BD6701F-E2

Datasheet DC Brushless Motor Drivers for Cooling Fans Two-phase Full-wave DC Brushless Fan Motor Drivers BD6701F ●General description BD6701F is two-phase half-wave fan motor 1 chip driver that composes 2 Nch power DMOS FET. This driver incorporates lock protection, automatic restart circuit and FG/AL output. ●Package SOP-8 W (Typ.) x D (Typ.) x H (Max.) 5.00mm x 6.20mm x 1.71mm ●Features „ Power Tr incorporated „ Incorporates reverse connection protection diode „ Incorporates lock protection and automatic restart circuit „ Rotation speed pulse signal (FG) output „ Lock alarm signal (AL) output SOP8 ●Application „ For desktop PC, server, general consumer equipment, communication equipment and industrial equipment. ●Absolute maximum ratings Symbol Parameter Supply voltage Power dissipation Operating temperature range Storage temperature range Output current AL signal output current AL signal output voltage FG signal output current FG signal output voltage Junction temperature *1 *2 ● Vcc Pd Topr Tstg Iomax IAL VAL IFG VFG Tjmax Limit Unit 36 780 *1 -40∼+100 -55∼+150 800 *2 10 36 10 36 150 V mW ℃ ℃ mA mA V mA V ℃ Reduce by 6.24mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. Recommended operating conditions Symbol Limit Unit Operating supply voltage range Vcc 6.0∼28.0 V Hall input voltage range VH 0∼Vcc-3.0 V Parameter ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Pin configuration ●Pin description P/No. 1 2 3 4 5 6 7 8 (TOP VIEW) OUT2 1 8 GND AL 2 7 OUT1 FG 3 6 H- Vcc 4 5 H+ T/Name OUT2 AL FG Vcc H+ H– OUT1 GND Function Motor output terminal 2 Lock alarm signal output terminal Speed pulse signal output terminal Power supply terminal Hall + input terminal Hall – input terminal Motor output terminal 1 Ground terminal (signal ground) Fig.1 Pin configuration ●Block diagram OUT2 1 AL GND 8 Lock Detect Auto Restart Pre Drive OUT1 2 7 OSC FG H- 3 6 Control TSD Vcc 4 HALL AMP REG - H+ + 5 Fig.2 Block diagram ●I/O truth table Hall input Driver output H+ H- H L L H OUT1 OUT2 FG H (Output Tr OFF) L (Output Tr ON) L (Output Tr ON) H (Output Tr OFF) L (Output Tr ON) Hi-Z (Output Tr OFF) H; High, L; Low, Hi-Z; High impedance FG output is open-drain type. Motor state Rotating Locking AL L Hi-Z L; Low, Hi-Z; High impedance AL output is open-drain type. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Electrical characteristics(Unless otherwise specified Ta=25°C, Vcc=12V) Parameter Circuit current Hall input offset voltage Hall input hysteresis Output L voltage Output leak current Output zenner voltage Lock detection ON time Lock detection OFF time FG output voltage L FG output leak current AL output voltage L AL output leak current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Symbol Icc Vhofs Vhys Vol Iol Voz Ton Toff Vall Iall Vfgl Ifgl Min. 3 -10 ±5 50 0.30 3.0 - Limit Typ. 6 ±10 0.30 54 0.50 5.0 - 3/13 Max. 9 10 ±15 0.50 100 58 0.70 7.0 0.4 50 0.4 50 Unit mA mV mV V µA V sec sec V μA V μA Conditions Ref. data Io=±200mA Vo=45V Clamp current =10mA IFG=5mA VFG=36V IAL=5mA VAL=36V TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Typical performance curves(Reference data) 20 12 100°C Hall input hysteresis, Vhys [mV] Circuit current, Icc [mA] 100°C 9 25°C -40°C 6 3 10 25°C -40°C 0 -10 Operating range Operating range -20 0 0 6 12 18 24 0 30 6 18 24 30 Supply voltage, Vcc [V] Supply voltage, Vcc [V] Fig.3 Circuit current Fig.4 Hall input hysteresis 5 60 Output zenner voltage, VOZ [V] Output L voltage, VOL [V] 12 4 3 2 100°C 1 25°C -40°C 0.2 0.4 0.6 100°C 54 25°C 52 -40°C Operating range 0 0.8 6 12 18 24 30 Supply voltage, Vcc [V] Output current, Io [mA] Fig.5 Output L voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 56 50 0 0 58 Fig.6 Output zenner voltage 4/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Typical performance curves(Reference data) 6.0 Lock detect OFF time, TOFF [sec] Lock detect ON time, TON [sec] 0.60 0.55 0.50 100°C 25°C 0.45 -40°C 5.5 5.0 100°C 25°C 4.5 -40°C Operating range Operating range 4.0 0.40 0 6 12 18 24 30 0 6 18 24 30 Supply voltage, Vcc [V] Supply voltage,Vcc [V] Fig.7 Lock detection ON time Fig.8 Lock detection OFF time 0.20 0.20 FG/AL low voltage, VFGL/VALL [V] FG/AL low voltage, VFGL/VALL [V] 12 0.15 100°C 25°C 0.10 -40°C 0.05 0.15 0.10 0.05 0.00 0.00 0 2 4 6 8 0 10 4 6 8 10 FG/AL current, IFG/IAL [mA] FG/AL current, IFG/IAL [mA] Fig.9 FG/AL output L voltage (Temperature characteristics) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 Fig.10 FG/AL output L voltage (Voltage characteristics) 5/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Typical performance curves(Reference data) Drain current, Ids [A] 10.0 1.0 0.8 0.1 0.1 1.0 10.0 36.0 100.0 Drain - source voltage, Vds[V] Fig.11 Output Tr ASO (Ton=100msec) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Application circuit example(Constant values are for reference) OUT2 1 Connect a pull-up resistor because open collector output is set. AL GND 8 Lock Detect Auto Restart Pre Drive OUT1 2 7 Set according to the amplitude of hall element output and hall input voltage range. OSC FG Take a measure against Vcc voltage rise generated by reverse connection of current and back electromotive force. H- 3 6 HALL Control TSD Vcc 4 HALL AMP REG - H+ + 5 Fig.12 application circuit Substrate design note a) IC power, motor outputs, and motor ground lines are made as fat as possible. b) IC ground (signal ground) line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to (–) land. c) The bypass capacitor and/or Zenner diode are arrangement near to Vcc terminal. d) H+ and H– lines are arranged side by side and made from the hall element to IC as shorter as possible, because it is easy for the noise to influence the hall lines. