Datasheet
Small Signal IGBT/MOSFET Gate Driver Series
Two-Channel/Three-Channel
Small Signal
IGBT/MOSFET Gate Drivers
BD6562FV-LB, BD6563FV-LB
●General Description
These products guarantee long time support in
Industrial market.
These products are the most suitable to use as these
applications.
●Key Specifications
Output-side supply voltage(max.):
30V
Input-side supply voltage:
3.0V to 5.5V
Output peak current(≦1us):
±0.6A
Input-Output delay time (at VDD=3.3V):380ns(Max.)
Input-Output delay time (at VDD=5.0V):345ns(Max.)
Operating temperature range:
-25℃ to +125℃
BD6562FV-LB/BD6563FV-LB is 2ch/3ch gate driver to
drive gate of IGBT/MOSFET from 3.3V or 5V input
signals.
Output signals consist of each high side and low side
drive signals in order to make ON/OFF timing control
easy. 1 input signal generates 2 output signals which are
high side output and low side output signal for 1 channel
drive. High side output signal outputs "H" level and high
impedance and low side output signal outputs "L" signal
and high impedance.
●Package
SSOP-B16
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.40mm x 1.35mm
●Features
Long Time Support Product for Industrial Applications
Two-Channel/Three-Channel Gate Drivers
Separated Turn ON and Turn OFF Output
●Applications
Low-side IGBT/MOSFET Gate Drive for DCDC
Converter
Low-side IGBT/MOSFET Gate Drive for Inverter
SSOP-B16
●Typical Application Circuit
OUT_H1, OUT_H2/
OUT_H1, OUT_H2, OUT_H3
IN1, IN2/
IN1, IN2, IN3
BD6562FV-LB/
BD6563FV-LB
OUT_L1, OUT_L2/
OUT_L1, OUT_L2, OUT_L3
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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TSZ02201-0717ABZ00030-1-2
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Datasheet
BD6562FV-LB, BD6563FV-LB
●Pin Configuration
(BD6562FV-LB TOP VIEW)
(BD6563FV-LB TOP VIEW)
VCC
1
16
OUT_H1
VCC
1
16
OUT_H1
VDD
2
15
OUT_L1
VDD
2
15
OUT_L1
LGND
3
14
PGND
LGND
3
14
PGND
IN1
4
13
NC
IN1
4
13
OUT_H2
NC
5
12
NC
IN2
5
12
OUT_L2
IN2
6
11
PGND
IN3
6
11
PGND
LGND
7
10
OUT_H2
LGND
7
10
OUT_H3
VCC
8
9
OUT_L2
VCC
8
9
OUT_L3
Figure 2. Pin configuration
●Pin Description
BD6562FV-LB
BD6563FV-LB
Pin No.
Pin Name
Function
Pin No.
Pin Name
Function
1
VCC
Output-side power supply pin
1
VCC
Output-side power supply pin
2
VDD
Input-side power supply pin
2
VDD
Input-side power supply pin
3
LGND
Input-side ground pin
3
LGND
Input-side ground pin
4
IN1
Control input 1 pin
4
IN1
Control input 1 pin
5
NC
NC
5
IN2
Control input 2 pin
6
IN2
Control input 2 pin
6
IN3
Control input 3 pin
7
LGND
Input-side ground pin
7
LGND
Input-side ground pin
8
VCC
Output-side power supply pin
8
VCC
Output-side power supply pin
9
OUT_L2
Low-side output 2 pin
9
OUT_L3
Low-side output 3 pin
10
OUT_H2
High-side output 2 pin
10
OUT_H3
High-side output 3 pin
11
PGND
Output-side ground pin
11
PGND
Output-side ground pin
12
NC
NC
12
OUT_L2
Low-side output 2 pin
13
NC
NC
13
OUT_H2
High-side output 2 pin
14
PGND
Output-side ground pin
14
PGND
Output-side ground pin
15
OUT_L1
Low-side output 1 pin
15
OUT_L1
Low-side output 1 pin
16
OUT_H1
High-side output 1 pin
16
OUT_H1
High-side output 1 pin
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Datasheet
BD6562FV-LB, BD6563FV-LB
●Block Diagram
VDD
VCC
Level Shift
IN1
Filter
LGND
PGND
IN2
Filter
*1
Filter
IN3
OUT_H1
OUT_L1
Level Shift
OUT_H2
OUT_L2
Level Shift
OUT_H3 *1
OUT_L3 *1
*1 BD6562FV-LB : There are not IN3, OUT_H3 and OUT_L3.
