Datasheet
36 V High-performance,
High-reliability Withstand Voltage
Stepping Motor Driver
BD63740FM
General Description
Key Specifications
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BD63740FM is a bipolar low-consumption driver that is
driven by PWM current. Rated power supply voltage of
the device is 36 V, and rated output current is 4.0 A.
CLK-IN driving mode is adopted for input interface, and
excitation mode is corresponding to FULL STEP mode (2
types), HALF STEP mode (2 types), QUARTER STEP
mode (2 types), 1/8 STEP mode and 1/16 STEP mode
via a built-in DAC. In terms of current decay, the SLOW
DECAY/FAST DECAY ratio may be set without any
limitation, and all available modes may be controlled in
the most appropriate way. In addition, the power supply
may be driven by one single system, which simplifies the
design.
Range of Power Supply Voltage
8 V to 28 V
Rated Output Current (continuous)
4.0 A
Rated Output Current (peak value)
4.5 A
Range of Operating Temperature -25 °C to +85 °C
Output ON Resistance
0.28 Ω (Typ)
(total of upper and lower resistors)
Package
HSOP-M36
W (Typ) x D (Typ) x H (Max)
18.5 mm x 9.9 mm x 2.4 mm
Features
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Rated Output Current 4.0 A
Low ON Resistance DMOS Output
CLK-IN Drive Mode
PWM Constant Current (other oscillation)
Built-in Spike Noise Cancel Function
(external noise filter is unnecessary)
FULL STEP (2 types), HALF STEP (2 types),
QUARTER STEP (2 types), 1/8 STEP, 1/16 STEP
Functionality
Freely Timing Excitation Mode Switch
Current Decay Mode Switch
(linearly variable SLOW/FAST DECAY ratio)
Normal Rotation & Reverse Rotation Switching
Function
Power Save Function
Built-in Logic Input Pull-down Resistor
Power-on Reset Function
Thermal Shutdown Circuit (TSD)
Over-current Protection Circuit (OCP)
Under Voltage Lock Out Circuit (UVLO)
Over Voltage Lock Out Circuit (OVLO)
Protects Against Malfunction when Power Supply is
Disconnected (Ghost Supply Prevention Function)
Adjacent Pins Short Protection
Typical Application Circuit
GND
CLK
CW_CCW
MODE0
PS
MODE1
MODE2
ENABLE
VCC1
VREF
OUT1A
M
OUT1B
RNF1
RNF1S
Application
VCC2
■ Sewing Machine, PPC, Multi-function Printer, Laser
Beam Printer, Ink-jet Printer, Monitoring Camera,
WEB Camera, Photo Printer, FAX, Scanner, Mini
Printer, Toy and Robot
CR
OUT2A
M
OUT2B
MTH
TEST
RNF2
RNF2S
GND
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays
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BD63740FM
Pin Configuration
Block Diagram
[TOP VIEW]
36 NC
35 OUT2B
OUT1B 3
34 OUT2B
CLK 19
RNF1 4
33
RNF2
RNF1 ５
32
RNF2
RNF1S ６
31
RNF2S
OUT1A ９
10 VCC1
11 VCC1
8 OUT1A
VREF 17
4 bit DAC
9 OUT1A
29 OUT2A
2 OUT1B
28 OUT2A
3
OUT1B
4
RNF1
5
RNF1
6
RNF1S
RNF1S
F
I
N
F
I
N
RNF2S
VCC1 10
27 VCC2
VCC1 11
26 VCC2
NC 12
Blank time
PWM control
CR 14
OSC
24
ENABLE
MTH 16
Mix decay
control
CR 14
23 MODE1
MODE2 15
22 MODE0
26 VCC2
27 VCC2
28 OUT2A
29 OUT2A
34 OUT2B
25 NC
GND 13
18 PS
MODE2 15
ENABLE 24
30 NC
OUT1A ８
Translator
Predriver
NC ７
OCP
UVLO
RESET
MODE0 22
MODE1 23
TSD
OVLO
13 GND
CW_CCW 20
Control logic
GND １
OUT1B ２
35 OUT2B
32 RNF2
33 RNF2
Regulator
TEST 21
31 RNF2S
1
MTH 16
GND
21 TEST
VREF 17
20 CW_CCW
PS 18
19 CLK
Pin Description
Pin No.
Pin Name
1
GND
2
Function
Pin No.
Pin Name
Ground pin
19
CLK
OUT1B
H bridge output pin
20
CW_CCW
3
OUT1B
H bridge output pin
21
TEST
4
RNF1
Connection pin of resistor for output
current detection
22
MODE0
Motor excitation mode setting pin
5
RNF1
23
MODE1
Motor excitation mode setting pin
6
RNF1S
24
ENABLE
Output enable pin
Connection pin of resistor for output
current detection
Input pin of current detection
comparator
No connection
Function
CLK input pin for advancing the
electrical angle
Motor rotating direction setting pin
Pin for testing. (Used by connecting
with GND)
7
NC
25
NC
8
OUT1A
H bridge output pin
26
VCC2
Power supply pin
9
OUT1A
H bridge output pin
27
VCC2
Power supply pin
10
VCC1
Power supply pin
28
OUT2A
H bridge output pin
11
VCC1
Power supply pin
H bridge output pin
12
NC
13
GND
14
15
29
OUT2A
No connection
30
NC
Ground pin
31
RNF2S
CR
Connection pin of CR for setting
chopping frequency
32
RNF2
MODE2
Motor excitation mode setting pin
33
RNF2
No connection
No connection
16
MTH
Current decay mode setting pin
34
OUT2B
Input pin of current detection
comparator
Connection pin of resistor for output
current detection
Connection pin of resistor for output
current detection
H bridge output pin
17
VREF
Output current value setting pin
35
OUT2B
H bridge output pin
18
PS
Power save pin
36
NC
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BD63740FM
Function Explanation
1
CLK/Clock input pin for advancing the electrical angle
Trigger is CLK’s rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise is picked up at the CLK pin, so design the pattern in such a way that there is
no noise plunging in.
