Datasheet
Load Switch ICs
0.5A Current Load Switch ICs
for Portable Equipment
BD6528HFV
BD6529GUL
General Description
Key Specifications
BD6528HFV and BD6529GUL are high side switch IC
using an N-Channel Power MOSFET and used as a
power switch for memory card slot. This switch IC has
an ON-Resistance of 100mΩ for BD6529GUL and
110mΩ for BD6528HFV. Operations using low input
voltage (V IN ≥ 2.7V) are possible for various switch
applications. BD6528HFV is available in space-saving
HVSOF6 package.
Switch Voltage Range
Input Voltage Range:
ON-Resistance:
BD6528HFV
BD6529GUL
Output Current:
Standby Current:
Operating Temperature Range:
W(Typ)
Packages
Features
Built-in Single N-Channel MOSFET with Low
ON-Resistance
Low-Voltage Switching Capability
Soft-Start Function
Output Discharge Circuit
Reverse Current Flow Blocking at Switch OFF
Condition
0V to 2.7V
2.7V to 4.5V
110mΩ(Typ)
100mΩ(Typ)
0.5 A(Max)
0.01μA (Typ)
-25°C to +85°C
D(Typ)
H (Max)
HVSOF6
1.60mm x 3.00mm x 0.75mm
Applications
Load Switches for Mobile Phone, Digital Still Camera,
PDA, MP3 Player, PC, etc.
VCSP50L1
1.50mm x 1.00mm x 0.55mm
Typical Application Circuit
V IN
VDD
ON / OFF
IN
OUT
VDD
OUT
EN
GND
LOAD
Lineup
ON-Resistance
(Typ)
Control Input
Logic
110mΩ
High
HVSOF6
Reel of 3000
BD6528HFV-TR
100mΩ
High
VCSP50L1
Reel of 3000
BD6529GUL-E2
Package
Orderable Part Number
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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BD6528HFV
Datasheet
BD6529GUL
Block Diagram
IN
OUT
VDD
Charge
Pump
GND
EN
Pin Configuration
B
IN
A
OUT
1
GND
EN 6
2
OUT
VDD 5
3
OUT
IN 4
OUT
VDD
EN
GND
1
2
3
BD6529GUL (Bottom view)
BD6528HFV (Top view)
Pin Description
Pin Number
1
(A3)
2, 3
(B2, B3)
4
(B1)
5
(A1)
6
(A2)
Pin Name
Pin Function
GND
Ground
OUT
Switch output
(connect each pin externally)
IN
VDD
EN
Switch input
Power supply
(for switch control and drive circuit)
Enable input
(active-high input)
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BD6528HFV
Datasheet
BD6529GUL
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
V DD
-0.3 to +6.0
V
Supply Voltage
IN Voltage
V IN
-0.3 to +6.0
V
EN Voltage
V EN
-0.3 to V DD +0.3
V
OUT Voltage
V OUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
°C
Power Dissipation
Pd
0.84
(Note 1)
(BD6528HFV)
0.57
(Note 2)
(BD6529GUL)
W
(Note 1)
When mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB, derate by 6.8mW /°C at Ta > 25°C
(Note 2)
When mounted on 50mm x 58mm x 1.75mm Glass-epoxy PCB, derate by 4.6mW /°C at Ta > 25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Min
Typ
Max
Unit
Operating Voltage
V DD
2.7
3.3
4.5
V
Switch Input Voltage
V IN
0
1.2
2.7
V
Operation Temperature
Topr
-25
+25
+85
°C
I LO
0
-
500
mA
Output Current
Electrical Characteristics
BD6528HFV (Unless otherwise specified, V DD = 3.3V, V IN = 1.2V, Ta = 25°C)
Limit
Unit
Parameter
Symbol
Min
Typ
Max
Conditions
[Current Consumption]
Operating Current
I DD
-
20
30
µA
V EN = 1.2V
Standby Current
