System Lens Driver Series for Digital Still Cameras / Single-lens Reflex Cameras
7ch System Lens Drivers for
Digital Still Cameras / Single-lens Reflex Cameras
BD6757KN, BD6889GU
No.09014EAT04
●Description
BD6757KN and BD6889GU motor drivers provide 6 Full-ON Drive H-bridge channels and 1 Linear Constant-Current Drive
H-bridge channel. Stepping motors can be used for the auto focus, zoom, and iris, making it possible to configure a
sophisticated, high precision lens drive system. ROHM’s motor drivers are both compact, multifunctional, and enable
advanced features such as lens barrier and anti shock.
●Features
3
1) Subminiature grid array package: 5.0 5.0 1.2mm (BD6889GU)
2) DMOS output allowing a range power supply: 2.0V to 8.0V (BD6757KN)
3) Low ON-Resistance Power MOS output:
Full-ON Drive block with 1.3Ω Typ. and Linear Constant-Current Drive block with 0.9Ω Typ. (BD6757KN, BD6889GU)
4) Built-in two digital NPN transistor circuits for photo-interrupter waveform shaping:
Input-dividing type with output pull-up resistance (BD6757KN)
5) Built-in four digital NPN transistor circuits for photo-interrupter waveform shaping:
Input-dividing type with output pull-up resistance (BD6889GU)
6) Built-in four digital PNP transistor circuits for photo-interrupter waveform shaping:
Input-dividing type with output pull-down resistance (BD6889GU)
7) Built-in voltage-regulator circuit for photo-interrupter (BD6889GU)
8) Built-in two-step output current setting switch for the Linear Constant-Current Drive block (BD6757KN)
9) 0.9V±2% high-precision reference voltage output
10) Constant-Current Drive block features phase compensation capacitor-free design
11) Built-in ±3% high-precision Linear Constant-Current Driver
12) Built-in charge pump circuit for the DMOS gate voltage drive(BD6757KN)
13) UVLO (Under Voltage Lockout Protection) function
14) Built-in TSD (Thermal Shut Down) circuit
15) Standby current consumption: 0μA (Typ.)
●Absolute Maximum Ratings
Parameter
Power supply voltage
Motor power supply voltage
Charge pump voltage
Control input voltage
Power dissipation
Operating temperature range
Junction temperature
Storage temperature range
H-bridge output current
Symbol
VCC
VM
VG
VIN
Pd
Topr
Tjmax
Tstg
Iout
Limit
BD6757KN
-0.5 to +7.0
-0.5 to +10.0
15.0
-0.5 to VCC+0.5
950※1
-25 to +75
+150
-55 to +150
-800 to +800※3
BD6889GU
-0.5 to +7.0
-0.5 to +7.0
None
-0.5 to VCC+0.5
980※2
-25 to +85
+150
-55 to +150
-800 to +800※3
Unit
V
V
V
V
mW
°C
°C
°C
mA/ch
※1 Reduced by 7.6mW/°C over 25°C, when mounted on a glass epoxy board (70mm 70mm 1.6mm).
※2 Reduced by 7.84mW/°C over 25°C, when mounted on a glass epoxy board (70mm 70mm 1.6mm).
※3 Must not exceed Pd, ASO, or Tjmax of 150°C.
●Operating Conditions (Ta=-25 to +75°C(BD6757KN), -25 to +85°C(BD6889GU))
Limit
Parameter
Symbol
BD6889GU
BD6757KN
Power supply voltage
VCC
2.5 to 5.5
2.5 to 5.7
Motor power supply voltage
VM
2.5 to 8.0
2.5 to 5.7
Control input voltage
VIN
0 to VCC
0 to VCC
H-bridge output current
Iout
-500 to +500※4
-500 to +500※4
Unit
V
V
V
mA/ch
※4 Must not exceed Pd or ASO.
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© 2009 ROHM Co., Ltd. All rights reserved.
