rotation Direction Select
Rotation Speed Pulse Signal Output (FG, 1/2FG)
Protection Function
(Under Voltage Lock Out Protection Function, Lock
Protection Function (Automatic Recovery), High
Speed Rotation Protection Function and Low Speed
Rotation Protection Function)
SSOP-B16
Application
Fan Motors for General Consumer Equipment such
as Refrigerator etc.
Typical Application Circuit
－
REF
GND
CONT
FG
SIG
PWM
REF
1
MIN
SOSC
OSC
SEL2
BD63242FV
REF
FR
SEL
VCL
VCC
RNF
W
U
V
＋
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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BD63242FV
Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Application .............................................................................................................................................................................. 1
Key Specifications................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Typical Application Circuit ........................................................................................................................................................ 1
Contents ................................................................................................................................................................................. 2
Pin Configuration .................................................................................................................................................................... 3
Pin Descriptions ...................................................................................................................................................................... 3
Block Diagram ........................................................................................................................................................................ 4
Absolute Maximum Ratings ..................................................................................................................................................... 5
Thermal Resistance ................................................................................................................................................................ 5
Recommended Operating Conditions ...................................................................................................................................... 5
Electrical Characteristics ......................................................................................................................................................... 6
Application Examples .............................................................................................................................................................. 7
Typical Performance Curves .................................................................................................................................................... 8
Description of Function Operations ........................................................................................................................................ 14
Thermal Resistance Model .................................................................................................................................................... 23
I/O Equivalence Circuits (Resistance Values are Typical)........................................................................................................ 24
Note for Content ................................................................................................................................................................... 24
Location of IC ....................................................................................................................................................................... 24
Operational Notes ................................................................................................................................................................. 25
Ordering Information ............................................................................................................................................................. 27
Marking Diagram................................................................................................................................................................... 27
Physical Dimension and Packing Information ......................................................................................................................... 28
Revision History .................................................................................................................................................................... 29
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BD63242FV
Pin Configuration
(TOP VIEW)
REF
1
16 GND
CONT
2
15 FG
MIN
3
14 SOSC
SEL2
4
13 OSC
FR
5
12 SEL
VCL
6
11 VCC
RNF
7
10 W
U
8
9
V
Figure 1. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
1
REF
2
CONT
3
MIN
4
SEL2
5
FR
Motor rotation direction setting pin
6
VCL
Current limit setting pin in fixed initial position and forcibly synchronized start-up section
7
RNF
Output current detecting resistor connection pin
8
U
Output U pin
9
V
Output V pin
10
W
Output W pin
11
VCC
Power supply pin
12
SEL
Start-up assist function setting pin
13
OSC
14
SOSC
15
FG
Oscillating capacitor connection pin for OSC frequency setting
