BD6712AF

1/4 STRUCTURE PRODUCT SERIES TYPE FEATURES Silicon Monolithic Integrated Circuit 2-Phase Half-Wave Pre Driver for Fan Motor ＢＤ６７１２ＡＦ Built - in zenner diode for Vcc clamp 〇ABSOLUTE MAXIMUM RATINGS Parameter Power dissipation Operating temperature Storage temperature Output current AL Signal output current Symbol Pd Topr Tstg Iomax IAL VAL Limit 780＊ -35～+95 -55～+150 40 15 60 Unit mW ℃ ℃ mA mA V ℃ AL Signal output voltage Tjmax 150 Junction temperature ＊ To use at temperature above Ta=25℃ reduce 6.24mW/℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) 〇OPERATING CONDITIONS Parameter Operating supply voltage range Operating supply current range FG output voltage range ， AL output voltage range Hall input voltage range Symbol Vcc Icc VSI VH Limit 3.5～Vcz 1～30 0～48 0～Vcz-1.5 Unit V mA V V ＊This product is not designed for production against radioactive rays. ＊This document may be strategic data subject to COCOM regulations. REV. B 2/4 〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V) Limit Unit Min. Typ. Max. Internal voltage Vcz 5.5 6.0 6.5 V Circuit current1 Icc1 0.5 1.5 3.0 mA Circuit current2 Icc2 4 6.7 9.5 mA Hall input hysteresis voltage Vhys 5 15 25 mV Lock detection ON time TON 0.25 0.5 1 sec Lock detection OFF time TOFF 2.5 5 10 sec Output H voltage VOH Vcc-0.5 Vcc-0.2 Vcc V Output L voltage VOL 0.2 0.5 V Hall output L voltage VFGL 0.15 0.5 V Hall output leak current IFGL 0 10 μA Alarm output L voltage VALL 0.15 0.5 V Alarm output leak current IALL 0 10 μA ＊ H+:3V,H-:2V,Output,FG,AL terminal are open. ＊＊ Hall-input is 100Hz square wave.Output is connected with 1kΩto ground. FG and AL are connected with 50kΩto Vcc. Parameter Symbol Conditions Icc=10mA ＊ ＊＊ Io=-10mA Io=10mA IFG=5mA VFG=48V IAL=5mA VAL=48V REV. B 3/4 〇PACKAGE OUTLINES 5.0±0.2 8 5 6.2±0.3 4.4±0.2 6712A Lot No. 1 4 1.5±0.1 0.11 0.15±0.1 0.1 1.27 0.4±0.1 SOP 8(UNIT:mm) 〇BLOCK DIAGRAM Vcc OUT2 0.3Min. 〇Terminal name Pin No. 1 2 3 4 5 6 7 8 Terminal name Vcc H+ AL HGND FG OUT1 OUT2 1 REG TSD H+ 8 OUT1 + 2 HALL AMP Control 7 AL FG LOCK DETECTION AND AUTO RESTART 3 6 H- GND 4 5 REV. B 4/4 〇CAUTIONS 1) Absolute maximum ratings There is possibility of destruction in using beyond the absolute maximum rating. In case of destruction, a failure mode can not be defined (short mode or open mode). Therefore when special mode is envisaged where absolute maximum rating may be exceeded, please take a physical safety measure such as fuse. 2) Reverse connection of power supply connector Reverse connection of power supply connector may break IC. Take a measure against reverse connection destruction such as inserting a diode between power supply and Vcc terminal. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current, and fully ensure that the capacitor characteristics have no problem before determine a capacitor value 4) GND potential Ensure that the potential of GND terminal is the minimum potential in any operating condition. Also ensure that all terminals except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Consider the power dissipation under actual use condition and apply thermal design with sufficient margin. 6) Mounting failures In attaching IC to printed board, pay enough attention to the direction and dislocation of IC. Mounting failures may break IC. In addition, destruction is also possible when circuit is shorted by foreign substance brought between outputs or between output and power supply - GND. 7) Operation in strong electromagnetic field Use in strong electromagnetic field may cause malfunction, please be careful. 8) ASO Please consider that the output Tr does not exceed the absolute maximum rating and ASO. 9) Thermal shut down circuit This IC has thermal shut down (TSD) circuit. Operation temperature is 175℃(typ.) and has a hysteresis width of 25 ℃ (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is simply for the purpose of intercepting IC from overheating, and not for protecting and assuring IC. Therefore do not continue to use IC thereafter with this circuit operating and do not use IC assuming the operation of this circuit. 10) Inspection with a set board When connecting a capacitor to a pin with low impedance in inspection on a set board, stress may possibly be applied to IC, therefore be sure to apply discharging in each process. In attaching to and detaching from jigs in inspection process, be sure to turn off power before connecting, and turn off power before removing IC. In addition, apply grounding to assembling process as a measure of anti-static electricity, and use full caution in transporting and storing. 11) GND wiring pattern When there are small signal GND and large current GND, separate the large current GND pattern from small signal GND pattern. It is recommended to apply one-point grounding at the reference point of the set in order that resistance of wiring pattern and large current do not cause change of voltage of small signal GND. Please be cautious not to fluctuate the wiring pattern of GND of external mounted parts. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. 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