Datasheet
Load Switch ICs
2.0A Current Load Switch ICs
for Portable Equipment
BD6520F BD6522F
General Description
BD6520F and BD6522F are power management
switches (N-Channel Power MOSFET) with an ONResistance of 50mΩ (Typ). An internal charge pump
drives the gate of the N-Channel Power MOSFET. Also,
an external capacitor can be connected to the soft start
control terminal, thus achieving reduction of the inrush
current to the load capacitor during turn on.
Furthermore, these ICs have undervoltage lockout,
thermal shutdown and a discharge circuit for the
capacitive load at switch OFF.
Key Specifications
Input Voltage Range:
3.0V to 5.5V
ON-Resistance:
R ON1 (at V DD = 5V BD6520F, BD6522F) 50mΩ (Typ)
60mΩ (Typ)
R ON2 (at V DD = 3V BD6520F)
R ON2 (at V DD = 3.3V BD6522F)
60mΩ (Typ)
Continuous Current:
2.0 A
Operating Temperature Range:
-25°C to +85°C
W (Typ)
Package
D (Typ)
H (Max)
Features
Low ON-Resistance (50mΩ, Typ) NMOS Switch
Maximum Output Current: 2A
Discharge Circuit
Soft Start Control
Undervoltage Lockout (UVLO)
Thermal Shutdown (Output OFF Latching)
Reverse Current Flow Blocking at Switch OFF
(Only in BD6522F)
Applications
SOP8
5.00mm x 6.20mm x 1.71mm
Notebook PCs
PC Peripheral Devices
Typical Application Circuit
BD6520F
Power Supply
VDDA
OUTA
VDDB
OUTB
SSCTL
OUTC
1µF
Css
ON/OFF
CTRL
Load
VSS
Lineup
3µs
Reverse Current Flow
Blocking at Switch OFF
-
SOP8
Reel of 2500
Orderable Part
Number
BD6520F-E2
4µs
○
SOP8
Reel of 2500
BD6522F-E2
OUT Rise Time
OUT Fall Time
1000µs
1000µs
Package
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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BD6520F BD6522F
Block Diagrams
(BD6520F)
VDDA
OUTA
1
8
VDDB
OUTB
2
7
Oscillator
SSCTL
3
Charge
OUTC
6
Pump
＋
UVLO
－
Band
Thermal
Gap
Shutdown
S
Q
FF
R
CTRL
4
VSS
Figure 1. Block Diagram (BD6520F)
5
(BD6522F)
VDDA
OUTA
1
8
VDDB
OUTB
2
7
Oscillator
SSCTL
3
Charge
Pump
＋
UVLO
－
Band
Thermal
Gap
Shutdown
CTRL
DISC
S
Q
6
FF
R
4
VSS
5
Figure 2. Block Diagram (BD6522F)
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BD6520F BD6522F
Pin Configurations
BD6520F
(TOP VIEW)
BD6522F
(TOP VIEW)
1
VDDA
OUTA 8
1
VDDA
OUTA 8
2
VDDB
OUTB 7
2
VDDB
OUTB
7
3
SSCTL
OUTC 6
3
SSCTL
DISC
6
4
CTRL
VSS 5
4
CTRL
VSS 5
Pin Descriptions
BD6520F
Pin No.
Symbol
1,2
VDDA, VDDB
3
SSCTL
4
CTRL
5
VSS
6,7,8
OUTA, OUTB, OUTC
BD6522F
Pin No.
Pin Function
Switch input pin
When in use, connect each pin externally.
Soft start setting pin
Adding an external capacitor makes it possible to delay
switching (ON or OFF) time.
Control input pin
Switch on at high level, switch OFF at low level.
Ground
Switch output pin
When in use, connect each pin externally.
Symbol
Pin Function
Switch input pin
When in use, connect each pin externally.
Soft start setting pin
Adding an external capacitor makes it possible to delay
switching (ON or OFF) time.
Control input pin
Switch ON at high level, switch OFF at low level.
1,2
VDDA, VDDB
3
SSCTL
4
CTRL
5
VSS
Ground
6
DISC
Discharge pin
7,8
OUTA, OUTB
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TSZ22111･15･001
Switch output pin
When in use, connect each pin externally.