Oscillating capacitor connection pin for output switching frequency setting in forcibly
synchronized start-up section
Rotating speed pulse signal output pin
16
GND
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Function
Reference voltage output pin
Output duty control pin
Minimum output duty setting pin
Rotation speed pulse signal selection, minimum BEMF detect width setting pin
Ground pin
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Block Diagram
REF
CONT
1
REF
LOCK
PROTECT
TSD
QUICK
START
2
16
GND
SIGNAL
OUTPUT
15
FG
SOSC
14
SOSC
13
OSC
12
SEL
11
VCC
10
W
9
V
UVLO
OSC
MIN
PWM
COMP
3
REF
SEL2
CONTROL
4
FR
OSC
LOGIC
REF
REF
5
Current
Limit
sel COMP
VCLV
Amp
VCL
DET.
COMP
6
DETECT
LEVEL
PRE DRIVER
U V W
RNF
7
U
8
VCC
VCC
VCC
Figure 2. Block Diagram
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Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VCC)
VCC
20
V
Storage Temperature Range
Tstg
-55 to +150
°C
VO
20
V
IO
(Note 1)
A
Output Voltage (U, V, W)
Output Current (U, V, W)
1.0
FG Output Voltage
VFG
20
V
FG Output Current
IFG
10
mA
Reference Voltage (REF) Output Current
IREF
10
mA
Input Voltage1 (CONT, VCL, FR, SEL, SEL2, MIN)
VIN1
7
V
Input Voltage2 (RNF)
VIN2
4.5
V
Tjmax
150
°C
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Tjmax
Thermal Resistance(Note 2)
Parameter
Thermal Resistance (Typ)
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
θJA
140.9
77.2
°C/W
ΨJT
6
5
°C/W
SSOP-B16
Junction to Ambient
Junction to Top Characterization Parameter
(Note 3)
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Symbol
Min
Typ
Max
Unit
Supply Voltage(VCC)
VCC
5
12
16
V
Input Voltage(CONT, VCL, FR, SEL, SEL2, MIN)
VIN
0
-
VREF
V
Input Frequency(CONT)
fIN
10
-
50
kHz
Operating Temperature
Topr
-40
-
+100
°C
Parameter
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Electrical Characteristics (Unless otherwise specified VCC=12 V, Ta=25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
ICC
4.0
6.6
8.9
mA
VREF
4.65
5.00
5.35
V
IREF=-2 mA
SOSC Charge Current
ICSOSC
-55
-44
-33
µA
VSOSC=0.8 V
SOSC Discharge Current
IDSOSC
33
44
55
µA
VSOSC=0.8 V
SOSC Frequency
fSOSC
46.6
64.7
82.8
kHz
CSOSC=680 pF
CONT Input High Voltage
VCONTH
2.5
-
VREF
V
CONT Input Low Voltage
VCONTL
0.0
-
0.8
V
CONT Input Bias Current 1
ICONT1
-75
-50
-25
µA
CONT Input Bias Current 2
ICONT2
-1
-
-
µA
IMIN
-1
-
-
µA
PWM Input Mode
VOSC=0 V
PWM Input Mode
VOSC=0 V
PWM Input Mode
VOSC=0 V, VCONT=0 V
DC Input Mode
VCONT=0 V
VMIN=0 V
OSC Charge Current
ICOSC
-60
-44
-28
µA
VOSC=1.8 V
OSC Discharge Current
IDOSC
28
44
60
µA
VOSC=1.8 V
OSC Frequency
fOSC
28.8
46.0
63.4
kHz
COSC=330 pF
VCLV
120
150
180
mV
IVCL
-1
-
-
µA
VVCL=0 V
FG Output Low Voltage
VFGL
-
0.15
0.40
V
IFG=5 mA
FG Output Leak Current
IFGL
-
-
10
µA
VFG=20 V
tOFF
3.75
5.00
6.25
s
VO
-
0.3
0.4
V
IO=±300 mA
High and low side output
voltage total
ISEL
-35
-25
-15
µA
VSEL=0 V
SEL Mode 1 Input Voltage
VSEL_1
3.8
-
VREF
V
SEL Mode 2 Input Voltage
VSEL_2
0.0
-
0.8
V
ISEL2
-35
-25
-15
µA
SEL2 Mode 1 Input Voltage
VSEL2_1
3.85
-
VREF
V
SEL2 Mode 2 Input Voltage
VSEL2_2
2.60
-
3.65
V
SEL2 Mode 3 Input Voltage
VSEL2_3
1.35
-
2.40
V
SEL2 Mode 4 Input Voltage
VSEL2_4
0.00
-
1.15
V
IFR
-35
-25
-15
µA
FR Input High Voltage
VFRH
3.8
-
VREF
V
FR Input Low Voltage
VFRL
0.0
-
0.8
V
Circuit Current
Conditions
Reference Voltage
MIN Input Bias Current
Current Limit Setting Voltage
VCL Input Bias Current
Lock Detection OFF Time
Output Voltage
SEL Input Current
SEL2 Input Current
VSEL2=0 V
FR Input Current
VFR=0 V
For parameters involving current, positive notation means inflow of current to the IC while negative notation means outflow of current from the IC
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BD63242FV
Application Examples
1.
Variable Speed Control Application using PWM Duty Converted to DC Voltage.
This is the application example to control rotation speed by the external PWM signal converted to DC voltage.
And the MIN pin setting the minimum output duty is possible.
Stabilization of REF voltage.
0.01 µF or more
PWM
REF
CONT
PWM
To DC
1
QUICK
START
MIN
SEL2
Rotation direction setting
SOSC
4
CONTROL
13
OSC
LOGIC
Current
VcLV
limit
sel COMP
Amp
DET.
COMP
6
11
VCC
VCC
SEL
Reverse connection measures
of the fan connector.
VCC
4.7 μF
or more
DETECT
LEVEL
U V W
Start-up assist setting
330 pF
12
5
7
OSC
REF
＋
W
10
VCC
Measures against VCC voltage
rise by BEMF.
0Ω
or more
U
Forcibly synchronized start-up
time setting.
It is necessary to select the best
capacitor value by the
characteristic of the motor.
220 pF to 1000 pF
1 kΩ
or more
The detect current resister to motor
current
Be mindful to power consumption.
14
SOSC
PRE DRIVER
RNF
Protection of the FG open-drain
－
FG
REF
REF
VCL
VCL voltage sets the current
limit level at the start-up.
PWM
COMP
3
REF
1 kΩ
or more
15
GND
SIG
1 kΩ
or more
FR
16
OSC
1 kΩ
or more
1 kΩ
or more
Rotation speed pulse signal
selection and minimum BEMF
detect width setting.
UVLO
SIGNAL
OUTPUT
2
1 kΩ
or more
Minimum output duty setting.
LOCK
PROTECT
TSD
REF
8
9
V
Connect bypass capacitor as
close as possible to the VCC
pin.
Absolute output voltage 20 V
Absolute output current 1.0 A
Figure 3. Application of PWM Duty Converted to DC Voltage
2.
Variable Speed Control Application by PWM Duty Input
Setting of the minimum output duty is not possible in this application.
The CONT pin protection
REF
0.01 μF
or more
REF
LOCK
PROTECT
TSD
UVLO
16
GND
－
FG
SIG
REF
QUICK
START
CONT
PWM duty input.