2
MODE0, MODE1, MODE2/Motor excitation mode setting pin
Sets the motor excitation mode.
MODE0
MODE1
MODE2
Excitation Mode
L
L
L
FULL STEP A
H
L
L
HALF STEP A
L
H
L
HALF STEP B
H
H
L
QUARTER STEP A
L
L
H
FULL STEP B
H
L
H
QUARTER STEP B
L
H
H
1/8 STEP
H
H
H
1/16 STEP
Refer to the P.14, 15, 16 for the timing chart and motor torque vector of various excitation modes.
The excitation mode setting changes regardless of CLK signal (Refer to P.18).
3
CW_CCW/Motor rotating direction setting pin
Sets the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change
in setting (refer to P.17).
CW_CCW
Rotating Direction
L
H
4
ENABLE/Output enable pin
Turn off forcibly all the output transistors (motor output is open).
The translator circuit stop and the electrical angle doesn't advance in the section of ENABLE=L. Because CLK input is
blocked.
However, during excitation modes (MODE0, MODE1, MODE2) switch within the interval of ENABLE=L, as ENABLE=L
to H is reset, the new mode upon switch will be applied for excitation (Refer to P.18).
ENABLE
Motor Output
L
H
5
Clockwise (CH2’s current is outputted with a phase lag of 90° in regard to CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90° in regard to CH1’s current)
OPEN (electrical angle maintained)
ACTIVE
PS/Power save pin
The PS pin can make circuit in standby state and make motor output OPEN.
In standby state, translator circuit is RESET (initialized) and electrical angle is initialized.
When PS=L to H, be careful because there is a delay of 40 μs (Max) before it is returned from standby state to normal
state and the motor output becomes ACTIVE (Refer to P.13).
PS
Status
L
H
Standby state (RESET)
ACTIVE
The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows (Refer to
P.14, 15, 16).
Excitation Mode
Initial Electrical Angle
FULL STEP A
HALF STEP A
HALF STEP B
QUARTER STEP A
FULL STEP B
QUARTER STEP B
1/8 STEP
1/16 STEP
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45°
45°
45°
45°
45°
45°
45°
45°
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BD63740FM
Function Explanation - continued
6
(Note 1)
VCCX
/Power supply pin
Motor’s drive current is flowing in this pin, design the wire in such a way that it is thick enough, as short as possible
and has low impedance. VCC voltage may have large fluctuations due to counter electromotive force of the motor,
PWM switching noise etc., so arrange the bypass capacitors to 100 μF to 470 μF, as close as possible to the pin and
adjust in such a way the VCC voltage is stable. Increase the capacitor if needed specially when a large current is used
or those motors that have large electromotive force are used. In addition, we recommend placing a multilayer ceramic
capacitor of 0.01 μF to 0.1 μF in parallel for the purpose of lowering the impedance of the power supply in a wide
frequency band. Extreme care should be observed to make sure that the VCC voltage does not exceed the rating even
for a short period of time only. VCCX is shorted inside the IC, so make sure to short VCCX externally. If it is used
without shorting, malfunction or destruction may occur because of concentration of current routes, so make sure to
short it. In addition, the power supply in has a built-in clamp element for preventing electrostatic damage. If a steep
pulse signal or voltage, such as a surge exceeding the absolute maximum rating, is applied, the clamping element
may operate and be destroyed, so do not exceed the absolute maximum rating. It is also effective to attach a Zener
diode of the absolute maximum rating. In addition, the diode for preventing electrostatic damage is inserted between
the VCCX pin and the GND pin, as a result there is a danger that IC will destroyed if a reverse voltage is applied, so be
careful.
(Note 1) x=1 or 2
7
GND/Ground pin
In order to reduce the noise caused by switching current and stabilized the internal reference voltage of IC, wire in
such a way that the wiring impedance from this pin made as low as possible to achieve the lowest electrical potential in
any operating conditions. Design the pattern so that it does not have a common impedance with other GND patterns.
8
OUT1A, OUT1B, OUT2A, OUT2B/H bridge output pin
Motor’s drive current is flowing in this pin, design the wire in such a way that it is thick enough, as short as possible
and has low impedance. It is also effective to add a Schottky diode when the output has large positive and negative
fluctuations when large current is used, for example when the back electromotive voltage is large. In addition, the
output pin has a built-in clamp element for preventing electrostatic damage. If a steep pulse signal or voltage, such as
a surge exceeding the absolute maximum rating, is applied, the clamping element may operate and be destroyed, so
do not exceed the absolute maximum rating.
9
RNFX
/Connection pin of resistor for detecting of output current
Insert current detecting resistor of 0.1 Ω to 0.2 Ω between RNFX and GND.
The power consumption of current detecting resistor (W) can be calculated by the motor output current value (I OUT)
and resistance for current detecting resistor (R).
(Note 2)
𝑊 = 𝐼𝑂𝑈𝑇 2 × 𝑅
[W]
Where:
W
IOUT
R
:
:
:
is the power consumption of current detecting resistor
is the motor output current value
is the current-detecting resistor
To avoid exceeding the rated power consumption of the resistor, consider its power consumption. In addition, design it
in such a way it that it has low impedance and does not have a common impedance with other GND patterns because
motor’s drive current flows through this pattern from the RNFX pin to current-detecting resistor to GND. Do not exceed
the rating because there is the possibility of circuits’ malfunction etc., if the RNFX voltage has exceeded the maximum
rating (0.7 V). Moreover, be careful because if the RNFX pin is shorted to GND, large current flows without normal
PWM constant current control, then there is the danger that OCP or TSD will operate. If the RNFX pin is open, then
there is the possibility of such malfunction as output current does not flow either, so do not let it open.
(Note 2) x=1 or 2
(Note 3)
10 RNFXS
/Input pin of current detection comparator
In this IC, the RNFxS pin, which is the input pin of current detection comparator, is independently arranged in order to
decrease the lowing of the current-detecting accuracy caused by the wire impedance inside the IC of the RNFX pin.
