BD63401EFV-E2

Datasheet 40 V Stepping Motor Driver BD63401EFV General Description Key Specifications ■ ■ ■ ■ BD63401EFV is a bipolar low-consumption driver that driven by PWM current. Rated power supply voltage of the device is 40 V, and rated output current is 1.35 A. PARA-IN driving mode is adopted for input interface. In addition, the power supply can be driven by one single system, which simplifies the design. Range of Power Supply Voltage 8 V to 33 V Rated Output Current 1.35 A Range of Operating Temperature -25 °C to +85 °C Output ON Resistance 1.0 Ω (Typ) (total of upper and lower resistors) Package Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ HTSSOP-B20 Rated Output Current 1.35 A Low ON Resistance DMOS Output PARA-IN Drive Mode PWM Constant Current (other oscillation) Built-in Spike Noise Cancel Function (external noise filter is unnecessary) FULL STEP, HALF STEP Functionality Current Decay Mode is SLOW DECAY Power Save Function Built-in Logic Input Pull-down Resistor Thermal Shutdown Circuit (TSD) Over-current Protection Circuit (OCP) Under Voltage Lock Out Circuit (UVLO) Over Voltage Lock Out Circuit (OVLO) Protects against malfunction when power supply is disconnected (Ghost Supply Prevention function) Microminiature, Ultra-thin and High Heat-radiation (exposed metal type) Package W (Typ) x D (Typ) x H (Max) 6.50 mm x 6.40 mm x 1.00 mm Typical Application Circuit TEST Application ■ Sewing Machine, PPC, Multi-function Printer, Laser Beam Printer, Ink-jet Printer, Monitoring Camera, WEB Camera, Photo Printer, FAX, Scanner, Mini Printer, Toy and Robot IN1 IN2 IN3 IN4 VREF1 VREF2 PS VCC1 OUT1A OUT1B RNF1 VCC2 SELECT TIMING OUT2A OUT2B RNF2 GND 〇Product structure : Silicon integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Pin Configuration Block Diagram [TOP VIEW] TEST 6 GND １ OUT1B ２ RNF1 3 OUT1A 4 VCC1 ５ 20 OUT2B IN1 12 IN2 13 19 RNF2 IN3 14 TSD OCP OVLO UVLO RESET 18 OUT2A 17 VCC2 VREF2 8 16 GND 14 IN3 VREF2 ８ 13 IN2 EXP-PAD RNF2 Blank time PWM control SELECT 10 Predriver VREF1 ７ RNF1 Control Logic 15 IN4 12 IN1 SELECT１０ 11 TIMING 1 GND 9 PS 5 VCC1 4 2 OUT1A OUT1B 3 RNF1 17 VCC2 18 20 OUT2A OUT2B 19 RNF2 16 GND 15 VREF1 7 TEST ６ PS ９ IN4 Translator OSC TIMING 11 Regulator Pin Description Pin No. Pin Name 1 GND 2 OUT1B 3 RNF1 4 OUT1A 5 Function Pin No. Pin Name Ground pin 11 TIMING Chopping input pin H bridge output pin 12 IN1 Phase selection pin Connection pin of resistor for output current detection 13 IN2 Phase selection pin H bridge output pin 14 IN3 Phase selection pin VCC1 Power supply pin 15 IN4 Phase selection pin 6 TEST Pin for testing. (Used by connecting with GND) 16 GND Ground pin 7 VREF1 Output current value setting pin 17 VCC2 Power supply pin 8 VREF2 Output current value setting pin 18 OUT2A 9 PS Power save pin 19 RNF2 10 SELECT Minimum on time setting pin 20 OUT2B - EXP-PAD The EXP-PAD of the product connect to GND. - - www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/19 Function H bridge output pin Connection pin of resistor for output current detection H bridge output pin - TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Function Explanation PS/Power Save Pin The PS pin can make circuit standby state and make motor output OPEN. When PS=L→H, be careful because there is a delay of 40 μs (Max) before it is returned from standby state to normal state and the motor output becomes ACTIVE. PS Status L H Standby state ACTIVE IN1, IN2, IN3, IN4/Phase Selection Pin This is the pin to decide output pin logic. Input IN1 IN2 PS IN3 IN4 (Note 1) (Note 1) L X X H L L H H L H L H H H H Output OUT1A OUT1B OUT2A OUT2B OPEN OPEN OPEN OPEN H L L H OPEN OPEN Status POWER SAVE (STANDBY) STOP FORWARD REVERSE STOP (Note 1) x=Low or High VCC1, VCC2/Power Supply Pin Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. Voltage VCC may have great fluctuation due to counter electromotive force of the motor, PWM switching noise etc. So arrange the bypass capacitor of about 100 µF to 470 µF as close to the pin as possible and adjust the voltage VCC is stable. Increase the capacity as needed especially, when a large current is used or those motors that have great back electromotive force are used. In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel connection of multi-layered ceramic capacitor