BD6425

Stepping Motor Driver series High Voltage Series Stepping Motor Drivers BD6422EFV (PARALLEL-IN type) BD6425, BD6423EFV (CLK-IN type) No.12009EAT06 ●Description These products are a low power consumption PWM constant current-drive driver of bipolar stepping motor supply’s rated voltage of 45V and rated output current of 1.0A, 1.5A. ●Feature 1) Power supply: one system drive (rated voltage of 45V) 2) Rated output current: 1.0A, 1.5A 3) Low ON resistance DMOS output 4) CLK-IN drive mode (BD6425/6423EFV) 5) Parallel IN drive mode (BD6422EFV) 6) PWM constant current control (other oscillation) 7) Built-in spike noise blanking function (external noise filter is unnecessary) 8) FULL STEP & HALF STEP (two kinds), applicable to QUARTER STEP 9) Current decay mode switching function (4 kinds of FAST/SLOW DECAY ratio) 10) Normal rotation & reverse rotation switching function (BD6425/6423EFV) 11) Power save function 12) Built-in logic input pull-down resistor 13) Power-on reset function(BD6425/6423EFV) 14) Thermal shutdown circuit (TSD) 15) Over current protection circuit (OCP) 16) Under voltage lock out circuit (UVLO) 17) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention) 18) Electrostatic discharge: 8kV (HBM specification) 19) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package ●Application serial dot impact printer､sewing machine etc. ●Absolute maximum ratings(Ta=25℃) Item Supply voltage Power dissipation Input voltage for control pin RNF maximum voltage Maximum output current Operating temperature range Storage temperature range Junction temperature ※1 ※2 ※3 ※4 ※5 with power Symbol VCC1,2 Pd VIN VRNF IOUT Topr Tstg Tjmax BD6425EFV -0.2～+45.0 1.45※1 4.70※2 -0.2～+5.5 0.7 1.5※5 -25～+85 -55～+150 +150 BD6423/6422EFV -0.2～+45.0 1.1※3 4.0※4 -0.2～+5.5 0.7 1.0※5 -25～+85 -55～+150 +150 Unit V W W V V A/phase ℃ ℃ ℃ 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃. 4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃. 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃. 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃. Do not, however exceed Pd, ASO and Tjmax=150℃. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV ●Operating conditions( (Ta= -25～+85℃) Item Supply voltage Maximum Output current (DC) ※6 Do not however exceed Pd, ASO. Technical Note Symbol VCC1,2 IOUT BD6425EFV 1.2※6 BD6423/6422EFV 19~42 0.7※6 Unit V A/phase ●Electrical characteristics (Unless otherwise specified Ta=25℃､VCC1,2=37V) Limit Item Symbol Min. Typ. Whole ICCST 1.0 Circuit current at standby 2.0 ICC Circuit current Control input VINH 2.0 H level input voltage VINL L level input voltage IINH 35 50 H level input current IINL -10 0 L level input current Output (OUT1A, OUT1B, OUT2A, OUT2B) RON 1.10 Output ON resistance(BD6425EFV) RON 2.00 Output ON resistance(BD6423/6422EFV) ILEAK Output leak current Current control IRNFS -2.0 -0.1 RNFXS input current (BD6425EFV) IRNF -40 -20 RNFX input current IVREF -2.0 -0.1 VREF input current VREF 0 VREF input voltage range tONMIN 0.5 1.5 Minimum on time (Blank time) BD6425/6423EFV VCTH 0.57 0.60 Comparator threshold BD6422EFV Comparator threshold 100% VCTH100 0.57 0.60 Comparator threshold 67% VCTH67 0.38 0.40 Comparator threshold 33% VCTH33 0.18 0.20 Max. 2.5 5.0 0.8 100 1.43 2.60 10 3.0 3.0 0.63 0.63 0.42 0.22 Unit mA mA Condition PS=L PS=H, VREF=3V V V μA VIN=5V μA VIN=0V Ω IOUT=1.0A,Sum of upper and lower Ω IOUT=0.5A,Sum of upper and lower μA μA μA μA V μs V V V V RNFXS=0V RNFX=0V VREF=0V C=470pF, R=82kΩ VREF=3V VREF=3V, (I0X,I1X)=(L,L) VREF=3V, (I0X,I1X)=(H,L) VREF=3V, (I0X,I1X)=(L,H) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV ●Terminal function and Application circuit diagram 1) BD6425EFV Pin Pin name Function No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 GND OUT1B RNF1 RNF1S OUT1A NC VCC1 NC GND CR DEC1 DEC2 VREF PS Ground terminal H bridge output terminal Connection terminal of resistor for output current detection Input terminal of current limit comparator H bridge output terminal Non connection Power supply terminal Non connection Ground terminal Connection terminal of CR for setting chopping frequency Current decay mode setting terminal Current decay mode setting terminal Output current value setting terminal Power save terminal Technical Note Pin Pin name No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CLK CW_CCW TEST MODE0 MODE1 ENABLE NC VCC2 NC OUT2A RNF2S RNF2 