1/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Electrical Characteristics
1) BD6757KN Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=3.0V, VM=5.0V)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Overall
Circuit current
during standby operation
Circuit current
ICCST
-
0
10
μA
PS=0V
ICC
-
1.0
3.0
mA
PS=VCC with no signal
Control input (IN=PS, IN1A to IN7B, and LIMSW)
High level input voltage
VINH
2.0
-
-
V
Low level input voltage
VINL
-
-
0.7
V
High level input current
IINH
15
30
60
μA
VINH=3V
Low level input current
IINL
-1
0
-
μA
VINL=0V
Pull-down resistor
RIN
50
100
200
kΩ
VCP
10
11
-
V
VUVLO
1.6
-
2.4
V
RON
-
1.3
1.6
Ω
Io=±400mA on high and low sides
in total
tp
100
-
-
ns
With an input pulse with of 200ns
Charge pump
Charge pump voltage
UVLO
UVLO voltage
Full-ON Drive block (ch1 to ch6)
Output ON-Resistance
Pulse input response
Linear Constant-Current Drive block (ch7)
Output ON-Resistance
RON
-
0.9
1.1
Ω
Io=±400mA on high and low sides
in total
VREF output voltage
VREF
0.88
0.90
0.92
V
Iout=0~1mA
Output limit current 1
IOL1
388
400
412
mA
Output limit current 2
IOL2
285
300
315
mA
Output limit current 3
IOL3
190
200
210
mA
RNF=0.5Ω with a load of 10Ω
VLIMH(L)=0.2V, LIMSW=0V(3V)
RNF=0.5Ω with a load of 10Ω
5
VLIMH(L)=0.15V, LIMSW=0V(3V)※
RNF=0.5Ω with a load of 10Ω
VLIMH(L)=0.1V, LIMSW=0V(3V)※5
Digital NPN transistor block for photo-interrupter waveform shaping
Input current
ISIH
-
-
0.1
mA
Low level output voltage
VSOL
-
0.1
0.25
V
Input dividing resistance
RSIL
70
100
130
kΩ
Output pull-up resistance
RSOH
5
10
20
kΩ
Input dividing resistance
comparison
-
0.8
1.0
1.2
-
SIx=3V
SIx=3V, ISO=0.5mA
Division resistance comparison
between SIx and GND※5
※5 Design target value (Not all shipped devices are fully tested.)
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© 2009 ROHM Co., Ltd. All rights reserved.
2/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
2) BD6889GU Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=3.0V, VM=5.0V)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Overall
Circuit current
during standby operation
Circuit current
ICCST
-
0
10
μA
PS=0V
ICC
-
1.5
3.0
mA
PS=VCC with no signal
Control input (IN=PS, IN1A to IN7B, SW, DSW, DSEL1, and DSEL2)
High level input voltage
VINH
2.0
-
-
V
Low level input voltage
VINL
-
-
0.7
V
High level input current
IINH
15
30
60
μA
VINH=3V
Low level input current
IINL
-1
0
-
μA
VINL=0V
Pull-down resistor
RIN
50
100
200
kΩ
VUVLO
1.6
-
2.4
V
RON
-
1.3
1.6
Ω
Io=±400mA on high and low sides
in total
tp
100
-
-
ns
With an input pulse with of 200ns
UVLO
UVLO voltage
Full-ON Drive block (ch1 to ch6)
Output ON-Resistance
Pulse input response
Linear Constant-Current Drive block (ch7)
Output ON-Resistance
RON
-
0.9
1.1
Ω
Io=±400mA on high and low sides
in total
VREF output voltage
VREF
0.88
0.90
0.92
V
Iout=0~1mA
Output limit current 1
IOL1
388
400
412
mA
RNF=0.5Ω with a load of 10Ω, VLIM=0.2V
Output limit current 2
IOL2
285
300
315
mA
RNF=0.5Ω with a load of 10Ω, VLIM=0.15V
Output limit current 3
IOL3
190
200
210
mA
RNF=0.5Ω with a load of 10Ω, VLIM=0.1V
SIx=3V
Digital NPN transistor block for photo-interrupter waveform shaping
Input current
ISIH
-
-
0.1
mA
Low level output voltage
VSOL
-
0.1
0.25
V
Input dividing resistance
RSIN
70
100
130
kΩ
Output pull-up resistance
RSOH
23
33
43
kΩ
Input dividing resistance
comparison
-
0.8
1.0
1.2
-
SIx=3V, ISO=0.5mA
Division resistance comparison
between SIx and GND※6
Digital PNP transistor block for photo-interrupter waveform shaping
Input current
ISIL
-0.1
-
-
mA
High level output voltage
VSOH
VCC-0.25
VCC-0.1
-
V
Input dividing resistance
RSIP
70
100
130
kΩ
Output pull-down resistance
RSOL
23
33
43
kΩ
-
0.8
1.0
1.2
-
Division resistance comparison
6
between SIx and VCC※
Input dividing resistance
comparison
SIx=0V
SIx=0V, ISO=-0.5mA
Voltage-regulator for photo-interrupter
High level output voltage
VREGH
VCC-0.25
VCC-0.2
-
V
IREG=100mA
Output ON-Resistance
RONREG
-
2
2.5
Ω
IREG=100mA
ILPI
-
0
1
μA
SW=VCC
Output leak current
※6 Design target value (Not all shipped devices are fully tested.)
