BD6538G_11

Power Management Switch ICs for PCs and Digital Consumer Products 1ch Small Package High Side Switch IC for USB Devices and Memory Cards BD6538G No.11029EBT14 ●Description BD6538G is single channel high side powers switch with low ON resistance Nch power MOSFET. Rich safety functions such as Over current detection, Thermal shutdown (TSD), Under Voltage Lock Out(UVLO) and Soft start function which are required for the power supply port protection are integrated into 1chip. ●Feature 1) Single channel of low ON resistance (Typ = 150mΩ) Nch power MOSFET built in 2) 500mA Continuous current load 3) Active”High”Control Logic 4) Soft start function 5) Over current detection（Output Off-latch Operating） 6) Thermal shutdown 7) Open drain error flag output 8) Under voltage lockout 9) Power supply voltage range 2.7V~5.5V 10) Operating temperature range-40°C~85°C 11) SSOP5 Package ●Absolute maximum ratings Parameter Supply voltage Enable voltage /OC voltage /OC current OUT voltage Storage temperature Power dissipation *1 * Symbol VIN VEN V/OC I/OC VOUT TSTG PD Ratings -0.3 -0.3 -0.3 to to to 5 -0.3 to VIN + 0.3 -55 to 150 675 *1 6.0 6.0 6.0 Unit V V V mA V °C mW 1 Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW / °C for operating above Ta=25°C. This product is not designed for protection against radioactive rays. ●Operating conditions Parameter Operating voltage Operating temperature Continuous output current Symbol VIN TOPR IOUT Ratings Min 2.7 -40 0 Typ Max 5.5 85 0.5 Unit V °C A www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/11 2011.05 - Rev.B BD6538G ●Electric characteristics Unless otherwise specified VIN = 5.0V, Ta = 25°C DC characteristics Parameter Operating Current Standby Current EN input voltage EN input current ON resistance Over current threshold Output current at short /OC output lOW voltage UVLO Threshold AC characteristics Parameter Output rise time Output rise delay time Output fall time Output fall delay time Blanking time Symbol TON1 TON2 TOFF1 TOFF2 TBLANK Limits Min. 10 Typ. 1 1.5 1 3 15 Max. 6 10 20 40 20 unit ms ms μs μs ms Symbol IDD ISTB VEN VEN IEN RON ITH ISC V/OC VTUVH VTUVL Limits Min. 2.0 -1.0 0.5 0.35 2.1 2.0 Typ. 110 0.01 0.01 150 2.3 2.2 Max. 160 5 0.8 1.0 200 1.0 0.4 2.5 2.4 unit μA μA V V μA mΩ A A V V V Technical Note Condition VEN = 5.0V, VOUT = Open VEN = 0V, VOUT = Open High input Low input VEN =0Vor5V IOUT = 50mA VOUT = 0V (RMS) I/OC = 0.5mA Increasing VIN Decreasing VIN Condition RL = 20Ω, Fig. 2 Ref. RL = 20Ω, Fig. 2 Ref. RL = 20Ω, Fig. 2 Ref. RL = 20Ω, Fig. 2 Ref. - www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/11 2011.05 - Rev.B BD6538G ●Measurement circuit VIN VIN Technical Note A VIN 1µF GND VEN EN /OC VEN VOUT A VIN 1µF GND EN /OC VOUT RL Operating current EN input voltage, Output rise, fall time VIN VIN 10k A VIN 1µF GND VEN EN /OC VOUT IOUT A IOC VIN 1µF GND VEN EN /OC VOUT ON resistance, Over current Fig.1 Measurement circuit /OC output LOW voltage ●Timing diagram VEN 50% TON2 90% 50% TOFF2 90% 10% TOFF1 VOUT 10% TON1 Fig.2 Timing chart at output rise / fall time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/11 2011.05 - Rev.B BD6538G ●Reference data 140 OPERATING CURRENT : IDD[μA] 120 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Ta=25°C Technical Note 140 120 OPERATING CURRENT : IDD [μA] 100 80 60 40 20 0 -50 VIN=5.0V 1.0 Ta=25°C OPERATING CURRENT : ISTB[µA] 0.8 0.6 0.4 0.2 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.3 Operating current EN Enable Fig.4 Operating current EN Enable Fig.5 Operating current EN Disable 1.0 VIN=5.0V 2.0 Ta=25°C 2.0 VIN=5.0V ENABLE INPUT VOLTAGE : VEN[V] Low to High High to Low 1.5 OPERATING CURRENT : ISTB[μA] 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] ENABLE