BD63572MUV-E2

Datasheet Drivers for DC Brush Motors Dual H-Bridge Driver High-Speed Switching Type BD63572MUV Key Specifications General Description              The BD63572MUV provides a dual H-Bridge motor driver which features wide range of motor power supply voltage from 2.0 V to 9.0 V and low power consumption to switch low ON-Resistance DMOS transistors at high speed. This small surface mounting package is most suitable for mobile system, home appliance and various applications. Features     Low ON-Resistance Power DMOS Output Charge Pump-less with PDMOS High-Side Driver Drive Mode Switch Function Under Voltage Locked Out Protection and Thermal Shutdown Function Power Supply Voltage Range: 2.5 V to 3.6 V Motor Power Supply Voltage Range: 2.0 V to 9.0 V Circuit Current (Open Mode): 740 μA(Typ) Stand-by Current: 1 μA (Max) Control Input Voltage Range: 0 V to VCC Logic Input Frequency: 1000 kHz(Max) Minimum Logic Input Pulse Width: 100 ns(Min) Turn On Time: 45 ns(Typ) Turn Off Time: 45 ns(Typ) H-Bridge Output Current (DC): -1.0 A to +1.0 A H-Bridge Output Current (Peak): -2.5 A to +2.5 A 0.40 Ω(Typ) Output ON-Resistance (Total): Operating Temperature Range: -30 °C to +85 °C Package VQFN20PV3535 Applications W(Typ) x D(Typ) x H(Max) 3.50 mm x 3.50 mm x 1.00 mm  Mobile System  Home Appliance  Amusement System, etc. VQFN20PV3535 Typical Application Circuit 1 µF to 100 µF VCC VM PS 1 µF to 100 µF OUT1A IN1A OUT1B IN1B VM PWM OUT2A IN2A OUT2B IN2B PGND N.C. 〇Product structure : Silicon integrated circuit www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 GND 〇This product has no designed protection against radioactive rays 1/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Pin Configuration OUT1A VM VM IN1A PWM (TOP VIEW) 20 19 18 17 16 PGND 1 15 N.C. OUT1B 2 14 IN1B PGND 3 13 VCC OUT2B 4 PGND 5 12 GND EXP-PAD 8 VM VM 9 10 IN2B 7 PS 6 OUT2A 11 IN2A Pin Description Pin No. Pin Name 1 PGND 2 Function Pin No. Pin Name Function Motor ground 12 GND Small signal ground OUT1B H-Bridge output 1B 13 VCC Power supply 3 PGND Motor ground 14 IN1B Control logic input 1B 4 OUT2B H-Bridge output 2B 15 N.C. Always keep open. 5 PGND Motor ground 16 PWM Drive mode logic input 6 OUT2A H-Bridge output 2A 17 IN1A Control logic input 1A 7 VM Motor power supply 18 VM Motor power supply 8 VM Motor power supply 19 VM Motor power supply 9 PS Power-Saving function 20 OUT1A H-Bridge output 1A 10 IN2B Control logic input 2B 11 IN2A Control logic input 2A - EXP-PAD The EXP-PAD of the center connect to GND Pin. Block Diagram VCC 13 PS 9 Power Save TSD & UVLO Band Gap 18 19 VM IN1A 17 Level Shift & Pre Driver Logic IN1B 14 20 OUT1A H-Bridge Full ON 2 OUT1B PWM 16 7 Level Shift & Pre Driver IN2A 11 IN2B 10 Logic 6 OUT2A H-Bridge Full ON 4 OUT2B 1 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15 12 N.C. GND 2/14 8 VM 3 5 PGND TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Description of Functions 1. Power-Saving Function A Power-Saving Function is included, which allows the system to save power when not driving the motor. The voltage level on the PS Pin should be set high so as to keep the Active Mode. (See the Electrical Characteristics) 2. Motor Control Input (a) IN1A, IN1B, IN2A and IN2B Pins Logic level controls the output logic of H-Bridge. (See the Electrical Characteristics, and I/O Truth Table) (b) PWM Pin Logic level sets the IN/IN or EN/IN drive mode. (See the Electrical Characteristics and I/O Truth Table) 3. VM Pin Each H-Bridge can be controlled independently. Take into consideration that each VM Pin (Pin No.7, 8, 18 and 19 pins) are short-circuited internally. (See the Block Diagram) Each VM Pins must be shorted on printed circuit board. 