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© 2009 ROHM Co., Ltd. All rights reserved.
3/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Electrical Characteristic Diagrams
BD6757KN
750
570mW
500
250
750
0
25
50
75
510mW
500
250
75°C
0
980mW
1000
85°C
0
100
125
150
0
Ambient temperature : Ta [°C]
(2.5V to 5.7V)
2.0
1.0
0.0
100
2.0
3.0
4.0
5.0
6.0
0.0
3.0
2.0
1.0
10.0 11.0
12.0
13.0 14.0
(2.5V to 5.7V)
2.0
1.0
0.0
15.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Supply voltage : VM [V]
5.0
6.0
BD6757KN
Top 75°C
Mid 25°C
Low -25°C
4.0
3.0
2.0
1.0
9.0
10.0 11.0
12.0
13.0 14.0
Fig.6 Output ON-Resistance
(Linear Constant-Current Drive block)
BD6889GU
Top 85°C
Mid 25°C
Low -25°C
4.0
Op. range
3.0
(2.5V to 5.7V)
2.0
1.0
BD6757KN, BD6889GU
250
200
150
100
Top 85°C
Mid 25°C
Low -25°C
50
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Supply voltage : VM [V]
0
50
100
150
200
Fig.8 Output ON-Resistance
Fig.9 Output limit voltage
(Linear Constant-Current Drive block)
(RNF=0.5Ω)
4/15
250
VLIM voltage : VLIM [mV]
(Full-ON Drive block)
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15.0
(Full-ON Drive block)
Fig.7 Output ON-Resistance
© 2009 ROHM Co., Ltd. All rights reserved.
7.0
Supply voltage : VG [V]
0.0
0.0
4.0
Fig.5 Output ON-Resistance
5.0
Output ON resistance : RON [Ω]
Op. range
3.0
3.0
0.0
9.0
BD6889GU
2.0
5.0
Supply voltage : VG [V]
Top 85°C
Mid 25°C
Low -25°C
1.0
Fig.3 Circuit current
BD6757KN
4.0
7.0
Fig.4 Circuit current
4.0
1.0
Supply voltage : VCC [V]
Top 75°C
Mid 25°C
Low -25°C
Supply voltage : VCC [V]
5.0
(2.5V to 5.5V)
2.0
150
RNF voltage : VRNF [mV]
1.0
Op. range
3.0
0.0
125
0.0
0.0
Output ON resistance : RON [Ω]
75
5.0
Output ON resistance : RON [Ω]
Circuit current : ICC [mA]
Op. range
3.0
50
4.0
Fig.2 Power Dissipation Reduction
BD6889GU
Top 85°C
Mid 25°C
Low -25°C
4.0
25
Top 75°C
Mid 25°C
Low -25°C
Ambient temperature : Ta [°C]
Fig.1 Power Dissipation Reduction
5.0
Circuit current : ICC [mA]
940mW
BD6757KN
5.0
Output ON resistance : RON [Ω]
1000
BD6889GU
1250
Power dissipation : Pd [mW]
Power dissipation : Pd [mW]
1250
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Pin arrangement and Pin Function
SI1
IN1B
SI2
IN1A
OUT5A
OUT4A
OUT5B
OUT4B
PGND2
OUT3A
OUT6A
PGND1
OUT7A
OUT2B
RNF
OUT2A
OUT7B
OUT1B
SENSE
OUT1A
IN6A
IN6B
PS
VM1
VCC
LIMSW
VLIML
VLIMH
VREF
GND
IN5B
IN7A
IN5A
SO1
VM4
SO2
IN7B
26
OUT3B
BD6757KN
OUT6B
52
IN2A
IN2B
IN3A
CP1
VM2
CP2
CP3
VG
CP4
VM3
IN3B
IN4A
IN4B
39
13
Fig.10 BD6757KN Pin Arrangement (Top View)
UQFN52 Package
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Pin Name