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BD6520F BD6522F
Absolute Maximum Ratings
Parameter
Supply Voltage
Symbol
Rating
Unit
V DD
-0.3 to +6.0
V
CTRL Input Voltage
V CTRL
-0.3 to +6.0
V
Switch Output Voltage
V OUT
-0.3 to V DD +0.3 (BD6520F)
V
Storage Temperature
Tstg
Power Dissipation
-0.3 to +6.0 (BD6522F)
V
-55 to +150
°C
Pd
0.69
(Note 1)
W
o
o
(Note 1)
Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.5mW/ C above Ta=25 C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Supply Voltage
Symbol
V DD
Rating
Min
Typ
Max
3.0
-
5.5
Unit
V
Switch Current
I OUT
0
-
2
A
Operating Temperature
Topr
-25
-
+85
°C
Electrical Characteristics
BD6520F (Unless otherwise specified, Ta= 25°C, V DD = 5V)
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
R ON1
-
50
70
mΩ
V DD = 5V, V CTRL = 5V
R ON2
-
60
85
mΩ
V DD = 3V, V CTRL = 3V
I DD
-
110
220
µA
V CTRL = 5V, OUT= OPEN
I DDST
-
-
2
µA
V CTRL = 0V, OUT= OPEN
V CTRLL
-
-
0.7
V
V CTRLL = Low Level
V CTRLH
2.5
-
-
V
V CTRLH = High Level
I CTRL
-1
0
+1
µA
V CTRL = L, H
Turn ON Delay
t rd
200
1000
2000
µs
Turn ON Rise Time
tr
500
2000
7500
µs
Turn OFF Delay
t fd
-
3
20
µs
Turn OFF Fall Time
tf
-
1
20
µs
R SWDC
-
350
600
Ω
V DD = 5V, V CTRL = 0V, V OUT = 5V
V UVLOH
2.3
2.5
2.7
V
V DD Increasing
V UVLOL
2.1
2.3
2.5
V
V DD Decreasing
UVLO Hysteresis Voltage
V HYS
100
200
300
mV
V HYS = V UVLOH - V UVLOL
Thermal Shutdown Threshold
T TS
-
135
-
°C
V CTRL = 5V
V SSCTL
-
13.5
-
V
V CTRL = 5V
ON-Resistance
Operating Current
Control Input Voltage
Control Input Current
Discharge Resistance
UVLO Threshold Voltage
SSCTL Output Voltage
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R L = 10Ω, SSCTL = OPEN
CTRL= L→H → OUT=50%
R L = 10Ω, SSCTL= OPEN
OUT= 10% to 90%
R L = 10Ω, SSCTL= OPEN
CTRL= H→L → OUT=50%
R L = 10Ω, SSCTL= OPEN
OUT= 90% to 10%
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BD6520F BD6522F
Electrical Characteristics - continued
BD6522F (Unless otherwise specified, Ta= 25°C, V DD = 5V)
Limit
Parameter
Symbol
Min
Typ
ON-Resistance
Operating Current
R ON1
-
R ON2
-
I DD
-
I DDST
-
Unit
Max
50
Conditions
70
mΩ
V DD = 5V, V CTRL = 5V
60
85
mΩ
V DD = 3.3V, V CTRL = 3.3V
110
220
µA
V CTRL = 5V, OUT= OPEN
-
2
µA
V CTRL = 0V, OUT= OPEN
V CTRLL
-
-
0.7
V
V CTRLL = Low Level
V CTRLH
2.5
-
-
V
V CTRLH = High Level
I CTRL
-1
0
+1
µA
Turn ON Time
t ON
-
1000
3500
µs
Turn OFF Time
t OFF
-
4
20
µs
R SWDC
-
350
600
Ω
V CTRL = L, H
R L = 10Ω, SSCTL= OPEN
CTRL= H → OUT= 90%
R L = 10Ω, SSCTL= OPEN
CTRL= L → OUT= 10%
V DD = 5V, V CTRL = 0V
V UVLOH
2.3
2.5
2.7
V
V DD Increasing
V DD Decreasing
Control Input Voltage
Control Input Current
Discharge Resistance
UVLO Threshold Voltage
V UVLOL
2.1
2.3
2.5
V
UVLO Hysteresis Voltage
V HYS
100
200
300
mV
V HYS = V UVLOH - V UVLOL
Thermal Shutdown Threshold
T TS
-
135
-