of 0.01 µF to 0.1 µF etc. Extreme care must be used to make sure that the voltage VCC does not exceed the rating even for a moment. VCC1 and VCC2 are shorted inside IC, but be sure to short externally VCC1 and VCC2 when using. If used without shorting, malfunction or destruction may occur because of concentration of current routes etc. Still more, in the power supply pin, there is built-in clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component operates, as a result there is the danger of destruction, so be sure that the absolute maximum rating must not be exceeded. It is effective to mount a Zener diode of about the absolute maximum rating. Moreover, the diode for preventing of electrostatic destruction is inserted between the VCC1,VCC2 and GND pin, as a result there is the danger of IC destruction if reverse voltage is applied between the VCC1, VCC2 and GND pin, so be careful. GND/Ground Pin In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, the wiring impedance from this pin is made as low as possible to achieve the lowest electrical potential no matter what operating state it can be. Moreover, design patterns not to have any common impedance with other GND patterns. OUT1A, OUT1B, OUT2A, OUT2B/H Bridge Output Pin Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. It is also effective to add a Schottky diode if output has positive or negative great fluctuation when large current, for example, counter electromotive voltage etc., is used. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component operates, as a result there is the danger of even destruction, so be sure that the absolute maximum rating must not exceeded. RNFX(Note 2)/Connection Pin Of Resistor For Detecting Of Output Current Connect the resistor of 0.1 Ω to 0.7 Ω for current detection between this pin and GND. Determine the resistor so that power consumption W=IOUT2xR [W] of the current-detecting resistor does not exceed rated power consumption. In addition, it has a low impedance and does not have a common impedance with other GND patterns because motor’s drive current flows in the pattern through the RNFX Pin to current-detecting resistor to GND. Do not exceed the rating because there is the possibility of circuits’ malfunction etc., if the RNFX voltage has exceeded the maximum rating (0.7 V). Moreover, be careful because if the RNFX pin is shorted to GND, large current flows without normal PWM constant current control, then there is the danger that OCP or TSD will operate. If the RNFX pin is open, then there is the possibility of such malfunction as output current does not flow either, so do not let it open. (Note 2) x=1 or 2 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Function Explanation – continued VREFX(Note 1)/Output current value setting Pin This is the pin to set the output current value. It can be set by VREFX voltage and current-detecting resistor (RNFX(Note 1) resistor). (Note 1) x=1 or 2 𝐼𝑂𝑈𝑇 = 𝑉𝑅𝐸𝐹𝑋 / 𝑅𝑁𝐹𝑋 [A] Where: IOUT VREFX RNFX is the output current. is the voltage of output current value-setting pin. is the current-detecting resistor. Avoid using it with the VREFX pin open because if the VREFX pin is open, the input is unsettled, and the VREFX voltage increases, and then there is the possibility of such malfunctions as the setting current increases and a large current flows etc. Keep to the input voltage range because if the voltage of 3 V or more is applied on the VREFX pin, then there is also the danger that a large current flows in the output and so OCP or TSD will operate. Besides, select the resistance value in consideration of the outflow current (Max 2 µA) if it is inputted by resistance division. The minimum current, which can be controlled by VREFX voltage, is determined by motor coil’s L, R values and minimum ON time because there is a minimum ON time in PWM drive. SELECT/ Minimum on time setting Pin This is the pin to set the minimum on time. SELECT Minimum on time L H 1.55 µs (Typ) 2.50 µs (Typ) TIMING/ Chopping input pin This is the pin to set the chopping frequency of output. Output turn on again from current decay mode by changing this pin to the high voltage from the low voltage. Recommended frequency is from 20 kHz to 150 kHz. