BD6512F_11

Power Management Switch ICs for PCs and Digital Consumer Products 2ch High Side Switch ICs for USB Devices and Memory Cards BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ No.11029EBT11 ●Description High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET, and current of 500mA as USB standard can be flown to the respective channels. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. ●Features 1) Dual N-MOS high side switch 2) Continuous current load 0.5A 3) Control input logic Active-Low Active-High 4) Soft start circuit 5) Over current detection 6) Thermal shutdown 7) Under voltage lockout 8) Open drain error flag output 9) Reverse-current protection when switch off 10) Flag output delay filter built in ●Applications USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth ●Lineup Parameter Over current detection Output current at short On resistance Control input logic Reverse current flow blockingat switch off Flag output delay filter BD6512F 1.65 100 High BD6513F 1.65 100 Low BD6516F 1.65 110 High ○ ○ BD6517F 1.65 110 Low ○ ○ BD2052AFJ BD2042AFJ 1.0 100 High ○ ○ 1.0 100 Low ○ ○ Unit A A mΩ - www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Absolute Maximum Ratings ◎BD6512F/BD6513F/BD6516F/BD6517F Parameter Supply voltage CTRL voltage Flag voltage Symbol VDD VCTRL VFLAG Ratings -0.3 to 6.0 Unit V V V V V ºC mW Technical Note -0.3 to VDD+0.3 -0.3 to 6.0 Output voltage VOUT -0.3 to VDD+0.3 (BD6512F/ BD6513F) -0.3 to 6.0 (BD6516F/ BD6517F) -55 to 150 560 *1 Storage temperature Power dissipation *1 ◎BD2042AFJ/ BD2052AFJ Parameter Supply voltage EN,/EN voltage /OC voltage /OC current OUT voltage Storage temperature Power dissipation *1 TSTG Pd Symbol VIN VEN, V/EN V/OC IS/OC VOUT TSTG Pd Ratings -0.3 -0.3 -0.3 to to to 10 -0.3 to 6.0 6.0 6.0 6.0 Unit V V V mA V ºC mW -55 to 150 560*1 *1 This value decreases 4.48mW/℃ above Ta=25℃. * Resistance radiation design is not doing. ●Operating conditions ◎BD6512F/BD6513F/BD6516F/BD6517F Parameter Supply voltage Operation temperature Continuous output current ◎BD2042AFJ/ BD2052AFJ Parameter Supply voltage Operation temperature Continuous output current Symbol VIN TOPR ILO Ratings 2.7 to 5.5 -40 to 85 0 to 500 Unit V ºC mA Symbol VDD TOPR ILO Ratings 3.0 to 5.5 -25 to 85 0 to 500 Unit V °C mA www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Electrical characteristics ◎BD6512F/BD6513F(VDD =5V, Ta=25℃, unless otherwise specified.) Limits Parameter Symbol Min. Typ. Max. Operating current IDD Control input voltage Control input current On resistance Turn on delay Turn on rise time Turn off delay Turn off fall time UVLO threshold voltage Thermal shutdown threshold Flag output resistance Flag off current Current limit threshold Over current limit level VCTRL ICTRL RON TRD TR TFD TF VUVLOH VUVLOL TTS RFLAG IFLAG ITHLIM ILIM 2.5 -1 100 200 2.3 2.1 1.25 0.6 0.01 0.01 100 120 600 1500 3 １ 2.5 2.3 135 16 0.01 1.65 1.1 2 0.7 1 130 160 2000 6000 20 20 2.7 2.5 40 1 2.20 1.6 μA V V μA mΩ mΩ μs μs μs μs V V ºC Ω μA A A IFLAG=5mA 85 120 Technical Note Unit μA Condition VCTRL=5V(BD6512F), 0V(BD6513F) OUT=OPEN VCTRL=0V(BD6512F), 5V(BD6513F) OUT=OPEN CTRL Low Level Input CTRL High Level Input VCTRL=0V or 5V VDD=5V,IOUT=500mA VDD=3.3V,IOUT=500mA RL=10Ω RL=10Ω RL=10Ω RL=10Ω VDD increasing VDD decreasing ◎BD6516F/BD6517F (VDD =5V, Ta=25℃, unless otherwise specified.) Limits Parameter Symbol Min. Typ. Max. Current consumption IDD CTRL input voltage CTRL input current FLAG output resistance FLAG output leak current FLAG output delay ON resistance Short circuit output current Output leak current Thermal shutdown threshold Output rise time Output turn