Therefore, be sure to connect the RNFX pin and the RNFXS pin together when using the device in the case of PWM
constant current control. In addition, impedance of board pattern between the RNFX pin and the current-detecting
resistor can decrease accuracy, so connect RNF XS pattern in such a way it is connected near the current-detecting
resistor so accuracy can be increased. Moreover, design the pattern in such a way that there is no noise plunging in. In
addition, be careful because if the RNFXS pin is shorted to GND, large current flows without normal PWM constant
current control and, then there is the danger that OCP or TSD will operate.
(Note 3) x=1 or 2
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Function Explanation - continued
11 VREF/Output current value setting pin
(Note 1)
This is the pin to set the output current value. It can be set by VREF voltage and current-detecting resistor (RNFX
resistor).
(Note 1) x=1 or 2
𝐼𝑂𝑈𝑇 =
𝑉𝑅𝐸𝐹
𝐼𝑂𝑈𝑇 =
𝑉𝑅𝐸𝐹
5
5
1
× 𝑅𝑁𝐹
𝑋
×
0.7071
𝑅𝑁𝐹𝑋
[A] … (All modes except FULL STEP B)
[A] … (FULL STEP B)
Where:
IOUT
VREF
RNFX
:
:
:
is the output current.
is the voltage of output current value-setting pin.
is the current-detecting resistor.
Avoid using the VREF pin open because input becomes unsettled, and the VREF voltage increases, and then there is
the possibility of such malfunctions as the setting current increases and a large current flows etc. Keep to the input
voltage range because if the voltage of above 3 V is applied on the VREF pin, then there is also the danger that a large
current flows in the output and so OCP or TSD will operate. Besides, take into consideration the outflow current (Max 2
μA) if the input used is a resistor divider. The minimum current, which can be controlled by VREF voltage, is
determined by motor coil’s L, R values and minimum ON time because there is a minimum ON time in PWM drive.
12 CR/Connection pin of CR for setting chopping frequency
This is the pin to set the chopping frequency of output. Connect the external C (470 pF to 1500 pF) and R (10 kΩ to
200 kΩ) between this pin and GND. Refer to P.9.
Make the connection from external components to GND in such a way that there is no common impedance with other
GND patterns. In addition, keep the pattern away from steep pulses like square waves, etc. and there is no noise
plunging in. When it is open or it is biased from the outside, it is not possible to control normal PWM constant current,
so if it is used in PWM constant current control, always put both C and R parts.
13 MTH/Current decay mode setting pin
This is the pin to set the current decay mode. Current decay mode can be optionally set according to input voltage.
MTH Pin Input Voltage [V]
Current Decay Mode
0 to 0.3
SLOW DECAY
0.4 to 1.0
MIX DECAY
1.5 to 2.0
FAST DECAY
3.1 to 3.5
AUTO DECAY
Connect to GND if using at SLOW DECAY mode.
Avoid using with the MTH pin open because if the MTH pin is open, the input is unsettled, and then there is the
danger that PWM operation becomes unstable. Besides, take into consideration the outflow current (Max 2 μA) if the
input used is a resistor divider.
14 TEST/Pin for testing
It is a pin to use at the time of an IC shipment test. Use it in GND connection.
In addition, malfunctions may be caused by application without grounding.
15 NC/No connection
This pin is unconnected electrically with IC internal circuit.
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BD63740FM
Protection Circuits
1
Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises 175 °C
(Typ) or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it
automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added
externally, heat overdrive can lead to destruction.
2
Over Current Protection (OCP)
This IC has a built-in over current protection circuit as a provision against destruction when the motor outputs are
shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to
OPEN condition when the regulated current flows for 4 μs (Typ). It returns with power reactivation or a reset by the PS
pin. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such
as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be
designed to take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return
by power reactivation or a reset by the PS pin, then OCP operates repeatedly and the IC may generate heat or
otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, the motor outputs are
shorted each other or VCC-motor output or motor output-GND is shorted., if the output pin voltage jumps up and the
absolute maximum values can be exceeded after the over current has flowed, there is a possibility of destruction. Also,
when current which is the output current rating or more and the OCP detection current or less flows, the IC can heat up
to Tjmax=150 °C exceeds and can deteriorate, so current which or more the output rating should not be applied.
3
Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage is low. When the applied voltage to the VCCX pin goes 5 V (Typ) or less, the motor output is set to OPEN.
This switching voltage has a 1 V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this circuit
does not operate during power save mode. Also, the electrical angle is reset when he UVLO circuit operates.
4
Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VCCX pin goes 32 V (Typ) or more, the motor output is set to OPEN. This
switching voltage has a 1 V (Typ) hysteresis and a 4 μs (Typ) mask time to prevent false operation by noise etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum
value for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be
aware that this circuit does not operate during power save mode.
5
Protects against malfunction when power supply is disconnected (Ghost Supply Prevention Function)
(Note1)
If a control signal
is input when there is no power supplied to this IC, there is a function which prevents a
malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction
prevention diode from these input pins to the VCCX. Therefore, there is no malfunction of the circuit even when voltage
is supplied to these input pins while there is no power supply.
(Note 1) control signal=CLK, CW_CCW, MODE0, MODE1, MODE2, ENABLE, PS, MTH, VREF
6
Operation Under Strong Electromagnetic Field
The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction
is found when using the IC in a strong electromagnetic field.
