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Structure Product Series Type Features Silicon Monolithic Integrated Circuit System Motor Driver for Portable MD
BD6607KN
・Operates at low power supply voltage (VCC=1.8V min.) ・Incorporates two, 3-phase half-bridge driver circuits (low ON resistance power DMOS 0.85Ω typ.) ・Incorporates two H-bridge driver circuits (low ON resistance power DMOS 0.70Ω typ.) ・Incorporates two comparator circuits for motor BEMF voltage detection ・Incorporates a standby circuit (current at standby 0μA) ・Incorporates thermal shutdown circuit
○Absolute maximum ratings (Ta=25°C) Parameter Power supply voltage for control circuit Power supply voltage for driver Power supply voltage for pre-driver circuit Input voltage Driver output current Power dissipation Operating temperature range Storage temperature range Junction temperature Symbol VCC VM VG VIN Iomax. Pd Topr Tstg Tjmax Limits 7 7 15 0～VCC *1000 **1250 -25～+75 -55～+150 150 Unit V V V V mA mW ℃ ℃ ℃
＊Must not exceed Pd or ASO, Tjmax=150℃. ＊＊Reduced by 10mW/°C over Ta=25°C, when mounted on a glass epoxy board (70mmx70mmx1.6mm). ○Operating conditions (Ta= -25 ～ +75°C) Parameter Power supply voltage for control circuit Power supply voltage for driver Power supply voltage for pre-driver circuit Input voltage for logic signal *1 Input voltage for analog signal *2 Symbol VCC VM VG VIL VIA Min. 1.8 0.9 VM+5 0 0 Typ. 2.4 1.2 Max. 5.0 5.0 12 VCC VM Unit V V V V V
*1 : 1 STALL, ST1, ST2, FI1, RI1, FI2, RI2, UI1, VI1, WI1, PWM1, UI2, VI2, WI2, PWM2 pins *2 : CPUI1, CPUVI1, CPWI1, CPCOM1, CPUI2, CPVI2, CPWI2, CPCOM2 pins This product described in this specification is not judged whether it applies to COCOM regulations. Please confirm in case of export. This product is not designed for protection against radioactive rays.
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○Electrical characteristics (Unless otherwise specified, Ta=25°C, VCC=2.4V, VM=1.2V, VG=6.8V) Parameter Control circuit current at standby Driver power supply current at standby Pre-driver power supply current at standby Power supply current of control circuit at no signal Power supply current of pre-driver at no signal Power supply current of control circuit at operation Power supply current of pre-driver at operation Symbol ICCST IMST IGST ICCN IGN ICC IG Limit Min. Typ. 4 100 8 0.7 Max. 1 1 1 10 160 15 0.95 Unit μA μA μA μA μA μA mA Conditions STALL=L(*1) STALL=L(*1) STALL=L(*1) STALL=L(*1) STALL=L(*1) STALL=H,ST1=ST2=L(*2) STALL=H,ST1=ST2=L(*2)
～Logic input～
Logic H level input voltage Logic L level input voltage Logic H level input current Logic L level input current ST pin pull-down resistance VIH VIL IIH IIL RST VOS ICP VOH VOL VCC x0.8 -1 0.33 -5 -1 VCC x0.8 0.6 VCC x0.2 1 1.0 5 1 VCC x0.2 V V μA μA MΩ mV μA V V Isource=500μA Isink=500A FI, RI, UI, VI, WI, PWM pins FI, RI, UI, VI, WI, PWM pins applied to STALL, ST1,ST2 pins
～BEMF voltage detection comparator～
Comparator input offset voltage Comparator input current Comparator H level output voltage Comparator L level output voltage
～Power MOS～
H-bridge output ON resistance Half-bridge output ON resistance ＊1 : Each input pin=L or H ＊2 : PWM1, PWM2 pins=176.4kHz, each H-bridge input pin= 88.2kHz, each 3-phase half-bridge input pin=100Hz RON1,2 RONU,V,W 0.7 0.85 1.30 1.55 Ω Ω upper and lower ON resistance in total upper and lower ON resistance in total
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○ Package outlines
Type
BD6607KN
Lot No.