Figure 3. Block Diagram
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Datasheet
BD6562FV-LB, BD6563FV-LB
●Absolute Maximum Ratings
Parameter
Symbol
Limits
Units
Output-side supply voltage
VCCMAX
30
V
Input-side supply voltage
VDDMAX
7
V
INX *1 pin input voltage
VINXMAX
-0.3 to VDD+0.3
V
OUT_HX / OUT_LX *1 pin
output voltage
VOUTHXMAX
VOUTLXMAX
-0.3 to VCC+0.3
V
OUT_HX *1 pin
output current (Peak 1us)
IOUTHXMAX
-0.6*2
A
OUT_LX *1 pin
output current (Peak 1us)
IOUTLXMAX
+0.6*2
A
Pd
0.87*3
W
Operating temperature range
TOPR
-25 to +125
℃
Storage temperature range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Power dissipation
Junction temperature
*1
*2
*3
BD6562FV-LB : X=1,2
BD6563FV-LB : X=1,2,3
Should not exceed Pd and Tj=150C.
Derate above Ta=25C at a rate of 7.0mW/C. Mounted on a glass epoxy of 70 mm 70 mm 1.6 mm.
●Recommended Operating Ratings
Parameter
Symbol
Min.
Max.
Units
Output-side supply voltage
VCC
10
25
V
Input-side supply voltage
VDD
3.0
5.5
V
INX *1 high level input voltage
VDD
VDD×0.7
-
V
INX *1 low level input voltage
VDD
-
VDD×0.3
V
*1
BD6562FV-LB : X=1,2
BD6563FV-LB : X=1,2,3
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Datasheet
BD6562FV-LB, BD6563FV-LB
●Electrical Characteristics
（Unless otherwise specified Ta=-25℃ to 125℃, V DD=3.0V to 5.5V, VCC=10V to 25V）
Parameter
Symbol
Min.
Typ.
Max.
Unit
INX *1 pull-down resistance
RINX *1
25
50
100
kΩ
Output-side circuit current 1
ICC1
-
0.32
1
mA
IN1=IN2=IN3=0V *2
Output-side circuit current 2
ICC2
-
0.43
1
mA
2
IN1=IN2=IN3=25kHz * ,
Duty=50%
Input-side circuit current 1
IDD1
-
0
10
uA
IN1=IN2=IN3=0V *2
Input-side circuit current 2
IDD2
-
25
100
uA
2
IN1=IN2=IN3=25kHz * ,
Duty=50%
High level output voltage
VOUTHX *1
VCC-2.0
VCC-1.0
VCC-0.4
V
IOUTHX=-100mA *1
Low level output voltage
VOUTLX *1
0.15
0.4
1.0
V
IOUTLX=100mA *1
Output delay time H 1
tPLHX1 *1
170
250
330
ns
V DD =5.0V
Output delay time L 1
tPHLX1 *1
185
265
345
ns
V DD =5.0V
⊿tPLHX1-PHLX1
1
*
-30
-15
20
ns
V DD =5.0V
Output delay time H 2
tPLHX2 *1
170
250
330
ns
V DD =3.3V
Output delay time L 2
tPHLX2 *1
220
300
380
ns
V DD =3.3V
⊿tPLHX2-PHLX2
*1
-80
-50
10
ns
V DD =3.3V
Delay matching,
1
tPLHX – tPLHY *
⊿tPLH
-20
0
20
ns
Delay matching,
tPHLX – tPHLY *1
⊿tPHL
-20
0
20
ns
Delay matching 1,
tPLHX1 – tPHLX1 *1
Delay matching 2,
tPLHX2 – tPHLX2 *1
*1
*2
Conditions
BD6562FV-LB : X=1,2 Y=1,2
BD6563FV-LB : X=1,2,3 Y=1,2,3
BD6562FV-LB : There is not IN3.