I STB
-
0.01
1
µA
V EN = 0V
V ENH
1.2
-
-
V
High Level Input
[I/O]
EN Input Voltage
V ENL
-
-
0.4
V
Low Level Input
I EN
-1
-
+1
µA
V EN = 0V or V EN = 1.2V
ON-Resistance
R ON
-
110
-
mΩ
I OUT = 500mA
Switch Leakage Current
I LEAK
-
0.01
10
µA
V EN = 0V, V OUT = 0V
Output Rise Time
t ON1
-
0.5
1
ms
R L = 10Ω, V OUT 10% to 90%
Output Turn ON Time
t ON2
-
0.6
2
ms
R L = 10Ω, V EN High to V OUT 90%
Output Fall Time
t OFF1
-
1
20
µs
R L = 10Ω, V OUT 90% to 10%
Output Turn OFF Time
t OFF2
-
15
100
µs
R L = 10Ω, V EN Low to V OUT 10%
Discharge ON-Resistance
R DISC
-
70
110
Ω
I OUT = -1mA, V EN = 0V
Discharge Current
I DISC
-
15
20
mA
V OUT = 3.3V, V EN = 0V
EN Input Current
[Power Switch]
[Discharge Circuit]
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BD6528HFV
Datasheet
BD6529GUL
Electrical Characteristics - continued
BD6529GUL (Unless otherwise specified, V DD =3.3V, V IN = 1.2V, Ta = 25°C)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
[Current Consumption]
Operating Current
I DD
-
20
30
µA
V EN = 1.2V
Standby Current
I STB
-
0.01
1
µA
V EN = 0V
V ENH
1.2
-
-
V
High Level Input
V ENL
-
-
0.4
V
Low Level Input
I EN
-1
-
+1
µA
V EN = 0V or V EN = 1.2V
ON-Resistance
R ON
-
100
-
mΩ
I OUT = 500mA
Switch Leakage Current
I LEAK
-
0.01
10
µA
V EN = 0V, V OUT = 0V
Output Rise Time
t ON1
-
0.5
1
ms
R L = 10Ω, V OUT 10% to 90%
Output Turn ON Time
t ON2
-
0.6
2
ms
R L = 10Ω, V EN High to V OUT 90%
Output Fall Time
t OFF1
-
0.1
4
µs
R L = 10Ω, V OUT 90% to 10%
Output Turn OFF Time
t OFF2
-
1
6
µs
R L = 10Ω, V EN Low to V OUT 10%
Discharge ON-Resistance
R DISC
-
70
110
Ω
I OUT = -1mA, V EN = 0V
Discharge Current
I DISC
-
15
20
mA
V OUT = 3.3V, V EN = 0V
[I/O]
EN Input Voltage
EN Input Current
[Power Switch]
[Discharge Circuit]
Measurement Circuit
VIN VDD
VEN
IN
OUT
VDD
OUT
EN
GND
RL
CL
Timing Diagram
VEN
VENH
50%
V50%
ENL
TtON2
ON2
tOFF2
TOFF2
90%
VOUT
90%
10%
10%
T
tOFF1
OFF1
TtON1
ON1
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BD6528HFV
Datasheet
BD6529GUL
Typical Performance Curves
30
Ta=25ºC
DD
[μA]
25
20
Operating Current : I
OPERATING CURRENT :
Operating Current : IDD[μA]
IDD [µA]
30
15
10
5
0
2
3
4
Supply
Voltage
:
V
[V] [V]
SUPPLY VOLTAGE :DD
VDD
VDD=3.3V
25
20
15
10
5
0
5
-50
1.0
1.0
Ta=25ºC
VDD=3.3V
0.8
Standby Current : ISTB[μA]
STANDBY CURRENT :
ISTB[uA]
100
Figure 2. Operating Current vs
Ambient Temperature
(EN Enable)
Figure 1. Operating Current vs Supply Voltage
(EN Enable)
Standby Current : ISTB[μA]
0
50
Ambient Temperature : Ta[°C]
0.6
0.4
0.2
0.0
2
3
4
Supply
Voltage : V: DD
[V] [V]
SUPPLY
VOLTAGE
VDD
0.6
0.4
0.2
0.0
5
-50
Figure 3. Standby Current vs Supply Voltage
(EN Disable)
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0.8
0
50
Ambient Temperature : Ta[°C]
100
Figure 4. Standby Current vs
Ambient Temperature
(EN Disable)
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Datasheet
BD6529GUL
Typical Performance Curves - continued
2.0
2.0
VDD=3.3V
ENABLE INPUT VOLTAGE:
Enable Input Voltage : VEN[V]
VEN [V]
ENABLE INPUT VOLTAGE :
Enable Input Voltage : VEN[V]
VEN [V]
Ta=25ºC
1.5
1.0
0.5
0.0
2
3
4
SupplyVOLTAGE
Voltage : V:DDVDD
[V] [V]
SUPPLY
1.5
1.0
0.5
0.0
5
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
Figure 5. EN Input Voltage vs
Supply Voltage
200
ON [mΩ]
Ta=25ºC
VIN=1.2V
IOUT=100mA
150
ON-Resistance : R
ON-Resistance : R
ON [mΩ]
200
Figure 6. EN Input Voltage vs
Ambient Temperature
100
50
0
2
3
4
Supply
Voltage : V: DD
[V] [V]
SUPPLY
VOLTAGE
VDD
150
100
50
0
5
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
Figure 7. ON-Resistance vs Supply Voltage
(BD6528HFV)
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VDD=3.3V
VIN=1.2V
IOUT=100mA
Figure 8. ON-Resistance vs
Ambient Temperature
(BD6528HFV)
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BD6528HFV
Datasheet
BD6529GUL
Typical Performance Curves - continued
200
ON [mΩ]
VDD=3.3V
IOUT=100mA
150
Ta=85ºC
ON-Resistance : R
ON-Resistance : R
ON [mΩ]
200
Ta=25ºC
100
Ta= -25ºC
50
VDD=3.3V
VIN=1.2V
150
Ta=85ºC
Ta=25ºC
100
Ta= -25ºC
50
0
0
0
1
2
Input
Voltage : V
INPUT
VOLTAGE
: IN
V[V]
IN [V]
3
0
Figure 9. ON-Resistance vs Input Voltage
(BD6528HFV)
Figure 10. ON-Resistance vs
Output Current
(BD6528HFV)
200
ON [mΩ]
Ta=25ºC
VIN=1.2V
IOUT=100mA
150
ON-Resistance : R
ON-Resistance : R
ON [mΩ]
200
100
50
0
2
3
4
Supply
Voltage
:
V
[V] [V]
SUPPLY VOLTAGE :DD
VDD
VDD=3.3V
VIN=1.2V
IOUT=100mA
150
100
50
0
5
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
Figure 12. ON-Resistance vs
Ambient Temperature
(BD6529GUL)
Figure 11. ON-Resistance vs Supply Voltage
(BD6529GUL)
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200
400
600
Output
Current : I:OUT
[mA]
OUTPUT
CURRENT
IOUT
[mA]
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Datasheet
BD6529GUL
Typical Performance Curves - continued
200
ON [mΩ]
VDD=3.3V
IOUT=100mA
150
ON-Resistance : R
ON-Resistance : R
ON [mΩ]
200
Ta=85ºC
100
Ta=25ºC
Ta= -25ºC
50
0
0
1
2
InputVOLTAGE
Voltage : VIN
INPUT
: [V]
VIN [V]
50
ON1 [ms]
0.6
Output Rise Time : t
0.4
0.2
0.0
Supply Voltage : VDD[V]
600
VDD=3.3V
RL=10Ω
0.8
0.6
0.4
0.2
0.0
5
-50
0
50
100
Ambient
Temperature
:
Ta[°C]
AMBIENT TEMPERATURE : Ta [°C]
Figure 15. Output Rise Time vs Supply Voltage
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200
400
Output Current
: IOUT:[mA]
OUTPUT
CURRENT
IOUT [mA]
Figure 14. ON-Resistance vs Output Current
(BD6529GUL)
0.8
4
Ta=25ºC
Ta= -25ºC
1.0
3
Ta=85ºC
100
0
Ta=25ºC
RL=10Ω
2
150
0
3
Figure 13. ON-Resistance vs Input Voltage
(BD6529GUL)
1.0
VDD=3.3V
VIN=1.2V
Figure 16. Output Rise Time vs
Ambient Temperature
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BD6528HFV
Datasheet
BD6529GUL
Typical Performance Curves - continued
2.0
ON2 [ms]
Ta=25ºC
RL=10Ω
1.6
Output Turn ON Time : t
Output Turn ON Time : t
ON2 [ms]
2.0
1.2
0.8
0.4
0.0
1.6
1.2
0.8
0.4
0.0
2
3
4
Supply
Voltage : V:DD
[V] [V]
SUPPLY
VOLTAGE
VDD
5
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