on delay time Output fall time Output turn off delay time VCTRL ICTRL RFLAG IFLAG TDFL RON ISC ILEAK TTS TON1 TON2 TOFF1 TOFF2 2.5 -1 1.2 100 200 0.01 0.01 250 0.01 1 110 140 1.65 135 1300 1500 1 3 2 0.7 1 450 1 4 150 180 2.2 10 4000 6000 20 20 100 140 Unit μA μA V V μA Ω μA ms mΩ mΩ A μA ºC μs μs μs μs Condition VCTRL=5V(BD6516F), 0V(BD6517F) OUT=OPEN VCTRL=0V(BD6516F), 5V(BD6517F) OUT=OPEN Low level input voltage High level input voltage VCTRL=0V or 5V IFLAG=1mA VFLAG=5V VDD=5V,IOUT=500mA VDD=3.3V,IOUT=500mA VOUT=0V VCTRL=0V(BD6516F), 5V(BD6517F) At Tj increase RL=10Ω RL=10Ω RL=10Ω RL=10Ω www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ◎BD2042AFJ/BD2052AFJ (VDD =5V, Ta=25℃, unless otherwise specified.) Limits Parameter Symbol Unit Min. Typ. Max. Operating Current Standby Current IDD ISTB 2.0 /EN input voltage /EN input current /OC output LOW voltage /OC output leak current ON resistance Output current at short Output rise time Output turn on time Output fall time Output turn off time UVLO threshold V/EN,EN I/EN,EN V/OC IL/OC RON ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL -1.0 0.7 2.1 2.0 110 0.01 0.01 0.01 100 1.0 1.8 2.1 1 3 2.3 2.2 140 1 0.8 0.4 1.0 0.5 1 130 1.3 10 20 20 40 2.5 2.4 μA μA V V V μA V μA mΩ A ms ms μs μs V V Increasing VIN Decreasing VIN RL = 10Ω , CL = OPEN Technical Note Condition V/EN = 0V, OUT = OPEN (BD2042AFJ) VEN = 5V, OUT = OPEN (BD2052AFJ) V/EN = 5V, OUT = OPEN (BD2042AFJ) VEN = 0V, OUT = OPEN (BD2052AFJ) High input Low input Low input2.7V≤ VIN ≤4.5V V/EN,EN = 0V or V/EN,EN = 5V I/OC = 5mA V/OC = 5V IOUT = 500mA VIN = 5V, VOUT = 0V, CL = 100μF (RMS) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Measurement circuit ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Technical Note VDD VDD VCTRL CTRLA FLAGA FLAGB VCTRL CTRLB OUTA VDD 1µF GND OUTB VCTRL CTRLB OUTB RL CL FLAGB GND A VCTRL CTRLA FLAGA OUTA VDD 1µF RL CL Operating current VDD 10k CTRLA FLAGA FLAGB VCTRL CTRLB OUTA VDD GND OUTB IOUT CL 1µF IOUT CL VDD CTRL input voltage, Output rise, fall time IFLAG VCTRL IFLAG CTRLA FLAGA FLAGB VCTRL CTRLB OUTA VDD 1µF GND OUTB VDD 10k VCTRL ON resistance, Over current detection ◎BD2042AFJ/ BD2052AFJ VDD 1µF GND IN VEN VEN EN1 EN2 /OC1 OUT1 OUT2 /OC2 VEN VEN VDD 1µF FLAG output resistance A GND IN EN1 EN2 /OC1 OUT1 RL OUT2 RL /OC2 CL CL Operating current VDD 10k /OC1 OUT1 OUT2 /OC2 IOUT IOUT VDD 10k EN, /EN input voltage, Output rise, fall time VDD IOUT /OC1 OUT1 OUT2 /OC2 IOUT 1µF GND IN 1µF GND IN VEN VEN EN1 EN2 VEN VEN EN1 EN2 ON resistance, Over current detection Fig.1 Measurement circuit /OC output LOW voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Timing diagram ◎BD6513F TF TR VOUT 50% 10% TFD TRD TRD 90% 90% 50% 10% 10% VOUT 50% TR 90% Technical Note ◎BD6512F TF 90% 50% 10% TFD VCTRL 50% 50% VCTRL 50% 50% ◎BD6515F/BD2042AFJ TOFF1 TON1 VOUT 10% TON2 90% 90% VOUT 10% 10% ◎BD6516F/BD2052AFJ TOFF1 TON1 90% 90% 10% TON2 TOFF2 TOFF2 VCTRL V/EN 50% 50% VCTRL VEN 50% 50% Fig.2 Timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Reference data ◎BD6512F/ BD6513F OPERATING CURRENT : IDD [uA] Ta=25ºC D OPERATING CURRENT : I D [uA] Technical Note VDD=5.0V CTRL CONTROL INPUT VOLTAGE : V [V] 120 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 120 100 80 60 40 20 0 -50 3.0 Ta=25ºC 2.5 2.0 1.5 1.0 0.5 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Low to High High to Low 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.3 Operating current 3.0 CTRL CONTROL INPUT VOLTAGE : V [V] Fig.4 Operating current 200 200 Fig.5 CTRL input voltage VDD=5.0V ON ON RESISTANCE : R [mΩ] Ta=25ºC 2.5 2.0 1.5 1.0 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 