2
SIGNAL
OUTPUT
15
SOSC
14
REF
PWM
OSC
0Ω
or more
Pull up the REF pin.
(Setting of the minimum output
duty is not possible.)
1
MIN
REF
1 kΩ
or more
PWM
COMP
3
SOSC
220 pF to 1000 pF
REF
SEL2
CONTROL
4
1 kΩ
or more
REF
VCL
12
Amp
Current
limit
sel
COMP
DET.
COMP
6
1 kΩ
or more
DETECT
LEVEL
PRE DRIVER
RNF
0 Ω
or more
U
11
VCC
VCC
VCC
8
Connected to the GND pin.
SEL
VCC
＋
4.7 μF
or more
U V W
7
OSC
REF
FR 5
VCLV
1 kΩ
or more
13
OSC
LOGIC
REF
10
9
W
V
Figure 4. PWM Duty Input Application
Board Design Note
1. IC power (VCC), motor outputs (U, V, W), and motor ground (RNF) lines are made as wide as possible.
2. The IC ground (GND) is common with the application ground except motor ground, and arranged as close as
possible to (-) land.
3. The bypass capacitor and the Zener diode are placed as close as possible to the VCC pin.
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Typical Performance Curves
(Reference Data)
6
10
Reference Voltage: VREF[V]
Circuit Current: ICC[mA]
8
6
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
4
5
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
4
3
2
Operating Voltage Range
Operating Voltage Range
2
0
0
5
10
15
Supply Voltage: VCC[V]
0
20
Figure 5. Circuit Current vs Supply Voltage
SOSC Charge/Discharge Current: ICSOSC/IDSOSC[μA]
Reference Voltage: VREF[V]
5
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
4
3
2
2
4
6
8
10
Reference Voltage Output Current: IREF[mA]
Figure 7. Reference Voltage vs
Reference Voltage Output Current
(VCC=12 V)
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10
15
Supply Voltage: VCC[V]
20
Figure 6. Reference Voltage vs Supply Voltage
6
0
5
80
Operating Voltage Range
40
Discharge CurrentTa=+100 °C
Ta=+25 °C
Ta=-40 °C
0
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-40
Charge Current
-80
0
5
10
15
Supply Voltage: VCC[V]
20
Figure 8. SOSC Charge/Discharge Current vs Supply Voltage
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Typical Performance Curves - continued
(Reference Data)
0
CONT Input Bias Current 1: I CONT1[μA]
SOSC Frequency: fSOSC[kHz]
120
100
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
80
60
40
Operating Voltage Range
20
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-40
-60
-80
Operating Voltage Range
-100
0
5
10
15
Supply Voltage: VCC[V]
20
0
Figure 9. SOSC Frequency vs Supply Voltage
(CSOSC=680 pF)
5
10
15
Supply Voltage: VCC[V]
20
Figure 10. CONT Input Bias Current 1 vs Supply Voltage
0.0
0.0
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
-0.2
MIN Input Bias Current: IMIN[μA]
CONT Input Bias Current 2: I CONT2[μA]
-20
-0.4
-0.6
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
-0.2
-0.4
-0.6
Operating Voltage Range
Operating Voltage Range
-0.8
-0.8
0
5
10
15
Supply Voltage: VCC[V]
20
0
Figure 11. CONT Input Bias Current 2 vs Supply Voltage
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5
10
15
Supply Voltage: VCC[V]
20
Figure 12. MIN Input Bias Current vs Supply Voltage
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Typical Performance Curves - continued
(Reference Data)
100
Operating Voltage Range
Operating Voltage Range
40
OSC Frequency: f OSC[kHz]
OSC Charge/Discharge Current: ICOSC/IDOSC[μA]
80
Discharge Current
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-40
60
40
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
20
Charge Current
-80
0
0
5
10
15
Supply Voltage: VCC[V]
20
0
Figure 13. OSC Charge/Discharge Current vs Supply Voltage
5
10
15
Supply Voltage: VCC[V]
20
Figure 14. OSC Frequency vs Supply Voltage
(COSC=330 pF)
0.0
300
250
VCL Input Bias Current: IVCL[μA]
Current Limit Setting Voltage: VCLV[mV]
80
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
200
150
100
50
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
-0.2
-0.4
-0.6
Operating Voltage Range
Operating Voltage Range
0
-0.8
0
5
10
15
Supply Voltage: VCC[V]
20
0
Figure 15. Current Limit Setting Voltage vs Supply Voltage
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5
10
15
Supply Voltage: VCC[V]
20
Figure 16. VCL Input Bias Current vs Supply Voltage
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Typical Performance Curves - continued
(Reference Data)
0.8
FG Output Low Voltage: VFGL[V]
FG Output Low Voltage: VFGL[V]
0.8
0.6
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0.4
0.2
0.6
VCC=16 V
VCC=12 V
VCC=5 V
0.4
0.2
0.0
0.0
0
2
4
6
8
FG Output Current: IFG[mA]
0
10
Figure 17. FG Output Low Voltage vs FG Output Current
(VCC=12 V)
4
6
8
FG Output Current: IFG[mA]
10
Figure 18. FG Output Low Voltage vs FG Output Current
(Ta=25 °C)
8.0
10.0
Operating Voltage Range
Lock Detection OFF Time: t OFF[s]
Operating Voltage Range
FG Output Leak Current: IFGL[μA]
2
8.0
6.0
4.0
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
2.0
7.0
6.0
5.0
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
4.0
3.0
2.0
0.0
0
5
10
15
Supply Voltage: VCC[V]
