Datasheet
2ch High Side Switch ICs
Current Limit High Side Switch ICs
BD6516F BD6517F BD2042AFJ
BD2052AFJ
General Description
Key Specifications
BD6516F, BD6517F, BD2042AFJ and BD2052AFJ
are dual channel high side switch ICs with an over
current protection for Universal Serial Bus (USB)
power supply line. The IC’s switch unit has two
channels of N-Channel power MOSFET. Over
current detection circuit, thermal shutdown circuit,
under voltage lockout and soft start circuit are built
in.
Input Voltage Range:
BD6516F/BD6517F
3.0V to 5.5V
BD2042AFJ/BD2052AFJ
2.7V to 5.5V
ON-Resistance:
BD6516F/BD6517F
110mΩ(Typ)
BD2042AFJ/BD2052AFJ
100mΩ(Typ)
Continuous Current:
0.5A
Current Limit Threshold:
BD6516F/BD6517F
1.2A(Min), 2.5A (Max)
BD2042AFJ/BD2052AFJ
0.7A(Min), 1.8A (Max)
Standby Current:
0.01μA (Typ)
Output Rise Time:
1.8ms (Typ)
Operating Temperature Range:
BD6516F/BD6517F
-25°C to +85°C
BD2042AFJ/BD2052AFJ
-40°C to +85°C
Features
■
■
■
■
■
■
■
■
■
Dual N-MOS High Side Switch
Control Input Logic
Active-Low:
BD6517F, BD2042AFJ
Active-High:
BD6516F, BD2052AFJ
Soft Start Circuit
Over Current Detection
Thermal Shutdown
Under Voltage Lockout
Open Drain Error Flag Output
Reverse-Current Protection when Switch Off
Flag Output Delay
W(Typ)
Packages
D(Typ)
H(Max)
Applications
USB Hub in Consumer Appliances, Note PC,
PC Peripheral Equipment, and so on.
SOP8
5.00mm x 6.20mm x 1.71mm
Typical Application Circuit
SOP-J8
4.90mm x 6.00mm x 1.65mm
5V(Typ)
GND
/OC1
CL
CIN
IN
OUT1
/EN1
(EN1)
/EN2
(EN2)
OUT2
Data
/OC2
CL
Data
Lineup
Current Limit Threshold
Control Input Logic
Min
Typ
Max
1.2A
1.65A
2.5A
High
1.2A
1.65A
2.5A
Low
0.7A
1.0A
1.8A
High
0.7A
1.0A
1.8A
Low
Package
BD6516F-E2
SOP8
Reel of 2500
SOP-J8
Orderable Part Number
BD6517F-E2
BD2052AFJ-E2
BD2042AFJ-E2
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Block Diagrams
BD6516F/BD6517F
CTRLA
BD2042AFJ/BD2052AFJ
FLAGA
Delay
Gate
Logic1
/EN1
EN1
TSD1
Gate
Logic1
Charge
Pump1
OCD1
OUTA
UVLO
TSD
IN
UVLO
Charge
Pump2
OCD2
FLAGB
/OC2
Gate
Logic2
Delay
GND
OUT2
/EN2
EN2
Charge
Pump2
Gate
Logic2
OUT1
OUTB
CTRLB
OCD2
Charge
Pump1
OCD1
VDD
/OC1
Delay
Delay
GND
TSD2
Pin Configurations
BD6516F/BD6517F
TOP VIEW
BD2042AFJ/BD2052AFJ
TOP VIEW
1 CTRLA
OUTA 8
1 GND
/OC1
2 FLAGA
VDD
7
2 IN
OUT1 7
3 FLAGB
GND
6
OUT2 6
4 CTRLB
OUTB 5
3 /EN1
(EN1)
4 /EN2
(EN2)
/OC2
8
5
Pin Descriptions
BD6516F/BD6517F
Pin
Symbol
I/O
No.
1, 4
CTRLA
CTRLB
I
2, 3
FLAGA
FLAGB
O
Pin Function
Enable input.
Switch on at low level.
(BD6517F)
Low level input < 0.7V.
Switch on at high level.
(BD6516F)
High level input > 2.5V.
Error flag output.
Low at over current, thermal
shutdown.
Open drain output.
BD2042AFJ/BD2052AFJ
Pin
Symbol I / O
No.
1
GND
I
Ground.
2
IN
I
Power supply input.
Input terminal of the switch and
power supply of internal circuit.
3, 4
/EN1
/EN2,
EN1
EN2
I
Ground.
5, 8
/OC2
/OC1
O
Power supply input.
Input terminal of the switch and
power supply of internal circuit.
6, 7
OUT2
OUT1
O
5, 8
OUTA
OUTB
O
Switch output.