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Protection Circuits Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises 175 °C (Typ) or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. Over Current Protection (OCP) This IC has a built-in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition when the regulated current flows for 4 µs (Typ). It returns with power reactivation or a reset by the PS pin. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return by power reactivation or a reset by the PS pin, then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, the motor outputs are shorted each other or VCC-motor output or motor output-GND is shorted, if the output pin voltage jumps up and the absolute maximum values can be exceeded after the over current has flowed, there is a possibility of destruction. Also, when current which is the output current rating or more and the OCP detection current or less flows, the IC can heat up to Tjmax=150 °C exceeds and can deteriorate, so current which or more the output rating should not be applied. Under Voltage Lock Out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage is low. When the applied voltage to the VCC pin goes 5 V (Typ) or less, the motor output is set to OPEN. This switching voltage has a 1 V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this circuit does not operate during power save mode. Over Voltage Lock Out (OVLO) This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage. When the applied voltage to the VCC pin goes 37 V (Typ) or more, the motor output is set to OPEN. This switching voltage has a 1 V (Typ) hysteresis and a 4 µs (Typ) mask time to prevent false operation by noise etc. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be aware that this circuit does not operate during power save mode. Protects against malfunction when power supply is disconnected (Ghost Supply Prevention Function) If a signal (logic input and VREFX(Note 1)) is input when there is no power supplied to this IC, there is a function which prevents a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction prevention diode from these input pins to the VCC. Therefore, there is no malfunction of the circuit even when voltage is supplied to these input pins while there is no power supply. (Note 1) x=1 or 2 Operation Under Strong Electromagnetic Field The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is found when using the IC in a strong electromagnetic field. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Absolute Maximum Rating (Ta=25 °C) Item Symbol Rated Value Unit VCC1, VCC2 -0.2 to +40.0 V VIN -0.2 to +5.5 V RNFX(Note 1) Maximum Voltage VRNF 0.7 V Output Current IOUT 1.35(Note 2) A/Phase Storage Temperature Tstg -55 to +150 °C Tjmax +150 °C Supply Voltage Input Voltage for Control Pin Maximum Junction Temperature (Note 1) x=1or 2 (Note 2) Do not exceed Tjmax=150 °C. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Condition Item Symbol Min Typ Max Unit VCC1, VCC2 8 30 33 V Operating Temperature Topr -25 +25 +85 °C Maximum Output Current (DC) IOUT - - 1.1(Note 3) A/Phase Supply Voltage (Note 3) Do not exceed Tjmax=150 °C. Thermal Resistance(Note 4) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 6) 2s2p(Note 7) θJA 95.5 26.8 °C/W ΨJT 8 4 °C/W HTSSOP-B20 Junction to Ambient Junction to Top Characterization Parameter (Note 5) (Note 4) Based on JESD51-2A(Still-Air), using a BD63401EFV Chip. (Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 6) Using a PCB board based on JESD51-3. (Note 7) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 8) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 8) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Electrical Characteristics (Unless otherwise specified Ta=25 °C, VCC1=VCC2=30 V) Item Symbol Specification Unit Condition Min Typ Max ICCST - - 10 µA PS=L ICC - 2.0 5.0 mA PS=H, VREF1=VREF2=3 V H-level Input Voltage VINH 2.0 - - V L-level Input Voltage VINL - - 0.8 V H-level Input Current IINH 35 50 100 µA VIN=5 V L-level Input Current IINL -10 0 - µA VIN=0 V IOUT =±1.1 A (Sum of upper and lower) [Whole] Circuit Current at Standby Circuit Current [Control input] [Output (OUT1A, OUT1B, OUT2A, OUT2B)] Output ON Resistance RON - 1.0 1.4 Ω Output Leak Current ILEAK - - 10 µA RNFX(Note 1) Input Current IRNF -80 -40 - µA RNFX=0 V VREFX(Note 1) Input Current