20
0
Figure 19. FG Output Leak Current vs Supply Voltage
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5
10
15
Supply Voltage: VCC[V]
20
Figure 20. Lock Detection OFF Time vs Supply Voltage
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Typical Performance Curves - continued
1.6
1.6
1.4
1.4
1.2
1.2
Output Voltage: VO[V]
Output Voltage: VO[V]
(Reference Data)
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0.4
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0.2
0.2
0.0
0.0
0.0
0.2
0.4
0.6
0.8
Output Current: IO[A]
1.0
0.0
Figure 21. Output Voltage vs Output Current
(VCC=12 V)
0.2
0.4
0.6
0.8
Output Current: IO[A]
1.0
Figure 22. Output Voltage vs Output Current
(Ta=25 °C)
0
0
-10
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-20
SEL2 Input Current: ISEL2[μA]
SEL Input Current: ISEL[μA]
VCC=5 V
VCC=12 V
VCC=16 V
-30
-40
-50
-10
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-20
-30
-40
-50
Operating Voltage Range
Operating Voltage Range
-60
-60
0
5
10
15
Supply Voltage: VCC[V]
0
20
Figure 23. SEL Input Current vs Supply Voltage
(VSEL=0 V)
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5
10
15
Supply Voltage: VCC[V]
20
Figure 24. SEL2 Input Current vs Supply Voltage
(VSEL2=0 V)
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BD63242FV
Typical Performance Curves - continued
(Reference Data)
0
FR Input Current: IFR[μA]
-10
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-20
-30
-40
-50
Operating Voltage Range
-60
0
5
10
15
Supply Voltage: VCC[V]
20
Figure 25. FR Input Current vs Supply Voltage
(VFR=0 V)
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BD63242FV
Description of Function Operations
1.
Sensor-less Full Sine Drive
BD63242FV is a motor driver IC for sensor-less full sine drive. It is a sensor-less drive which does not require a hall device
as a position detection sensor. And, it drives the output current of a three-phase brushless DC motor with a sine waveform.
1.1. Operation at Start-up
At start-up, it confirms the rotation of the rotor in the normal rotation judgement section for 50 ms (Typ). If it detects
normal rotation, the state moves to the BEMF detection driving section. If it detects reverse rotation, it sets output
logic of U, V, and W to low, then stops the rotation of the rotor. After 5 s (Typ), it moves to the normal rotation
judgement section again. Otherwise, it is judged that the rotor is stopped and it moves to the fixed initial position
section. In the fixed initial position section, it performs the operation to fix the rotor in the initial position for a given
period of time (1.15 s (Typ)). After that, it moves to the forcibly synchronized start-up section. In the forcibly
synchronized start-up section, it gradually increases the frequency at which the output is switched until the 8 electrical
cycles(Note 7) and accelerates the motor. After the forcibly synchronized start-up is completed, it moves to the BEMF
detection driving section.
(Note 7) One period for switching the output is defined as an electrical cycle. (Electrical Angle 360 degree)
VCC
Output U
Output V
Output W
FG Signal
Normal Rotation
Judgement Section
Fixed Initial
Position Section
Forcibly Synchronized Start-up Section
BEMF Detection Driving Section
Hi impedance
Figure 26. Timing Chart of Output Signals (U, V, W) and FG Signal
Table 1. Driving Section Description
Driving Section
Function
Detect the rotation of the rotor. (50 ms (Typ))
Fix the rotor in the initial position. (1.15 s (Typ))
Gradually increases the frequency at which the output is switched until 8 electrical
cycles and accelerates the motor.
Normal driving by BEMF detection.
In the forcibly synchronized start-up section, as
the number of electrical cycles increases, the
output switching frequency increases. The output
switching frequency depends on the SOSC
frequency determined by the capacitor value
which is in between the SOSC pin and the GND.
Output Switching Frequency [Hz]
Normal Rotation
Judgement Section
Fixed Initial
Position Section
Forcibly Synchronized
Start-up Section
BEMF Detection
Driving Section
SOSC frequency
set fast
(To decrease
the capacitance)
SOSC frequency
set slow
(To increase
the capacitance)
Electrical Cycles [Cycle]
8 Cycles
Figure 27. Output Switching Frequency vs Electrical Cycles
(Forcibly Synchronized Start-up Section)
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1.
Sensor-less Full Sine Drive – continued
1.2. Frequency Setting in Forcibly Synchronized Start-up Section
In the forcibly synchronized start-up section, the output switching frequency depends on the SOSC frequency
determined by the capacitor value which is in between the SOSC pin and the GND. The output switching frequency
differs depending on various characteristic parameters of motors. It is necessary to select the appropriate capacitor
value for stable start-up operation.