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BD6562FV-LB, BD6563FV-LB
100.0
100.0
85.0
85.0
Ta=-25℃
70.0
RINX [kΩ]
RINX [kΩ]
●Typical Performance Curves
70.0
VDD=5.5V
55.0
55.0
40.0
40.0
VDD=5.0V
Ta=25℃
Ta=125℃
25.0
25.0
3.0
3.5
4.0
4.5
VDD [V]
5.0
5.5
-40
1.0
1.0
0.8
0.8
0.6
-20
0
20
40 60
Ta [℃]
I CC1 [mA]
Ta=125℃
0.4
0.6
Vcc=25V
0.2
Ta=25℃
Vcc=15V
Vcc=10V
Ta=-25℃
0.0
0.0
10
15
20
25
-25
VCC [V]
0
25
50
Ta [℃]
75
100
125
Figure 7. Output-side circuit current
*2
（at IN1=IN2=IN3=L ）
Figure 6. Output-side circuit current
*2
（at IN1=IN2=IN3=L ）
*2
100 120
0.4
0.2
*1
80
Figure 5. INX *1 pull-down resistance
Figure 4. INX *1 pull-down resistance
ICC1 [mA]
VDD=3.0V
BD6562FV-LB : X=1,2
BD6563FV-LB : X=1,2,3
BD6562FV-LB : There is not IN3.
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BD6562FV-LB, BD6563FV-LB
1.0
1.0
0.9
0.9
0.8
0.8
Ta=125℃
Vcc=25V
0.7
0.6
I CC2 [mA]
I CC2 [mA]
0.7
0.5
0.4
0.6
0.5
0.4
0.3
0.3
Ta=25℃
Ta=-25℃
0.2
0.2
Vcc=15V
Vcc=10V
0.1
0.1
0.0
0.0
10
15
20
-25
25
0
25
50
Ta [℃]
VCC [V]
9.0
7.0
7.0
IDD1 [uA]
I DD1 [uA]
9.0
Ta=125℃
Ta=25℃
3.0
125
5.0
VDD=5.5V
VDD=5.0V
3.0
VDD=3.0V
Ta=-25℃
1.0
1.0
-1.0
-1.0
3.0
3.5
4.0
4.5
VDD [V]
5.0
5.5
-25
Figure 10. Input-side circuit current
*1
（at IN1=IN2=IN3=L ）
*1
100
Figure 9. Output-side circuit current
（at IN1=IN2=IN3=25kHz *1 and Duty=50%）
Figure 8. Output-side circuit current
*1
（at IN1=IN2=IN3=25kHz and Duty=50%）
5.0
75
0
25
50
Ta [℃]
75
100
125
Figure 11. Input-side circuit current
*1
（at IN1=IN2=IN3=L ）
BD6562FV-LB : There is not IN3.
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TSZ02201-0717ABZ00030-1-2
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BD6562FV-LB, BD6563FV-LB
100.0
100.0
90.0
Ta=125℃
80.0
80.0
70.0
60.0
IDD2 [uA]
I DD2 [uA]
Ta=125℃
Ta=25℃
60.0
50.0
VDD=5.0V
VDD=5.5V
40.0
40.0
Ta=-25℃
30.0
Ta=-40℃
Ta=25℃
20.0
20.0
VDD=3.0V
10.0
0.0
0.0
3.0
3.5
4.0
4.5
VDD [V]
5.0
-25
5.5
0
25
50
Ta [℃]
75
100
125
Figure 13. Input-side circuit current
（at IN1=IN2=IN3=25kHz *1 and Duty=50%）
Figure 12. Input-side circuit current
*1
（at IN1=IN2=IN3=25kHz and Duty=50%）
VCC
-0.40
VCC
-0.40
Ta=-25℃
Vcc=25V
-0.80
Ta=25℃
VOUTHX [V]
VOUTHX [V]
-0.80
-1.20
-1.20
Vcc=10V
Vcc=15V
Ta=125℃
-1.60
-1.60
-2.00
-2.00
10
15
20
25
-25
VCC [V]
Figure 14. High level output voltage
*1
0
25
50
Ta [℃]
75
100
125
Figure 15. High level output voltage
BD6562FV-LB : There is not IN3.