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BD63740FM
Absolute Maximum Rating (Ta=25 °C)
Item
Supply Voltage
Input Voltage for Control Pin
(Note 2)
RNFX
Symbol
Rated Value
Unit
VCC1, VCC2
-0.2 to +36.0
V
VIN
-0.2 to +5.5
V
VRNF
0.7
V
(Note 1)
Maximum Voltage
Output Current
Output Current (PEAK)
Storage Temperature Range
Maximum Junction Temperature
IOUT
4.0
(Note 3)
A/Phase
IOUTPEAK
4.5
(Note 3)
A/Phase
Tstg
-55 to +150
°C
Tjmax
+150
°C
(Note 1) Input Voltage for Control Pin=CLK, CW_CCW, MODE0, MODE1, MODE2, ENABLE, PS, MTH, VREF
(Note 2) x=1 or 2
(Note 3) Do not exceed Tjmax=150 °C.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Condition
Item
Symbol
Min
Typ
Max
Unit
VCC1, VCC2
8
24
28
V
Operating Temperature
Topr
-25
+25
+85
°C
Maximum Output Current (DC)
IOUT
-
-
Supply Voltage
3.2
(Note 4)
A/Phase
(Note 4) Do not exceed Tjmax=150 °C.
Thermal Resistance
(Note 5)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 7)
(Note 8)
2s2p
Unit
HSOP-M36
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
θJA
53.9
26.4
°C/W
ΨJT
3
2
°C/W
(Note 5) Based on JESD51-2A (Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
(Note 9)
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 9) This thermal via connects with the copper pattern of all layers.
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BD63740FM
Electrical Characteristics (Unless otherwise specified Ta=25 °C, VCC1=VCC2=24 V)
Item
Symbol
Specification
Unit
Condition
Min
Typ
Max
ICCST
-
0
10
μA
PS=L
ICC
-
2.0
5.0
mA
PS=H, VREF=3 V
H-level Input Voltage
VINH
2.0
-
-
V
L-level Input Voltage
VINL
-
-
0.8
V
H-level Input Current
IINH
35
50
100
μA
VIN=5 V
L-level Input Current
IINL
-10
0
-
μA
VIN=0 V
Output ON Resistance
RON
-
0.280
0.392
Ω
IOUT =±2.5 A
(Sum of upper and lower)
Output Leak Current
ILEAK
-
-
10
μA
IRNFS
-2.0
-0.1
-
μA
RNFXS=0 V
IRNF
-80
-40
-
μA
RNFX=0 V
VREF Input Current
IVREF
-2.0
-0.1
-
μA
VREF=0 V
VREF Input Voltage Range
VVREF
0
-
3.0
V
MTH H Input Current
IMTH_H
35
50
100
μA
MTH=5 V
MTH L Input Current
IMTH_L
-2.0
-0.1
-
μA
MTH=0 V
MTH Input Voltage Range
VMTH
0
-
3.5
V
Minimum ON Time
(Cancel time)
tONMIN
0.3
0.7
1.5
μs
C=1000 pF, R=39 kΩ
Comparator Threshold
VCTH
0.579
0.600
0.621
V
VREF=3 V
[Whole]
Circuit Current at Standby
Circuit Current
(Note 1)
[Control Logic Input
[Output
(Note 2)
]
]
[Current Control]
(Note 3)
RNFXS
(Note 3)
RNFX
Input Current
Input Current
(Note 1) Control Logic Input=CLK, CW_CCW, MODE0, MODE1, MODE2, ENABLE, PS
(Note 2) Output=OUT1A, OUT1B, OUT2A, OUT2B
(Note 3) x=1 or 2
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BD63740FM
PWM Constant Current Control
1
Current control operation
When the output transistor is turned on, the output current increases. The output current is converted to voltage due to
(Note 1)
the connected external resistance to the RNFX
pin. When the voltage on the RNFX pin reaches the voltage value
set by the VREF input voltage, the current limit comparator operates and enters current decay mode. Output turns on
again after changing this pin to the high voltage from the low voltage. The process repeats itself with chopping period
(tCHOP).
(Note 1) x=1 or 2
2
Noise-masking function
In order to avoid misdetection of current detection comparator due to RNF spike noise that may occur when the output
turns ON, the IC has the minimum ON time tONMIN (Blank time). The current detection is invalid from the output
transistor turned on to tONMIN. This allows for constant-current drive without the need for an external filter.
3
CR Timer
The external capacitor and resistor connected to the CR pin is repeatedly charged and discharged between the V CRH
and VCRL levels. The CR pin voltage decides in IC and it is V CRL=0.4 V, VCRH=1.0 V respectively. The output of the
current detection comparator is masked while charging from VCRL to VCRH. As mentioned above, this period defines the
minimum ON-time. The CR pin begins discharging once the voltage reaches VCRH. When the output current reaches
the current limit during this period, then the IC enters decay mode. The CR continues to discharge during this period
until it reaches VCRL, at which point the IC output is switched back ON. The current output and the CR pin begin
charging simultaneously. The CR charge time (tONMIN) and discharge time (tDISCHARGE) are set by external components,
according to the following formulas. The total of t ONMIN and tDISCHARGE yield the chopping period, tCHOP.
𝑅 ′ ×𝑅
𝑉
−0.4
𝑡𝑂𝑁𝑀𝐼𝑁 ≒ 𝐶 × 𝑅′ +𝑅 × 𝑙𝑛 (𝑉𝐶𝑅−1.0)
[s]
𝐶𝑅
0.30
Where:
0.25
:
:
:
:
:
is the minimum ON-time.
is the capacitance of the CR Pin.
is the resistance of the CR Pin.
is the CR Pin internal impedance 5 kΩ(Typ)
is the CR Pin voltage.
α[V]
tONMIN
C
R
R’
VCR
0.20
0.15
0.10
0.05
0.00
𝑅
𝑉𝐶𝑅 = 𝑉 × 𝑅′ +𝑅
0
[V]
:
1000
C[pF]
1500
2000
Figure 1. CR Coefficient for calculation of
discharge time
Where:
V
500
is the internal regulator voltage 5 V(Typ).
1+𝛼
𝑡𝐷𝐼𝑆𝐶𝐻𝐴𝑅𝐺𝐸 ≒ 𝐶 × 𝑅 × 𝑙𝑛 ( 0.4 )
[s]
Where:
tDISCHARGE
α
:
:
is the CR discharge time.
Refer to the right graph.