Set the appropriate capacitor value as follows. At first, set the capacitor value to 680 pF and confirm start-up
operation. Then, confirm the upper and lower limit of the capacitor value that makes the start-up operation impossible
by increasing/decreasing the capacitor value. Finally, determine the appropriate capacitor value from the upper and
lower limit of the capacitor value. For the motor with a small BEMF, the capacitor value tends to be small.
Icsosc
SOSC
SOSC
OSCILLATOR
SOSC Sig. to internal LOGIC
IDsosc
Figure 28. The SOSC Pin and IC Internal Circuit
Equation
𝑓𝑆𝑂𝑆𝐶 = 𝐶
|𝐼𝐷𝑆𝑂𝑆𝐶 ×𝐼𝐶𝑆𝑂𝑆𝐶 |
𝑆𝑂𝑆𝐶 ×(|𝐼𝐷𝑆𝑂𝑆𝐶 |+|𝐼𝐶𝑆𝑂𝑆𝐶 |)×(𝑉𝑆𝑂𝑆𝐶𝐻 −𝑉𝑆𝑂𝑆𝐶𝐿 )
[Hz]
Where:
𝑓𝑆𝑂𝑆𝐶 is the SOSC frequency [Hz]
𝐶𝑆𝑂𝑆𝐶 is the SOSC capacitor value [F]
𝐼𝐷𝑆𝑂𝑆𝐶 is the SOSC discharge current [A] (Typ +44 μA)
𝐼𝐶𝑆𝑂𝑆𝐶 is the SOSC charge current [A] (Typ -44 μA)
𝑉𝑆𝑂𝑆𝐶𝐻 is the SOSC high voltage [V] (Typ 1.0 V)
𝑉𝑆𝑂𝑆𝐶𝐿 is the SOSC low voltage [V] (Typ 0.5 V)
Example) If the SOSC capacitor value is 680 pF, the SOSC frequency is about 64.7 kHz.
|44 𝜇×(−44 𝜇)|
𝑓𝑆𝑂𝑆𝐶 = 680 𝑝×(|44 𝜇|+|−44 𝜇|)×(1.0−0.5) ≒ 64.7 [kHz]
Table 2. Setting Example of SOSC frequency
CSOSC [pF]
fSOSC [kHz]
470
93.6
680
64.7
820
53.7
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Description of Function Operations – continued
2.
Current Limit
BD63242FV has the current limit function that limits the current flowing through the motor coil.
The current limit function differs depending on each driving sections.
VCC
Current limit setting
ICL2
Current limit setting voltage(VCLV)
VCL pin setting voltage
(Note 8)
ICL1(Note 9)
ICC
Number of revolutions
Fixed initial
position section
Forcibly
synchronized
start-up section
BEMF detection driving section
(Note 8) Current limit setting determined by current limit voltage (VCLV).
(Note 9) Current limit setting determined by the VCL pin setting voltage.
Figure 29. Timing Chart in Start-up
When not using the current limit function, short the RNF pin with GND.
2.1. Current Limit in Fixed Initial Position and Forcibly Synchronized Start-up Section
The current limit in fixed initial position and forcibly synchronized start-up section, adjusts output PWM duty when the
current flowing through the motor coil detects being a set current value or more. The current limit setting value is
determined by the current limit setting voltage inside the IC (VCL1) (the voltage of 1/15 (Typ) of the VCL pin input
voltage) and the RNF pin voltage. As shown in Figure 30, if the current detection resistance (R1) is 0.20 Ω and the
VCL pin input voltage(VVCL) is 0.75 V, the current limit setting value and the maximum power consumption value of the
current detection resistance can be obtained from the following formula.
1
𝑉𝐶𝐿1 = 𝑉𝑉𝐶𝐿 × 15 =
𝐼𝐶𝐿1 =
𝑉𝐶𝐿1
𝑅1
=
50 𝑚
0.2
0.75
15
= 50 [mV]
= 0.25 [A]
VCC
𝑃𝑅𝑀𝐴𝑋 = 𝑉𝐶𝐿1 × 𝐼𝐶𝐿1
= 50 𝑚 × 0.25 = 0.0125 [W]
U
V
Where:
𝑉𝑉𝐶𝐿 is the VCL pin input voltage [V]
𝑉𝐶𝐿1 is the current limit setting voltage inside the
IC [V]
𝑅1 is the current detection resistance [Ω]
𝐼𝐶𝐿1 is the current limit setting value [A]
𝑃𝑅𝑀𝐴𝑋 is the maximum power consumption value
of the current detection resistance [W]
W
－
REF
R1
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ICL1
VCL
VCLV
sel
1/15
Amp
IC small signal
GND line
As shown in Figure 30, the IC small signal GND
line should be separated from the motor large
current GND line connected to R1.
RNF
Motor large
current GND line
GND
VCL1
CURRENT
LIMIT
COMP
Figure 30. Current Limit Setting
(Fixed Initial Position, Forcibly Synchronized
Start-up Section)
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BD63242FV
2.1. Current Limit in Fixed Initial Position and Forcibly Synchronized Start-up Section – continued
The relationship between the VCL pin input voltage and the current limit setting voltage (VCL1) is shown in Figure 31.