OUT2B NC Clock input terminal for advancing the electrical angle. Motor rotating direction setting terminal Terminal for testing (used by connecting with GND) Motor excitation mode setting terminal Motor excitation mode setting terminal Power supply terminal Non connection Power supply terminal Non connection H bridge output terminal Input terminal of current limit comparator Connection terminal of resistor for output current detection H bridge output terminal Non connection Function Logic input terminal. CLK 15 CW_CCW 16 Regulator 9 GND Power save terminal. MODE0 18 MODE1 19 ENABLE 20 Translator RESET UVLO TSD 14 PS Bypass capacitor. Setting range is 100uF～470uF(electrolytic) 0.01uF～0.1uF(multilayer ceramic etc.) Be sure to short VCC1 & VCC2. VREF 13 Set the output currenet. Input by resistor divison. ＋ － OCP 2bit DAC 7 VCC1 RNF1 Set the chopping frequency. Setting range is C:330pF～1500pF R:15kΩ～200kΩ ＋ － 5 2 OUT1A OUT1B RNF1 RNF1S VCC2 0.3Ω 100uF 0.1uF RNF2 ＋ － 3 Control logic Blank time PWM control CR 10 DEC1 11 DEC2 12 TEST 17 OSC Mix decay control Predriver 4 22 24 OUT2A 27 26 25 82kΩ 470pF OUT2B RNF2 RNF1S GND 0.3Ω Resistor for current. detecting. Setting range is 0.2Ω～0.4Ω. Terminal for testing. Please connect to GND. 1 Logic input terminal. for setting current decay mode Resistor for current. detecting. Setting range is 0.2Ω～0.4Ω. Fig.1 Block diagram & Application circuit diagram of BD6425EFV www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV 2) BD6423EFV Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Pin name GND OUT1B RNF1 OUT1A VCC1 NC GND CR DEC1 DEC2 VREF PS Logic input terminal Technical Note Function Ground terminal H bridge output terminal Connection terminal of resistor for output current detection H bridge output terminal Power supply terminal Non connection Ground terminal Connection terminal of CR for setting PWM frequency Current decay mode setting terminal Current decay mode setting terminal Output current value setting terminal Power save terminal Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Pin name CLK CW_CCW TEST MODE0 MODE1 ENABLE NC VCC2 OUT2A RNF2 OUT2B NC Function Clock input terminal for advancing the electrical angle. Motor rotating direction setting terminal Terminal for testing (used by connecting with GND) Motor excitation mode setting terminal Motor excitation mode setting terminal Output enable terminal Non connection Power supply terminal H bridge output terminal Connection terminal of resistor for output current detection H bridge output terminal Non connection CLK 13 CW_CCW 14 Regulator 7 Power save terminal. GND MODE0 16 MODE1 17 ENABLE 18 Translator RESET UVLO TSD 12 PS Bypass capacitor. Setting range is 100uF～470uF(electrolytic) 0.01uF～0.1uF(multilayer ceramic etc.) Be sure to short VCC1 & VCC2. VREF 11 Setting output current Input by resistance division. ＋ － OCP 2bit DAC 5 VCC1 RNF1 Set the PWM frequency. Setting range is C:330pF～1500pF R:15kΩ～200kΩ ＋ － 4 2 OUT1A OUT1B RNF1 VCC2 0.5Ω 100uF 0.1uF RNF2 ＋ － 3 Control logic Blank time PWM control CR 8 DEC1 9 DEC2 10 OSC Mix decay control Predriver 20 21 OUT2A 23 22 82kΩ 470pF OUT2B RNF2 GND 0.5Ω Resistor for current. detecting. Setting range is 0.4Ω～0.8Ω. Logic input terminal for setting current decay mode TEST 15 1 Terminal for testing. Please connect to GND. Resistor for current. detecting. Setting range is 0.4Ω～0.8Ω. Fig.2 Block diagram & Application circuit diagram of BD6423EFV www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 4/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV 3) BD6422EFV Pin Pin name No. 1 2 3 4 5 6 7 8 9 10 11 12 GND OUT1B RNF1 OUT1A VCC1 NC GND CR DEC1 DEC2 VREF PS Ground terminal H bridge output terminal Connection terminal of resistor for output current detection H bridge output terminal Power supply terminal Non connection Ground terminal Connection terminal of CR for setting PWM frequency Current decay mode setting terminal Current decay mode setting terminal Output current value setting terminal Power save terminal Technical Note Pin Function No. 13 14 15 16 17 18 19 20 21 22 23 24 Pin name Function PHASE1 I01 I11 PHASE2 I02 I12 NC VCC2 OUT2A RNF2 OUT2B NC Phase selection terminal VREF division ratio setting terminal VREF division ratio setting terminal Phase selection terminal VREF division ratio setting terminal VREF division ratio setting terminal Non connection Power supply