𝑡𝐶𝐻𝑂𝑃 = 𝑡𝑂𝑁𝑀𝐼𝑁 + 𝑡𝐷𝐼𝑆𝐶𝐻𝐴𝑅𝐺𝐸
[s]
Where:
tCHOP
:
is the chopping period.
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BD63740FM
3
CR Timer – continued
Spike noise
Current Detection Value
Output current
0 mA
Current Detection Value
RNFx(Note 1) Voltage
GND
VCRH(1.0 V Typ)
CR Voltage
VCRL(0.4 V Typ)
Discharge
time
tDISCHARGE
GND
Minimum ON Time Chopping Period
tONMIN
tCHOP
(Note 1) x=1 or 2
Figure 2. Timing Chart of CR Voltage, RNFx Voltage and Output Current
Attach a resistor of at least 10 kΩ to the CR Pin (10 kΩ to 200 kΩ recommended) as lower values may keep the CR
from reaching the VCRH voltage level. A capacitor in the range of 470 pF to 1500 pF is also recommended. Using
capacitance value of several thousand pF or more, however, the noise-masking period (tONMIN) also increases, and
there is a risk that the output current may exceed the setting value due to the internal L and R components of the
output motor coil. Also, ensure that the chopping period (t CHOP) is not set longer than necessary, as doing so will
increase the output ripple, thereby decreasing the average output current and yielding lower output rotation efficiency.
Select optimal value so that motor drive sound, and distortion of output current waveform can be minimized.
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BD63740FM
PWM Constant Current Control - continued
4
Current Decay Mode
PWM Constant Current Control can be optionally set the current decay mode in which the ratio of fast and slow decay.
The following diagrams show the state of each transistor and the regenerative current path during the current decay
for each decay mode.
FAST DECAY
SLOW DECAY
OFF→ON
ON→OFF
M
M
ON→OFF
OFF→ON
OFF→OFF
ON→OFF
OFF→ON
ON→ON
Output ON Time
Current Decay Time
Figure 3. Route of Regenerated Current during Current Decay
The merits of each decay mode are as follows:
4.1 SLOW DECAY
The output current ripple is small and this is favorable for keeping motor torque high because the voltage
between the motor coils is small and the regenerative current decreases slowly. However, an increase in the
output current due to deterioration of the current control in the lower current operation in HALF STEP,
QUARTER STEP, 1/8 STEP, 1/16 STEP, due to the influence of the motor reverse electromotive voltage
during high pulse rate driving in the mode, the current waveform is not able to follow the change in the current
limit and the distortion and motor vibration increases. Thus, this decay mode is suited to FULL STEP mode or
low-pulse-rate driven HALF STEP, QUARTER STEP, 1/8 STEP or 1/16 STEP modes.
4.2 FAST DECAY
Fast decay decreases the regeneration current much more quickly than slow decay, reducing distortion of the
output current waveform. However, fast decay yields a much larger output current ripple, which decreases
the overall average current running through the motor. This causes two problems: first, the motor torque
decreases (increasing the current limit value can help eliminate this problem, but the rated output current
must be taken into consideration); and second, the power loss within the motor increases and thereby
radiates more heat. If neither of these problems is of concern, then fast decay can be used for high-pulse rate
HALF STEP, QUARTER STEP, 1/8 STEP or 1/16 STEP drive.
Additionally, this IC allows for MIX DECAY mode/AUTO DECAY mode that can help to improve upon problems that
arise from using fast or slow decay.
4.3 MIX DECAY
During current decay Switching between SLOW DECAY and FAST DECAY can improve current control
without increasing the current ripple. In addition, the time ratio of SLOW DECAY and FAST DECAY can be
changed by the voltage input to the MTH pin, and it is possible to achieve optimal control state for any motor.
During MIX DECAY mode about chopping cycle, the first (t1 to t2) of which operates the IC in SLOW DECAY
mode, and the remainder (t2 to t3) of which operates in FAST DECAY mode. However, if the output current
does not reach the set current limit during the first (t 1 to t2) decay period, the IC operates in fast decay mode
only.
4.4 AUTO DECAY
Current control capability can still be improved without making the current ripple big by using SLOW DECAY
and switches only to FAST DECAY when required. Decay mode becomes FAST DECAY only when output
current reaches the set value while at minimum ON time.
MTH Pin Input Voltage [V]
Current Decay Mode
0 to 0.3
0.4 to 1.0
SLOW DECAY
MIX DECAY
1.5 to 2.0
3.1 to 3.5
FAST DECAY
AUTO DECAY
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BD63740FM
4
Current Decay Mode - continued
t1
t2
t3
1.0 V
CR Voltage
MTH Voltage
0.4 V
GND
Chopping Period
tCHOP
Current Detection Value
Output Current
SLOW
DECAY
FAST
DECAY
0A
Figure 4. CR Pin Voltage and Output Current during MIX DECAY
1.0 V
CR Voltage
0.4 V
GND
Chopping Period
tCHOP
Current Detection Value
Output Current
FAST
DECAY
SLOW
DECAY
0A
Minimun ON Time
tONMIN
Figure 5. CR Pin Voltage and Output Current during AUTO DECAY
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BD63740FM
Translator Circuit
This series has a built in translator circuit and can drive stepping motor in CLK-IN mode.
The operation of the translator circuit in CLK-IN drive mode is described as below.
1
Reset operation
The translator circuit is initialized by power ON Reset function and the PS Pin.
1.1 Initializing operation when power supply is turned on
1.1.1 If power supply is turned on at PS=L (Use this sequence as a general rule)
When power supply is turned on, the power ON reset function is initialized and operates the IC,
but as long as it is PS=L, the motor output is the OPEN state. After power supply is turned on,
the motor output becomes ACTIVE state by changing PS=L to H, and the excitation is started at
the initial electrical angle.
But at the time of PS=L to H, it returns from the standby state to the normal state and there is a
delay of 40 μs (Max) until the motor output has become the ACTIVE state.