°C
V CTRL = 5V
V SSCTL
-
13.5
-
V
V CTRL = 5V
SSCTL Output Voltage
Measurement Circuit
VDD
VDD
BD6520F
VDDA
OUTA
VDDA
OUTA
VDDB
OUTB
VDDB
OUTB
SSCTL
OUTC
SSCTL
DISC
CTRL
CSS
BD6522F
VSS
RL CL
IOUT
VCTRL
CTRL
CSS
VSS
RL CL
IOUT
VCTRL
Figure 3. Measurement Circuit
Timing Diagram
BD6522F
BD6520F
tr
tf
90%
VOUT
90%
50%
10%
50%
trd
10%
10%
tfd
tON
VCTRL
90%
VOUT
VCTRLH
tON
tOFF
VCTRL
VCTRLL
VCTRLH
tOFF
VCTRLL
Figure 4. Timing Diagram
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BD6520F BD6522F
Typical Performance Curves
BD6520F
80
Ta = 25°C
70
70
ON-Resistance: RON [mΩ]
ON RESISTANCE : Ron [mΩ]
ON-Resistance: RON [mΩ]
ON RESISTANCE : Ron [mΩ]
80
60
50
40
30
20
10
3
4
5
6
40
VDD=3.0V
30
VDD=3.3V
VDD=5.0V, 5.5V
20
10
-20
0
20
40
60
80
Supply Voltage:
[V][V]
VDD
[V]
SUPPLY
VOLTAGEV:DD
VDD
AMBITENT
TEMPERATURE
Ta [℃]
Ambient Temperature:
Ta :[°C]
AMBIENT
Figure 5. ON-Resistance vs Supply Voltage
Figure 6. ON-Resistance vs Ambient
Temperature
120
100
120
Ta = 25°C
80
60
40
20
3
4
5
100
80
60
40
20
0
-40
0
2
VDD = 5.0V
[µA]
100
Operating Current: I
OPERATING CURRENTDD
: I DD [uA]
Operating Current: IDD [µA]
OPERATING CURRENT : I DD [uA]
50
0
-40
0
2
60
6
-20
0
20
40
60
80
100
[V]
Supply Voltage:
VDD
SUPPLY
VOLTAGE
: VDD
V[V]
DD [V]
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
AMBIENT
[℃]
Figure 7. Operating Current vs Supply
Voltage
(CTRL Enable)
Figure 8. Operating Current vs Ambient
Temperature
(CTRL Enable)
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BD6520F BD6522F
Typical Performance Curves - continued
1.0
Ta = 25°C
VDD = 5.0V
0.06
0.04
0.02
0.00
2
3
4
5
0.2
0
20
40
60
80
100
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
AMBIENT
Figure 9. Operating Current vs Supply
Voltage
(CTRL Disable)
Figure 10. Leak Current vs Ambient
Temperature
2.5
Control Input Voltage: V CTRL[V]
CTRL INPUT VOLTAGE : VCTRL
[V]
2.0
Low to High
High to Low
1.0
0.5
0.0
2
0.4
VDD
[V]
Supply Voltage:
[V][V]
SUPPLY
VOLTAGEV:DD
VDD
Ta = 25°C
1.5
0.6
0.0
6
2.5
Control Input Voltage: VCTRL [V]
CTRL INPUT VOLTAGE : V CTRL [V]
0.8
LEAK
Leak Current: ILEAK [µA]
[uA]
0.08
LEAK CURRENT : I
Operating Current: IDDST [µA]
OPERATING CURRENT : I DDST [uA]
0.10
3
4
5
2.0
1.5
1.0
0.5
0.0
6
-40
VDD
[V]
DD
SUPPLY
VOLTAGE
:V
Supply Voltage:
VDD
[V][V]
-20
0
20
40
60
80
100
AMBIENT
Ta [℃]
AmbientTEMPERATURE
Temperature: Ta: [°C]
Figure 11. Control Input Voltage vs
Supply Voltage
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TSZ22111･15･001
VDD = 5.0V
Figure 12. Control Input Voltage vs
Ambient Temperature
(H to L)
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BD6520F BD6522F
Typical Performance Curves - continued
2.5
0.4
CTRL HYSTERESIS : V
2.0
1.5
1.0
0.5
0.0
-20
0
20
40
60
80
0.2
0.1
100
2
5
Figure 13. Control Input Voltage
vs Ambient Temperature
(L to H)
