BD6345FV-E2

Datasheet DC Brushless Motor Drivers Three-phase Full-wave DC Brushless Fan Motor Driver BD6345FV ●General description BD6345FV is a three-phase sensor-less fan that suit for speed controllable fans. Its feature is sensor-less drive which doesn’t require a hall device as a location detection sensor. Furthermore, introducing a PWM soft switched driving mechanism achieves silent operations and low vibrations. ●Package SSOP-B20 W (Typ.) x D (Typ.) x H (Max.) 6.50mm x 6.40mm x 1.45mm ●Features „ Sensor-less drive „ Lock protection and automatic restart „ Rotating speed pulse signal (SOUT) output SSOP-B20 ●Application „ For 12V fan for general consumer equipment ●Absolute maximum ratings Parameter Supply voltage Power dissipation Storage temperature Operating temperature Output voltage Output Current SOUT signal output voltage SOUT signal output current REF current ability Input voltage (TOSC) Junction temperature *1 *2 *2 Symbol VCC Pd Tstg Topr Vomax Iomax VSOUT ISOUT IREF VIN Tjmax Limit 20 1200*1 -55 to +150 -40 to +100 20 1.2*2 20 10 8 6.5 Unit V mW ℃ ℃ V A V mA mA V 150 °C Limit 5.5 to 17.0 Unit V Reduce by 9.6mW/°C over Ta=25°C (on 70.0mm×70.0mm×1.6mm glass epoxy board) T not exceed Pd and ASO It is permissible to 1.5A, 1 or less second. ●Recommended operating conditions Parameter Operating supply voltage range ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Symbol VCC ○This product is not designed protection against radioactive rays 1/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Pin description ●Pin configuration P/No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 T/Name GND GND GND REF TEST1 TEST2 N.C. N.C U PGND V W VCC COM 15 TOSC 16 N.C 17 SOUT 18 19 20 GND GND GND Fig.1 Pin configuration Function GND terminal GND terminal GND terminal Reference voltage terminal TEST terminal TEST terminal Motor output U Motor GND terminal Motor output V Motor output W Power Supply terminal Motor central tap terminal Oscillating capacitor connecting terminal for synchronous driving Rotating speed pulse signal output terminal GND terminal GND terminal GND terminal ●Block diagram Fig.2 Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Electrical characteristics(Unless otherwise specified Ta=25°C, Vcc=12V) ICC Min. 4 Limit Typ. 7 Max. 10 VREF 4.8 5 5.2 V VTOSCH VTOSCL ICTOSC IDTOSC 2.3 0.8 -80 40 2.5 1.05 -60 60 2.7 1.2 -40 80 V V uA uA VSOUTL ISOUTL - 0.3 - 0.4 10 V uA TON TOFF 0.3 3 0.5 5 0.8 8 s s Output Hi voltage VOH - 0.15 0.20 V Output Lo voltage VOL - 0.09 0.16 V Parameter Circuit current REF voltage TOSC high voltage TOSC low voltage TOSC Charge current TOSC Discharge current SOUT low voltage SOUT leak current Lock detect ON time Lock detect OFF time Symbol Unit Conditions mA IREF= -2mA ISOUT=5mA VSOUT=20V TOSC=2200pF Io＝-200mA ( VCC common) Io＝200mA ( GND common) About this specification, it is a provisional spec , and there is a possibility of the change. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Typical performance curves(Reference data) 6 10 100°C 25°C 8 REF voltage: VREF [V] Circuit current: Icc[mA] 100°C 25°C -40°C 5 -40°C 6 4 4 3 2 Operating range Operating range 2 0 0 5 10 15 0 20 5 15 20 Supply voltage: Vcc[V] Supply voltage: Vcc[V] Fig.3 Circuit current Fig.4 REF voltage 3.0 6.0 TOSC H/L voltage: VTOSCH/VTOSCL[V] 100°C 25°C -40°C 5.0 REF voltage: VREF [V] 10 4.0 3.0 2.0 100°C 25°C -40°C 2.5 2.0 Operating range 1.5 100°C 25°C -40°C 1.0 0.5 0 2 4 6 8 10 Output source current: IR EF [mA] 0 5 10 15 20 Supply voltage: Vcc[V] Fig.5 REF voltage current ability (Vcc=12V) Fig.6 TOSC High/Low voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Typical performance curves(Reference data) 0.8 100°C 25°C -40°C 50 SOUT low voltage: VSOUTL [V] TOSC Charge/ Discharge current: ICTOSC/ IDTOSC [uA] 100 0 Operating range -50 -40°C 25°C 100°C -100 0.6 0.4 100°C 25°C 0.2 -40°C 0.0 0 5 10 15 20 0 Supply voltage: Vcc[V] 2 4 6 8 10 SOUT sink current: ISOUT[mA] Fig.7 TOSC charge/discharge current Fig.8 SOUT low voltage (Vcc=12V) 0.8 10.0 8.0 SOUT leak current: ISOUTL [uA] S OU T lo w voltage: V SOUTL[V] 0.6 0.4 17V 12V 5.5V 0.2 0.0 6.0 4.0 Operating range 2.0 100°C 25°C -40°C 0.0 0 2 4 6 8 10 SOUT sink current: ISOUT[mA] 5 10 15 20 Supply voltage: Vcc[V] Fig.10 SOUT leak current Fig.9 SOUT low voltage (Ta=25℃) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 5/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Typical performance curves(Reference data) 0.20 0.20 Output Hi voltage: VOH [V] Output Hi voltage: VOH [V] 100°C 0.15 25°C 0.10 -40°C 0.05 0.00 0 50 100 150 0.15 5.5V 12V 17V 0.10 0.05 0.00 200 0 Output source current: IO[mA] 100 150 200 Output source current: IO[mA] Fig.11 Output Hi voltage (Vcc=12V) Fig.12 Output Hi voltage (Ta=25℃) 0.20 0.20 0.15 0.15 Output Lo voltage: VOL [V] Output Lo voltage: VOL [V] 50 0.10 100°C 25°C 