Reset is released
ACTIVE
Delay
PS
CLK
OUT1A
OUT1B
Motor output OPEN
1.1.2
Motor output ON
If power supply is turned on at PS=H
When power supply is turned on and the power ON reset function in IC operates, and be
initialized before the motor output becomes the ACTIVE state during EN=H, and the excitation is
started at the initial electrical angle.
1.2 Initializing operation during motor operating
Enter a reset signal to the PS pin to initialize the translator circuit during motor operation. (Refer to P.17) But
at the time of PS=L to H, it returns from the standby state to the normal state and there is a delay of 40 μs
(Max) until the motor output has become the ACTIVE state, so within this delay interval there is no phase
advance operation even if CLK is inputted.
2
Control Input Timing
Shown below is the operation of the translator circuit at the rising edge of CLK signal. If you disobey this timing and
input, then there is the possibility that the translator circuit does not operate as expected. In addition, at the time of
PS=L to H, it returns from the standby state to the normal state and there is a delay of 40 μs (Max) until the motor
output has become the ACTIVE state, so within this delay interval there is no phase advance operation even if CLK is
inputted.
A
PS
B
C
CLK
D
MODE0
MODE1
MODE2
CW_CCW
ENABLE
F
G
E
F
G
A: PS minimum input pulse width … 20 μs
B: PS rising edge to CLK rising edge input possible maximum delay time … 40 μs
C: CLK minimum period … 4 μs
D: CLK minimum input H pulse width … 2 μs
E: CLK minimum input L pulse width … 2 μs
F: MODE0, MODE1, MODE2, CW_CCW, ENABLE set-up time … 1 μs
G: MODE0, MODE1, MODE2, CW_CCW, ENABLE hold time … 1 μs
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Translator Circuit - continued
3
FULL STEP (MODE0=L, MODE1=L, MODE2=L, CW_CCW=L, ENABLE=H)
①
②
③
④
①
PS
100 %
CLK
67 %
OUT1A
33 %
OUT1A
1
4
OUT2A
OUT2B
OUT1B
OUT2A
3
2
OUT2B
100 %
67 %
33 %
IOUT(CH1)
OUT1B
4CLK = Electrical angle 360°
-33 %
-67 %
-100 %
100 %
67 %
33 %
IOUT(CH2)
-33 %
-67 %
-100 %
4
HALF STEP A (MODE0=H, MODE1=L, MODE2=L, CW_CCW=L, ENABLE=H)
①
②
③
④
⑤
⑥
⑦
⑧
①
②
OUT1A
100 %
PS
67 %
CLK
8
1
7
33 %
OUT1A
OUT2B
OUT1B
2
6
5
OUT2A
OUT2A
3
4
OUT2B
100 %
67 %
33 %
-33 %
-67 %
-100 %
IOUT(CH1)
OUT1B
8CLK = Electrical angle 360°
100 %
67 %
33 %
IOUT(CH2)
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-33 %
-67 %
-100 %
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04.Sep.2019 Rev.001
BD63740FM
Translator Circuit - continued
5
HALF STEP B (MODE0=L, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H)
①
②
③
④
⑤
⑥
⑦
⑧
①
②
OUT1A
PS
100 %
CLK
67 %
OUT1A
33 %
OUT1B
OUT2B
8
1
7
2
6
OUT2A
5
3
4
OUT2B
100 %
67 %
33 %
IOUT(CH1)
-33 %
-67 %
-100 %
OUT1B
8CLK = Electrical angle 360°
100 %
67 %
33 %
IOUT(CH2)
6
OUT2A
-33 %
-67 %
-100 %
QUARTER STEP A (MODE0=H, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H)
①②③④⑤⑥⑦⑧⑨⑩⑪⑫⑬⑭⑮⑯①②③④
OUT1A
100 %
PS
67 %
CLK
14
OUT2B
OUT1B
16
13
33 %
OUT1A
15
1
12
2
11
3
10
4
9
OUT2A
7
6
OUT1B
100 %
67 %
33 %
IOUT(CH1)
16CLK = Electrical angle 360°
-33 %
-67 %
-100 %
100 %
67 %
33 %
IOUT(CH2)
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8
OUT2B
OUT2A
-33 %
-67 %
-100 %
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BD63740FM
Translator Circuit - continued
7
Step sequence table (MODE2=H, CW_CCW=L, initial electrical angle = step angle 45°)
FULL STEP B
Initial
electrical angle →
1
2
3
4
QUARTER STEP B 1/8 STEP 1/16 STEP CH1 CURRENT[%]
1
1
1
100.00
2
99.52
2
3
98.08
4
95.69
2
3
5
92.39
6
88.19
4
7
83.15
8
77.30
3
5
9
70.71
10
63.44
6
11
55.56
12
47.14
4
7
13
38.27
14
29.03
8
15
19.51
16
9.80
5
9
17
0.00
18
-9.80
10
19
-19.51
20
-29.03
6
11
21
-38.27
22
-47.14
12
23
-55.56
24
-63.44
7
13
25
-70.71
26
-77.30
14
27
-83.15
28
-88.19
8
15
29
-92.39
30
-95.69
16
31
-98.08
32
-99.52
9
17
33
-100.00
34
-99.52
18
35
-98.08
36
-95.69
10
19
37
-92.39
38
-88.19
20
39
-83.15
40
-77.30
11
21
41
-70.71
42
-63.44
22
43
-55.56
44
-47.14
12
23
45
-38.27
46
-29.03
24
47
-19.51
48
-9.80
13
25
49
0.00
50
9.80
26
51
19.51
52
29.03
14
27
53
38.27
54
47.14
28
55
55.56
56
63.44
15
29
57
70.71
58
77.30
30
59
83.15
60
88.19
16
31
61
92.39
62
95.69
32
63
98.08
64
99.52
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CH2 CURRENT[%]
0.00
9.80
19.51
29.03
38.27
47.14
55.56
63.44
70.71
77.30
83.15
88.19
92.39
95.69
98.08
99.52
100.00
99.52
98.08
95.69
92.39
88.19
83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
9.80
0.00
-9.80
-19.51
-29.03
-38.27
-47.14
-55.56
-63.44
-70.71
-77.30
-83.15
-88.19
-92.39
-95.69
-98.08
-99.52
-100.00
-99.52
-98.08
-95.69
-92.39
-88.19
-83.15
-77.30
-70.71
-63.44
-55.56
-47.14
-38.27
-29.03
-19.51
-9.80
STEP ANGLE[°]
0.0
5.6
11.3
16.9
22.5
28.1
33.8
39.4
45.0
50.6
56.3
61.9
67.5
73.1
78.8
84.4
90.0
95.6
101.3
106.9
112.5
118.1
123.8
129.4
135.0
140.6
146.3
151.9
157.5
163.1
168.8
174.4
180.0
185.6
191.3
196.9
202.5
208.1
213.8
219.4
225.0
230.6
236.3
241.9
247.5
253.1
258.8
264.4
270.0
275.6
281.3
286.9
292.5
298.1
303.8
309.4
315.0
320.6
326.3
331.9
337.5
343.1
348.8
354.4
TSZ02201-0P1P0C702210-1-2
04.Sep.2019 Rev.001
BD63740FM
Translator Circuit - continued
8
Reset Timing Chart (QUARTER STEP A, MODE0=H, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H)
To reset the translator circuit during motor operation regardless of the other input signals, enter the PS pin input to L.