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Datasheet
0.90
0.90
0.75
0.75
Ta=125℃
VOUTLX [V]
VOUTLX [V]
BD6562FV-LB, BD6563FV-LB
0.60
0.45
Vcc=10V
Vcc=15V
Vcc=25V
0.60
0.45
Ta=25℃
0.30
0.30
Ta=-25℃
0.15
0.15
10
15
20
25
-25
0
25
VCC [V]
Figure 16. Low level output voltage
50
Ta [℃]
75
100
125
Figure 17. Low level output voltage
330
330
310
310
Ta=125℃
290
290
270
270
t PLHX [ns]
tPLHX [ns]
VDD=5.5V
250
250
230
230
210
210
VDD=5.0V
Ta=-25℃
Ta=25℃
190
190
170
170
3.0
3.5
4.0
4.5
VDD [V]
5.0
5.5
-25
Figure 18. Output delay time H
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VDD=3.0V
0
25
50
Ta [℃]
75
100
125
Figure 19. Output delay time H
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Datasheet
BD6562FV-LB, BD6563FV-LB
380
380
365
365
Ta=125℃
350
350
335
335
Ta=125℃
320
305
t PHLX [ns]
305
tPHLX [ns]
VDD=3.0V
320
Ta=25℃
290
275
290
275
260
260
Ta=25℃
245
245
Ta=-40℃
Ta=-25℃
230
230
215
215
200
200
VDD=5.5V
185
185
3.0
3.5
4.0
4.5
VDD [V]
5.0
-25
5.5
0
Figure 20. Output delay time L
0
0
-10
-10
-20
-20
-30
-40
Ta=125℃
Ta=25℃
Ta=-25℃
-50
25
50
Ta [℃]
75
100
125
Figure 21. Output delay time L
⊿tPLHX - t PHLX [ns]
⊿tPLHX - t PHLX [ns]
VDD=5.0V
-60
VDD=5.5V
-30
VDD=5.0V
-40
-50
-60
VDD=3.0V
-70
-70
-80
-80
3.0
3.5
4.0
4.5
VDD [V]
5.0
5.5
-25
25
50
Ta [℃]
75
100
125
Figure 23. Delay matching, OUT_HX and OUT_LX *1
Figure 22. Delay matching, OUT_HX and OUT_LX *1
*1
0
BD6562FV-LB : X=1,2
BD6563FV-LB : X=1,2,3
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Datasheet
BD6562FV-LB, BD6563FV-LB
20
20
15
15
10
10
5
5
VDD=5.5V
VDD=5.0V
⊿tPLH [ns]
⊿tPLH [ns]
VDD=3.0V
0
-5
-5
Ta=125℃
Ta= 25℃
Ta=-25℃
-10
0
-10
-15
-15
-20
-20
3.0
3.5
4.0
4.5
VDD [V]
5.0
5.5
-25
Figure 24. Delay matching, OUT_H1, OUT_H2, OUT_H3 *1
0
25
50
Ta [℃]
75
100
125
Figure 25. Delay matching, OUT_H1, OUT_H2, OUT_H3 *1
20
20
15
15
10
10
5
5
VDD=5.5V
VDD=5.0V
⊿tPHL [ns]
⊿tPHL [ns]
VDD=3.0V
0
-5
-5
Ta=125℃
Ta= 25℃
Ta=-25℃
-10
-10
-15
-15
-20
-20
3.0
3.5
4.0
4.5
VDD [V]
5.0
5.5
Figure 26. Delay matching, OUT_L1, OUT_L2, OUT_L3
*1
0
-25
*1
0
25
50
Ta [℃]
75
100
125
Figure 27. Delay matching, OUT_L1, OUT_L2, OUT_L3
BD6562FV-LB : There are not OUT_H3 and OUT_L3
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*1
Datasheet
BD6562FV-LB, BD6563FV-LB
●Timing Chart
VDD
VDD/2
INX
VDD/2
LGND
tPLHX
VCC
VCC/2
OUT_HX
(High-Z)*1
tPHLX
(High-Z)*1
VCC/2
OUT_LX
PGND
*1
Under condition that OUT_HX and OUT_LX are shorted.
Figure 28. Timing Chart
●Power Dissipation
1
Power Dissipation : Pd （W)
0.87W
0.75
0.5
0.25
0
0
25
50
75
100
125
150
Ambient Temperature: Ta(℃)
Figure 29. SSOP-B16 Derating Curve
Please confirm that the IC’s chip temperature Tj is not over 150℃, while considering the IC’s power consumption (W),
package power (Pd) and ambient temperature (Ta). When Tj=150℃ is exceeded the functions as a semiconductor do not
operate and some problems (ex. Abnormal operation of various parasitic elements and increasing of leak current) occur.