Figure 14. Control Hysteresis
Voltage vs Supply Voltage
6
5
Ta = 25°C
Turn ON Time: tON [ms]
TURN ON TIME :Ton [ms]
[V]
4
SUPPLY
VOLTAGE
: VDD
VDD
Supply Voltage:
VDD
[V][V][V]
VDD = 5.0V
0.3
0.2
0.1
0
-40
3
AmbientTEMPERATURE
Temperature: Ta: [°C]
AMBIENT
Ta [℃]
0.4
CTRL HYSTERESIS : V
0.3
0
-40
Control Hysteresis: VCTRLHYS
[V]
CTRLHYS
Ta = 25°C
[V]
CTRLHYS
Control Hysteresis: VCTRLHYS [V]
CTRL
CTRL INPUT VOLTAGE : V
Control Input Voltage: VCTRL [V]
[V]
VDD = 5.0V
-20
0
20
40
60
80
4
tON
3
tr
2
trd
1
0
100
2
3
4
5
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
AMBIENT
[℃]
VDD
[V]
SUPPLY
VDD
Supply VOLTAGE
Voltage: V:DD
[V][V]
Figure 15. Control Hysteresis
Voltage vs Ambient Temperature
Figure 16. Turn ON Time vs Supply
Voltage
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BD6520F BD6522F
Typical Performance Curves - continued
5
7
3
tON
2
tr
trd
1
0
-40
TURN OFF TIME : Toff [us
4
Turn OFF Time: tOFF [µs]
Turn ON Time: tON [ms]
TURN ON TIME : Ton [ms]
VDD = 5.0V
-20
0
20
40
60
80
Ta = 25°C
6
tOFF
5
tfd
4
3
tf
2
1
0
100
2
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
AMBIENT
[℃]
3
Turn OFF Time: tOFF [µs]
TURN OFF TIME : Toff [us]
VDD = 5.0V
6
tOFF
5
4
tfd
3
2
tf
1
0
-40
-20
0
20
40
60
80
100
6
500
Ta = 25°C
400
300
200
100
0
2
3
4
5
6
VDD
[V]
SupplyVOLTAGE
Voltage: V:DD
[V][V]
SUPPLY
VDD
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
AMBIENT
Figure 19. Turn OFF Time vs
Ambient Temperature
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TSZ22111･15･001
5
Figure 18. Turn OFF Time
vs Supply Voltage
Discharge Resistance: RSWDC [Ω]
DISCHARGE RESISTANCE : R SWDC [Ω]
Figure 17. Turn ON Time
vs Ambient Temperature
7
4
VDD
[V]
SupplyVOLTAGE
Voltage: V: DD
SUPPLY
V
DD[V]
[V]
Figure 20. Discharge
Resistance vs Supply Voltage
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BD6520F BD6522F
3.0
[V]
VDD = 5.0V
UVLO THRESHOLD : V
400
300
200
100
0
-40
0
20
40
60
80
2.8
2.6
VDD Increasing
2.4
VDD Decreasing
2.2
2.0
-40
-20
0
20
40
60
80
100
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
AMBIENT
[℃]
AMBIENT
[℃]
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
Figure 21. Discharge
Resistance vs Ambient Temperature
Figure 22. UVLO Threshold Voltage
vs Ambient Temperature
100
VDD = 5.0V
VDD = 5.0V, Ta = 25°C, RL = 10Ω
0.2
0.1
0
-40
VDD = 5.0V
100
Turn ON Time: tON [ms]
0.3
-20
TURN ON TIME : Ton [ms]
Discharge Resistance: R
UVLO HYSTERESIS : V UVLOHYS [V]
UVLO Hysteresis Voltage: VUVLOHYS [V]
UVLO Threshold Voltage:UVLO
VUVLO [V]
500
[Ω]
DISCHARGE RESISTANCE : SWDC
R SWDC [Ω]
Typical Performance Curves - continued
-20
0
20
40
60
80
1
100
1
AmbientTEMPERATURE
Temperature: Ta: [°C]
AMBIENT
Ta [℃]
10
100
1000
10000
Css [pF]
Figure 24. Turn ON Time vs CSS
Figure 23. UVLO Hysteresis Voltage vs
Ambient Temperature