Figure 18. Output Turn ON Time vs
Ambient Temperature
Figure 17. Output Turn ON Time vs Supply Voltage
1.0
OFF1 [μs]
Ta=25ºC
RL=10Ω
0.8
0.6
Output Fall Time : t
OFF1 [μs]
1.0
Output Fall Time : t
VDD=3.3V
RL=10Ω
0.4
0.2
0.0
2
3
4
Supply
Voltage
:
V
[V] [V]
SUPPLY VOLTAGE :DDVDD
0.8
0.6
0.4
0.2
0.0
5
-50
Figure 19. Output Fall Time vs
Supply Voltage
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VDD=3.3V
RL=10Ω
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
Figure 20. Output Fall Time vs
Ambient Temperature
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BD6528HFV
Datasheet
BD6529GUL
Typical Performance Curves - continued
50
OFF2 [μs]
Ta=25ºC
RL=10Ω
40
Output Turn OFF Time : t
Output Turn OFF Time : t
OFF2 [μs]
50
30
20
BD6528HFV
10
BD6529GUL
VDD=3.3V
RL=10Ω
40
30
20
BD6528HFV
10
BD6529GUL
0
0
2
3
4
Supply Voltage : VDD [V]
-50
5
0
50
100
AmbientTEMPERATURE
Temperature : Ta[°C]
AMBIENT
: Ta [°C]
DISC [Ω]
200
Figure 22. Output Turn OFF Time vs
Ambient Temperature
VDD=3.3V
150
Discharge ON-Resistance : R
Discharge ON-Resistance : R
DISC [Ω]
Figure 21. Output Turn OFF Time vs
Supply Voltage
100
50
0
2
3
4
Supply Voltage : VDD [V]
5
Ta=25ºC
150
100
50
0
-50
Figure 23. Discharge ON-Resistance vs
Supply Voltage
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200
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
Figure 24. Discharge ON-Resistance vs
Ambient Temperature
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BD6528HFV
Datasheet
BD6529GUL
Typical Wave Forms
VEN
(0.5V/div.)
VEN
(0.5V/div.)
VDD=3.3V
VIN=1.2V
RL=500Ω
CL=4.7μF
VOUT
(0.2V/div.)
IOUT
(10mA/div.)
VDD=3.3V
VIN=1.2V
RL=500Ω
CL=4.7μF
VOUT
(0.2V/div.)
IOUT
(10mA/div.)
TIME (0.2ms/div.)
TIME (0.2ms/div.)
Figure 25. Output Turn ON Response
BD6528HFV
Figure 26. Output Turn OFF Response
BD6528HFV
VEN
VEN
(0.5V/div.)
(0.5V/div.)
VOUT
VDD=3.3V
VIN=1.2V
RL=10Ω
CL=4.7μF
(0.2V/div.)
VDD=3.3V
VIN=1.2V
RL=10Ω
CL=4.7μF
VOUT
(0.2V/div.)
IOUT
IOUT
(50mA/div.)
(50mA/div.)
TIME (0.2ms/div.)
TIME (0.2ms/div.)
Figure 27. Output Turn ON Response
BD6528HFV
Figure 28. Output Turn OFF Response
BD6528HFV
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BD6528HFV
Datasheet
BD6529GUL
Typical Wave Forms - continued
VEN
(0.5V/div.)
VEN
(0.5V/div.)
VDD=3.3V
VIN=1.2V
RL=500Ω
CL=4.7μF
VOUT
(0.2V/div.)
IOUT
(10mA/div.)
VDD=3.3V
VIN=1.2V
RL=500Ω
CL=4.7µF
VOUT
(0.2V/div.)
IOUT
(10mA/div.)
TIME (0.2ms/div.)
TIME (0.2ms/div.)
Figure 29. Output Turn ON Response
BD6529GUL
Figure 30. Output Turn OFF Response
BD6529GUL
VEN
(0.5V/div.)
VEN
(0.5V/div.)
VDD=3.3V
VIN=1.2V
RL=10Ω
CL=4.7µF
VOUT
(0.2V/div.)
IOUT
(50mA/div.)
VDD=3.3V
VIN=1.2V
RL=10Ω
CL=4.7µF
VOUT
(0.2V/div.)
IOUT
(50mA/div.)
TIME (0.2ms/div.)
TIME (0.2ms/div.)
Figure 31. Output Turn ON Response
BD6529GUL
Figure 32. Output Turn OFF Response
BD6529GUL
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BD6528HFV
Datasheet
BD6529GUL
Typical Wave Forms - continued
VEN
(2V/div.)