IN7B
VM4
IN7A
GND
VREF
VLIMH
VLIML
LIMSW
VCC
VM1
PS
IN6B
IN6A
IN5B
IN5A
OUT1A
OUT1B
OUT2A
OUT2B
PGND1
OUT3B
OUT3A
OUT4B
OUT4A
IN1A
IN1B
BD6757KN Pin Function Table
Function
No. Pin Name
Control input pin ch7 B
27 IN2A
Motor power supply pin ch7
28 IN2B
Control input pin ch7 A
29 IN3A
Ground Pin
30 VM2
Reference voltage output pin
31 CP1
Output current setting pin 1 ch7
32 CP2
Output current setting pin 2 ch7
33 CP3
Output current setting selection pin ch7
34 CP4
Power supply pin
35 VG
Motor power supply pin ch1 and ch2
36 VM3
Power-saving pin
37 IN3B
Control input pin ch6 B
38 IN4A
Control input pin ch6 A
39 IN4B
Control input pin ch5 B
40 SI1
Control input pin ch5 A
41 SI2
H-bridge output pin ch1 A
42 OUT5A
H-bridge output pin ch1 B
43 OUT5B
H-bridge output pin ch2 A
44 PGND2
H-bridge output pin ch2 B
45 OUT6A
Motor ground pin ch1 to ch4
46 OUT6B
H-bridge output pin ch3 B
47 OUT7A
H-bridge output pin ch3 A
48 RNF
H-bridge output pin ch4 B
49 OUT7B
H-bridge output pin ch4 A
50 SENSE
Control input pin ch1 A
51 SO2
Control input pin ch1 B
52 SO1
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5/15
Function
Control input pin ch2 A
Control input pin ch2 B
Control input pin ch3 A
Motor power supply pin ch3 and ch4
Charge pump capacitor connection pin 1
Charge pump capacitor connection pin 2
Charge pump capacitor connection pin 3
Charge pump capacitor connection pin 4
Charge pump output pin
Motor power supply pin ch5 and ch6
Control input pin ch3 B
Control input pin ch4 A
Control input pin ch4 B
Digital transistor input pin 1
Digital transistor input pin 2
H-bridge output pin ch5 A
H-bridge output pin ch5 B
Motor ground pin ch5 and ch6
H-bridge output pin ch6 A
H-bridge output pin ch6 B
H-bridge output pin ch7 A
Resistance connection pin for output current detection ch7
H-bridge output pin ch7 B
Output current detection pin ch7
Digital transistor output pin 2
Digital transistor output pin 1
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
1
A
2
N.C.
B
3
OUT6A OUT6B
4
VM3
5
6
7
PGND3 OUT5B OUT5A
8
N.C.
DSW
IN6A
IN6B
SO4P
SO4N
REG
OUT4A
C
OUT7A
SW
DSEL2
IN7A
SI4
IN5A
PS
OUT4B
D
VM4
VCC
VREF
IN7B
IN5B
SI3
SO3P
VM2
E
RNF
DSEL1
IN1A
IN1B
IN4B
IN4A
SO3N
PGND2
F
SENSE
VLIM
IN2A
SI1
SI2
IN3A
IN3B
OUT3B
G
OUT7B
GND
IN2B
SO1P
SO1N
SO2P
SO2N
OUT3A
H
N.C.
OUT1A OUT1B PGND1
VM1
OUT2B OUT2A
N.C.
Fig.11 BD6889GU Pin Arrangement (Top View)
VBGA063T050 Package
No.
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
B3
B4
B5
B6
B7
B8
C1
C2
C3
C4
C5
C6
C7
C8
D1
D2
D3
D4
D5
D6
D7
D8
Pin Name
N.C.
OUT6A
OUT6B
VM3
PGND3
OUT5B
OUT5A
N.C.