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BD6520F BD6522F
Typical Performance Curves - continued
16
VDD = 5.0V, Ta = 25°C, RL = 10Ω
SSCTL VOLTAGE : V SSCTL [V]
SSCTL Output Voltage: VSSCTL [V]
Turn OFF Time: tOFF [µs]
TURN OFF TIME : Toff [us]
100
10
1
SSCTL Output Voltage: VSSCTL [V]
SSCTL VOLTAGE : V SSCTL [V]
14
12
10
8
6
4
2
0
1
16
Ta = 25°C
14
10
100
1000
10000
2
3
4
5
Css [pF]
VDD
[V]
Supply VOLTAGE
Voltage: V:DD
[V][V]
SUPPLY
V
DD
Figure 25. Turn OFF Time vs Css
Figure 26. SSCTL Output Voltage
vs Supply Voltage
6
VDD = 5.0V
12
10
8
6
4
2
0
-40
-20
0
20
40
60
80
100
AmbientTEMPERATURE
Temperature: Ta: [°C]
AMBIENT
Ta [℃]
Figure 27. SSCTL Output Voltage
vs Ambient Temperature
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BD6520F BD6522F
Typical Performance Curves - continued
BD6522F
80
Ta = 25°C
70
ON-Resistance: RON [mΩ]
70
ON RESISTANCE : Ron [mΩ]
ON-Resistance: R
[mΩ]
ON
ON RESISTANCE : Ron
[mΩ]
80
60
50
40
30
20
10
0
2
3
4
5
60
50
40
30
10
[V]
Supply Voltage:
VDD
SUPPLY
VOLTAGE
: VDD
VDD[V]
[V]
-20
0
20
40
60
80
100
AMBIENT
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
Figure 28. ON-Resistance vs
Supply Voltage
Figure 29. ON-Resistance vs
Ambient Temperature
120
120
[uA]
Ta = 25°C
DD
Operating Current: IDD [µA]
100
OPERATING CURRENT : I
Operating Current: IDD [µA]
OPERATING CURRENT : I DD [uA]
VDD=5.0V
20
0
-40
6
VDD=3.3V
80
60
40
20
3
4
5
80
60
40
20
0
-40
0
2
VDD = 5.0V
100
6
-20
0
20
40
60
80
[V]
Supply CURRENT
Voltage: VDD
[V][V]
SUPPLY
: VDD
VDD
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
AMBIENT
[℃]
Figure 30. Operating Current vs Supply
Current
(CTRL Enable)
Figure 31. Operating Current vs
Ambient Temperature
(CTRL Enable)
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TSZ02201-0E3E0H300250-1-2
21.Aug.2014 Rev.002
BD6520F BD6522F
Typical Performance Curves - continued
1.0
Ta = 25°C
[uA]
VDD = 5.0V
0.8
LEAK
Leak Current: ILEAK [µA]
0.08
0.06
LEAK CURRENT : I
Operating Current: IDDST [µA]
OPERATING CURRENT : I DDST [uA]
0.10
0.04
0.02
0.6
0.4
0.2
0.0
0.00
2
3
4
5
0
6
20
VDD
[V]
Supply VOLTAGE
Voltage: V:DD
SUPPLY
VDD[V]
[V]
80
100
Figure 33. Leak Current vs Ambient
Temperature
2.5
2.5
Ta = 25°C
Control Input Voltage: VCTRL [V]
CTRL INPUT VOLTAGE : V CTRL [V]
Control Input Voltage: VCTRL [V]
60
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C]
AMBIENT
[℃]
Figure 32. Operating Current vs
Supply Voltage
(CTRL Disable)
CTRL INPUT VOLTAGE : V CTRL [V]
40
2.0
Low to High
1.5
High to Low
1.0
0.5
VDD = 5.0V
2.0
High to Low
1.5
Low to High
1.0
0.5
0.0
0.0
2
3
4
5
-40
6
VDD
[V]
SUPPLY
VOLTAGEV:DD
VDD
Supply Voltage:
[V][V]
0
20
40
60
80
100
AMBIENT
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
Figure 35. Control Input Voltage
vs Ambient Temperature
Figure 34. Control Input Voltage
vs Supply Voltage