INPUT VOLTAGE : VEN[V] 0 1.5 Low to High High to Low 1.0 1.0 0.5 0.5 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.6 Operating current EN Disable 200 Ta=25°C Fig.7 EN input voltage Fig.8 EN input voltage 200 VIN=5.0V Overcurrent threshold : I TH[A] 1.0 Ta=25°C 0.9 ON RESISTANCE : RON[mΩ] ON RESISTANCE : RON[mΩ] 150 150 0.8 100 100 0.7 50 50 0.6 0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.5 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.9 ON resistance Fig.10 ON resistance Fig.11 Over current detection 1.0 100 80 60 40 20 0 2 3 4 5 S UPP LY V OLTAGE : VIN[V] 6 /OC OUTPUT L OW VOL TAG E : V/OC [mV] VIN=5.0V Ta=25°C /OC OUTPUT LOW VOLTAG E : V/OC[mV] 1 00 VIN=5.0V Overcurrent threshold : ITH[A] 0.9 80 60 40 20 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] 0.8 0.7 0.6 0.5 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.12 Over current detection www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig.13 /OC output LOW voltage Fig.14 /OC output LOW voltage 4/11 2011.05 - Rev.B BD6538G Technical Note 2.5 UVLO THRESHOLD : VTUVH, VTUVL[V] 1.0 UVLO HYSTERESIS VOLTAGE : VHYS[V] 5.0 Ta=25°C 2.4 0.8 4.0 2.3 VTUVH 0.6 RISE TIME : TON1[ms] 3.0 2.2 VTUVL 0.4 2.0 2.1 0.2 1.0 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.15 UVLO Threshold Fig.16 UVLO hysteresis voltage Fig.17 Output rise time 5.0 5.0 5.0 VIN=5.0V TURN ON TIME : TON2[ms] Ta=25°C TURN ON TIME : TON2[ms] VIN=5.0V 4.0 4.0 RISE TIME : TON1 [ms] 4.0 3.0 3.0 3.0 2.0 2.0 2.0 1.0 1.0 1.0 0 .0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.18 Output rise time Fig.19 Output turn on time Fig.20 Output turn on time 5.0 Ta=25°C 5.0 6.0 VIN=5.0V TURN OFF TIME : T OFF2[μs] Ta=25°C 5.0 4.0 3.0 2.0 1.0 0.0 4.0 FALL TIME : TOFF1[μs] 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 FALL TIME : TOFF1[μs] 4.0 3.0 2.0 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.21 Output fall time Fig.22 Output fall time Fig.23 Output turn off time 6.0 20 20 VIN=5.0V BLANKING TIME : TBLANK[ms] TURN OFF TIME : TOFF2[μs] 5.0 4.0 3.0 2.0 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Ta=25°C BLANK TIME : TBLANK[ms] 18 VIN=5.0V 18 16 16 14 14 12 12 10 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 10 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.24 Output turn off time Fig.25 Blanking time Fig.26 Blanking time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/11 2011.05 - Rev.B BD6538G ●Waveform data Technical Note VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) CL=147uF VOUT (5V/div.) VIN=5V RL=20Ω VOUT (5V/div.) VIN=5V RL=20Ω IOUT (0.2A/div.) CL=47uF TIME(1us/div.) CL=100uF IOUT (0.5A/div.) IOUT (0.5A/div.) VIN=5V RL=20Ω TIME(1ms/div.) TIME (2ms/div.) Fig.27 Output rise characteristic Fig.28 Output fall characteristic Fig29. Inrush current respone V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VEN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.5A/div.) VIN=5V TIME (20ms/div.) TIME (5ms/div.) IOUT (0.5A/div.) VIN=5V TIME (5ms/div.) IOUT (0.5A/div.) Fig.30 Over current response Ramped load Fig.31 Over current response Ramped load Fig.32 Over current response Enable to short circuit V/OC (5V/div.) VIN (5V/div.) VIN (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.5A/div.) IOUT (0.2A/div.) RL=20Ω IOUT (0.2A/div.) RL=20Ω TIME (5ms/div.) TIME (10ms/div.) TIME (10ms/div.) Fig.33 Over current response Output shortcircuit at Enable Fig.34 UVLO response VIN Increasing Fig.35 UVLO response VIN Decreasing www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/11 2011.05 - Rev.B BD6538G ●Block diagram Delay Counter /OC SQ R Charge pump Technical Note GND OCD UVLO TSD VIN 1 GND 2 Top View 5 VOUT EN VIN OUT EN 3 4 /OC Fig.36 Block diagram ●Pin description Pin No. 1 2 3 4 5 Fig.37 Pin