250
VCL1 Voltage [mV]
200
150
100
50
0
0
1
2
3
4
VCL Input Voltage [V]
5
Figure 31. VCL1 Voltage vs VCL Input Voltage
(VCC=12 V)
If the VCL pin input voltage is 3 V, the internal setting voltage may oscillate at 150 mV and 200 mV due to the
fluctuation of the input voltage. It is recommended to set the VCL pin input voltage to 0V to 2.25V or 4.5 V to the REF
pin voltage.
2.2. Current Limit in BEMF Detection Driving Section
The current limit in BEMF detection driving section, turns OFF the high side output when the current flowing through
the motor coil detects being a set current value or more. The current limit setting value is determined by the current
limit setting voltage inside the IC (VCLV) and the RNF pin voltage. As shown in Figure 32, if the current detection
resistance (R1) is 0.20 Ω, the current limit setting value and the maximum power consumption value of the current
detection resistance can be obtained from the following formula.
𝐼𝐶𝐿2 =
𝑉𝐶𝐿𝑉
𝑅1
=
150 𝑚
0.2
= 0.75 [A]
VCC
𝑃𝑅𝑀𝐴𝑋 = 𝑉𝐶𝐿𝑉 × 𝐼𝐶𝐿2
= 150 𝑚 × 0.75 = 0.113 [W]
U
V
Where:
𝑉𝐶𝐿𝑉 is the current limit setting voltage [V]
𝑅1 is the current detection resistance [Ω]
𝐼𝐶𝐿2 is the current limit setting value [A]
𝑃𝑅𝑀𝐴𝑋 is the maximum power consumption value
of the current detection resistance [W]
W
－
REF
R1
RNF
Motor large
current GND line
ICL2
VCL
VCLV
Setting Voltage
Route
sel
1/15
Amp
As shown in Figure 32, the IC small signal GND
line should be separated from the motor large
current GND line connected to R1.
UNUSED
IC small signal
GND line
GND
CURRENT
LIMIT
COMP
Figure 32. Current Limit Setting
(BEMF Detection Driving Section)
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Description of Function Operation – continued
3.
Output Signals (U, V, W) and FG Signal Logic in Driving
The timing chart of the output signals (U, V, W) and the FG signal in driving is shown in Figure 33. The FG signal outputs 1
FG or 1/2 FG by the SEL2 pin input voltage.
Output U
Output V
Output W
FG Signal
(1 FG)
FG Signal
(1/2 FG)
Electrical Cycle = 360˚
BEMF Detect Width (Hi impedance)
Hi impedance
Figure 33. Timing Chart of Output Signals (U, V, W) and FG Signal in Driving
4.
Start-up Assist Function (SEL Pin)
The input voltage of the SEL pin sets the start-up assist function. The input voltage range and the setting contents are
shown as Table 3. If set the SEL mode 1, the start-up assist function is enabled. When the SEL mode 1 cannot detect the
BEMF for a certain time (the FG output frequency is 10 Hz or less) in the BEMF detection section, it moves again to the
fixed initial position section only once. After that, it moves to the forcibly synchronized start-up section. From the second
time onwards, it moves to the lock protection mode (t OFF= 5.0 s (Typ)). If set the SEL mode 2, the start-up assist function is
disabled. When the SEL mode 2 cannot detect the BEMF for a certain time in the BEMF detection section, it moves to the
lock protection mode. When the SEL pin is open, it sets the SEL mode 1.
Table 3. SEL Mode Voltage and Start-up Assist Function (VCC=12 V)
5.
SEL Mode
SEL Pin Voltage [V]
Start-up Assist Function
SEL mode 1
3.8 to VREF
Enable
SEL mode 2
0.0 to 0.8
Disable
FG Output Pulse and Minimum BEMF Detect Width (SEL2 Pin)
The input voltage of the SEL2 pin sets the FG output pulse and the minimum BEMF detect width. The input voltage range
and the setting contents are shown as Table 4. When the SEL2 pin is open, it sets the SEL2 mode 1.
Table 4. SEL2 Mode and FG Output Pulse, Minimum BEMF Detect Width (VCC=12 V)
FG Output Pulse for
SEL2 Mode
SEL2 Pin Voltage [V]
Electrical Cycles 360°
FG output 1 pulse
SEL2 mode 1
3.85 to VREF
(1FG)
FG output 1 pulse
SEL2 mode 2
2.60 to 3.65
(1FG)
FG output 1/2 pulse
SEL2 mode 3
1.35 to 2.40
(1/2FG)
FG output 1/2 pulse
SEL2 mode 4
0.00 to 1.15
(1/2FG)
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Minimum BEMF Detect
Width [°]
11.25
7.5
7.5
11.25
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BD63242FV
Description of Function Operations – continued
6.
Motor Rotation Direction Setting (FR Pin)
The FR pin input voltage sets the rotation direction of the motor. The input voltage range and function is shown as Table 5.
When the FR pin is open, it sets the forward rotation mode.