0.05 0.10 17V 12V 5.5V 0.05 -40°C 0.00 0.00 0 50 100 150 0 200 100 150 200 Output sink current: IO[mA] Output sink current: IO[mA] Fig.13 Output Lo voltage (Vcc=12V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 50 Fig.14 Output Lo voltage (Ta=25℃) 6/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Application circuit example(Constant values are for reference) For the noise reduction purpose, a bypass capacitor must connect between VCC and GND. + VCC 4.7uF REF If the motor normally operates, This capacitor can be removed. SOUT 10uF Det Level REF REF 0.1uF TSD COM BEMF DET UVLO TOSC It is necessary to choose the best capacitor value for optimum start-up operation. This is an open collector output. Connect a pull-up resistor. LOCK PROTECTION VCC OSC TOSC LOGIC TOSC 100pF 3300pF 2200pF:typ U V W Pre Driver TEST1 TEST2 GND PGND Fig.15 Application circuit Substrate design note a) IC power, motor outputs, and motor ground lines are made as fat as possible. b) IC ground (signal ground) line is common with the application ground except motor ground, and arranged near to (–) land. c) The bypass capacitor and/or Zenner diode are arrangement near to Vcc terminal. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Description of operations 1) Sensorless Drive BD6345FV is a motor driver IC for driving a three-phase brushless DC motor without a hall sensor. Detecting a rotor location firstly at startup, an appropriate logic for the rotation direction is obtained using this information and given to each phase to rotate the motor. Then, the rotation of the motor induces electromotive voltage in each phase wiring and the logic based on the induced electromotive voltage is applied to the each phase to continue rotating. 2) Motor output U,V,W and FG output signals In Fig.16, the timing charts of the output signals from the U, V and W phases as well as the SOUT terminal is shown. Assuming that a three-slot tetrode motor is used, two pulse outputs of SOUT are produced for one motor cycle. The three phases are excited in the order of U, V and W phases. Motor output U Motor output V Motor output W SOUT Fig.16 sensor-less drive Motor output Motor output U Motor output V 1 H L 2 H Hi-Z 3 Hi-Z H 4 L H 5 L Hi-Z 3 Hi-Z L * About the output pattern, It changes in the flow of “1→2→3 ～ 6→1”. Output pattern Motor output W Hi-Z L L Hi-Z H H 3) Lock Protection Feature, Automatic Recovery Circuit To prevent passing a coil current on any phase when a motor is locked, it is provided with a function, which can turn OFF the output for a certain period of time and then automatically restore itself to the normal operation. During the motor rotation, an appropriate logic based on the induced electromotive voltage can be continuously given to each phase ; on the other hand, when the motor is locked, no induced electromotive voltage is obtained. Utilizing this phenomenon to take a protective against locking, when the induced electromotive voltage is not detected for a predetermined period of time (TON), it is judged that the motor is locked and the output is turned OFF for a predetermined period of time (TOFF). In Fig.17, the timing chart is shown. Motor lock Induced electromotive voltage detection Detecting Not Detectin TON Output Motor unlock Detecting TOFF OFF ON Recover to the normal operation ON SOUT Fig.17 Lock protection www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV 4) SOUT signal mask time when power supply is turned on SOUT signal is masked at start operation. When supply is turned on, SOUT signal is fixed Hi between 0.6sec. SOUT signal operates usually after 0.6 sec. Vcc ON Output Ｕ Output V Output W ＳＯＵＴ signal Rotation speed signal mask time : 0.6sec (.typ) Fig.18 SOUT operation at start 5) UVLO（Under voltage lock out circuit） In the operation area under the guaranteed operating power supply voltage of 5.5V (typ.), the transistor on the output can be turned OFF at a power supply voltage of 3.9V (typ.). A hysteresis width of 250mV is provided and a normal operation can be performed at 4.15V(typ.). This function is installed to prevent unpredictable operations, such as a large amount of current passing through the output, by means of intentionally turning OFF the output during an operation at a very low power supply voltage which may cause an abnormal function in the internal circuit. About turning off a output voltage at UVLO, It becomes a OFF mode. (Upper MOS FET and Under MOS FET are turned OFF.) 6) Motor start up frequency setting The TOSC terminal starts a self-oscillation by connecting a capacitor between the TOSC terminal and GND terminal. It becomes a start-up frequency, and synchronized time can be adjusted by changing external capacitor. When the capacitor value is small, synchronized time becomes short. It is necessary to choose the best capacitor value for optimum start-up operation. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Equivalent circuit 1) SOUT output terminal 2) Motor output terminal SOUT U,V,W PGND 3) Coil midpoint terminal 4) Reference voltage terminal COM REF 5) Oscillating capacitor connecting terminal TOSC www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Safety measure 1) Reverse connection protection diode Reverse connection of power results in IC destruction as shown in Fig.19. When reverse connection is possible, reverse connection protection diode must be added between power supply and VCC. In normal energization After reverse connection destruction prevention Reverse power connection VCC VCC Circuit block VCC Circuit block I/O PIN GND GND Internal circuit impedance is high ⇒Amperage small Circuit block I/O PIN I/O PIN GND Large current flows ⇒Thermal destruction No destruction Fig.19 Flow of current when power is connected reversely 2) Measure against VCC voltage rise by back electromotive force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply. ON ON ON Phase switching ON Fig.20 Vcc voltage rise by back electromotive force When you use reverse connection protection diode, Please connect Zenner diode. Do not exceed absolute maximum ratings Vcc=20V. Capacitor & Zenner diode ON ON Fig.21 Measure against VCC voltage rise www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV 3) Problem of GND line PWM switching Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum. VCC M Motor Driver Controller PWM input GND Prohibit Fig.22 GND line PWM switching prohibited 4) SOUT output SOUT output is an open drain and requires pull-up resistor. Adding resistor R1 can protect the IC. An excess of absolute maximum rating, when SOUT output terminal is directly connected to power supply, could damage the IC. VCC Pull-up resistor SOUT Protection resistor R1 Connector of board Fig.23 Protection of SOUT terminal 5) Location of IC (Generally three-phase sensor less driver IC) a) Generally, three-phase sensorless driver is rotated motor by detecting the induced electromotive voltage. Line noise,line resistance is influenced for detecting the induced electromotive voltage. From motor to IC line should be shorted, its suggest that location of IC is on the board of Motor in below Fig.24.. b) In three-phase sensorless and variable speed driver, It is necessary to tuning motor and IC (each motor units). (Usually Motor maker does it to tuning motor and IC.) Motor Motor IC IC Board Board Fig.24 Location of IC 6) Note for contents To explain about function of operation, timing charts might be partly omitted. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.25 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj－Ta) / P [°C/W] Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistanceθja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Fig.26 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70[mm]×70[mm] ×1.6[mm] (copper foil area below 3[%])) θja = (Tj - Ta) / P [°C/W] Package surface temperature Tc[°C] Ambient temperature Ta[°C] Pd[mW] 2000 1500 1200 θja=104.2 [°C/W] 1000 500 Chip surface temperature Tj[°C] Power consumption P[W] 0 25 50 75 100 125 150 Ta[°C] ＊Reduce by 7.0mW/℃over 25℃ (On 70.0mm×70.0mm×1.6mm glass epoxy board) Fig.25 Thermal resistance www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Fig.26 Thermal derating curve 13/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Operational Notes 1) Absolute maximum ratings An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (When applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor. The potential GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if VCC is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When VCC voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above VCC or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. 14) In use We are sure that the example of application circuit is preferable, but please check the character further more in application to a part that requires high precision. In using the unit with external circuit constant changed, consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining. ●status of this document The English version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet BD6345FV ●Physical Dimension Tape and Reel Information SSOP-B20 6.5 ± 0.2 11 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed 0.3Min. 4.4 ± 0.2 6.4 ± 0.3 20 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 10 1.15 ± 0.1 0.1± 0.1 0.15 ± 0.1 0.1 0.65 0.22 ± 0.1 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram SSOP-B20 (TOP VIEW) D 6 3 4 5 F Part Number LOT Number 1PIN Mark www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/15 TSZ02201-0H1H0B100290-1-2 31.Jul.2012 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 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