6
GND
I
7
VDD
I
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Pin Function
Enable input.
/EN: Switch on at low level.
(BD2042AFJ)
Low level input < 0.8V
EN: Switch on at high level.
(BD2052AFJ)
High level input > 2.0V.
Error flag output.
Low at over current, thermal
shutdown.
Open drain output.
Switch output.
TSZ02201-0E3E0H300240-1-2
21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Absolute Maximum Ratings
BD6516F/BD6517F
Parameter
Symbol
Rating
Unit
Input Voltage
VDD
-0.3 to +6.0
V
CTRL Voltage
VCTRL
-0.3 to V DD +0.3
V
FLAG Voltage
VFLAG
-0.3 to +6.0
V
Output Voltage
VOUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
ºC
Power Dissipation
Pd
0.67
(Note 1)
W
BD2042AFJ/BD2052AFJ
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +6.0
V
VEN, V/EN
-0.3 to +6.0
V
/OC Voltage
V/OC
-0.3 to +6.0
V
/OC Current
IS/OC
10
mA
OUT Voltage
VOUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
ºC
Power Dissipation
Pd
0.67
Input Voltage
EN, /EN Voltage
(Note 1)
W
o
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ C above Ta=25 oC
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operation Conditions
BD6516F/BD6517F
Parameter
Symbol
Rating
Min
Typ
Max
Unit
Input Voltage
V DD
3.0
-
5.5
V
Operation Temperature
Topr
-25
-
+85
°C
Continuous Output Current
I LO
0
-
500
mA
BD2042AFJ/BD2052AFJ
Parameter
Symbol
Rating
Min
Typ
Max
-
5.5
Unit
Input Voltage
V IN
2.7
Operation Temperature
Topr
-40
-
+85
°C
Continuous Output Current
I LO
0
-
500
mA
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V
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Electrical Characteristics
BD6516F/BD6517F (V DD =5V, Ta=25 ºC, unless otherwise specified.)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
I DD
-
100
140
μA
Standby Current
I STB
-
0.01
2
μA
-
-
0.7
V
V CTRL =5V(BD6516F), 0V(BD6517F)
OUT=OPEN
V CTRL =0V(BD6516F), 5V(BD6517F)
OUT=OPEN
Low Level Input Voltage
2.5
-
-
V
High Level Input Voltage
CTRL Input Voltage
V CTRL
CTRL Input Current
I CTRL
-1
+0.01
+1
μA
V CTRL =0V or 5V
FLAG Output Resistance
R FLAG
-
250
450
Ω
I FLAG =1mA
FLAG Output Leak Current
I FLAG
-
0.01
1
μA
V FLAG =5V
FLAG Output Delay
t/FL
-
1
4
ms
ON-Resistance
R ON
Over-Current Threshold
Short Circuit Output Current
-
110
150
mΩ
V DD =5V, I OUT =500mA
-
140
180
mΩ
V DD =3.3V, I OUT =500mA
I TH
1.2
1.65
2.5
A
I SC
1.2
1.65
2.2
A
V OUT =0V
Output Leak Current
I LEAK
-
-
10
μA
V CTRL =0V(BD6516F), 5V(BD6517F)
Thermal Shutdown
Threshold
T TS
-
135
-
ºC
At Tj Increase
Output Rise Time
t ON1
0.1
1.3
4.0
ms
R L =10Ω
Output Turn ON Delay Time
t ON2
0.2
1.5
6.0
ms
R L =10Ω
Output Fall Time
t OFF1
-
1
20
μs
R L =10Ω
Output Turn OFF Delay Time
t OFF2
-
3
20
μs
R L =10Ω
BD2042AFJ/BD2052AFJ (V DD =5V, Ta=25 ºC, unless otherwise specified.)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Operating Current
I DD
-
110
140
μA
V /EN = 0V, OUT = OPEN (BD2042AFJ)
V EN = 5V, OUT = OPEN (BD2052AFJ)
Standby Current
I STB
-
0.01
1
μA
V /EN = 5V, OUT = OPEN (BD2042AFJ)
V EN = 0V, OUT = OPEN (BD2052AFJ)
V /ENH ,
V ENH
2.0
-
-
V
High Input
/EN, EN Input Voltage
V /ENL ,
V ENL
-
-
0.8
V
Low Input
-
-
0.4
V
Low Input 2.7V≤ V IN ≤4.5V
I /EN , I EN
-1.0
+0.01
+1.0
μA
V /EN ,V EN = 0V or V /EN ,V EN = 5V
/OC Output Low Voltage