terminal H bridge output terminal Connection terminal of resistor for output current detection H bridge output terminal Non connection Logic input terminal. Power save terminal. PHASE1 13 PHASE2 16 I01 I11 15 I02 17 I12 18 ＋ － Regulator 7 GND 14 12 PS UVLO TSD OCP 2bit DAC 5 VREF 11 Setting output current. Input by resistance division. Bypass capacitor. Setting range is 100uF～470uF(electrolytic) 0.01uF～0.1uF(multilayer ceramic etc.) Be sure to short VCC1 & VCC2. VCC1 OUT1A OUT1B RNF1 0.5Ω 100uF 0.1uF RNF1 Set the PWM frequency. Setting range is C:330pF～1500pF R:15kΩ～200kΩ ＋ － 4 2 Control Logic RNF2 ＋ － 3 Blank time PWM control CR 8 Predriver 20 21 23 22 VCC2 OUT2A OUT2B RNF2 GND Resistor for current. detecting. Setting range is 0.4Ω～0.8Ω. Resistor for current. detecting. Setting range is 0.4Ω～1.0Ω. 82kΩ 470pF OSC Mix decay control DEC1 9 DEC2 10 0.5Ω 1 Logic input terminal. for setting current decay mode Fig.3 Block diagram & Application circuit diagram of BD6422EFV www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV Technical Note ●Usage Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply Lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) GND Potential The potential of GND pin must be minimum potential in all operating conditions. (5) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (6) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. Users should be aware that these products have been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface. It is important to consider actual usage conditions and to take as large a dissipation pattern as possible. (7) Inter-pin shorts and mounting errors When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (8) Operation in a strong electric field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (9) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (10) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. TSD on temperature [℃] (Typ.) 175 Hysteresis Temperature [℃] 25 (Typ.) (11) Inspection of the application board During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 6/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV Technical Note (12) Input terminal of IC This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up. For example, when the resistance and transistor are connected to the terminal as shown in figure 4, ○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○Also, when GND＞(Terminal B) at the transistor (NPN) The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic diode. Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the GND (P substrate) to the input terminal. Resistor Pin A Pin A P+ N P+ N P+ Transistor (NPN) Pin B C B E N B N E Pin B C N P N Parasitic element P P+ P substrate Parasitic element GND P substrate Parasitic element GND GND GND Parasitic element Other adjacent elements Fig. 4 Pattern Diagram of Parasitic Element (13) Ground Wiring Patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern potential of any external components, either. (14) TEST Terminal (BD6425/6423EFV) Be sure to connect TEST pin to GND. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 7/8 2012.02 - Rev.A BD6422EFV, BD6423EFV, BD6425EFV ●Ordering part number Technical Note B 形名 D 6 4 2 2 E F V - E2 包装、フォーミング仕様 E2: リール状エンボステーピング パッケージ EFV=HTSSOP-B24(BD6423EFV /BD6422EFV) EFV=HTSSOP-B28(BD6425EFV) HTSSOP-B24 7.8±0.1 (MAX 8.15 include BURR) (5.0) 24 13 +6° 4° −4° 0.53±0.15 Tape Quantity 1.0±0.2 Embossed carrier tape (with dry pack) 2000pcs E2 The direction is the 1pin of product is at the upper left when you hold 7.6±0.2 5.6±0.1 Direction of feed (3.4) ( reel on the left hand and you pull out the tape on the right hand ) 1 12 0.325 0.85±0.05 1PIN MARK S +0.05 0.17 -0.03 1.0MAX 0.08±0.05 0.65 +0.05 0.24 -0.04 0.08 S 0.08 M 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. HTSSOP-B28 9.7±0.1 (MAX 10.05 include BURR) (5.5) 28 15 Tape +6° 4° −4° 0.5±0.15 1.0±0.2 Embossed carrier tape (with dry pack) 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold Quantity Direction of feed 6.4±0.2 4.4±0.1 (2.9) ( reel on the left hand and you pull out the tape on the right hand ) 1 14 0.625 1.0MAX 1PIN MARK S +0.05 0.17 -0.03 0.85±0.05 0.08±0.05 0.08 S 0.65 +0.05 0.24 -0.04 0.08 M 1pin (Unit : mm) Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/8 2012.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. 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