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Typical Performance Curves - continued
0.4
Ta = 25°C
CTRL HYSTERESIS : V CTRLHYS [V]
Control Hysteresis: VCTRLHYS [V]
Control Hysteresis: VCTRLHYS [V]
CTRL HYSTERESIS : V CTRLHYS [V]
0.4
0.3
0.2
0.1
VDD = 5.0V
0.3
0.2
0.1
0.0
0
2
3
4
5
-40
6
VDD
[V]
SUPPLY
VDD[V]
[V]
Supply VOLTAGE
Voltage: V:DD
0
20
40
60
80
100
AMBIENT
Ta [℃]
Ambient TEMPERATURE
Temperature: Ta: [°C]
Figure 36. Control Hysteresis Voltage
vs Supply Voltage
Figure 37. Control Hysteresis Voltage
vs Ambient Temperature
5
5
Ta = 25°C
VDD = 5.0V
4
Turn ON Time: tON [ms]
TURN ON TIME : Ton [ms]
Turn ON Time: tON [ms]
TURN ON TIME : Ton [ms]
-20
3
2
1
3
4
5
3
2
1
0
-40
0
2
4
6
-20
0
20
40
60
80
VDD
[V]
SUPPLY
VOLTAGE
:V
DD
Supply Voltage:
VDD
[V][V]
AMBIENT
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
Figure 38. Turn ON Time vs Supply
Voltage
Figure 39. Turn ON Time vs Ambient
Temperature
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Typical Performance Curves - continued
7
7
Ta = 25°C
Turn OFF Time: tOFF [µs]
TURN OFF TIME : Toff [us]
Turn OFF Time: tOFF [µs]
TURN OFF TIME : Toff [us]
5
4
3
2
1
3
4
5
6
4
3
2
1
-20
0
20
40
60
80
VDD
[V]
SUPPLY
VDD
Supply VOLTAGE
Voltage: V:DD
[V][V]
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
AMBIENT
Figure 40. Turn OFF Time vs Supply Voltage
Figure 41. Turn OFF Time vs Ambient
Temperature
Discharge Resistance: RSWDC [Ω]
Ta = 25°C
400
SWDC
[Ω]
500
DISCHARGE RESISTANCE : R
SWDC
Discharge Resistance: RSWDC [Ω]
[Ω]
2
5
0
-40
0
DISCHARGE RESISTANCE : R
VDD = 5.0V
6
6
300
200
100
0
2
3
4
5
6
[V]
Supply Voltage:
VDD
[V][V]
SUPPLY
VOLTAGE
: VDD
VDD
500
VDD = 5.0V
400
300
200
100
0
-40
-20
0
20
40
60
80
100
Ambient TEMPERATURE
Temperature: Ta: Ta
[°C][℃]
AMBIENT
Figure 43. Discharge Resistance vs
Ambient Temperature
Figure 42. Discharge Resistance
vs Supply Voltage
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Typical Performance Curves - continued
UVLO HYSTERESIS : V UVLOHYS [V]
UVLO Hysteresis Voltage: VUVLOHYS [V]
UVLO THRESHOLD : V UVLO [V]
UVLO Threshold Voltage: VUVLO [V]
3.0
Ta = 25°C
2.8
2.6
VDD Increasing
2.4
VDD Decreasing
2.2
2.0
-40
-20
0
20
40
60
80
100
0.3
VDD = 5.0V
0.2
0.1
0
-40
Figure 44. UVLO Threshold Voltage
vs Ambient Temperature
20
40
60
80
100
Figure 45. UVLO Hysteresis Voltage vs
Ambient Temperature
100
VDD = 5.0V, Ta = 25°C, RL = 10Ω
Turn OFF Time: tOFF [µs]
TURN OFF TIME : Toff [us]
Turn ON Time: tON [ms]
TURN ON TIME : Ton [ms]
0
AmbientTEMPERATURE
Temperature: Ta
[°C]
AMBIENT
: Ta
[℃]
AMBIENT
[℃]
Ambient TEMPERATURE
Temperature: Ta: Ta
[°C]
100
-20
10
1
VDD = 5.0V, Ta = 25°C, RL = 10Ω
10
1
1
10
100
1000
10000
1
10
100
1000
Css [pF]
Css [pF]
Figure 46. Turn ON Time vs CSS
Figure 47. Turn OFF Time vs CSS
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Typical Performance Curves - continued