Configuration symbol VIN GND EN /OC VOUT I/O I O O Pin function Power supply input. Input terminal to switch and power supply input terminal of the internal circuit. Ground. Enable input. Power switch on at High level. Over current output. Low level at over current detection. Open drain output. Switch output. ●Terminal circuit symbol Pin No. Equivalent circuit EN 3 EN VOUT 5 VOUT /OC /OC 4 Fig.38 Terminal circuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/11 2011.05 - Rev.B BD6538G Technical Note ●Operations Explanation 1.Overcurrent protection（OCD） The overcurrent detection circuit limits the current and outputs an error flag (/OC) when the current flowing in switch MOSFET exceeds overcurrent threshold (ITH). The timer is reset when the state of the overcurrent is terminated before passing of TBLANK. After a state of overcurrent is passed at blanking time, the switch is shut down and the overcurrent signal (/OC) changes to Low level. The latch is reset through it input Low to EN or detects UVLO. Normal operation is returned by EN signal is set to High or UVLO is off. (Fig. 4, Fig. 5). The over current limit circuit works when EN signal is enable. 2. Thermal shutdown circuit（TSD） Thermal shutdown circuit turns off the switch and outputs an error flag (/OC) when the junction temperature exceeds 150°C (typ.). Therefore, when the junction temperature goes down to 150°C (typ), the switch output and an error flag (/OC) are recovered automatically. This operating is repeated until cause of junction temperature increase is removed or EN signal is set Disable. Thermal shutdown circuit works when EN signal is enable. 3. Under voltage lockout （UVLO） UVLO keeps the switch-off state at MOSFET until VIN exceeds 2.3V (Typ.). If VIN drops under 2.2V (Typ.) while the switch is turning on, then UVLO shuts off the power switch. Under voltage lockout works when EN signal is enable. 4. Overcurrent signal output Overcurrent signal output（/OC） N-MOS open drain output. At detection of overcurrent, thermal shutdown, output is Low level. is ●Over current shutdown operating TBLAN K TBLAN K O u t u t cu rre n t p ON S w i ch st t s t au OFF ON FLA G O ut ut p VIN VTU VL VTU VH VEN Fig.39 Overcurrent shutdown operation（Reset at toggle of EN） TBLANK TBLANK O u t u t cu rre n t p ON S w i ch st t s t au OFF ON FLA G O ut ut p VEN Fig.40 Overcurrent shutdown operation (Reset at reclosing of power supply VIN) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/11 2011.05 - Rev.B BD6538G ●Typical application circuit 5V(typ.) 10k~ 100kΩ CIN Controller VIN GND EN /OC VOUT CL + - Technical Note Ferrite bead Fig.41 Typical application circuit ●Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1uF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. ●Power dissipation character (SSOP5 package) 700 600 POWER DISSIPATION: Pd[mV] 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta[℃] * 70mm * 70mm * 1.6mm : glass epoxy board mounting Fig.42 Power dissipation curve (Pd-Ta Curve) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/11 2011.05 - Rev.B BD6538G Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/11 2011.05 - Rev.B BD6538G ●Ordering part number Technical Note B D 6 Part No. 6538 5 3 8 G - T R Part No. Package G: SSOP5 Packaging and forming specification TR: Embossed tape and reel (SSOP5) SSOP5 2.9±0.2 5 4 +6° 4° −4° Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold +0.2 1.6 −0.1 2.8±0.2 1 2 3 0.2Min. ( reel on the left hand and you pull out the tape on the right hand 1pin ) +0.05 0.13 −0.03 1.25Max. S +0.05 0.42 −0.04 0.95 0.1 S 1.1±0.05 0.05±0.05 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/11 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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