DSW
IN6A
IN6B
SO4P
SO4N
REG
OUT4A
OUT7A
SW
DSEL2
IN7A
SI4
IN5A
PS
OUT4B
VM4
VCC
VREF
IN7B
IN5B
SI3
SO3P
VM2
BD6889GU Pin Function Table
Function
No. Pin Name
E1 RNF
H-bridge output pin ch6 A
E2 DSEL1
H-bridge output pin ch6 B
E3 IN1A
Motor power supply pin ch5 and ch6
E4 IN1B
Motor ground pin ch5 and ch6
E5 IN4B
H-bridge output pin ch5 B
E6 IN4A
H-bridge output pin ch5 A
E7 SO3N
E8 PGND2
F1 SENSE
Enable input pin for transistor
F2 VLIM
Control input pin ch6 A
F3 IN2A
Control input pin ch6 B
F4 SI1
PNP transistor output pin 4
F5 SI2
NPN transistor output pin 4
F6 IN3A
Regulator output pin for PI
F7 IN3B
H-bridge output pin ch4 A
F8 OUT3B
H-bridge output pin ch7 A
G1 OUT7B
Regulator input pin for PI
G2 GND
Selection pin for transistor output 2
G3 IN2B
Control input pin ch7 A
G4 SO1P
Digital transistor input pin 4
G5 SO1N
Control input pin ch5 A
G6 SO2P
Power-saving pin
G7 SO2N
H-bridge output pin ch4 B
G8 OUT3A
Motor power supply pin ch7
H1 N.C.
Power supply pin
H2 OUT1A
Reference voltage output pin
H3 OUT1B
Control input pin ch7 B
H4 PGND1
Control input pin ch5 B
H5 VM1
Digital transistor input pin 3
H6 OUT2B
PNP transistor output pin 3
H7 OUT2A
Motor power supply pin ch3 and ch4
H8 N.C.
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6/15
Function
Resistance connection pin for output current detection ch7
Selection pin for transistor output 1
Control input pin ch1 A
Control input pin ch1 B
Control input pin ch4 B
Control input pin ch4 A
NPN transistor output pin 3
Motor ground pin ch3 and ch4
Output current detection pin ch7
Output current setting ch7
Control input pin ch2 A
Digital transistor input pin 1
Digital transistor input pin 2
Control input pin ch3 A
Control input pin ch3 B
H-bridge output pin ch3 B
H-bridge output pin ch7 B
Ground pin
Control input pin ch2 B
PNP transistor output pin 1
NPN transistor output pin 1
PNP transistor output pin 2
NPN transistor output pin 2
H-bridge output pin ch3 A
H-bridge output pin ch1 A
H-bridge output pin ch1 B
Motor ground pin ch1 and ch2
Motor power supply pin ch1 and ch2
H-bridge output pin ch2 B
H-bridge output pin ch2 A
-
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Application Circuit Diagram
Bypass filter Capacitor for
power supply input. (p.14/16)
0.1μF
0.1μF
0.1μF
1～100uF
CP1
VCC
31
9
Power-saving (p.9/16)
H : Active
L : Standby
PS 11
CP2
CP3
32
33
OSC
Charge Pump
Power Save
TSD & UVLO
Motor control input
(p.9/16)
CP4
VG
34
35
Charge Pump
Bypass filter Capacitor for
power supply input. (p.14/16)
BandGap
1～100uF
10
VG
VM1
16
H bridge
IN1A 25
Level Shift
IN1B 26
Logic12
Full ON
17
OUT1A
OUT1B
M
&
IN2A 27
Pre Driver
18
H bridge
IN2B 28
Full ON
19
OUT2A
Bypass filter Capacitor for
power supply input. (p.14/16)
OUT2B
1～100uF
Motor control input
(p.9/16)
30
VG
22
H bridge
IN3A 29
Level Shift
IN3B 37
Logic34
Full ON
21
VM2
OUT3A
OUT3B
M
&
IN4A 38
Pre Driver
24
H bridge
IN4B 39
Full ON
23
20
OUT4A
Bypass filter Capacitor for