V /OC
-
-
0.5
V
I /OC = 5mA
/OC Output Leak Current
I L/OC
-
0.01
1
μA
V /OC = 5V
ON-Resistance
R ON
-
100
130
mΩ
I OUT = 500mA
Over-Current Threshold
I TH
0.7
1.0
1.8
A
Short Circuit Output Current
I SC
0.7
1.0
1.3
A
Output Rise Time
t ON1
-
1.8
10
ms
Output Turn ON Time
t ON2
-
2.1
20
ms
Output Fall Time
t OFF1
-
1
20
μs
Output Turn OFF Time
t OFF2
-
3
40
μs
V TUVH
2.1
2.3
2.5
V
Increasing V IN
V TUVL
2.0
2.2
2.4
V
Decreasing V IN
/EN, EN Input Current
UVLO Threshold
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V IN = 5V, V OUT = 0V,
C L = 100μF (RMS)
R L = 10Ω , C L = OPEN
TSZ02201-0E3E0H300240-1-2
21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Measurement Circuits
BD6516F/BD6517F
VDD
VDD
CTRLA
VCTRL
FLAGA
VCTRL
A
OUTA
VDD
VCTRL
GND
CTRLB
OUTB
VCTRL
A. Operating Current
VCTRL
VCTRL
VDD
CTRLA
OUTA
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
RL
CL
RL
CL
B. CTRL Input Voltage, Output Rise / Fall Time
VDD
10k
10k
OUTA
1µF
1µF
FLAGB
CTRLA
VCTRL
IOUT
VDD
IFLAG
IFLAG
CL
CTRLA
OUTA
FLAGA
VDD
FLAGB
GND
CTRLB
OUTB
1µF
1µF
VCTRL
IOUT
CL
C. ON-Resistance, Over Current Detection
D. FLAG Output Resistance
BD2042AFJ/BD2052AFJ
VDD
VDD
1µF
1µF
A
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
RL
RL
E. Operating Current
VDD
1µF
GND
10k
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
CL
F. EN, /EN Input Voltage, Output Rise / Fall Time
VDD
10k
VDD
/OC1
IN
CL
1µF
GND
IOUT
IOUT
IOUT
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
G. ON-Resistance, Over Current Detection
IOUT
H. /OC Output Low Voltage
Figure 1. Measurement Circuits
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Timing Diagram
BD6517F/BD2042AFJ
BD6516F/BD2052AFJ
tOFF1
tOFF1
tON1
tON1
90%
VOUT
90%
10%
VCTRL
V/EN
VCTRL
V/ENL
90%
10%
10%
tON2
90%
VOUT
10%
tON2
tOFF2
VCTRL
V/ENH
VCTRL
VEN
VCTRL
VENH
tOFF2
VCTRL
VENL
Figure 2. Timing Diagram
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves
BD6516F/ BD6517F
Ta=25ºC
Operating Current: I [μA]
100
120
OPERATING CURRENT : DD
I DD [uA]
OperatingCURRENT
Current:: IIDD
[μA]
DD [uA]
OPERATING
120
80
60
40
20
3
4
5
80
60
40
20
0
-50
0
2
VDD=5.0V
100
6
50
100
AMBIENT
Ta[°C
Ambient TEMPERATURE
Temperature : :Ta[
℃]
SUPPLY
VDD
DD [V]
Supply VOLTAGE
Voltage :: V
[V]
Figure 3. Operating Current
vs Supply Voltage
Figure 4. Operating Current
vs Ambient Temperature
1.0
1.0
Standby Current: ISTB[μA]
Ta=25ºC
OPERATING CURRENT : IDD [uA]
Standby CURRENT
Current: I:STB
OPERATING
IDD[μA]
[uA]
0
0.8
0.6
0.4
0.2
0.0
2
3
4
5
0.6
0.4
0.2
0.0
6
-50
SUPPLY Voltage
VOLTAGE
: VDD[V]
[V]
Supply
:V
DD
0
50
100
AMBIENT
: Ta[
℃] ]
Ambient TEMPERATURE
Temperature : Ta[
°C
Figure 5. Standby Current vs
Supply Voltage
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TSZ22111･15･001
VDD=5.0V
0.8
Figure 6. Standby Current vs
Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
3.0
Ta=25ºC
CTRL Input Voltage : VCTRL[V]
2.5
CONTROL INPUT VOLTAGE : VCTRL[V]
CTRL Input Voltage : V
[V]
CONTROL INPUT VOLTAGE : CTRL
VCTRL[V]
3.0
2.0
1.5
1.0
0.5
0.0
VDD=5.0V
2.5
2.0
1.5
1.0
0.5
0.0
2
3
4
5
6
-50
SUPPLY
SupplyVOLTAGE
Voltage :: V
VDD [V]
[V]
Figure 8. CTRL Input Voltage
vs Ambient Temperature
(BD6516F)
3.0
CTRL Input Voltage : VCTRL[V]
3.0