At this time, IC internal circuit enters the standby mode, and makes the motor output OPEN.
RESET
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
①
②
③
④
⑤
⑥
⑦
⑧
PS
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100 %
67 %
33 %
IOUT(CH1)
-33 %
-67 %
-100 %
100 %
67 %
33 %
IOUT(CH2)
9
-33 %
-67 %
-100 %
CW_CCW Switch Timing Chart (FULL STEP A, MODE0=L, MODE1=L, MODE2=L, ENABLE=H)
The switch of CW_CCW is reflected by the rising edge of CLK that comes immediately after CW_CCW signal has
changed. However, depending on the state of operation of the motor at the time of switching, the motor cannot follow
even if the control on driver IC corresponds. There are possibilities of step-out and mistake step in motor, so evaluate
the sequence of the switch enough.
CW
①
CCW
②
③
②
①
PS
CW_CCW
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100 %
IOUT(CH1)
-100 %
100 %
IOUT(CH2)
-100 %
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BD63740FM
Translator Circuit - continued
10
ENABLE Switch Timing Chart (FULL STEP A, MODE0=L, MODE1=L, MODE2=L)
The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input
signals.
The translator circuit stop and the electrical angle doesn't advance in the section of ENABLE=L. Because the output
for motor is OPEN and CLK input is blocked. When ENABLE=L to H, the output state returns immediately to the last
state before the input of ENABLE=L. Excitation mode (MODE0, MODE1, MODE2) also switches within ENABLE=L
interval. Where excitation mode switched within ENABLE=L interval, restoring of ENABLE=L to H was done in the
excitation mode after switch.
Output off & Translator stop
①
②
②
③
PS
ENABLE
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100 %
IOUT(CH1)
-100 %
100 %
IOUT(CH2)
-100 %
Restoring in the state prior to input of ENABLE=L
11
About the Switch of the Motor Excitation Mode
The switch of the excitation mode can be done with regardless of the CLK signal at the same time as changing of the
signal MODE0, MODE1 and MODE2. The following built-in function can prevent motor out-of-step caused by
discrepancies of torque vector of transitional excitations during switch between excitation modes. This function is
limited to fixed MODE2 signal only. Depending on the state of operation of the motor at the switch the motor cannot
follow even if the control on driver IC side is correspondent and there are possibilities of step-out and mistake step in
motor. Therefore, switch sequence shall be evaluated sufficiently before any decision.
12
Cautions of Bidirectional Switch of CW_CCW and Excitation Modes (MODE0, MODE1, MODE2)
As shown in the figure below, the area between the end of reset discharge (PS=L to H) and beginning of the first CLK
signal input is defined as interval A, while the area until the end of the first CLK signal input is defined as interval B.
Interval A
=> For CW_CCW, no limitation is applied on switch of excitation mode.
Interval B
=> In CLK1 period, or within ENABLE=L interval, CW_CCW and excitation mode can’t be switched together.
Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.
Therefore, in case that CW_CCW and excitation modes are switched simultaneously, the PS pin must be input
with reset signal. Then start to operate in interval A before carrying out such bidirectional switch.
Interval A
Interval B
PS
CLK
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BD63740FM
Power Dissipation
In consideration of the IC’s power consumption (W), thermal resistance (°C/W), and ambient temperature (Ta), confirm that the
IC’s chip temperature Tj is not over 150 °C. When Tj=150 °C is exceeded, the functions as a semiconductor do not operate and
problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration and eventually
destruction of the IC. Tjmax=150 °C must be strictly obeyed under all circumstances.
1
Thermal Calculation
The IC’s consumed power can be estimated roughly with the power supply voltage (V CC), circuit current (ICC), output
ON resistance (RONH, RONL) and motor output current value (IOUT).
The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:
𝑊𝑉𝐶𝐶 = 𝑉𝐶𝐶 × 𝐼𝐶𝐶
[W]
Where:
WVCC
VCC
ICC
:
:
:
is the consumed power of the VCC.
is the power supply voltage.
is the circuit current.
𝑊𝐷𝑀𝑂𝑆 = 𝑊𝑂𝑁 + 𝑊𝐷𝐸𝐶𝐴𝑌 [W]
𝑊𝑂𝑁 = (𝑅𝑂𝑁𝐻 + 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × 2 × 𝑜𝑛_𝑑𝑢𝑡𝑦 [W]
𝑊𝐷𝐸𝐶𝐴𝑌 = (2 × 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × 2 × (1 − 𝑜𝑛_𝑑𝑢𝑡𝑦) [W]
Where:
WDMOS
WON
WDECAY
RONH
RONL
IOUT
:
:
:
:
:
:
on_duty
:
is the consumed power of the output DMOS.
is the consumed power during output ON.
is the consumed power during current decay.
is the upper P-channel DMOS ON-resistance.
is the lower N-channel DMOS ON-resistance.
is the motor output current value.