150 ON ON RESISTANCE : R [mΩ] 150 Low to High High to Low VDD=3.3V 100 100 VDD=5.0V 50 50 0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.6 CTRL input voltage 4000 TURN ON RISE TIME : TR [us] R TURN ON RISE TIME : T [us] Fig.7 ON resistance 4000 4000 VDD=5.0V Fig.8 ON resistance Ta=25ºC Ta=25ºC TURN ON DELAY : TRD [us] 3000 3000 3000 2000 2000 2000 1000 1000 1000 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] 0 -50 0 0 50 100 2 AMBIENT TEMPERATURE : Ta[℃ ] 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.9 Output rise time Fig.10 Output rise time Fig.11 Output rise delay time 4000 VDD=5.0V TURN OFF FALL TIME : T F[us] 5.0 5.0 Ta=25ºC 4.0 TURN OFF FALL TIME : T F[us] 4.0 VDD=5.0V TURN ON DELAY : TRD [us] 3000 3.0 3.0 2000 2.0 2.0 1000 1.0 1.0 0 -50 0.0 0.0 0 50 100 2 3 4 5 6 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] SUPPLY VOLTAGE : VDD [V] AMBIENT T EMPERATURE : Ta[℃ ] Fig.12 Output rise delay time Fig.13 Output fall time Fig.14 Output fall time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note 5.0 Ta=25ºC FD TURN OFF DELAY : T [us] 5.0 VDD=5.0V FD TURN OFF DELAY : T [us] 3.0 UVLO THRESHOLD VOLTAGE VUVLOH , VUVLOL [V] 2.8 2.6 VUVLOH 4.0 4.0 3.0 3.0 2.0 2.0 1.0 0.0 2.4 VUVLOL 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 2.2 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.15 Output fall delay time UVLO HYSTERESIS VOLTAGE : VHYS[V] 1.0 Fig.16 Output fall delay time Fig.17 UVLO threshold voltage 3.0 CURRENT LIMIT THRESHOLD : ITHLIM[A] 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Ta=25ºC CURRENT LIMIT THRESHOLD : ITH [A] LIM 3.0 VDD=5.0V 2.0 2.0 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] Fig.18 UVLO hysteresis voltage Fig.19 Over current threshold Fig.20 Over current threshold FLAG FLAG OUTPUT RESISTANCE : R [Ω] 25 20 15 10 5 0 2 3 4 5 6 Supply Voltage : VDD [V] 25 20 15 10 5 0 -50 OPERATING CURRENT : IDD [uA] Ta=25ºC FLAG FLAG OUTPUT RESISTANCE : R [Ω] 30 30 1.0 VDD=5.0V Ta=25ºC 0.8 0.6 0.4 0.2 0.0 0 50 100 2 3 4 5 6 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VDD [V] Fig.21 Flag output resistance Fig.22 Flag output resistance Fig.23 Operating current CTRL Disable 1.0 D OPERATING CURRENT : I D [uA] VDD=5.0V 0.8 0.6 0.4 0.2 0.0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] Fig.24 Operating current CTRL Disable www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Reference data ◎BD6516F/ BD6517F 120 OPERATING CURRENT : IDD [uA] Technical Note 120 OPERATING CURRENT : I DD [uA] 3.0 VDD=5.0V CTRL CONTROL INPUT VOLTAGE : V [V] Ta=25ºC 100 80 60 40 20 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] 100 80 60 40 20 0 -50 Ta=25ºC 2.5 2.0 1.5 1.0 0.5 0.0 0 50 100 2 3 4 5 6 AMBIENT TEMPERATURE : Ta[℃] Fig.25 Operating current Fig.26 Operating current Fig.27 CTRL input voltage (BD6516F) SUPPLY VOLTAGE : VDD [V] 3.0 CTRL CONTROL INPUT VOLTAGE : V [V] CTRL CONTROL INPUT VOLTAGE : V [V] 3.0 CTRL CONTROL INPUT VOLTAGE : V [V] 3.0 Ta=25ºC VDD=5.0V 2.5 2.0 1.5 1.0 0.5 0.0 2 3 4 5 6 VDD=5.0V 2.5 2.0 1.5 1.0 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2.5 2.0 Low to High 1.5 1.0 0.5 0.0 SUPPLY VOLTAGE : VDD [V] Low to High High to Low High to Low -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.28 CTRL input voltage (BD6516F) Fig.29 CTRL input voltage (BD6517F) Fig.30 CTRL input voltage (BD6517F) 200 200 4000 TURN ON RISE TIME : TON1 [us] Ta=25ºC ON ON RESISTANCE : R [mΩ] Ta=25ºC 3000 150 ON RESISTANCE : RON[mΩ] 150 VDD=3.3V 100 100 VDD=5.0V 2000 50 50 1000 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] Fig.31 ON resistance Fig.32 ON resistance Fig.33 Output rise time 4000 TURN ON RISE TIME : T [us] ON1 4000 4000 Ta=25ºC TURN ON DELAY : TON2[us] 3000 3000 TURN ON DELAY : TON2[us] 3000 VDD=3.3V 2000 2000 VDD=3.3V 2000 1000 VDD=5.0V VDD=5.0V 1000 1000 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[V] 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.34 Output rise time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig.35 Output rise delay time Fig.36 Output rise delay time 9/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ 5.0 OFF1 TURN OFF FALL TIME : T [us] Technical Note FLAG OUTPUT RESISTANCE : RFLAG[Ω] 500 5.0 TURN OFF FALL TIME : T OFF1[us] Ta=25ºC 400 4.0 4.0 300 3.0 3.0 VDD=3.3V 200 VDD=5.0V 100 2.0 2.0 VDD=3.3V 1.0 VDD=5.0V 0.0 -50 0 50 100 1.0 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] AMBIENT TEMPERATURE : Ta[℃] Fig.37 Flag output resistance Fig.38 Output fall time Fig.39 Output fall time 5.0 TURN OFF DELAY : TOFF2[us] TURN OFF DELAY : TOFF2[us] 5.0 3.0 SHORT CIRCUIT CURRENT : ISC[A] Ta=25ºC Ta=25ºC 4.0 4.0 3.0 3.0 VDD=3.3V 2.0 2.0 2.0 VDD=5.0V 1.0 1.0 1.0 0.0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[V] 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[V] Fig.40 Output fall delay time FLAG OUTPUT RESISTANCE : RFLAG[Ω] Fig.41 Output fall delay time 500 Fig.42 Shortcircuit output current 4 FLAG OUTPUT DELAY : TDFL[ms] Ta=25ºC 3 3.0 SHORT CIRCUIT CURRENT : ISC[A] Ta=25ºC 400 2.0 VDD=5.0V VDD=3.3V 1.0 300 2 200 1 100 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[V] 0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[V] Fig.43 Shortcircuit output current 4 FLAG OUTPUT DELAY : TDFL[ms] OPERATING CURRENT : IDD[uA] 1.0 Fig.44 Flag output resistance Fig.45 Flag output delay 1.0 OPERATING CURRENT : IDD[uA] VDD=5.0V Ta=25ºC 0.8 VDD=5.0V 0.8 3 0.6 0.6 2 0.4 0.4 1 0.2 0.2 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[V] 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.46 Flag output delay Fig.47 Operating current CTRL Disable Fig.48 Operating current CTRL Disable www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Reference data ◎BD2042AFJ/ BD2052AFJ 140 OPERATING CURRENT : IDD[uA] 120 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Ta=25ºC 140 120 OPERATING CURRENT : IDD[uA] 100 80 60 40 20 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] VIN=5.0V OPERATING CURRENT : ISTB[uA] Technical Note 1.0 Ta=25ºC 0.8 0.6 0.4 0.2 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.49 Operating current EN,/EN Enable 1.0 VIN=5.0V OPERATING CURRENT : ISTB[uA] Fig.50 Operating current EN,/EN Enable 2.0 Ta=25ºC ENABLE INPUT VOLTAGE : VEN, V/EN[V] 0 1.5 Low to High 1.0 High to Low 2.0 Fig.51 Operating current EN,/EN Disable VIN=5.0V ENABLE INPUT VOLTAGE : VEN, V/EN[V] 1.5 0.8 Low to High High to Low 0.6 1.0 0.4 0.2 0.5 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.52 Operating current EN,/EN Disable 0.5 /OC OUTPUT LOW VOLTAGE : V/OC[V] Fig.53 EN,/EN input voltage 0.5 /OC OUTPUT LOW VOLTAGE : V/OC[V] 200 VIN=5.0V Fig.54 EN,/EN input voltage Ta=25ºC Ta=25ºC 0.4 0.3 0.2 0.1 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD[V] 6 0.4 0.3 0.2 0.1 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] ON RESISTANCE : R ON[mΩ] 150 100 50 0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.55 /OC output LOW voltage 200 Fig.56 /OC output LOW voltage Fig.57 ON resistance VIN=5.0V 2.0 Ta=25ºC SHORT CIRCUIT CURRENT : ISC[A] 2.0 VIN=5.0V SHORT CIRCUIT CURRENT : ISC[A] 1.5 ON RESISTANCE : RON[mΩ] 150 1.5 100 1.0 1.0 50 0.5 0.5 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.58 ON resistance Fig.59 Output current at shortcircuit Fig.60 Output current at shortcircuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note 