CONTROL INPUT VOLTAGE : VCTRL[V]
CTRL Input
[V]
CTRL [V]
CONTROL
INPUTVoltage
VOLTAGE: V
: VCTRL
(BD6516F)
Ta=25ºC
Low to High
1.5
High to Low
1.0
100
Ambient Temperature : Ta[°C]
Figure 7. CTRL Input Voltage vs
Supply Voltage
2.0
50
AMBIENT TEMPERATURE : Ta[℃]
DD
2.5
0
0.5
VDD=5.0V
2.5
2.0
Low to High
1.5
High to Low
1.0
0.5
0.0
0.0
2
3
4
5
-50
6
SUPPLY
[V]
SupplyVOLTAGE
Voltage ::VVDDDD
[V]
50
100
AMBIENT
TEMPERATURE
] ]
℃°C
Ambient
Temperature: :Ta[
Ta[
Figure 10. CTRL Input Voltage
vs Ambient Temperature
Figure 9. CTRL Input Voltage
vs Supply Voltage
(BD6517F)
(BD6517F)
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
200
Ta=25ºC
ON RESISTANCE : RON [mΩ]
ON-Resistance : RON[mΩ]
ON RESISTANCE : RON [mΩ]
ON-Resistance : RON[mΩ]
200
150
100
50
150
3
4
5
50
0
-50
6
100
]
Figure 12. ON-Resistance vs
Ambient Temperature
4.0
Output Rise Time: tON1
[ms]
ON1 [us]
4.0
Ta=25ºC
3.0
TURN ON RISE TIME : T
ON1 [us]
50
Ambient Temperature : Ta[°C℃
]
Figure 11. ON-Resistance vs
Supply Voltage
Output Rise Time: tON1[ms]
0
AMBIENT TEMPERATURE : Ta[
SUPPLYVoltage
VOLTAGE
VDD
[V]
Supply
: V:DD
[V]
TURN ON RISE TIME : T
VDD=5.0V
100
0
2
VDD=3.3V
2.0
1.0
0.0
2
3
4
5
VDD=3.3V
2.0
VDD=5.0V
1.0
0.0
6
-50
SUPPLY VOLTAGE : VDD [V]
0
50
100
AmbientTEMPERATURE
Temperature :: Ta[℃]
Ta[°C]
AMBIENT
Supply Voltage : VDD[V]
Figure 13. Output Rise Time vs
Supply Voltage
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3.0
Figure 14. Output Rise Time vs
Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
4.0
Output TURN
Turn ON
Delay Time: tON2[ms]
ON DELAY : T ON2 [us]
TURN ON DELAY : T
ON2
[us]
Output Turn ON Delay Time: tON2[ms]
Typical Performance Curves - continued
Ta=25ºC
3.0
2.0
1.0
0.0
2
3
4
5
6
4.0
3.0
VDD=3.3V
2.0
VDD=5.0V
1.0
0.0
-50
[V]
SUPPLY
Supply VOLTAGE
Voltage : :VVDD[V]
Figure 15. Output Turn ON Delay
Time vs Supply Voltage
Output
Fall Time:
[μs]
OFF1 [us]
TURN
OFF FALL
TIME : TtOFF1
[μs]
Output Fall Time: t
OFF1 [us]
TURN OFF FALL TIME : TOFF1
5.0
4.0
3.0
2.0
1.0
0.0
3
100
Figure 16. Output Turn ON Delay
Time vs Ambient Temperature
Ta=25ºC
2
50
AMBIENT
Ta[℃]
AmbientTEMPERATURE
Temperature : :Ta[
°C]
DD
5.0
0
4
5
4.0
3.0
2.0
VDD=3.3V
1.0
VDD=5.0V
0.0
6
-50
0
50
Supply
:V
[V]
DD
[V]
SUPPLYVoltage
VOLTAGE
:V
DD
Ambient TEMPERATURE
Temperature : Ta[
AMBIENT
: Ta[°C
℃]]
Figure 17. Output Fall Time vs
Supply Voltage
Figure 18. Output Fall Time vs
Ambient Temperature
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TSZ02201-0E3E0H300240-1-2
21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Output TURN
Turn OFF
Delay: Time:
OFF DELAY
TOFF2[us]tOFF2[μs]
TURN OFF DELAY : TOFF2[us]
Output Turn OFF Delay Time: tOFF2[μs]
Typical Performance Curves - continued
5.0
Ta=25ºC
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
5.0
4.0
VDD=3.3V
3.0
2.0
VDD=5.0V
1.0
0.0
-50
SUPPLYVoltage
VOLTAGE
VDD
Supply
: V:DD
[V][V]
Short
Output
Current
: ISC[A]
SHORTCircuit
CIRCUIT
CURRENT
: ISC [A]
SC
Short
Circuit Output Current : I [A]
SHORT CIRCUIT CURRENT : I [A]SC
Ta=25ºC
2.0
1.0
0.0
4
5
3.0
2.0
VDD=5.0V
VDD=3.3V
1.0
0.0
6
-50
SUPPLY
VOLTAGE
:V
DD
[V]
Supply Voltage
:V
[V]
DD
0
50
100
AmbientTEMPERATURE
Temperature : :Ta[
AMBIENT
Ta[°C
℃]]
Figure 21. Short Circuit Output
Current vs Supply Voltage