○Pin No./Pin name NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pin name WI1 PGNDW1 WO1 ST1 VMVW1 VO1 VO1 PGNDUV1 UO1 UO1 VMU1 VMR1 RO1 RO1 PGND1 FO1 FO1 VMF1 FI1 RI1 COM1 CPUI1 CPVI1 CPWI1 CPWI2 CPVI2 CPUI2 COM2 RI2 FI2 VMF2 FO2 NO. 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Pin name FO2 PGND2 RO2 RO2 VMR2 VMU2 UO2 UO2 PGNDUV2 VO2 VO2 VMVW2 ST2 WO2 PGNDW2 WI2 VI2 UI2 PWM2 CPUO2 CPVO2 CPWO2 STALL GND VCC VG CPWO1 CPVO1 CPUO1 PWM1 UI1 VI1
UQFN64 outlines (Unit：mm) ○Block diagram
GND(56) PWM2(51) VI2(549) WI2(48) UI2(50)
PGNDW2(47) VCC(57) PGNDUV2(41)
STALL(55)
Stand-by
Decoder
UO2(39,40)
ST2(45) ST1(4) PGND2(34) FI2(30) FO2(32,33)
Pre Drive
VMU2(38) VMVW2(44) VO2(42,43)
WO2(46)
Pre Drive
+ － CPUO2(52)
VMF2(31) VMR2(37)
BEMF COMP2
+ － CPVO2(53)
RO2(35,36) RI2(29)
+ － CPWO2(54) COM2(28) CPUI2(27) CPVI2(26)
VG(58)
CPWI2(25) PGNDW1(2) PGNDUV1(8)
PGND1(15) FI1(19) FO1(16,17)
Pre Drive
VMF1(18) VMR1(12)
Pre Drive
UO1(9,10)
VMU1(11) VMVW1(5) VO1(6,7)
RO1(13,14) RI1(20)
BEMF COMP1 Decoder
+ － + － + －
WO1(3)
CPUO1(61)
CPVO1(60)
CPWO1(59)
CPVI1(23)
CPUI1(22)
CPWI1(24)
PWM1(62)
COM1(21)
UI1(63)
VI1(64)
WI1(1)
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○Notes on the use (1) Absolute maximum ratings If the input voltage or the operating temperature range exceeds absolute maximum ratings, IC may be damaged. No destruction mode (e.g., short-circuiting or open) can be specified in that case. If such special mode as will exceed absolute maximum ratings is assumed, take the physical safety measures, such as a fuse. (2) Power supply lines The regenerated current by BEMF of the motor will return. Therefore, take measures, such as the insertion of a capacitor between the power supply and GND as the pass of the regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage of the power supply line to rise, which the product and its peripheral circuit may exceed the absolute maximum ratings. It is recommended to implement physical safety measures such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) Ground potential Ensure a minimum GND pin potential in all operating conditions. (4) Design for heat Use the design for heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual using conditions. (5) Operation in strong magnetic field Use caution when using the IC in the strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, make settings so that the output transistors for the motor will not be used under conditions in excess of the absolute maximum ratings and ASO. (7) Thermal shutdown circuit This IC incorporates thermal shutdown circuit(TSD circuit). When the chip temperature becomes the one shown in below, TSD circuit operates and makes the coil output to motor open. It is designed to shut the IC off from runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD ON temperature[℃] 175 (8) Ground wiring pattern When having both small signal and large current GND, it is recommended to isolate the two GND patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause voltage variations of the small signal GND. Be careful not to change the GND wiring pattern of any external parts, either. (typ.) Hysteresis temperature 25 [℃ ] (typ.)
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Notice
Notes
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R1120A