Constant use under these circumstances leads to deterioration and eventually IC may destruct. Tjmax=150℃ must be strictly
obeyed under all circumstances.
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Datasheet
BD6562FV-LB, BD6563FV-LB
●I/O equivalence circuits
Name
Pin No.
I/O equivalence circuits
Function
VDD
IN1, IN2, IN3 *1
4, 5, 6
IN1, IN2, IN3
*1
Control input X pin
LGND
VCC
OUT_L1, OUT_L2, OUT_L3 *1
OUT_L1, OUT_L2, OUT_L3 *1
9, 12, 15
Low-side output X pin
PGND
VCC
OUT_H1, OUT_H2, OUT_H3 *1
10, 13, 16
OUT_H1, OUT_H2, OUT_H3
*1
High-side output X pin
PGND
*1 BD6562FV-LB : There are not IN3, OUT_L3 and OUT_H3.
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Datasheet
BD6562FV-LB, BD6563FV-LB
●Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection
devices, such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic
capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of LGND pin and PGND pin must be minimum potential in all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
(6) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
(7) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
(9) Input terminal of IC
Between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s
N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 65,
○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N
junction operates as a parasitic diode.
○Also, when GND＞(Terminal B) at the transistor (NPN), The parasitic NPN transistor operates with the
N layers of other elements close to the aforementioned parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship.
The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and
destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by
applying voltage that is lower than the GND (P substrate) to the input terminal.
Transistor (NPN)
Resistor
Terminal A
Terminal B
C
Terminal B
B
Terminal A
N
N
P+
E
N
P+
P
N
P
+
P+
P
Parasitic element
P substrate
Parasitic element
N
B
N
C
E
P substrate
GND
GND
Parasitic element
GND
GND
Parasitic
element
Other adjacent elements
Figure 30. Pattern Diagram of Parasitic Element
(10) Ground Wiring Patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern potential of any external components, either.
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/16
TSZ02201-0717ABZ00030-1-2
10.MAR.2014 Rev.005
Datasheet
BD6562FV-LB, BD6563FV-LB
●Ordering Information
B
D
6
5
6
D
V
-
LBE2
Package
FV : SSOP-B16
Part Number
B
F
2
6
5
6
F
3
V
Product class
LB for Industrial applications
Packaging and forming specification
E2: Embossed tape and reel
-
LBE2
Package
FV : SSOP-B16
Part Number
Product class
LB for Industrial applications
Packaging and forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
SSOP-B16
5.0±0.2
9
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3Min.
4.4±0.2
6.4±0.3
16
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
8
0.10
1.15±0.1
0.15±0.1
0.1
0.65
Direction of feed
1pin
0.22±0.1
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
BD6562FV-LB
BD6563FV-LB
SSOP-B16
(TOP VIEW)
SSOP-B16
(TOP VIEW)
Product Name.
Product Name.
D6563
D6562
LOT No.
LOT No.
1PIN MARK
1PIN MARK
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/16
TSZ02201-0717ABZ00030-1-2
10.MAR.2014 Rev.005
Datasheet
BD6562FV-LB, BD6563FV-LB
●Revision History
Date
Revision
Changes
20.JUN.2012
001
New Release
13.JUL.2012
002
Page 1 : Change Key Specifications ‘Output peak current’
Page 4 : Change Absolute Maximum Ratings ‘OUT_HX pin output current’
Page 4 : Change Absolute Maximum Ratings ‘OUT_LX pin output current’
25.MAR.2013
003
Add BD6562FV
01.AUG.2013
004
Page 5 : Change Electrical Characteristics ‘Delay matching 1”
Page 5 : Change Electrical Characteristics ‘Delay matching 2”
10.MAR.2014
005
Page 1 : Change “Long term operation and supply” ⇒ “Long Time Support”
Page 15 : Add Ordering Information " Product class LB for Industrial applications"
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/16
TSZ02201-0717ABZ00030-1-2
10.MAR.2014 Rev.005
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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