5.0 Ta=25ºC 4.0 RISE TIME : TON1[ms] 5.0 5.0 VIN=5.0V 4.0 TURN ON TIME : TON2[ms] 4.0 Ta=25ºC RISE TIME : TON1[ms] 3.0 3.0 3.0 2.0 2.0 2.0 1.0 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0.0 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.61 Output rise time Fig.62 Output rise time Fig.63 Output turn on time 5.0 5.0 5.0 Ta=25ºC VIN=5.0V 4.0 VIN=5.0V 4.0 TURN ON TIME : TON2[ms] 4.0 FALL TIME : TOFF1[us] 3.0 3.0 FALL TIME : TOFF1[us] 3.0 2.0 2.0 2.0 1.0 1.0 1.0 0.0 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 -50 0 50 100 -50 AMBIENT TEMPERATURE : Ta[℃] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.64 Output turn on time Fig.65 Output fall time Fig.66 Output fall time 6.0 5.0 Ta=25°C VIN=5.0V UVLO THRESHOLD VOLTAGE : VUVLOH, VUVLOL[V] 2.5 5.0 4.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 4.0 TURN OFF TIME : TOFF2[us] 2.4 TURN OFF TIME : TOFF2[us] VUVLOH 2.3 3.0 VUVLOL 2.2 2.0 1.0 2.1 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.67 Output turn off time Fig.68 Output turn off time Fig.69 UVLO threshold voltage 1.0 UVLO HYSTERESIS VOLTAGE : VHYS[V] 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.70 UVLO hysteresis voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Waveform data VCTRL (5V/div.) VCTRL (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) VDD=5V RL=47Ω CL=47uF IOUT (0.2A/div.) TIME(200ms/div.) IOUT (0.2A/div.) TIME(200ms/div.) VDD=5V RL=47Ω CL=47uF IOUT (0.2A/div.) VEN (5V/div.) Technical Note VFLAG (5V/div.) VOUT (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VDD=5V RL=10Ω CL=100uF TIME(200ms/div.) Fig.71 Output rise, fall characteristic (BD6512F) Fig.72 Output rise, fall characteristic (BD6516F) Fig.73 Output rise, fall characteristic (BD2052AFJ) VFLAG (5V/div.) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) TIME (2ms/div.) VDD=5V CL=47uF IOUT (0.5A/div.) TIME (2ms/div.) VDD=5V CL=47uF VDD=5V IOUT (0.5A/div.) TIME (2ms/div.) Fig.74 Over current response Ramped load (BD6512F) VCTRL (5V/div.) Fig.75 Over current response Ramped load (BD6516F) VCTRL (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) Fig.76 Over current response Ramped load (BD2052AFJ) VEN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) TIME (2ms/div.) VDD=5V CL=47uF 1ms Delay IOUT (0.5A/div.) TIME (2ms/div.) VDD=5V CL=47uF 1.3ms Delay IOUT (0.5A/div.) TIME (2ms/div.) VDD=5V CL=100uF Fig.77 Over current response Enable to shortcircuit (BD6512F) Fig.78 Over current response Enable to shortcircuit (BD6516F) Fig.79 Over current response Enable to shortcircuit (BD2052AFJ) VFLAG (5V/div.) VOUT (5V/div.) VDD=5V CL=47uF VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VDD=5V CL=47uF Thermal Shutdown IOUT (2A/div.) TIME (100ms/div.) TIME (100ms/div.) VOUT (5V/div.) VDD=5V CL=100uF Thermal Shutdown IOUT (2A/div.) TIME (200ms/div.) Thermal Shutdown IOUT (2A/div.) Fig.80 Over current response Output shortcircuit at Enable (BD6512F) Fig.81 Over current response Output shortcircuit at Enable (BD6516F) Fig.82 Over current response Output shortcircuit at Enable (BD2052AFJ) Regarding the output rise/fall and over current detection characteristics of BD6513F, BD6517F, BD2042AFJ refer to the characteristic of BD6512F, BD6516F, BD2052AFJ. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Block diagram ◎BD6512F/ BD6513F/ BD6516F/ BD6517F (BD6516F/17F) Delay FLAGA Technical Note CTRLA Gate Logic1 OCD1 Charge Pump1 VDD UVLO CTRLB OCD2 Gate Logic2 GND Charge Pump2 TSD OUTA CTRLA 1 OUTB 8 OUTA 7 VDD Top View 6 GND 5 OUTB FLAGA 2 FLAGB 3 FLAGB Delay (BD6516F/17F) CTRLB 4 Fig.83 Block diagram ●Pin description ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Pin No. 1, 4 Symbol CTRLA CTRLB FLAGA FLAGB OUTB OUTA GND VDD I/O I Fig.84 Pin Configuration Pin function Enable input. Switch on at Low level. (BD6513F/BD6517F) Switch on at High level. (BD6512F/BD6516F) High level input > 2.5V, Low level input < 0.7V. Error flag output. Low at over current, thermal shutdown. Open drain output. Switch output. Ground. Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. 2, 3 5, 8 6 7 O O I I ●I/O circuit ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Symbol Pin No. Equivalent circuit (BD6512F/ BD6513F) CTRLA CTRLB Equivalent circuit (BD6516F/ BD6517F) CTRLA CTRLB CTRLA CTRLB 1, 4 FLAGA FLAGB FLAGA FLAGB FLAGA FLAGB 2, 3 OUTA OUTB 5, 8 OUTA OUTB OUTA OUTB www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Block diagram ◎BD2042AFJ/BD2052AFJ /EN1 EN1 Gate Logic1 OCD1 TSD1 /OC1 Delay Technical Note Charge Pump1 IN UVLO /EN2 EN2 OCD2 Gate Logic2 GND TSD2 Charge Pump2 OUT1 GND 1 IN 2 /EN1 3 (EN1) /EN2 4 (EN2) Top View 8 /OC1 7 OUT1 6 OUT2 5 /OC2 OUT2 /OC2 Delay Fig.85 Block diagram ●Pin description ◎BD2042AFJ/BD2052AFJ Pin No. Symbol 1 2 GND IN Fig.86 Pin Configuration I/O I I Ground. Pin function Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. Enable input. Switch on at Low level. (BD2042AFJ) Switch on at High level. (BD2052AFJ) High level input > 2.0V, Low level input < 0.8V. Error flag output. Low at over current, thermal shutdown. Open drain output. Switch output. 3, 4 /EN, EN I 5, 8 6, 7 /OC OUT O O ●I/O circuit ◎BD2042AFJ/BD2052AFJ Symbol Pin No Equivalent circuit /EN1(EN1) /EN2(EN2) /EN1(EN1) /EN2(EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 5, 8 OUT1 OUT2 6, 7 OUT1 OUT2 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Functional description 1. Switch operation VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD(IN) pin is used also as power source input to internal control circuit. When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT is connected. In a normal condition, current flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD, since the switch is bidirectional. ◎BD6512F/ BD6513F There is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the switch is off, if the voltage of OUT is higher than that of VDD, current flows from OUT to VDD. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ There is not parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD. 2. Thermal shutdown (TSD) Thermal shut down circuit turns off the switch and outputs an error flag when the junction temperature in chip exceeds a threshold temperature. The thermal shut down circuit works when either of two control signals is active. In BD6512F/BD6513F/BD6516F/BD6517F, the switches of both OUTA and OUTB become off and error flags are output to the both. BD2042AFJ/ BD2052AFJ have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output. ◎BD6512F/BD6513F The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down, switch off and error flag output status are maintained. To release the latch, it is necessary to input a signal to switch off to CTRL pin or make UVLO status. When the switch on signal is input or UVLO is released, the switch on and error flag output are recovered. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed or the switch is turned off, thermal shut down detection and recovery are repeated. 3. Over current detection, limit circuit The over current detection circuit limits current and outputs error flag when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection, limit circuit works when the switch is on (CTRL・EN signal is active). 