power supply input. (p.14/16)
OUT4B
PGND1
1～100uF
Motor control input
(p.9/16)
36
VG
42
H bridge
IN5A 15
Level Shift
IN5B 14
Logic56
Full ON
43
VM3
OUT5A
OUT5B
M
&
IN6A 13
Pre Driver
45
H bridge
IN6B 12
Full ON
46
44
Motor control input
(p.9/16)
OUT6A
Bypass filter Capacitor for
power supply input. (p.14/16)
OUT6B
PGND2
1～100uF
VG
2
VM4
Level Shift
IN7A 3
Logic7
&
IN7B 1
47
H bridge
Const. Current
Pre Driver
49
OUT7A
OUT7B
RNF
48
50
VCC
VREF
4
GND
5
VREF
8
6
R1
When using the VREF voltage (0.9V) resistance division
value as VLIMH and VLIML input value, select R1, R2, and R3
values such that,
1kΩ≦R1+R2+R3≦20kΩ (p.9/16)
VCC
The output current is converted to a voltage with
the RNF external resistor and transmitted to the
SENSE pin. (p.9/16)
Iout[A] = (VLIMH or VLIML[V])÷RNF[Ω]
Selector
LIMSW
0.1Ω~5.0Ω
SENSE
7
40
VLIMH
VLIML
R2
R3
SI1
52
SO1
41
SI2
51
SO2
The sensor signal SI2, for lens position
detection, is reshaped and output to SO2.
p.10/16
Output current selection
(p.9/16)
H : VLIML
L : VLIMH
The sensor signal SI1, for lens position
detection, is reshaped and output to SO1.
p.10/16
Fig.12 BD6757KN Application Circuit Diagram
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7/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
Bypass filter Capacitor for
power supply input. (p.14/16)
1～100uF
Power-saving (p.9/16)
H : Active
L : Standby
VCC
Bypass filter Capacitor for
power supply input. (p.14/16)
D2
Power Save
PS C7
TSD & UVLO
BandGap
1～100uF
Motor control input
(p.9/16)
H5
VM1
H2
H bridge
IN1A E3
Level Shift
IN1B E4
Logic12
Full ON
H3
OUT1A
OUT1B
M
&
IN2A F3
Pre Driver
H7
H bridge
IN2B G3
Full ON
H6
H4
OUT2A
Bypass filter Capacitor for
power supply input. (p.14/16)
OUT2B
PGND1
1～100uF
Motor control input
(p.9/16)
D8
G8
H bridge
IN3A F6
Level Shift
IN3B F7
Logic34
Full ON
F8
VM2
OUT3A
OUT3B
M
&
IN4A E6
Pre Driver
B8
H bridge
IN4B E5
Full ON
C8
E8
OUT4A
Bypass filter Capacitor for
power supply input. (p.14/16)
OUT4B
PGND2
1～100uF
Motor control input
(p.9/16)
A4
A7
H bridge
IN5A C6
Level Shift
IN5B D5
Logic56
Full ON
A6
VM3
OUT5A
OUT5B
M
&
IN6A B3
Pre Driver
A2
H bridge
IN6B B4
Full ON
A3
A5
OUT6A
Bypass filter Capacitor for
power supply input. (p.14/16)
OUT6B
PGND3
1～100uF
Motor control input
(p.9/16)
D1
VM4
Level Shift
IN7A C4
Logic7
&
IN7B D4
C1
H bridge
Const. Current
Pre Driver
G1
The output current is converted
to a voltage with the RNF
external resistor and transmitted
to the SENSE pin. (p.9/16)
Iout[A] = VLIM[V]÷RNF[Ω]
OUT7A
OUT7B
RNF
E1
F1
Selector for Digital
transistor (p.10/16)
0.1Ω~5.0Ω
SENSE
VLIM
F2
R2
DSEL1 E2
R1
Digital
transistor SW
DTR Selector
DSEL2 C3
VREF
DSW B2
VCC
REG Switch (p.10/16)
H : REG output ON
L : REG output OFF
D3
VCC
B5
VCC
B6
SW
SW
C5
VCC
VCC
VCC
VCC
VCC
Power supply for photo
interrupter (p.10/16)
VCC
G2
VCC
SW
SW
G5
F4
GND
SI1
SO1N
REG
The sensor signal SI1, for lens position
detection, is reshaped and output to SO1x.