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TSZ22111･15･001
100
Figure 20. Output Turn OFF Delay
Time vs Ambient Temperature
3.0
3
50
AMBIENT
Ta[℃
AmbientTEMPERATURE
Temperature :: Ta[
°C] ]
Figure 19. Output Turn OFF Delay
Time vs Supply Voltage
2
0
Figure 22. Short Circuit Output
Current vs Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
FLAG
Output
Resistance:
RFLAG
FLAG
OUTPUT
RESISTANCE
: RFLAG
[Ω] [Ω]
FLAG Output Resistance: R
FLAG
FLAG OUTPUT RESISTANCE : RFLAG
[Ω]
[Ω]
Typical Performance Curves - continued
500
Ta=25ºC
400
300
200
100
0
2
3
4
5
500
400
300
VDD=3.3V
200
VDD=5.0V
100
0
6
-50
Supply
: V:DD
[V]
[V]
SUPPLYVoltage
VOLTAGE
VDD
4
100
FLAG Output Delay: t/FL [ms]
4
Ta=25ºC
FLAG OUTPUT DELAY : TDFL[ms]
FLAG OUTPUT DELAY : TD
FL [ms]
50
Figure 24. FLAG Output Resistance
vs Ambient Temperature
Figure 23. FLAG Output Resistance
vs Supply Voltage
FLAG Output Delay: t/FL [ms]
0
AmbientTEMPERATURE
Temperature: :Ta[
AMBIENT
Ta[°C
℃]]
3
2
1
0
2
3
4
5
3
2
1
0
6
-50
SUPPLY VOLTAGE : VDD [V]
0
50
100
AmbientTEMPERATURE
Temperature : :Ta[
AMBIENT
Ta[°C
℃]]
Supply Voltage : VDD[V]
Figure 25. FLAG Output Delay
vs Supply Voltage
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VDD=5.0V
Figure 26. FLAG Output Delay
vs Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
BD2042AFJ/ BD2052AFJ
VIN=5.0V
Operating Current : IDD[μA]
Operating Current : IDD[μA]
Ta=25ºC
Supply Voltage : VIN[V]
Ambient Temperature : Ta[°C]
Figure 27. Operating Current vs
Supply Voltage
(EN, /EN Enable)
Figure 28. Operating Current vs
Ambient Temperature
(EN, /EN Enable)
1.0
1.0
Standby Current
: ISTB: [μA]
OPERATING
CURRENT
I STB[uA]
Standby Current : ISTB[μA]
Ta=25ºC
0.8
0.6
0.4
0.2
0.0
2
3
4
5
0.8
0.6
0.4
0.2
0.0
6
-50
0
50
AMBIENT
: Ta[℃]
AmbientTEMPERATURE
Temperature : Ta[
°C]
Supply Voltage : VIN[V]
Figure 29. Standby Current vs
Supply Voltage
(EN, /EN Disable)
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VIN=5.0V
100
Figure 30. Standby Current vs
Ambient Temperature
(EN, /EN Disable)
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
Enable Input Voltage: VEN, V/EN[V]
Ta=25ºC
1.5
Low to High
VEN, V/EN [V] 0
ENABLE
INPUT
VOLTAGE
Enable
Input
Voltage:
VEN, V:/EN[V]
2.0
High to Low
1.0
0.5
VIN=5.0V
Low to High
High to Low
0.0
2
3
4
5
SUPPLY
VOLTAGE
IN [V]
Supply Voltage
: V: V[V]
6
Ambient Temperature : Ta[°C]
IN
Figure 32. EN, /EN Input Voltage
vs Ambient Temperature
Figure 31. EN, /EN Input Voltage
vs Supply Voltage
Ta=25ºC
/OC Output Low Voltage: V/OC[V]
V/OC [V]
OUTPUT
VOLTAGE
:
/OC/OC
Output
LowLOW
Voltage:
V/OC[V]
0.5
0.4
0.3
0.2
0.1
0.0
2
3
4
5
SUPPLY VOLTAGE : VDD [V]
6
Supply Voltage : VIN [V]
Ambient Temperature : Ta[°C]
Figure 34. /OC Output Low Voltage
vs Ambient Temperature
Figure 33. /OC Output Low Voltage
vs Supply Voltage
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Datasheet
BD2052AFJ
Typical Performance Curves - continued
2.0
2
ON RESISTANCE :RON[mΩ]
/OC Output Delay: t/OC[ms]
ON RESISTANCE :
RON[mΩ]
/OC Output Delay: t/OC[ms]
Ta=25ºC
1.5
1.0
0.5
0.0
VIN=5.0V
1.5
1
0.5
0
2
3
4
5
SUPPLY
VOLTAGE
:
V
Supply Voltage : V [V]DD[V]
6
-50
0
Figure 35. /OC Output Delay vs
Supply Voltage
Figure 36. /OC Output Delay vs
Ambient Temperature
200