IVREF -2.0 -0.1 - µA VREFX=0 V VREFX(Note 1) Input Voltage Range VVREF 0 - 3.0 V tONMIN1 0.70 1.55 3.10 µs SELECT=L tONMIN2 1.25 2.50 4.50 µs SELECT=H VCTH 0.579 0.600 0.621 V VREFX=0.6 V [Current control] Minimum ON Time1 (Blank time) Minimum ON Time2 (Blank time) Comparator Threshold (Note 1) x=1or 2 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV PWM Constant Current Control 1 Current control operation The output current increases due to the output transistor turned on. When the voltage on the RNF X(Note 1) pin, the output current is converted it due to connect the external resistance to RNFX pin, reaches the voltage value set by the VREFX pin input voltage, the current limit comparator operates and enters current decay mode. Output turn on after changing this pin to the high voltage from the low voltage. The process repeats itself with chopping period (t CHOP). (Note 1) x=1 or 2 2 Noise-masking function In order to avoid misdetection of current detection comparator due to RNF spike noise that may occur when the output turns ON, the IC has the minimum ON time (tONMIN). The current detection is invalid from the output transistor turned on to tONMIN. This allows for constant-current drive without the need for an external filter. 3 PWM Timing Chart Spike Noise Current Limit Value Output Current 0mA Current Limit Value RNFX(Note 1) Voltage GND 5V Timing Voltage 0V Minimum ON Time Chopping Period tONMIN tCHOP (Note 1) x=1 or 2 Figure 1. Timing chart of TIMING voltage, RNFX voltage and output current www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV PWM Constant Current Control – continued Current Decay Mode In PWM constant current control, SLOW DECAY in synchronous rectification mode is adopted to minimize IC power consumption. The diagram shows the operating state of each transistor and the regenerative current path during attenuation at SLOW DECAY. SLOW DECAY OFF→OFF ON→OFF M ON→ON OFF→ON Output ON Time Current Decay Time Figure 2. Route of Regenerated Current during Current Decay About the merits of SLOW DECAY, the voltage of motor coils is small and the regenerative current decreases slowly. So the output current ripple is small and it is advantageous for motor torque. However, output current increasing according to fall-off current characteristic deterioration in the low-current area and it is easily influenced by EMF when pulse late is high. As a result, the waveform is distortion and motor oscillation increasing in the half-step mode. Thus, this decay mode is most suited to full-step mode or low-pulse-rate as half-step mode. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV PARA-IN Drive Mode It is possible to drive stepping motor with FULL STEP, HALF STEP, by inputting the following motor control signals using PARA-IN drive mode. Examples of control sequence and torque vector FULL STEP Controlled by logic signals of IN1, IN2, IN3, IN4 ① ② ③ OUT1A ④ IN1 4 1 IN2 OUT2B OUT2A IN3 2 3 IN4 OUT1B IOUT (CH1) IOUT (CH2) HALF STEP Controlled by logic signals of IN1, IN2, IN3, IN4 ① ② ③ ④ ⑤ ⑥ ⑦ OUT1A ⑧ 1 IN1 IN2 OUT2B 8 2 7 3 OUT2A IN3 6 4 5 IN4 OUT1B IOUT (CH1) IOUT (CH2) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Power Dissipation Confirm that the IC’s chip temperature Tj is not over 150 °C in consideration of the IC’s power consumption (W), thermal resistance (°C/W) and ambient temperature (Ta). When Tj=150 °C is exceeded, the functions as a semiconductor do not operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration and eventually destruction of the IC. Tjmax=150 °C must be strictly obeyed under all circumstances. Thermal Calculation The IC’s consumed power can be estimated roughly with the power supply voltage (VCC), circuit current (ICC), output ON resistance (RONH, RONL) and motor output current value (I OUT). The calculation method during FULL STEP drive, SLOW DECAY mode is shown here: 𝑊𝑉𝐶𝐶 = 𝑉𝐶𝐶 × 𝐼𝐶𝐶 [W] where: WVCC VCC ICC is the consumed power of the VCC. is the power supply voltage. is the circuit current. 