𝑡
PWM on duty= 𝑂𝑁⁄𝑡
𝐶𝐻𝑂𝑃
tON varies depending on the L and R values of the motor coil and the current set value. Confirm by actual
measurement, or make an approximate calculation.
tCHOP is the chopping period, which depends on the CR pin. Refer to P.9 for details.
IC number
BD63740FM
Upper Pch DMOS ON Resistance
RONH[Ω] (Typ)
0.18
Lower Nch DMOS ON Resistance
RONL[Ω] (Typ)
0.10
𝑊_𝑡𝑜𝑡𝑎𝑙 = 𝑊𝑉𝐶𝐶 + 𝑊𝐷𝑀𝑂𝑆 [W]
𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑊_𝑡𝑜𝑡𝑎𝑙 [°C]
Where:
W_total
Tj
Ta
θja
:
:
:
:
is the consumed total power of IC.
is the junction temperature.
is the ambient temperature.
is the thermal resistance value.
However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated
values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application
board used, and create the thermal design with enough margin not to exceed Tjmax=150 °C. Although unnecessary
with normal use, if the IC is used under especially strict heat conditions, consider externally attaching a Schottky diode
between the motor output pin and GND to abate heat from the IC.
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BD63740FM
Power Dissipation - continued
2
Temperature Monitoring
In respect of BD63740FM, there is a way to directly measure the approximate chip temperature by using the TEST pin
with a protection diode for prevention from electrostatic discharge. However, temperature monitor way is used only for
evaluation and experimenting, and must not be used in actual usage conditions.
Process 1 Measure the pin voltage when a current of IDIODE=50 μA flows from the TEST pin to the GND,
without supplying VCC to the IC. This measurement is for measuring the VF voltage of the internal diode.
Process 2 Measure the temperature characteristics of this pin voltage. (VF has a linear negative temperature factor
against the temperature.) With the results of these temperature characteristics, chip temperature can be
calibrated from the TEST pin voltage.
Process 3 Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be
approximated from the results of Process 2.
-VF［mV］
TEST pin
Internal Circuit
IDIODE
VF
25
150 Chip Temperature Tj［°C］
Figure 6. Model diagram for measuring chip temperature
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BD63740FM
Application Example
Logic input pin.
Refer to P.3 for detail.
CLK 19
CW_CCW 20
OCP
OVLO
UVLO
RESET
MODE0 22
MODE1 23
TSD
Translator
Power save pin.
Refer to P.3 for detail.
13 GND
Bypass capacitor.
Setting range is
100 μF to 470 μF (electrolytic)
0.01 μF to 0.1 μF (multilayer ceramic etc.)
Refer to P.4 for detail.
Be sure to short VCC1 and VCC2.
18 PS
MODE2 15
10 VCC1
ENABLE 24
11 VCC1
VREF 17
8 OUT1A
9 OUT1A
4 bit DAC
3
RNF1S
4
5
Set the chopping frequency.
Setting range is
C:470 pF to 1500 pF
R:10 kΩ to 200 kΩ
Refer to P.5, 9 for detail.
14
1000 pF
MTH 16
6
Predriver
Blank time
PWM control
Control logic
RNF2S
CR
39 kΩ
OUT1B
RNF1
21
35 OUT2B
32 RNF2
Regulator
0.2 Ω
Resistor for current detection.
Setting range is
0.1 Ω to 0.2 Ω.
Refer to P.4 for detail.
31 RNF2S
1
GND
Resistor for current detection.
Setting range is
0.1 Ω to 0.2 Ω.
Refer to P.4 for detail.
Test pin.
Applied upon connecting with GND
Refer to P.5 for detail
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100 µF
M
34 OUT2B
Mix decay
control
0.1 µF
26 VCC2
27 VCC2
28 OUT2A
29 OUT2A
OSC
0.2 Ω
RNF1
RNF1S
33 RNF2
TEST
Set the current decay mode.
1) SLOW DECAY
=>Connect to GND.
2) MIX DECAY/AUTO DECAY
=>Input by resistor division.
Refer to P.5, 11 for detail.
M
2 OUT1B
Set the output current.
Input by resistor division.
Refer to P.5 for detail.
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BD63740FM
I/O Equivalence Circuit
CLK
CW_CCW
MODE0
MODE1
MODE2
ENABLE
PS
215 kΩ
100 kΩ
VREF
5 kΩ
10 kΩ
10 kΩ
100 kΩ
VREG (internal regulator）
5 kΩ
RNF1S
RNF2S
5 kΩ
CR
MTH
5 kΩ
5 kΩ
10 kΩ
100 kΩ
5 kΩ
VCC
OUT1A
OUT2A
OUT1B
OUT2B
Internal
Circuit
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RNF1
RNF2
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BD63740FM
Operational Notes
1
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD63740FM
Operational Notes – continued
10
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 7. Example of Monolithic IC Structure
11
Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12
Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13
Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD63740FM
Ordering Information
B
D
6
3
7
ROHM Model
4
0
F
M
-
Package type
FM : HSOP-M36
E2
Packing, Forming specification
E2: Reel-wound embossed taping
Marking Diagram
HSOP-M36 (TOP VIEW)
Part Number Marking
BD63740FM
LOT Number
Pin 1 Mark
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BD63740FM
Physical Dimension and Packing Information
Package Name
HSOP-M36
Max 18.75 (include. BURR)
PIN 1 MARK
(UNIT: mm)
PKG: HSOP-M36
Drawing: EX142-5001
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BD63740FM
Revision History
Date
Revision
04.Sep.2019
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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Rev.001
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