VIN=1.2V
VDD=3.3V
VOUT
(1V/div.)
CL=22µF
CL=10μF
IOUT
(20mA/div.)
CL=4.7μF
TIME (0.2ms/div.)
Figure 33. Rush Current Response
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BD6528HFV
Datasheet
BD6529GUL
Typical Application Circuit
V IN
ON / OFF
VDD
IN
OUT
VDD
OUT
EN
GND
LOAD
This application circuit does not guarantee its operation.
When the recommended external circuit components are changed, be sure to consider adequate margins by taking into
account external parts and/or IC’s dispersion including not only static characteristics, but also transient characteristics.
Functional Description
1. Switch Operation
Each IN and OUT pins are connected to MOSFET’s drain and source respectively. By setting EN input to High level, the
internal charge pump operates and turns on the MOSFET. When MOSFET is turned on, the switch’s operation becomes
bidirectional. Consequently, in case of V IN < V OUT , the current is flowing from OUT to IN.
Since there is no parasitic diode between switch’s drain and source, the reverse flow of current from OUT to IN is
prevented when the switch is at off condition.
2. Output Discharge Circuit
When the switch between the IN and OUT pins is turned OFF, the 70Ω (Typ) discharge switch between OUT and GND
turns on. By turning on this switch, the electric charge at capacitive load is discharged quickly.
VDD
VIN
VEN
VOUT
Discharge Circuit ON
OFF
ON
OFF
ON
Figure 34. Operation Timing
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BD6528HFV
Datasheet
BD6529GUL
Power Dissipation
900
Power Dissipation : Pd[mW]
POWER DISSIPATION : Pd [mW]
800
700
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ambient
Temperature : Ta
Ta[°C]
AMBIENT
TEMPERATURE
[℃]
Figure 35. Power Dissipation Curve (Pd-Ta Curve)
Mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB
(HVSOF6 Package)
700
Power Dissipation : Pd[mW]
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AmbientTEMPERATURE
Temperature : :Ta[°C]
AMBIENT
Ta [℃]
Figure 36. Power Dissipation Curve (Pd-Ta Curve)
Mounted on 50mm x 58mm x 1.75mm Glass-epoxy PCB
(VCSP50L1 Package)
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BD6528HFV
Datasheet
BD6529GUL
I/O Equivalence Circuit
Pin Name
Pin Number
Equivalence Circuit
VVDD
DD
EN
IN
OUT
EN
6
(A2)
4
(B1)
2, 3
(B2, B3)
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OUT
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BD6528HFV
Datasheet
BD6529GUL
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD6528HFV
Datasheet
BD6529GUL
Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 37. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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BD6528HFV
Datasheet
BD6529GUL
Ordering Information
B
D
6
5
2
8
Part Number
B
D
H
F
V
-
Package
HFV: HVSOF6
6
5
2
Part Number
9
G
U
TR
Packaging and forming specification
TR: Embossed tape and reel
(HVSOF6)
L
-
Package
GUL: VCSP50L1
E2
Packaging and forming specification
E2: Embossed tape and reel
(VCSP50L1)
Marking Diagrams
HVSOF6(TOP VIEW)
Part Number Marking
VCSP50L1
(TOP VIEW)
BK
LOT Number
AA3
1PIN MARK
Part Number Marking
LOT Number
1PIN MARK
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BD6528HFV
Datasheet
BD6529GUL
Physical Dimension, Tape and Reel Information
Package Name
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BD6528HFV
Datasheet
BD6529GUL
Physical Dimension, Tape and Reel Information – continued
VCSP50L1 (BD6529GUL)
1.00±0.05
Package Name
1PIN MARK
AA3
1.50±0.05
0.10±0.05
0.55MAX
Lot. No.
S
0.08
S
0.05
AB
0.25±0.05
(φ0.15) INDEX POST
6-φ0.25±0.05
A
0.5
B B
A
1
0.25±0.05
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(Unit : mm)
TSZ02201-0E3E0H300270-1-2
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BD6528HFV
Datasheet
BD6529GUL
Revision History
Date
Revision
11.Mar.2013
25.Jun.2013
21.Aug.2014
001
002
003
Changes
New Release
Deleted figures of package on page 1.
Applied the ROHM Standard Style and improved understandability.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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