𝑊𝐷𝑀𝑂𝑆 = 𝑊𝑂𝑁 + 𝑊𝐷𝐸𝐶𝐴𝑌 [W] 𝑊𝑂𝑁 = (𝑅𝑂𝑁𝐻 + 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × 2 × 𝑜𝑛_𝑑𝑢𝑡𝑦 [W] 𝑊𝐷𝐸𝐶𝐴𝑌 = (2 × 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × 2 × (1 − 𝑜𝑛_𝑑𝑢𝑡𝑦) [W] where: WDMOS WON WDECAY RONH RONL IOUT on_duty “2” is the consumed power of the output DMOS. is the consumed power during output ON. is the consumed power during current decay. is the upper P-channel DMOS ON-resistance. is the lower N-channel DMOS ON-resistance. is the motor output current value. PWM on duty 𝑡 = 𝑂𝑁⁄𝑡 𝐶𝐻𝑂𝑃 is the H bridge 1 and 2. tON varies depending on the L and R values of the motor coil and the current set value. Confirm by actual measurement, or make an approximate calculation. tCHOP is the chopping period, which depends on the TIMING pin. Refer to P.8 for details. IC number BD63401EFV Upper Pch DMOS ON Resistance RONH[Ω] (Typ) 0.60 Lower Nch DMOS ON Resistance RONL[Ω] (Typ) 0.40 𝑊_𝑡𝑜𝑡𝑎𝑙 = 𝑊𝑉𝐶𝐶 + 𝑊𝐷𝑀𝑂𝑆 [W] 𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑊_𝑡𝑜𝑡𝑎𝑙 [°C] where: W_total Tj Ta θja is the consumed total power of IC. is the junction temperature. is the ambient temperature. is the thermal resistance value. However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application board used, and create the thermal design with enough margin not to exceed Tjmax=150 °C. Although unnecessary with normal use, if the IC is used under especially strict heat conditions, consider externally attaching a Schottky diode between the motor output pin and GND to abate heat from the IC. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Power Dissipation - continued Temperature Monitoring In respect of BD63401EFV, there is a way to directly measure the approximate chip temperature by using the TEST pin with a protection diode for prevention from electrostatic discharge. However, temperature monitor way is used only for evaluation and experimenting, and must not be used in actual usage conditions. (1) Measure the pin voltage when a current of IDIODE=50 μA flows from the monitor TEST pin to the GND, without supplying VCC to the IC. This measurement is for measuring the VF voltage of the internal diode. (2) Measure the temperature characteristics of this pin voltage. (VF has a linear negative temperature factor against the temperature.) With the results of these temperature characteristics, chip temperature can be calibrated from the TEST pin voltage. (3) Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be approximated from the results of (2). VCC Internal Circuit -VF［mV］ TEST pin Internal Circuit IDIODE VF 25 150 Chip Temperature Tj［°C］ Figure 3. Model diagram for measuring chip temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Application Example TEST GND Logic input pin. See P.3 for detail. Translator IN1 IN2 IN3 IN4 TSD OCP OVLO UVLO RESET PS Bypass capacitor. Setting range is 100 μF to 470 μF (electrolytic) 0.01 μF to 0.1 μF (multilayer ceramic etc.) Refer to P.3 for detail. Be sure to short VCC1 & VCC2. VREF1 Set the output current. Input by resistor division. Refer to P.4 for detail. Power save pin. Refer to P.3 for detail. VREF2 VCC1 OUT1A OUT1B RNF1 SELECT Blank time PWM control TIMING Predriver RNF2 RNF1 Control Logic Set the minimum on time. Refer to P.4for detail. 0.2Ω 100 µF VCC2 OUT2A OUT2B Resistor for current detection. Setting range is 0.1 Ω to 0.7 Ω. Refer to P.3 for detail. RNF2 OSC 0.1 µF 0.2Ω Set the PWM frequency. Recommended frequency is from 20 kΩ to 150 kΩ. Refer to P.4 8 for detail. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Regulator GND Resistor for current detection. Setting range is 0.1 Ω to 0.7 Ω. Refer to P.3 for detail. 13/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV I/O Equivalence Circuit PS IN1 IN2 IN3 IN4 TIMING VREF1 VREF2 10kΩ 5kΩ 10kΩ 100kΩ SELECT 10kΩ 2.4Ω 100kΩ VCC OUT1A OUT2A OUT1B OUT2B RNF1 RNF2 circuitry 5kΩ www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 9. Example of monolithic IC structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Ordering Information B D 6 3 4 0 1 E F V Package type EFV: HTSSOP-B20 ROHM Model - E2 Packing, Forming specification E2: Reel-wound embossed taping Marking Diagram HTSSOP-B20 (TOP VIEW) Part Number Marking D 6 3 4 0 1 LOT Number Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSSOP-B20 18/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 BD63401EFV Revision History Date Revision 26.Oct.2018 001 Changes New Release www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/19 TSZ02201-0P2P0C702100-1-2 26.Oct.2018 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001