16
Ta = 25°C
[V]
14
SSCTL Output Voltage: VSSCTL [V]
SSCTL
12
10
SSCTL VOLTAGE : V
SSCTL VOLTAGE : V SSCTL [V]
SSCTL Output Voltage: VSSCTL [V]
16
8
6
4
2
3
4
5
6
VDD
[V]
SUPPLY
VOLTAGE
VDD
Supply Voltage:
V:DD
[V][V]
12
10
8
6
4
2
-20
0
20
40
60
80
100
AmbientTEMPERATURE
Temperature: Ta: Ta
[°C][℃]
AMBIENT
Figure 48. SSCTL Output Voltage
vs Supply Voltage
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VDD = 5.0V
0
-40
0
2
14
Figure 49. SSCTL Output Voltage
vs Ambient Temperature
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BD6520F BD6522F
Typical Wave Forms
V DD = 5V, C L = 47µF, R L = 47Ω, unless otherwise specified.
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VOUT
(2V/div.)
VOUT
(2V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME (5ms/div.)
TIME (1ms/div.)
Figure 51. Turn OFF Fall Time
(BD6520F)
Figure 50. Turn ON Rise Time
(BD6520F)
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VOUT
(2V/div.)
VOUT
(2V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME (5ms/div.)
TIME (1ms/div.)
Figure 53. Turn OFF Fall Time
(BD6522F)
Figure 52. Turn ON Rise Time
(BD6522F)
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Typical Wave Forms - continued
VCTRL
(5V/div.)
VCTRL
(5V/div.)
CL=330uF
CL=330μF
Open
Open
470pF
1000pF
2200pF
4700pF
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Figure 55. Inrush Current vs Css
(BD6522F)
Figure 54. Inrush Current vs Css
(BD6520F)
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VOUT
(2V/div.)
VOUT
(2V/div.)
Temperature Decline
DISC terminal in use
Thermal Shutdown
TIME (20ms/div.)
TIME (500ms/div.)
Figure 56. Discharge: CL = 47μF, RL = Open
(BD6522F)
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Figure 57. Thermal Shutdown
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Typical Wave Forms - continued
VDD
(2V/div.)
VDD
(2V/div.)
VOUT
(2V/div.)
VOUT
(2V/div.)
TIME (500ms/div)
TIME (500ms/div)
Figure 59. UVLO
(at VDD Decrease)
Figure 58. UVLO
(at VDD Increase)
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BD6520F BD6522F
Typical Application Circuits
BD6520F
Power Supply
VDDA
1µF
OUTB
SSCTL
OUTC
CTRL
VSS
CSS
ON/OFF
OUTA
VDDB
Load
CSS
ON/OFF
OUTA
VDDB
OUTB
SSCTL
DISC
CTRL
VSS
CSS
ON/OFF
OUTA
VDDB
OUTB
SSCTL
DISC
CTRL
VSS
Load
Figure 61. Power Supply Switch Circuit (BD6522F)
BD6522F
BD6522F
VDDA
VDDA
1µF
Figure 60. Power Supply Switch Circuit (BD6520F)
Power Supply A
BD6522F
Power Supply
Power Supply B
CSS
ON/OFF
VDDA
OUTA
VDDB
OUTB
SSCTL
DISC
CTRL
VSS
Load
Figure 62. 2 Power Supply Changeover Switch Circuit (BD6522F)
Application Information
1. Functional Description
(1) Switch Operation
VDD pin and OUT pin are connected to the drain and source of the Power MOSFET (switch) respectively. VDD also
serves as the power source input to the internal control circuit.
