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BD6524HFV-TR

BD6524HFV-TR

  • 厂商:

    ROHM(罗姆)

  • 封装:

    SMD6

  • 描述:

    IC PWR MANAGEMENT SWITCH HVSOF6

  • 数据手册
  • 价格&库存
BD6524HFV-TR 数据手册
Package Information : HVSOF6                                                                                                             1. Package Information                                                                                            Package Name Type Pin Count Outline Dimension Drowing No. Package Weight [g] Lead Finish MSL Level     HVSOF6       SOP    6     EX162-5001     0.0077 Pure Tin       Level1                                                                                                                                                              2. Package Structure                                                                                                                                                                                                                                                                                                                                                                                                   www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved       1/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001      HVSOF6                               Package Information 3. Packing Specification 3.1 Packing form, Quantity, PIN1 Orientation Packing Form Packing Quantity PIN 1 Orientation [pcs] Tape&Reel 3,000 TR 3.2 Use material   Item Embossed carrier tape Cover tape Reel Unit box   Shipping box Material PS PET+PE PS Cardboard Cardboard 3.3 Leader specification No component pockets are160 mm or more. 3.4 Trailer specification No component pockets are 40 mm or more. Tape is free from reel. 3.5 Peelback strength Cover tape peelback strength is 0.2 N to 0.7 N. Fig. 2 Test method 3.6 Missing Ics (1) No consecutive dropouts. (2) A maximun 0.1 % of specified number of products in each packing may be missing.                                             www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved     2/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001 HVSOF6                                    Package Information 3.7 Tape and Reel Specification 3.7.1 Tape Dimension                                             www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved     3/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001      HVSOF6 Package Information                               3.7.2 Reel Dimension (unit:mm)             A   B C D E W1   W2   Reel Dimension           180       60 13 21 2 9 11.4       Reel Tolerance +0/-1.5 +1.0/-0 ±0.2 ±0.8 ±0.5 +1.0/-0 ±1.0                                                         www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved     4/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001 HVSOF6                                    Package Information 3.8 Packing Method 3 reel(s) or less per unit box 3.9 Packing Style 4 unit boxes or less per shipping box (unit:mm) Shipping Box Dimension X Y  Z 190 255     193 3.10 Label Specification                                             www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved     5/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001      HVSOF6                               Package Information 4. Footprint dimensions (unit:mm) In actual design, please optimize in accordance with the situation of your board design and soldering condition.                                             www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved     6/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001      HVSOF6                               Package Information 5. Marking Specification 6. Storage conditions 6.1 Storage environment Recommended storage conditions                   Min.     Temperature 5   Humidity 40   Max. 30 70    Max. 1    Unit °C     % RH 6.2 Storage period                     Storage period Min. -         Unit year                                             www.rohm.com   ©2016 ROHM Co., Ltd. All rights reserved     7/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001 HVSOF6                                    Package Information 7. Soldering conditions 7.1 Recommended temperature profile for reflow 7.2 For wave soldering The wave soldering method is not supported. 7.3 For solder iron Rework by soldering iron is not allowed or it may cause mold crack and terminal open.                                                     www.rohm.com ©2016 ROHM Co., Ltd. All rights reserved 8/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001 HVSOF6                                    Package Information 7.4 Caution for solder mounting 7.4.1 For mounting on flexible film Mounting on flexible film, film bend may occur lack of lead from package, usage of support board and under fill is recommended. 7.4.2 For Mounting long and narrow board Mounting on long and narrow board, bending stress may occur a luck of lead from package, bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended.                                                            www.rohm.com ©2016 ROHM Co., Ltd. All rights reserved 9/9 TSZ02201-HVSOF6-1-2 2016/09/19 - Rev. 001 Notice Notes 1) The information contained herein is subject to change without notice. 2) Before you use our Products, please contact our sales representative and verify the latest specifications : 3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM. 4) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 5) The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. 6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. 7) The Products specified in this document are not designed to be radiation tolerant. 8) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 9) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. 11) ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. 12) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 13) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 201 ROHM Co., Ltd. All rights reserved. R1102A
BD6524HFV-TR 价格&库存

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BD6524HFV-TR
    •  国内价格
    • 50+4.69533
    • 100+4.47592
    • 250+4.27407

    库存:0

    BD6524HFV-TR
      •  国内价格 香港价格
      • 1+5.953131+0.72128
      • 10+4.8773610+0.59094
      • 50+2.7905350+0.33810
      • 100+2.65303100+0.32144
      • 500+2.22434500+0.26950
      • 1000+2.151541000+0.26068
      • 2000+1.997862000+0.24206
      • 4000+1.973604000+0.23912

      库存:0