BD6538G-LBTR

Datasheet 1 Channel Compact High Side Switch ICs Output OFF Latch High Side Switch ICs BD6538G-LB General Description Key Specifications „ „ „ „ „ This is the product guarantees long time support in Industrial market. BD6538G is single channel high side powers switch with low ON resistance Nch power MOSFET. Rich safety functions such as Over current detection, Thermal shutdown (TSD), Under Voltage Lock Out(UVLO) and Soft start function which are required for the power supply port protection are integrated into 1chip. Input voltage range: 2.7V to 5.5V ON resistance : 150mΩ(Typ.) Over current threshold: 0.5A min., 1.0A max. Standby current: 0.01μA (Typ.) Operating temperature range: -40℃ to +85℃ Package W(Typ.) SSOP5 D(Typ.) H (Max.) 2.90mm x 2.80mm x 1.25mm Features „ Long time support a product for Industrial applications. „ Single channel of low ON resistance (Typ = 150mΩ) Nch power MOSFET built in „ 500mA Continuous current load „ Active”High”Control Logic „ Soft start function „ Over current detection（Output Off-latch Operating „ Thermal shutdown „ Open drain error flag output „ Under voltage lockout SSOP5 Applications Industrial Equipment, Typical Application Circuit 5V(typ.) CIN VIN VOUT + GND CL - EN /OC Lineup Over current detection Min. Typ. Max. 0.5A - 1.0A ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Control input logic High Package SSOP5 Orderable Part Number Reel of 3000 BD6538G – LBTR ○This product has no designed protection against radioactive rays 1/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Block Diagram GND Delay Counter OCD /OC S Q R Charge pump UVLO TSD EN VIN VOUT Pin Configuration TOP VIEW 1 VIN VOUT 5 2 GND 3 EN /OC 4 Pin Description Pin No. Symbol I/O Pin function 1 VIN - Power supply input. Input terminal to switch and power supply input terminal of the internal circuit. 2 GND - Ground. 3 EN I Enable input. Power switch on at High level. 4 /OC O Over current output. Low level at over current detection. Open drain output. 5 VOUT O Switch output. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Ratings Unit VIN -0.3 to 6.0 V Supply voltage Enable voltage VEN -0.3 to 6.0 V /OC voltage V/OC -0.3 to 6.0 V /OC current I/OC 5 mA OUT voltage VOUT -0.3 to VIN + 0.3 V Storage temperature TSTG -55 to 150 °C Power dissipation PD 675 *1 mW *1 1 Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW / °C for operating above Ta=25°C. Recommended Operating Ratings Parameter Symbol Ratings Unit Min Typ Max VIN 2.7 - 5.5 V Operating temperature TOPR -40 - 85 °C Continuous output current IOUT 0 - 0.5 A Operating voltage Electrical Characteristics Unless otherwise specified VIN = 5.0V, Ta = 25°C DC characteristics Parameter Symbol Limits Min. Typ. Max. unit Condition Operating Current IDD - 110 160 μA VEN = 5.0V, VOUT = Open Standby Current ISTB - 0.01 5 μA VEN = 0V, VOUT = Open VEN 2.0 - - V High input VEN - - 0.8 V Low input EN input current IEN -1.0 0.01 1.0 μA VEN =0Vor5V ON resistance RON - 150 200 mΩ IOUT = 50mA Over current threshold ITH 0.5 - 1.0 A Output current at short ISC 0.35 - - A VOUT = 0V (RMS) /OC output lOW voltage V/OC - - 0.4 V I/OC = 0.5mA VTUVH 2.1 2.3 2.5 V Increasing VIN VTUVL 2.0 2.2 2.4 V Decreasing VIN EN input voltage UVLO Threshold - AC characteristics Parameter Symbol Limits Min. Typ. Max. unit Condition Output rise time TON1 - 1 6 ms RL = 20Ω, Figure 2. Ref. Output rise delay time TON2 - 1.5 10 ms RL = 20Ω, Figure 2. Ref. Output fall time TOFF1 - 1 20 μs RL = 20Ω, Figure 2. Ref. Output fall delay time TOFF2 - 3 40 μs RL = 20Ω, Figure 2. Ref. Blanking time TBLANK 10 15 20 ms www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/21 - TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Measurement Circuit VIN VIN A A VIN VOUT VIN 1µF VOUT 1µF GND VEN EN A. RL GND VEN /OC EN /OC B. EN input voltage, Output rise, fall time Operating current VIN VIN A A 10k IOC VIN VOUT VIN 1µF 1µF IOUT GND VEN VOUT EN GND VEN /OC C. ON resistance, Over current detection EN /OC D. /OC output LOW voltage Figure 1. Measurement circuit Timing Diagram VEN 50% 50% TON2 TOFF2 90% VOUT 10% 90% 10% TON1 TOFF1 Figure 2. Timing chart at output rise / fall time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Performance Curves 140 140 120 OPERATING CURRENT : I [μA] OPERATING CURRENT : I [μA] VIN=5.0V Ta=25°C 120 100 100 80 60 40 80 60 40 20 20 0 0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 -50 100 Figure 4. Operating current EN Enable Figure 3. Operating current EN Enable 1.0 1.0 VIN=5.0V Ta=25°C 0.8 0.8 OPERATING CURRENT : I [μA] OPERATING CURRENT : I [μA] 0 50 AMBIENT TEMPERATURE : Ta[℃] 0.6 0.6 0.4 0.4 0.2 0.2 0.0 0.0 2 3 4 5 6 -50 Figure 5. Operating current EN Disable www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VIN[V] Figure 6. Operating current EN Disable 5/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Performance Curves - continued 2.0 2.0 1.5 VIN=5.0V ENABLE INPUT VOLTAGE : V [V] ENABLE INPUT VOLTAGE : V [V] 0 Ta=25°C Low to High 1.5 Low to High High to Low 1.0 High to Low 1.0 0.5 0.5 0.0 0.0 2 3 4 5 6 -50 50 AMBIENT TEMPERATURE : Ta[℃] Figure 7. EN input voltage Figure 8. EN input voltage 100 200 200 VIN=5.0V Ta=25°C 150 ON RESISTANCE : R [mΩ] 150 ON RESISTANCE : RON[mΩ] 0 SUPPLY VOLTAGE : VIN[V] 100 100 50 50 0 0 2 3 4 5 -50 6 SUPPLY VOLTAGE : VIN [V] 100 Figure 10. ON resistance Figure 9. ON resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AMBIENT TEMPERATURE : Ta[℃] 6/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Performance Curves - continued 1.0 1.0 VIN=5.0V Overcurrent threshold : ITH[A] Overcurrent threshold : ITH[A] Ta=25°C 0.9 0.8 0.7 0.6 0.5 0.8 0.7 0.6 0.5 2 3 4 5 6 -50 50 100 Figure 11. Over current detection Figure 12. Over current detection /OC OUTPUT LOW VOLTAGE : V/OC[mV] AMBIENT TEMPERATURE : Ta[℃] Ta=25°C 80 60 40 20 0 2 0 SUPPLY VOLTAGE : VIN[V] 100 /OC OUTPUT LOW VOLTAGE : V/OC[mV] 0.9 3 4 5 SUPPLY VOLTAGE : VIN[V] VIN=5.0V 80 60 40 20 0 -50 6 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 14. /OC output LOW voltage Figure 13. /OC output LOW voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 100 7/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Performance Curves - continued 1.0 UVLO HYSTERESIS VOLTAGE : V [V] [V] 2.5 UVLO THRESHOLD : V ,V 2.4 2.3 VTUVH 2.2 VTUVL 2.1 2.0 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 0.8 0.6 0.4 0.2 0.0 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] Figure 15. UVLO Threshold Figure 16. UVLO hysteresis voltage 5.0 5.0 VIN=5.0V Ta=25°C [ms] 4.0 3.0 3.0 RISE TIME : T [ms] 4.0 RISE TIME : T 100 2.0 2.0 1.0 1.0 0.0 0.0 2 3 4 SUPPLY VOLTAGE : VIN[V] 0 50 AMBIENT TEMPERATURE : Ta[℃] Figure 17. Output rise time Figure 18. Output rise time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5 6 -50 8/21 100 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Performance Curves - continued 5.0 5.0 4.0 [ms] VIN=5.0V 4.0 3.0 TURN ON TIME : T TURN ON TIME : TON2 [ms] Ta=25°C 3.0 2.0 1.0 0.0 2.0 1.0 0.0 2 3 4 5 6 -50 0 50 SUPPLY VOLTAGE : VIN[V] AMBIENT TEMPERATURE : Ta[℃] Figure 19. Output turn on time Figure 20. Output turn on time 100 5.0 5.0 VIN=5.0V Ta=25°C 4.0 FALL TIME : TOFF1[μs] FALL TIME : TOFF1[μs] 4.0 3.0 2.0 3.0 2.0 1.0 1.0 0.0 0.0 2 3 4 5 -50 6 50 100 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VIN[V] Figure 21. Output fall time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 Figure 22. Output fall time 9/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Performance Curves - continued 6.0 6.0 Ta=25°C VIN=5.0V 5.0 [μs] [μs] 5.0 4.0 TURN OFF TIME : T TURN OFF TIME : T 4.0 3.0 2.0 1.0 0.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] Figure 23. Output turn off time Figure 24. Output turn off time 20 20 VIN=5.0V Ta=25°C 18 [ms] 18 16 16 BLANK TIME : T BLANKING TIME : TBLANK[ms] 100 14 12 10 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 12 10 6 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 Figure 26. Blanking time Figure 25. Blanking time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14 10/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Wave Forms VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V RL=20Ω VIN=5 RL=20Ω IOUT (0.5A/div.) IOUT (0.5A/div.) TIME(1ms/div.) TIME(1us/div.) Figure 27. Output rise characteristic Figure 28. Output fall characteristic VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) CL=147uF CL=100uF IOUT (0.2A/div.) CL=47uF VIN=5V RL=20Ω IOUT (0.5A/div.) VIN=5V TIME (2ms/div.) TIME (20ms/div.) Figure 29. Inrush current response Figure 30. Over current response Ramped load www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Wave Forms - continued V/OC (5V/div.) VEN (5V/div.) VOUT (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.5A/div.) IOUT (0.5A/div.) VIN=5V TIME (5ms/div.) TIME (5ms/div.) Figure 31. Over current response Ramped load Figure 32. Over current response Enable to short circuit V/OC (5V/div.) VIN (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.5A/div.) IOUT (0.2A/div.) RL=20Ω TIME (5ms/div.) TIME (10ms/div.) Figure 33. Over current response Output shortcircuit at Enable Figure 34. UVLO response VIN Increasing www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Wave Forms - continued VIN (5V/div.) VOUT (5V/div.) IOUT (0.2A/div.) RL=20Ω TIME (10ms/div.) Figure 35. UVLO response VIN Decreasing www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Typical Application Circuit 5V(typ.) 10k to 100kΩ CIN Controller VIN VOUT + GND CL - EN /OC Application Information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1uF or higher is recommended. Pull up /OC output by resistance 10kΩ to 100kΩ. Set up value which satisfies the application as CL. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Functional Description 1.Overcurrent protection（OCD） The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. The timer is reset when the state of the overcurrent is terminated before passing of TBLANK. After a state of overcurrent is passed at blanking time, the switch is shut down and the overcurrent signal (/OC) changes to Low level. The latch is reset through it input Low to EN or detects UVLO. Normal operation is returned by EN signal is set to High or UVLO is off. (Figure 36, Figure 37). There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN, /EN signal is active). 1-1. When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. 1-2. When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 1-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 2. Thermal shutdown circuit（TSD） Thermal shutdown circuit turns off the switch and outputs an error flag (/OC) when the junction temperature exceeds 170°C (typ.). Therefore, when the junction temperature goes down to 150°C (typ), the switch output and an error flag (/OC) are recovered automatically. This operating is repeated until cause of junction temperature increase is removed or EN signal is set Disable. Thermal shutdown circuit works when EN signal is enable. 3. Under voltage lockout （UVLO） UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V (Typ.). If the VIN drops below 2.2V (Typ.) while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV (Typ.). Under-voltage lockout circuit works when the switch is on (EN, /EN signal is active). 4. Error flag (/OC) output Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output. Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Over Current Shutdown Operating TBLANK TBLANK Output current ON OFF ON Switch status FLAG Output VEN Figure 36. Overcurrent shutdown operation（Reset at toggle of EN） TBLANK TBLANK Output current ON OFF ON Switch status FLAG Output VTUVL VIN VTUVH VEN Figure 37. Overcurrent shutdown operation (Reset at reclosing of power supply VIN) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Power Dissipation (SSOP5 package) 700 POWER DISSIPATION: Pd[mV] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta[℃] * 70mm * 70mm * 1.6mm : glass epoxy board mounting Figure 38. Power dissipation curve (Pd-Ta Curve) I/O Equivalence Circuit Symbol Pin No. EN 3 VOUT 5 Equivalence circuit EN VOUT /OC /OC www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4 17/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Operational Notes (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible. Do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Ordering Information B D 6 5 3 Part Number 8 G - Package G : SSOP5 LBTR Product class LB for Industrial applications Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP5(TOP VIEW) A6 Part Number Marking LOT Number www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Physical Dimension Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 20/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet BD6538G-LB Revision History Date Revision 13.Mar.2013 001 21.Feb.2014 002 Changes New Release Delete sentence “and log life cycle” in General Description and Futures (page 1). Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1). Applied new style (“title” and “Ordering Information”). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/21 TSZ02201-0E3E0H300420-1-2 21.Feb.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001