BD63843EFV-E2

Stepping Motor Driver series Micro step 36V Stepping Motor Drivers BD63843EFV, BD63847EFV No.12009EAT08 ●Description BD63843EFV / BD63847EFV are stepping motor drivers of 1/16 micro step(sixteenth step) drive. As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply rated voltage of 36V and rated output current (DC) of 1.0A, 2.0A. The input interface is CLK-IN type. There are step modes of Full step & Half step, Eighth step, Sixteenth step mode by internal DAC (D-A converter), and for current decay mode, the ratio of FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can be realized. In addition, being able to drive with one system of power supply makes contribution to the set design’s getting easy. ●Feature 1) Single power supply input (rated voltage of 36V) 2) Rated output current:(DC) 1.0A, 2.0A 3) Low ON resistance DMOS output 4) CLK-IN drive mode 5) PWM constant current control (other oscillation) 6) Built-in spike noise cancel function (external noise filter is unnecessary) 7) Full step, Half step, Eighth step, Sixteenth step drive 8) Timing free for changing step modes 9) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio) 10) Normal rotation & reverse rotation switching function 11) Power save function 12) Built-in logic input pull-down resistor 13) Power-on reset function 14) Thermal shutdown circuit (TSD) 15) Over current protection circuit (OCP) 16) Under voltage lock out circuit (UVLO) 17) Over voltage lock out circuit (OVLO) 18) Ghost Supply Prevention (protects against malfunction when power supply is disconnected) 19) Electrostatic discharge: 8kV (HBM specification) 20) Adjacent pins short protection 21) Inverted mounting protection 22) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package 23) Pin-compatible line-up (In addition, pin-compatible to BD6387□EFV series) ●Application PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo printer, FAX, scanner, mini printer, toy, and robot etc. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/8 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV ●Absolute maximum ratings (Ta=25°C) Item Symbol Supply voltage VCC1,2 Power dissipation Input voltage for control pin RNF voltage Output current Output current (peak)※4 Operating temperature range Storage temperature range Junction temperature ※1 ※2 ※3 ※4 BD63847EFV BD63843EFV Unit V W W V V A/phase A/phase °C °C °C -0.3~+36.0 1.45※1 4.70※2 -0.3~+7.0 0.7 Pd VIN VRNF IOUT 2.0※3 2.5※3 IOUTPEAK Topr Tstg Tjmax 1.0※3 1.5※3 -25~+85 -55~+150 +150 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C. 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C. Do not, however exceed Pd, ASO and Tjmax=150°C. Pulse width tw≦1ms, duty20%. ●Operating conditions (Ta= -25~+85°C) Item Symbol Supply voltage VCC1,2 Input voltage for control pin VIN Output current IOUT BD63847EFV BD63843EFV Unit V V A/相 19~28 0~5.5 1.7※5 0.7※5 ※5 Do not, however exceed Pd, ASO. ●Electrical characteristics (Unless otherwise specified Ta=25°C, VCC1,2=24V) Limit Item Symbol Min. Typ. Max. Whole Circuit current at standby ICCST 1.0 2.5 Circuit current ICC 2.5 5.0 Control input (CLK, CW_CCW, MODE0, MODE1, ENABLE, PS) H level input voltage VINH 2.0 L level input voltage VINL 0.8 H level input current IINH 35 50 100 L level input current IINL -10 0 Output (OUT1A, OUT1B, OUT2A, OUT2B) Unit mA mA PS=L PS=H, VREF=3V V V µA µA VIN=5V VIN=0V Output ON resistance (BD63847EFV) RON - 0.85 1.10 Ω Output ON resistance (BD63843EFV) RON - 1.90 2.47 Ω ILEAK - - 10 µA IRNFS IRNF IVREF VREF IMTH VMTH tONMIN VCTH1 VCTH2 VCTH3 -2.0 -40 -2.0 0 -2.0 0 0.3 0.570 0.403 0.196 -0.1 -20 -0.1 -0.1 0.8 0.600 0.424 0.230 3.0 3.5 1.5 0.630 0.445 0.264 µA µA µA V µA V µs V V V Output leak current Current control RNFXS input current RNFX input current VREF input current VREF input voltage range MTH input current MTH input voltage range Minimum on time (Blank time) Comparator threshold 1 Comparator threshold 2 Comparator threshold 3 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/8 Condition IOUT=1.5A, Sum of upper and lower IOUT=0.5A, Sum of upper and lower RNFXS=0V RNFX=0V VREF=0V MTH=0V C=1000pF, R=39kΩ VREF=3V, 100% VREF=3V, 70.71% VREF=3V, 38.27% 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV ●Terminal