200
Ta=25ºC
VIN=5.0V
150
ON-Resistance : RON[mΩ]
ON RESISTANCE :
RON[mΩ]
100
Ambient TEMPERATURE
Temperature : Ta[
°C]
AMBIENT
: Ta[℃]
IN
ON-Resistance : RON[mΩ]
50
100
50
0
150
100
50
0
2
3
4
5
SUPPLY
VOLTAGE
:
V
DD [V]
Supply Voltage : V [V]
6
-50
IN
Figure 37. ON-Resistance vs
Supply Voltage
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TSZ22111･15･001
0
50
100
AMBIENT
TEMPERATURE
Ta[℃]
Ambient Temperature
: Ta[:°C
]
Figure 38. ON-Resistance vs
Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
2.0
VIN=5.0V
Ta=25ºC
Over Current
Threshold:
SHORT CIRCUIT
CURRENT :ITH[A]
SHORT CIRCUIT CURRENT :I
Over Current Threshold: ITH[A]
SC [A]
2.0
1.5
1.0
0.5
1.5
1.0
0.5
0.0
0.0
2
3
4
5
SUPPLY
VOLTAGE
:
V
IN [V]
Supply Voltage : V [V]
6
-50
Figure 39. Over Current Threshold vs
Supply Voltage
SC [A]
100
Figure 40. Over Current Threshold vs
Ambient Temperature
2.0
2.0
Ta=25ºC
Short Circuit Output Current : ISC[A]
SHORT CIRCUIT CURRENT :I
50
Ambient Temperature : Ta[°C]
IN
Short Circuit Output Current : ISC[A]
0
AMBIENT TEMPERATURE : Ta[℃]
1.5
1.0
0.5
0.0
2
3
4
5
SUPPLY
VOLTAGE
:
V
IN [V]
Supply Voltage : V [V]
1.5
1.0
0.5
0.0
-50
6
IN
Figure 41. Short Circuit Output Current vs
Supply Voltage
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VIN=5.0V
0
50
100
AMBIENT
TEMPERATURE
:
Ta[℃]
Ambient Temperature : Ta[°C]
Figure 42. Short Circuit Output Current vs
Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
5.0
VIN=5.0V
4.0
RISE TIME :
TON1[ms]
Output Rise Time : tON1[ms]
Output Rise Time : tON1[ms]
Ta=25ºC
3.0
2.0
1.0
0.0
-50
Supply Voltage : VIN[V]
Figure 43. Output Rise Time vs
Supply Voltage
0
50
AMBIENTTemperature
TEMPERATURE
Ta[]℃]
Ambient
: Ta[: °C
100
Figure 44. Output Rise Time vs
Ambient Temperature
Ta=25ºC
ON2 [ms]
VIN=5.0V
4.0
TURN ON TIME :T
Output Turn ON Time: tON2[ms]
Output Turn ON Time: tON2[ms]
5.0
3.0
2.0
1.0
0.0
-50
Supply Voltage : VIN[V]
Figure 45. Output Turn ON Time vs
Supply Voltage
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TSZ22111･15･001
0
50
100
Ambient Temperature
: Ta[: °C
]
AMBIENT
TEMPERATURE
Ta[℃]
Figure 46. Output Turn ON Time vs
Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
5.0
VIN=5.0V
Output Fall Time : tOFF1[µs]
4.0
FALL TIME :
TOFF1[us]
Output Fall Time : tOFF1[µs]
Ta=25ºC
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY
VOLTAGE
VIN [V]
Supply
Voltage
: VIN: [V]
6
Ambient Temperature : Ta[°C]
Figure 47. Output Fall Time vs
Supply Voltage
Figure 48. Output Fall Time vs
Ambient Temperature
5.0
5.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY
VOLTAGE
VIN [V]
Supply
Voltage
: VIN:[V]
4.0
3.0
2.0
1.0
0.0
6
-50
Figure 49. Output Turn OFF Time
vs Supply Voltage
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VIN=5.0V
TOFF2[us]
Output TURN
Turn OFF
Time: t
[µs]
OFF TIME :OFF2
Ta=25°C
TURN OFF TIME :
TOFF2[us]
Output Turn OFF Time: tOFF2[µs]
6.0
0
50
100
AMBIENT
TEMPERATURE
:
Ta[
]
℃
Ambient Temperature : Ta[°C]
Figure 50. Output Turn OFF Time
vs Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Performance Curves - continued
1.0
UVLO Hysteresis Voltage: VHYS[V]
UVLO THRESHOLD VOLTAGE : V
V UVLOL [V]
UVLO Threshold : VTUVH, VTUVL[V]
UVLOH ,
2.5
2.4
VTUVH
2.3
VTUVL
2.2
2.1
2.0
-50
0
50
100
AMBIENT