4. PGND Pin Each PGND Pins must be shorted on printed circuit board. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Absolute Maximum Ratings (Ta=25 °C) Parameter Power Supply Voltage Symbol Rating Unit VCC -0.3 to +4.5 V Motor Power Supply Voltage VM -0.3 to +10.0 V Control Input Voltage VIN -0.3 to VCC+0.3 V H-Bridge Output Current (DC) IOUT -1.0 to +1.0 (Note 1) -2.5 to +2.5 (Note 2) A H-Bridge Output Current (PEAK) IOUT(PEAK) Maximum Junction Temperature Tjmax 150 °C Tstg -55 to +150 °C Storage Temperature Range A Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) ASO and Tj=150 °C should not be exceeded. (Note 2) PEAK=100 ms (Duty≤10 %). ASO and Tj=150 °C should not be exceeded. Thermal Resistance(Note 3) Parameter Symbol Thermal Resistance (Typ) 1s(Note 5) 2s2p(Note 6) Unit VQFN20PV3535 Junction to Ambient θJA 181.9 50.5 °C/W Junction to Top Characterization Parameter(Note 4) ΨJT 19 7 °C/W (Note 3) Based on JESD51-2A (Still-Air) (Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 5) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm (Note 6) Using a PCB board based to JESD51-5 , 7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top Thermal Via(Note 7) Pitch Diameter 1.20 mm Φ0.30 mm 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 7) This thermal via connects with the copper pattern of all layers. Recommended Operation Conditions Parameter Symbol Min Typ Max Unit VCC 2.5 - 3.6 V Motor Power Supply Voltage VM 2.0 - 9.0 V Control Input Voltage VIN 0 - VCC V Logic Input Frequency fIN 0 - 1000 kHz tIN 100 - - ns Topr -30 - +85 °C Power Supply Voltage Minimum Logic Input Pulse Width Operation Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Electrical Characteristics (Unless otherwise specified, VCC=3.0 V, VM=5.0 V, Ta=25 °C) Parameter Symbol Min Typ Max Unit Conditions All Circuits Stand-by Current ICCST - 0 1 μA VPS=0 V Circuit Current 1 ICC1 200 740 1150 μA VPS=3 V, Open Mode(Note 8) Circuit Current 2 ICC2 200 750 1150 μA VPS=3 V, CW & CCW Mode(Note 8) Circuit Current 3 ICC3 300 770 1200 μA VPS=3 V, Short Brake Mode(Note 8) High-Level Input Voltage VPSH 1.85 - VCC V Low-Level Input Voltage VPSL 0 - 0.9 V High-Level Input Current IPSH 15 30 60 μA VPS=3 V Low-Level Input Current IPSL -1 0 +1 μA VPS=0 V PS Input (PS) Control Input (IN=IN1A, IN1B, IN2A, IN2B, PWM) High-Level Input Voltage VINH 1.85 - VCC V Low-Level Input Voltage VINL 0 - 0.9 V High-Level Input Current IINH 15 30 60 μA VIN=3 V Low-Level Input Current IINL -1 0 +1 μA VIN=0 V 2.0 - 2.4 V Under Voltage Locked Out (UVLO) UVLO Voltage VUVLO FULL ON Type H-Bridge Driver Output ON-Resistance RON - 0.40 0.60 Ω Turn On Time tON - 45 200 ns IOUT=±500 mA, High & Low-side total Resistance 20 Ω Loading Turn Off Time tOFF - 45 200 ns 20 Ω Loading (Note 8) Refer to Table 1. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Typical Performance Curves (Reference Data) 3.0 Top +85 °C Mid +25 °C Low -30 °C Top +85 °C Mid +25 °C Low -30 °C 4.0 Circuit Current : ICC1 [mA] Stand-by Current : ICCST [μA] 5.0 3.0 Operating Range (2.5 V to 3.6 V) 2.0 2.0 Operating Range (2.5 V to 3.6 V) 1.0 1.0 0.0 0.0 0 1 2 3 4 0 Power Supply Voltage : VCC [V] 2 3 4 Power Supply Voltage : VCC [V] Figure 1. Stand-by Current vs Power Supply Voltage (Stand-by Mode) Figure 2. Circuit Current vs Power Supply Voltage (Open Mode) 500 500 Top +85 °C Mid +25 °C Low -30 °C Top +85 °C Mid +25 °C Low -30 °C 400 Output VDSL : VDSL [mV] 400 Output VDSH : VDSH [mV] 1 300 200 100 300 200 100 0 0 0 200 400 600 800 1000 0 Output Current : IOUT [mA] 400 600 800 1000 Output Current : IOUT [mA] Figure 3. Output VDSH vs Output Current (Output ON-Resistance on high-side, VM=5 V, VCC=3 V) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 200 Figure 4. Output VDSL vs Output Current (Output ON-Resistance on low-side, VM=5 V, VCC=3 V) 6/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV 1.0 0.5 Top +85 °C Mid +25 °C Low -30 °C Output ON-Resistance Low-side : R ONL [Ω] Output ON-Resistance High-side : R ONH [Ω] Typical Performance Curves (Reference Data) - continued 0.8 0.6 Operating Range (2.0 V to 9.0 V) 0.4 0.2 0.0 Top +85 °C Mid +25 °C Low -30 °C 0.4 0.3 Operating Range (2.0 V to 9.0 V) 0.2 0.1 0.0 0 2 4 6 8 Motor Power Supply Voltage : VM [V] 10 0 Figure 5.Output ON-Resistance High-side vs Motor Power Supply Voltage (Output ON-Resistance on High-side VM Dependency, VCC=3 V) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2 4 6 8 Motor Power Supply Voltage : VM [V] 10 Figure 6. Output ON-Resistance Low-side vs Motor Power Supply Voltage (Output ON-Resistance on Low-side VM Dependency, VCC=3 V) 7/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Timing Chart Table 1. I/O Truth Table Input Mode PS(Note 9) INPUT IN1A / PWM IN2A L EN/IN H H IN/IN - L L X OUTPUT OUT1B / Output Mode (Note 10) OUT2B L Short Brake IN1B / IN2B X OUT1A / OUT2A L H L H L CW H H L H CCW L L Z Z Open H L H L CW L H L H CCW H H L L Short Brake X X Z Z Open L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 9) PS=High: Active Mode, PS=Low: Stand-by Mode (Note 10) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=1,2) tIN Control Input 1.85 V 1.4 V tIN 0.9 V tON tON tOFF tOFF +100 % +50 % +50 % Motor Current 0% -50 % -50 % -100 % Figure 7. Input-Output AC Characteristic 1 1.85 V Control Input 1.4 V 0.9 V tIN tON tOFF 100 % Motor Current 50 % 0% Figure 8. Input-Output AC Characteristic 2 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Application Example 1 µF to 100 µF VCC VM PS 1µ F to 100 µF OUT1A IN1A OUT1B IN1B VM PWM OUT2A IN2A OUT2B IN2B PGND N.C. GND Selection of Components Externally Connected When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC. I/O Equivalence Circuits PS IN1A, IN1B, IN2A, IN2B, PWM VM, PGND, OUTxA, OUTxB (x=1,2) VM 75 kΩ 10 kΩ 100 kΩ 100 kΩ OUTxA OUTxB PGND www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal(GND) and large-current ground(PGND) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 9. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Ordering Information B D 6 3 5 7 2 M U V Package MUV:VQFN20PV3535 - E2 Package and forming specification E2: Embossed tape and reel Marking Diagram VQFN20PV3535 (TOP VIEW) Part Number Marking BD635 LOT Number 72MUV Pin 1 Mark www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Physical Dimension and Packing Information Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN20PV3535 13/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 BD63572MUV Revision History Date Revision 07.Dec.2017 001 New Release 25.Jan.2019 002 Change Physical Dimension and Packing Information www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Changes 14/14 TSZ02201-0H3H0B301690-1-2 25.Jan.2019 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001