BD6360GUL_11

1/4 STRUCTURE PRODUCT SERIES TYPE FEATURES Silicon Monolithic Integrated Circuit Motor Driver for electronic camera module BD6360GUL ・Built in 2 Full-ON H BridgeDrivers ・Built in 1 comparator with hysteresis for photo-interrupter output waveform shaping ・Built in 1 voltage-regulator for photo-interrupter Absolute maximum ratings (Ta=+25°C) Parameter Symbol Power supply voltage VCC Control input voltage VIN Power dissipation Pd Operating Topr temperature range Junction temperature Tjmax Storage temperature range Tstg H-bridge output current Iout ※1 ※2 Limit -0.3 to +6.5 -0.3 to VCC+0.3 730※1 -25 to +85 +150 -55 to +150 -500 to +500※2 Unit V V mW °C °C °C mA/ch Reduced by 5.84mW/°C over 25°C, when mounted on a glass epoxy board (50mm  58mm  1.75mm; 8 layers) Must not exceed Pd, ASO, or Tjmax of 150°C. Operating Conditions (Ta= -25°C to +85°C) Parameter Symbol Power supply voltage VCC Control input voltage VIN H-bridge output current Iout ※3 Must not exceed Pd or ASO. Min. 2.3 0 - Typ. 3.0 - Max. 5.5 VCC 3 400※ Unit V V mA/ch REV. B 2/4 BD6360GUL Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=3.0V) Parameter Overall Circuit current during standby operation Symbol Limit Min. Typ. Max. Unit Conditions ICCST ICC VINH VINL IINH IINL VUVLO IBIPI VLOPI VHIPI VTHPI VHYSPI RONSW - 0 1.1 5 1.8 μA mA V V μA μA V μA V V V mV Ω μA Ω PS=0V PS=3V with no signal, and no load Circuit current High level input voltage Low level input voltage High level input current Low level input current Control input (VIN= IN1A, IN1B, IN2A, IN2B, SEL, and PS) 1.5 0 15 -1 30 0 VCC 0.5 60 - VINH=3V, pull down resistance typ.100kΩ VINL=0V UVLO UVLO voltage Input bias current Output low level voltage Output high level voltage 1.6 2.2 Photo-interrupter (PI) comparator -3 0 VCC-0.5 1.2 200 0 1.3 300 3 0.5 VCC 1.4 400 Io=+1mA Io=-1mA Lo→Hi threshold voltage Hi→Lo threshold voltage VTHPI-VHYSPI Threshold voltage Hysteresis voltage ON-Resistance OFF current Output ON-Resistance Output AC characteristic Turn-on time Turn-off time Rise time Fall time Photo-interrupter (PI) regulator -1.0 0 10 - Io=-30mA BIAS=0V ILSW RON ton toff tr tf Full-ON Drive block (ch1 and ch2) 1.00 1.25 Io=+400mA on high and low sides in total 0.1 - 0.6 0.08 0.15 0.03 2.0 0.5 1.0 0.2 μs μs μs μs Io=±400mA Io=±400mA Io=±400mA Io=±400mA Photo-interrupter I/O Timing Chart PS H L CIN 1.3V 1.0V COUT VCC 0V Hi impedance Fig.1 Photo-interrupter I/O Timing Chart REV. B 3/4 Package Outline 1PIN MARK Pin Arrangement (Top View) 1 2.1 ± 0.1 2 3 4 AAG Lot No. 2.1 ± 0.1 Top View A OUT2B CIN COUT BIAS B 0.1 ± 0.05 0.55 MAX OUT2A INDEX POST IN2A VCC S 0.08 S Side View C OUT1B IN1B IN2B SEL 15－φ0.25 ± 0.05 φ0.05 AB 0.5 A D C B A 1 2 3 4 B 0.3 ± 0.1 D OUT1A GND IN1A PS (φ0.15)INDEX POST P=0.5×3 Bottom View Fig.3 BD6360GUL Pin Arrangement (Top View) 0.3 ± 0.1 P=0.5×3 Fig.2 VCSP50L2 Package (Unit; mm) Block Diagram VCC 4B I/O Truth Table Tab. 1 BD6360GUL I/O Truth Table INPUT OUTPUT INxB X L H L H L H X OUTxA Z H L Z L H L Z OUTxB Z L H Z H L L Z BandGap VCC 1D OUT1A PS 4D Power Save TSD & UVLO MODE PS SEL INxA L EN/IN L H H H IN/IN H H H L X X L L IN1A 3D IN1B 2C IN2A 3B IN2B 3C SEL 4C VCC PS_ H bridge Logic Pre Driver H bridge 1A OUT2B 2D GND BandGap 1C OUT1B 1B OUT2A VREF 4A BIAS 2A CIN 3A COUT Fig.4 BD6360GUL Block Diagram L : Low, H : High, X : Don’t care, Z : Hi impedance REV. B 4/4 I/O Switching Waveform 100% VIN 50% ton ton toff 90% 50% motor current 10% -10% -50% -90% tf tr -10% -50% -90% tf tr -100% toff 50% 10% 0% 90% 100% 50% 0% Fig.5 BD6360GUL I/O Switching Waveform Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and ground pins. (3) (4) (5) (6) (7) Ground potential Ensure a minimum GND pin potential in all operating conditions. Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. Thermal shutdown circuit This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the following temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD ON temperature [°C] (Typ.) 175 (8) Ground Wiring Pattern When using both small signal GND and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. Hysteresis temperature [°C] (Typ.) 25 REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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