Table 5. FR Mode and Motor Rotation Direction (VCC=12 V)
FR Mode
FR Pin Voltage [V]
Motor Rotation Direction
Forward rotation mode
3.8 to VREF
Forward rotation(U→V→W)
Reverse rotation mode
0.0 to 0.8
Reverse rotation(U→W→V)
Output U
Output V
Output W
FG Signal
(1 FG)
BEMF Detect Width (Hi impedance)
Hi impedance
Figure 34. Timing Chart of Output Signals (U, V, W) and FG Signal in Forward Rotation Mode
Output U
Output V
Output W
FG Signal
(1 FG)
BEMF Detect Width (Hi impedance)
Hi impedance
Figure 35. Timing Chart of Output Signals (U, V, W) and FG Signal in Reverse Rotation Mode
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Description of Function Operations – continued
7.
Speed Control
7.1. Speed Control by DC Voltage
The DC voltage input to the CONT and MIN pins control the motor rotation speed. As shown in Figure 36, the
command PWM duty are generated by comparing the DC voltage input to the CONT pin with the triangular wave
generated by the OSC circuit. Similarly, the minimum command PWM duty are generated by comparing the DC
voltage input to the MIN pin with the triangular wave. The command PWM duty is determined by the low voltage of
CONT voltage or MIN voltage.
REF
REF
OSC
OSC
PWM
COMP
REF
Command
PWMduty
PWM
Disable
SEL
LPF
5.0V
REF
CONT
MIN
OSC
2.5V
1.05V
GND
0.0V
CONT
High
PWM
COMP
MIN
Figure 36. DC Voltage Input Application
Command
PWM duty
Low
Figure 37. Timing Chart of PWM Duty Generation in DC Voltage Input
The OSC High voltage (2.50 V (Typ)) and the Low voltage (1.05 V (Typ)) are made by resistance division of the
reference voltage (REF) and are designed to be resistant to voltage ratio fluctuations. Therefore, by setting the CONT
pin input voltage to the REF voltage reference, it is possible to make it an application that is not easily affected even if
there is voltage fluctuation of the triangular wave. In this case as well, in applications requiring strict accuracy, decide
the value with sufficient margin after consideration.
7.2. OSC Frequency Setting
The capacitor value (COSC) connected to the OSC pin sets the OSC frequency.
Equation
𝑓𝑂𝑆𝐶 = 𝐶
|𝐼𝐷𝑂𝑆𝐶 ×𝐼𝑆𝑂𝑆𝐶 |
𝑂𝑆𝐶 ×(|𝐼𝐷𝑂𝑆𝐶 |+|𝐼𝐶𝑂𝑆𝐶 |)×(𝑉𝑂𝑆𝐶𝐻 −𝑉𝑂𝑆𝐶𝐿 )
[Hz]
Where:
𝑓𝑂𝑆𝐶 is the OSC frequency [Hz]
𝐶𝑂𝑆𝐶 is the OSC capacitor value [F]
𝐼𝐷𝑂𝑆𝐶 is the OSC discharge current [A] (Typ +44 μA)
𝐼𝐶𝑂𝑆𝐶 is the OSC charge current [A] (Typ -44 μA)
𝑉𝑂𝑆𝐶𝐻 is the OSC high voltage [V] (Typ 2.50 V)
𝑉𝑂𝑆𝐶𝐿 is the OSC low voltage [V] (Typ 1.05 V)
Example) If the OSC capacitor value is 330 pF, the OSC frequency is about 46 kHz.
|44 𝜇×(−44 𝜇)|
𝑓𝑂𝑆𝐶 = 330 𝑝×(|44 𝜇|+|−44 𝜇|)×(2.50−1.05) ≒ 46.0 [kHz]
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Speed Control – continued
7.
7.3. Speed Control by PWM Input
The PWM signal input to the CONT pin controls the motor rotation speed. As shown in Figure 38, the command PWM
duty is determined by the PWM signal input to the CONT pin. The MIN pin should be pulled up the REF pin.
REF
REF
REF MIN
OSC
CONT
OSC
REF
5.0V
2.5V
Disable
0.8V
PWM
COMP
GND OSC
PWM
0.0V
High
CONT
MIN
Command
PWM duty
PWM
COMP
Low
command
PWM duty
Figure 38. PWM Input Application
Figure 39. Timing Chart of PWM Duty Generation in PWM Input
7.4. PWM Input
When the command PWM duty reaches 5% (Typ) or more, the IC starts driving and outputs the PWM signal from
output pins (U, V, W). Also, when the command PWM duty becomes 1% (Typ) or less, the IC stops driving and output
pins becomes low. In other areas, the output PWM duty is proportional to the command PWM duty.
Output PWM duty [%]
100
5
1
0 1 5
100
Command PWM duty [%]
Figure 40. Output PWM Duty vs Command PWM Duty
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Description of Function Operations – continued
8.
Under Voltage Lock Out Protection Function (UVLO)
The under voltage lock out protection function is a protection function to prevent unexpected operation, such as large
current flow, by turning output pins to OFF state in an extremely low supply voltage range deviating from normal operation.