TEMPERATURE
:
Ta[℃]
Ambient Temperature : Ta[°C]
0.6
0.4
0.2
0.0
-50
0
50
100
Ambient Temperature : Ta[°C]
AMBIENT TEMPERATURE : Ta[℃]
Figure 51. UVLO Threshold Voltage vs
Ambient Temperature
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0.8
Figure 52. UVLO Hysteresis Voltage vs
Ambient Temperature
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Wave Forms
VCTRL
(5V/div.)
VEN
(5V/div.)
VFLAG
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VDD=5V
VIN=5V
RL=10Ω
RL=47Ω
CL=47μF
IOUT
(0.2A/div.)
CL=100μF
IOUT
(0.2A/div.)
TIME(200ms/div.)
TIME(200ms/div.)
Figure 54. Output Rise / Fall Characteristic
Figure 53. Output Rise / Fall Characteristic
(BD2052AFJ)
(BD6516F)
VFLAG
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VDD=5V
CL=47μF
IOUT
(0.5A/div.)
VIN=5V
IOUT
(0.5A/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Figure 55. Over-Current Response
Ramped Load
Figure 56. Over-Current Response
Ramped Load
(BD2052AFJ)
(BD6516F)
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Datasheet
BD2052AFJ
Typical Wave Forms - continued
VCTRL
(5V/div.)
VEN
(5V/div.)
VFLAG
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
1ms Delay
VDD=5V
CL=47μF
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
1.3ms Delay VIN=5V
CL=100μF
TIME (2ms/div.)
TIME (2ms/div.)
Figure 58. Over-Current Response
Enable to 1Ω Short Circuit
Figure 57. Over-Current Response
Enable to Short Circuit
(BD2052AFJ)
(BD6516F)
VFLAG
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VDD=5V
CL=47μF
VIN=5V
CL=100μF
Thermal Shutdown
Thermal Shutdown
IOUT
(2A/div.)
IOUT
(2A/div.)
TIME (100ms/div.)
TIME (200ms/div.)
Figure 59. Over-Current Response
1Ω Load Connected at Enable
Figure 60. Over-Current Response
1Ω Load Connected at Enable
(BD2052AFJ)
(BD6516F)
Regarding the output rise/fall and over current detection characteristics of BD6517F, BD2042AFJ refer to the characteristic of BD6516F, BD2052AFJ.
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Typical Application Circuit
5V(Typ)
10k to100k
10k to100k
VBUS
IN
OUT
ON/OFF
GND
/OC1
D+
CL
OC
CIN
DOC
Regulator
GND
ON/OFF
IN
/EN1
(EN1)
/EN2
(EN2)
OUT1
OUT2
/OC2
Data
CL
BD2042AFJ/52AFJ
Data
USB Controller
Data
Application Information
Excessive current flow due to output short circuit, or so, may induce ringing because of the presence of an inductance
between the supply line and IC. This event may cause IC malfunction during operation. To avoid this, connect a bypass
capacitor between IN and GND pins. 1μF or higher is recommended.
Pull up flag output (/OC) by resistance value from 10kΩ to 100kΩ.
Set up values of C L which satisfies the application.
The application circuit above does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as IC transient characteristics.
Functional Description
1. Switch Operation
VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. The VDD(IN) pin is
also used as a power source for internal control circuit.
When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT are connected. In a normal condition,
current flows from VDD to OUT. If the voltage at OUT is higher than VDD, current flows from OUT to VDD since the
There is no parasitic diode and it is possible to prevent current flow from OUT to VDD(IN).