When CTRL input is set to high and the switch is turned ON, VDD and OUT are connected by a 50mΩ resistance.
Normally, current flows from VDD to OUT. But since the switch is bidirectional, if the voltage of OUT is higher than that
of VDD, current flows from OUT to VDD.
In BD6520F, there is a parasitic diode between the drain and the source of switch. Therefore, when the switch is OFF
and the voltage of OUT is higher than that of VDD, current will flow from OUT to VDD. In BD6522F, there is no parasitic
diode, thus, current flow from OUT to VDD is prevented.
(2) Thermal Shutdown
The thermal shut down circuit turns OFF the switch when the junction temperature exceeds 135°C (Typ). However, the
CTRL signal should be active for thermal shutdown to work.
The switch OFF status of the thermal shut down is latched. Therefore, even when the junction temperature goes down,
OFF status is maintained. There are two ways to release the latch, first is by toggling the CTRL pin from H to L to H.
Second, is by resetting the power supply V DD .
(3) Under Voltage Lockout (UVLO)
The UVLO circuit compares the VDD voltage with the UVLO threshold (2.5V rising, 2.3V falling, Typ) to ensure that V DD
is high enough for reliable operation. The 200mV (Typ) hysteresis prevents supply transients from causing a shutdown.
Once V DD exceeds the UVLO rising threshold, start-up begins. When V DD falls below the UVLO falling threshold, the
circuit turns OFF the switch. However, the CTRL input should be active for UVLO to work.
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(4) Soft Start Control
BD6520F/BD6522F has a soft start control to reduce inrush current at switch ON.
By connecting an external capacitor between SSCTL and GND, switch rise time can be smoothened. When the switch
is enabled, SSCTL outputs a voltage of about 13.5V. The SSCTL terminal requires high impedance, therefore, proper
packaging should be observed to avoid leak current. When a certain value of voltage is supplied to SSCTL, switching is
disabled.
(5) Discharge Circuit
When the switch between VDD and OUT is OFF, the 350Ω (Typ) discharge switch resistance between OUT and GND
turns on. By turning ON this switch, the electric current stored by the capacitive load is discharged.
In BD6522F, the input of the discharge circuit (DISC) is separated from the OUT pin. When the discharge circuit is used,
simply connect OUT and DISC to ensure proper operation.
Timing Diagram
VDD
VCTRL
VOUT
Discharge Circuit
ON
OFF
ON
Figure 63. Normal Operation
VDD
VUVLOH
VUVLOL
VCTRL
VOUT
Discharge Circuit
ON
OFF
Figure 64. UVLO Operation
Over temperature
occurs
Over temperature
corrected
Over temperature
occurs
Over temperature
corrected
VDD
VCTRL
VOUT
Latch
Discharge Circuit
Release
OFF
Set
Release
ON
OFF
Release
Set
Release
OFF
Figure 65. Thermal Shutdown Operation
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Power Dissipation
(SOP8)
700
Power Dissipation: Pd[mW]
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75
100
AMBIENT
[℃]
AmbientTEMPERATURE
Temperature:: TaTa[°C]
125
150
70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 66. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Equivalence Circuit
BD6520F
Pin No.
Equivalence Circuit
BD6522F
SSCTL
SSCTL
3
CTRL
4
CTRL
CTRL
DISC
DISC
6
(BD6522F)
OUT
6 (BD6520F),
7, 8
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OUT
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 67. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD6520F BD6522F
Ordering Information
B
D
6
5
2
0
Part Number
B
D
F
-
E2
Package
F: SOP8
6
5
2
Part Number
2
F
Packaging and forming specification
E2: Embossed tape and reel
-
E2
Package
F: SOP8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number
Part Number Marking
BD6520F
D6520
BD6522F
D6522
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Physical Dimension Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Revision History
Date
11.Mar.2013
21.Aug.2014
Revision
001
002
Changes
New Release
Applied the ROHM Standard Style and improved understandability.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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