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Description of operations 1) Lock protection and automatic restart ○Incorporated counter system Motor rotation is detected by hall signal, and lock detection ON time (TON) and lock detection OFF time (TOFF) are set by IC internal counter. Timing chart is shown in Fig.13. H+ TOFF TON OUT1 Output Tr OFF ON OUT2 FG Hi (Open collector) AL Lock Motor Recovers Lock release normal operation locking detection Fig.13 Lock protection (incorporated counter system) timing chart www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.14 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj – Ta) / P [°C/W] Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Fig.15 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70 [mm] x 1.6 [mm] (copper foil area below 3 [%])) Pd(mW) 800 780 700 624 600 θja = (Tj – Ta) / P [°C/W] 500 Ambient temperature Ta[°C] Package surface temperature Tc[°C] 400 300 200 100 Chip surface temperature Tj[°C] Power consumption P[W] 0 Fig.14 Thermal resistance ●I/O equivalence circuit(Resistance values are typical) 1) Hall input terminal 25 50 75 85 95 100 125 150 Ta(℃) ＊Reduce by 6.24mW/°C over 25°C (On 70.0mm x 70.0mm x 1.6mm glass epoxy board) Fig.15 Thermal de-rating curve 2) Output terminal OUT1 Vcc H+ OUT2 1kΩ 1kΩ H- 3) FG output terminal 4) AL output terminal FG www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 AL 9/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Safety measure 1) Reverse connection protection diode Reverse connection of power results in IC destruction as shown in Fig 16. When reverse connection is possible, reverse connection protection diode must be added between power supply and Vcc. Reverse power connection In normal energization Vcc After reverse connection destruction prevention Vcc Vcc Circuit block Circuit block Each pin GND Internal circuit impedance high Æ amperage small Circuit block Each pin GND Large current flows Æ Thermal destruction Each pin GND No destruction Fig.16 Current flow when power is connected reversely 2) About measures of voltage rise by back electromotive force The voltage of output terminal rises by back electromotive force. The diode D1 of Fig.17 is necessary to divide a power supply line of motor with small signal line, so that the voltage of the output does not affect a power supply line. D1 IC Fig.17 Separation of a power supply line 3) FG/AL output Vcc FG /AL Pull-up resistor Protection resistor R1 Connector of board Fig.18 Protection of FG and AL terminal FG and AL output is an open collector and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG or AL output terminal is directly connected to power supply, could damage the IC. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F 4) Problem of GND line PWM switching Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum. Vcc Motor Driver GND Controller PWM input Prohibite Fig.19 GND Line PWM switching prohibited ●Calculation of power consumption by IC Power consumption of this IC is approximately calculated as follows: Pc=Pc1+Pc2+Pc3 ・Pc1：Power consumption by circuit current Pc1=Vcc×Icc ・Pc2：Power consumption on output stage Pc2=VOL×Io VOL is the L voltage of output terminal 1 and 2. Io is the current flowing to output terminal 1 and 2. ・Pc3：Power consumption at FG and AL Pc3=VFG×IFG＋VAL×IAL VFG is L voltage of FG output. VAL is L voltage of AL output. IFG and IAL are the current of FG and AL. Vcc Icc FG IFG OUT1 OUT2 Io Fig.20 Calculation of power consumption by IC Power consumption by IC greatly changes with use condition of IC such as power supply voltage and output current. Consider thermal design so that the maximum power dissipation on IC package is not exceeded. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Operational Notes 1) Absolute maximum ratings An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. 14) In use We are sure that the example of application circuit is preferable, but please check the character further more in application to a part which requires high precision. In using the unit with external circuit constant changed, consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet BD6701F ●Physical dimension tape and reel information SOP8 6 5 +6° 4° −4° 0.3MIN 7 4.4±0.2 6.2±0.3 8 1 2 3 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking diagram SOP8 (TOP VIEW) 6 7 0 1 Part Number LOT Number 1PIN Mark www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/13 TSZ02201-0H1H0B100510-1-2 18.DEC.2012 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. 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If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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