2. Thermal Shutdown (TSD)
Thermal shutdown circuit turns off the switch and outputs an error flag when the junction temperature in the chip exceeds
a threshold temperature. The thermal shutdown circuit works when either of the two control signals is active.
In BD6516F/BD6517F, the switches of both OUTA and OUTB turn off and output error flags;. BD2042AFJ/ BD2052AFJ has dual
threshold temperature for its thermal shutdown. Since thermal shutdown works at a lower junction temperature, only the
switch with an over current state turns off whenever over current occurs and outputs an error flag.
Thermal shutdown detection has hysteresis. Therefore, when the junction temperature goes down, switch turns on and
error flag is cancelled. Unless the increase of the chip’s temperature is removed or the output of power switch is turned
off, this operation repeats.
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BD2052AFJ
Datasheet
3. Over-Current Detection/Limit Circuit
The over current detection circuit limits current (I SC ) and outputs an error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (CTRL, EN signal is active).
(1) When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
(2) When the output short-circuits or high-current load is connected while the switch is on, very large current flows until
the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.
(3) When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit turns off the switch to prevent malfunction when the supply voltage is below the UVLO threshold level, The
UVLO circuit works when either of two control signals is active.
◎BD2042AFJ/BD2052AFJ
UVLO circuit prevents the switch from turning on until the V IN exceeds 2.3V(Typ). If the V IN drops below 2.2V(Typ)
while the switch is ON, then UVLO shuts OFF the switch. UVLO has hysteresis of 100mV(Typ).
5. Error Flag (/OC) Output
Error flag output is an N-MOS open drain output.
At detection of over current limit and thermal shutdown, /OC outputs a low level signal. Error flag output (/OC) at over
current detection has a delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch ON, or applying external power supplies. If fault flag output is unused, /OC pin should be connected to open or
ground line.
VCTRL
CTRL
CTRL
V
V
VEN
EN
VOUT
V
VOUT
OUT
IOUT
IOUT
OUT
Output Short
shortcircuit
Output
Circuit
Thermal
shut down
Thermal Shutdown
V
VFLAG
FLAG
FLAG
V
V/OC
/OC
FLAG
delay Output Delay
Figure 61. BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ Over Current Detection, Thermal Shutdown Timing Diagram
(V CTRL , V /EN of BD6517F/BD2042AFJ Active Low)
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BD6516F BD6517F BD2042AFJ
Datasheet
BD2052AFJ
Power Dissipation
(SOP8, SOP-J8)
700
Power Dissipation: Pd[mW]
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75
100
AMBIENT
[℃]
AmbientTEMPERATURE
Temperature:: TaTa[°C]
125
150
70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 62. Power Dissipation Curve
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Datasheet
BD2052AFJ
I/O Equivalence Circuit
BD6516F/BD6517F
Symbol
Pin No.
CTRLA
CTRLB
1, 4
Equivalence Circuit
CTRLA
CTRLB
FLAGA
FLAGB
FLAGA
FLAGB
2, 3
OUTA
OUTB
5, 8
OUTA
OUTB
BD2042AFJ/BD2052AFJ
Symbol
Pin No
/EN1(EN1)
/EN2(EN2)
Equivalence Circuit
/EN1(EN1)
/EN2(EN2)
3, 4
/OC1
/OC2
/OC1
/OC2
OUT1
OUT2
5, 8
OUT1
OUT2
6, 7
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Datasheet
BD2052AFJ
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
BD2052AFJ
Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 63. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
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Datasheet
BD2052AFJ
Ordering Information
B
D
6
5
1
x
D
-
Package
F: SOP8
Part Number
6516
6517
B
F
2
0
x
2
A
Part Number
2042
2052
F
E2
Packaging and forming specification
E2: Embossed tape and reel
(SOP8)
J
-
Package
FJ:SOP-J8
E2
Packaging and forming specification
E2: Embossed tape and reel
(SOP-J8)
Marking Diagrams
SOP8 (TOP VIEW)
SOP-J8 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Part Number
Part Number Marking
Part Number
Part Number Marking
BD6516F
D6516
BD2042AFJ
D042A
D6517
BD2052AFJ
D052A
BD6517F
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Datasheet
BD2052AFJ
Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include. BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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BD2052AFJ
Datasheet
Physical Dimension, Tape and Reel Information – continued
Package Name
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Datasheet
BD2052AFJ
Revision History
Date
Revision
11.Mar.2013
25.Jun.2013
001
002
21.Aug.2014
003
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© 2013 ROHM Co., Ltd. All rights reserved.
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Changes
New Release
Changed character color from RED to BLACK on page 6.
Applied the ROHM Standard Style and improved understandability.
Delete BD6512F and BD6513F.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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