function and Application circuit diagram Pin No. Pin name Function 1 GND 2 OUT1B Pin No. Pin name Function Ground terminal 15 CLK Clock input terminal for advancing the electrical angle. H bridge output terminal 16 CW_CCW Motor rotating direction setting terminal Connection terminal of resistor for output current detection Input terminal of current limit comparator 17 TEST 18 MODE0 Motor excitation mode setting terminal H bridge output terminal 19 MODE1 Motor excitation mode setting terminal Non connection 20 ENABLE Output enable terminal Power supply terminal 21 NC 22 VCC2 3 RNF1 4 RNF1S 5 OUT1A 6 NC 7 VCC1 8 NC Non connection 9 GND Ground terminal 23 NC 24 OUT2A 10 CR Connection terminal of CR for setting chopping frequency 11 NC Non connection 25 RNF2S 12 MTH Current decay mode setting terminal 26 RNF2 13 VREF Output current value setting terminal 27 OUT2B 14 PS Power save terminal 28 NC Terminal for testing (Used by connecting with GND) Non connection Power supply terminal Non connection H bridge output terminal Input terminal of current limit comparator Connection terminal of resistor for output current detection H bridge output terminal Non connection Logic input terminal. Refer to P.5 for detail. Power save terminal Refer to P.5 for detail. Regulator CLK 15 9 GND CW_CCW 16 MODE0 18 MODE1 19 ENABLE 20 Translator 14 PS RESET UVLO OVLO Bypass capacitor. Setting range is 100uF~470uF(electrolytic) 0.01uF~0.1uF(multilayer ceramic etc.) Refer to P.6 for detail. Be sure to short VCC1 & VCC2. TSD VREF 13 ＋ － 4bit DAC OCP Set the output currenet. Input by resistor divison. Refer to P.6 for detail. 7 VCC1 RNF2S 2 ＋ － Blank time PWM control CR 10 39kΩ 4 22 24 OSC 1000pF 27 MTH 12 Set the current decay mode. ①SLOW DECAY ⇒Connect to GND. ②MIX DECAY ⇒Input by resistor divison. Refer to P.7, 9 for detail. 3 Predriver Set the chopping frequency. Setting range is C:470pF~1500pF R:10kΩ~200kΩ Refer to P.7, 8 for detail. 5 Control logic RNF1S ＋ － TEST 26 Mix decay control 25 17 1 OUT1A OUT1B RNF1 0.2Ω 100µF 0.1µF RNF1S VCC2 OUT2A OUT2B RNF2 0.2Ω Resistor for current. detecting. Setting range is 0.1Ω~0.3Ω. Refer to P.6 for detail. RNF2S GND Resistor for current. detecting. Setting range is 0.1Ω~0.3Ω. Refer to P.6 for detail. Terminal for testing. Connect to GND. Fig.1 Block diagram & Application circuit diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/8 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV ●Points to notice for terminal description ○CLK/Clock input terminal for advancing the electrical angle CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that there is no noise plunging. ○MODE0,MODE1/Motor excitation mode setting terminal Set the step mode. MODE0 MODE1 Step mode L H L H L L H H Full step Half step 1/8 step 1/16 step ○CW_CCW /Motor rotating direction setting terminal Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change in setting CW_CCW Rotating direction L H Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current) Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current) ○ENABLE/Output enable terminal Turn off forcibly all the output transistors (motor output is open). At ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted. If step modes are changed during ENABLE=L, new step mode is carried out at ENABLE=L to H ENABLE Motor output L H OPEN (electrical angle maintained) ACTIVE ○PS/Power save terminal PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized) and electrical angle is initialized. Please be careful because there is a delay of 40µs(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE PS State L Standby state (RESET) H ACTIVE The electrical angle (initial electrical angle) of each step mode immediately after RESET is as follows Step mode Initial electrical angle Full step Half step 1/8 step 1/16 step 45° 45° 45° 45° ●Protection Circuits ○Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C (Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150°C (Typ.), it automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. ○Over Current Protection (OCP) This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition when the regulated threshold current flows for 4µs (Typ.). It returns with power reactivation or a reset of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the output rating should not be applied. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 4/8 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV ○Under Voltage Lock Out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to OPEN. This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates during CLK-IN drive mode. ○Over Voltage Lock Out (OVLO) This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This switching voltage has a 1V (Typ.) hysteresis and a 4µs (Typ.) mask time to prevent false operation by noise etc. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this circuit does not operate during power save mode. ○Ghost Supply Prevention (protects against malfunction when power supply is disconnected) If a signal (logic input, VREF, MTH) is input when there is no power supplied to this IC, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is supplied to these input terminals while there is no power supply. ●Thermal derating curve HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. 5.0 4.70W Measurement machine：TH156（Kuwano Electric） Measurement condition：ROHM board Board size：70mm*70mm*1.6mm (With through holes on the board) The exposed metal of the backside is connected to the board with solder. 4 Board①：1-layer board (Copper foil on the back 0mm) Board②：2-layer board (Copper foil on the back 15mm*15mm) Board③：2-layer board (Copper foil on the back 70mm*70mm) Board④：4-layer board (Copper foil on the back 70mm*70mm) 4.0 Power Dissipation：Pd[W] 3.30W 3 Board①：θja=86.2°C W Board②：θja=67.6°C W Board③：θja=37.9°C W Board④：θja=26.6°C W 3.0 2.0 1.0 1.85W 1.45W 2 1 0 25 50 75 85 100 125 150 Ambient temperature:Ta[C] Fig.2 HTSSOP-B28 Thermal derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5/8 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV ●Usage Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply Lines As return of current regenerated by back EMF of FET output happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (4) GND Potential The potential of GND pin must be minimum potential in all operating conditions. (5) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (6) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes the metal on the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (7) Inter-pin shorts and mounting errors When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (8) Operation in a strong electric field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (9) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (10) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. TSD on temperature [°C] (Typ.) 175 Hysteresis temperature [°C] (Typ.) 25 (11) Inspection of the application board During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 6/8 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV (12) Input terminal of IC This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up. For example, when the resistance and transistor are connected to the terminal as shown in figure 3, ○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○Also, when GND＞(Terminal B) at the transistor (NPN) The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic diode. Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the GND (P substrate) to the input terminal. Resistor Transistor (NPN) Pin A Pin B Pin B C B Pin A E C N P+ N P N P+ N Parasitic element P+ N P P substrate B + N E P substrate GND GND Parasitic element Parasitic element P GND GND Parasitic element Other adjacent elements Fig. 3 Pattern diagram of parasitic element (13) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (14) TEST pin Be sure to connect TEST pin to GND. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 7/8 2012.02 - Rev.A Technical Note BD63843EFV, BD63847EFV ●Ordering part number B D 6 3 8 4 3 E F V パッケージ EFV=HTSSOP-B28 形名 - E2 包装、フォーミング仕様 E2: リール状エンボステーピング HTSSOP-B28 9.7±0.1 (MAX 10.05 include BURR) (5.5) 1 Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 14 +0.05 0.17 -0.03 1PIN MARK 1.0MAX 0.625 1.0±0.2 (2.9) 0.5±0.15 15 4.4±0.1 6.4±0.2 28 +6° 4° −4° 0.08±0.05 0.85±0.05 S 0.08 S 0.65 +0.05 0.24 -0.04 0.08 1pin M Reel (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2012.02 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001