3-1 When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status, the switch become current limit mode soon. 3-2 When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out. 3-3 When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under voltage lockout(UVLO) When the supply voltage is below UVLO threshold level, UVLO circuit turns off switch to prevent malfunction. The UVLO circuit works when either of two control signals is active. ◎BD6512F/BD6513F UVLO circuit prevents the switch from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.) while the switch turns on, then UVLO shuts off the switch. ◎BD2042AFJ/BD2052AFJ UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ). 5. Error flag output Error flag output is N-MOS open drain output. ◎BD6512F/BD6513F At detection of over current detection, thermal shutdown, UVLO, Low level is output. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ At detection of over current detection, thermal shutdown, Low level is output. Error flag output at over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note VCTRL Output shortcircuit Thermal shut down IOUT VOUT VFLAG Latch Latch release Fig.87 BD6512F/ BD6513F over current detection, thermal shutdown timing (VCTRL of BD6513F active Low) VCTRL VEN Output shortcircuit Thermal shut down IOUT VFLAG V/OC delay VOUT Fig.88 BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ over current detection, thermal shutdown timing (VCTRL, V/EN of BD6517F/BD2042AFJ active Low) ●Typical application circuit 5V(Typ) 100k 100k VBUS D+ ON/OFF DGND Regulator OC OC Data USB Controller Data Ferrite Beads CIN CL IN OUT ON/OFF CTRLA (EN) CTRLB (EN) FLAGA (/OC) FLAGA (/OC) VDD GND OUTA Data OUTB CL Fig.89 Typical application circuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 17/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC operations. In order to avoid this case, connect a bypass capacitor by VDD pin and GND pin of IC. 1uF or higher is recommended. Pull up flag output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. In BD6512F/BD6513F, there are cases where over current detection error flag is output to inrush current at switch on or at insertion of active line of peripheral devices. In the case of erroneous detection inBD6512F/BD6513F, use RC filter shown in Fig. 90 for FLAG output. VDD CTRLA OC FLAGA FLAGB USB Controller CTRLB OUTA VDD GND OUTB BD6512F/13F Fig.90 FLAG output RC filter ●Thermal derating characteristic (SOP8, SOP-J8) 600 500 POWER DISSIPATION: Pd[mW] 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.92 Power dissipation curve www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 18/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become 135°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 19/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Ordering part number Technical Note B D 6 Part No. 6512 6513 6516 6517 2042A 2052A 5 1 2 F Package F: SOP8 - E 2 Part No. Packaging and forming specification E2: Embossed tape and reel (SOP8,SOP-J8) FJ:SOP-J8 SOP8 5.0±0.2 (MAX 5.35 include BURR) 8 7 6 5 +6° 4° −4° 0.9±0.15 0.3MIN Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.2±0.3 4.4±0.2 ( reel on the left hand and you pull out the tape on the right hand ) 12 3 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S 0.1 0.11 S 1.27 0.42±0.1 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. SOP-J8 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 8 7 6 5 Tape Quantity 0.45MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.0±0.3 3.9±0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 0.545 S 0.2±0.1 1.375±0.1 0.175 1.27 0.42±0.1 0.1 S 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 20/20 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A