When the supply voltage is 3.9 V (Typ) or less, the under voltage lock out circuit operates (UVLO ON) and output pins are
turned OFF. It returns to normal operation (UVLO OFF) when the supply voltage is 4.2 V (Typ) or more.
9.
Lock Protection Function (Automatic Recovery)
When a motor is locked, the lock protection function (automatic recovery) sets output pins to low state for a certain time
(tOFF=5.0 s (Typ)) so as not to keep flowing current through the coil, and then automatically recovers. It is generated the
BEMF in the coil of each phase during the motor rotation. However, when the motor lock, no the BEMF is generated. This
characteristic is used to judge the motor lock state.
10. High Speed Rotation Protection Function and Low Speed Rotation Protection Function
The high speed rotation protection function and the low speed rotation protection function set output pins to low state for a
certain time (tOFF=5.0 s (Typ)) so that the motor speed does not become uncontrollable by becoming faster or slower than
expected, and then automatically recovers. The speed protection function is set by the FG signal frequency condition. The
FG signal frequency corresponds to the FG output pulse set with the SEL2 pin. The speed protection function and the FG
frequency condition is shown as Table 6.
Table 6. Speed Protection Function and FG Signal Frequency Condition
Speed Protection Function
FG Signal Frequency Condition
High Speed Rotation Protection
400 Hz (Typ) or more
Low Speed Rotation Protection
10 Hz (Typ) or less
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Thermal Resistance Model
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. Thermal resistance from the
chip junction to the ambient is represented in θJA [°C/W], and thermal characterization parameter from junction to the top center
of the outside surface of the component package is represented in ΨJT [°C/W]. Thermal resistance is divide into the package
part and the substrate part. Thermal resistance in the package part depends on the composition materials such as the mold
resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate heat
dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be decreased by
the heat radiation measures like installing a heat sink etc. in the mounting substrate.
The thermal resistance model is shown in Figure 41, and equation is shown below.
Equation
𝜃𝐽𝐴 =
𝜓𝐽𝑇 =
𝑇𝑗−𝑇𝑎
𝑃
𝑇𝑗−𝑇𝑡
𝑃
[°C/W]
Ambient temperature: Ta[°C]
[°C/W]
θJA[°C/W]
Where:
𝜃𝐽𝐴 is the thermal resistance from junction to ambient
[°C/W]
𝜓𝐽𝑇 is the thermal characterization parameter from junction
to the top center of the outside surface of the component
package [°C/W]
𝑇𝑗 is the junction temperature [°C]
𝑇𝑎 is the ambient temperature [°C]
𝑇𝑡 is the package outside surface (top center)
temperature [°C]
𝑃 Is the power consumption [W]
Junction temperature: Tj[°C]
Package outside surface (top center)
temperature: Tt[°C]
ΨJT[°C/W]
Mounting Substrate
Figure 41. Thermal Resistance Model of Surface Mount
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption and the
measurement environments of the ambient temperature, the mounting condition and the wind velocity, etc.
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I/O Equivalence Circuits (Resistance Values are Typical)
1. VCC, GND pins
2. CONT pin
3. SEL2 pin
REF
REF
4. FR, SEL pins
REF
VCC
REF
200 kΩ
1 kΩ
200 kΩ
SEL2
100 kΩ
FR, SEL
1 kΩ
10 kΩ
10 kΩ
CONT
GND
1 kΩ
1 kΩ
5. REF pin
6. SOSC, OSC pins
7. VCL pin
8. FG pin
VCC
VCC
REF
1 kΩ
1 kΩ
ＶＣＬ
10 Ω
FG
53 kΩ
SOSC, OSC
9. U, V, W, RNF pins
10. MIN pin
VCC
VCC
VCC
10 kΩ
V
U
W
30 kΩ
30 kΩ
30 kΩ
MIN
1 kΩ
RNF
Note for Content
Timing charts might be omitted or simplified to explain functional operation.
Location of IC (Generally Three-phase Sensor-less Driver IC)
1.
2.
Generally, the three-phase sensor-less driver detects the BEMF and is rotated the motor. The line noise and resistance
affect the detection of the BEMF. As shown in Figure 42, shorten the line from the motor to the IC and place the IC on the
motor board.
For the three-phase sensor-less and the variable speed driver, it is necessary to adjust the IC and the motor for each
motor unit. (Generally, the motor and the IC are adjusted by the motor manufacturer.)
Motor
Motor
IC
IC
×
Board
Board
Figure 42. Location Image of IC
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to
back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not
cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor
characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the
ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other specially to ground, power supply and output pin. Inter-pin
shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD63242FV
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
Parasitic
Elements
Pin B
B
GND
GND
Parasitic
Elements
GND
N Region
close-by
Figure 43. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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BD63242FV
Ordering Information
B
D
6
3
2
4
2
F
V
Package
FV:SSOP-B16
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B16 (TOP VIEW)
Part Number Marking
6 3 2 4 2
LOT Number
Pin 1 Mark
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BD63242FV
Physical Dimension and Packing Information
Package Name
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BD63242FV
Revision History
Date
Revision
13.Sep.2018
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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