(p.10/16)
SO4P
G4
SO1P
SW
G7
F5
SI2
SO2N
G6
SO2P
REG
SI4
The sensor signal SI4, for lens position
detection, is reshaped and output to SO4x.
(p.10/16)
VCC
SW
SO4N
REG
REG B7
SW
When using the VREF voltage (0.9V)
resistance division value as VLIM input
value, select R1 and R2 values such that,
1kΩ≦R1+R2≦20kΩ (p.9/16)
VCC
SW C2
VCC
VREF
SW
E7
D6
SI3
SO3N
D7
SO3P
REG
The sensor signal SI2, for lens position
detection, is reshaped and output to SO2x.
(p.10/16)
The sensor signal SI3, for lens position
detection, is reshaped and output to SO3x.
(p.10/16)
Fig.13 BD6889GU Application Circuit Diagram
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8/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Function Explanation
1) Power-saving function
When Low-level voltage is applied to PS pin, the IC will be turned off internally and the circuit current will be 0μA (Typ.).
During operating mode, PS pin should be High-level. (See the Electrical Characteristics; p.2/16 and p.3/16)
2)
Motor Control input
(1) INxA and INxB pins
These pins are used to program and control the motor drive modes. The Full-ON drivers and the Linear Constant-Current
driver use IN/IN and EN/IN input modes, respectively. (See the Electrical Characteristics; p.2/16 and p.3/16, and I/O Truth
Table; p.10/16)
3) H-bridge
The 7-channel H-bridges can be controlled independently. For this reason, it is possible to drive the H-bridges
simultaneously, as long as the package thermal tolerances are not exceeded.
The H-bridge output transistors of the BD6757KN and BD6889GU consist of Power DMOS, with the charge pump step-up
power supply VG, and Power CMOS, with the motor power supply VM, respectively. The total H-bridge ON-Resistance on
the high and low sides varies with the VG and VM voltages, respectively. The system must be designed so that the
maximum H-bridge current for each channel is 800mA or below. (See the Operating Conditions; p.1/16)
4) Drive system of Linear Constant-Current H-bridge (BD6757KN: ch7 and BD6889GU: ch7)
BD6757KN (ch7) and BD6889GU (ch7) enable Linear Constant-Current Driving.
(1) Reference voltage output (with a tolerance of ±2%)
The VREF pin outputs 0.9V, based on the internal reference voltage. The output current of the Constant-Current Drive
block is controllable by connecting external resistance to the VREF pin of the IC and applying a voltage divided by the
resistor to the output current setting pins. (BD6757KN: VLIMH and VLIML pins, BD6889GU: VLIM pin) It is
recommended to set the external resistance to 1kΩ or above in consideration of the current capacity of the VREF pin,
and 20kΩ or below in order to minimize the fluctuation of the set value caused by the base current of the internal
transistor of the IC.
(2) Output current settings and setting changes (BD6757KN)
When the Low-level control voltage is applied to the LIMSW pin, the value on the VLIMH pin will be used as an output
current set value to control the output current. When the High-level control voltage is applied to the LIMSW pin, the
value on the VLIML pin will be used as an output current set value to control the output current. (See the Electrical
Characteristics; P.2/16)
(3) Output current detection and current settings
By connecting external resistor (0.1Ω to 5.0Ω) to the RNF pin of the IC, the motor drive current will be converted into
voltage in order to be detected. The output current is kept constant by shorting the RNF and SENSE pins and
comparing the voltage with the VLIMH or VLIML voltage (VLIM voltage in the case of the BD6889GU). To perform
output current settings more precisely, trim the external RNF resistance if needed, and supply a precise voltage externally to
the VLIMH or VLIML pin of the IC (VLIM pin in the case of the BD6889GU). In that case, open the VREF pin.
VLIMH[V]
Output current value Iout[A] =
or
VLIML[V]
RNF[Ω]
VLIM[V]
RNF[Ω]
Select VLIMH when LIMSW is Low-level
Select VLIML when LIMSW is High-level
(BD6757KN)
･･････(1)
(BD6889GU)
The output current is 400mA3% if 0.2V is applied to the VLIMH or VLIML pin (VLIM pin in the case of the
BD6889GU) and a 0.5Ω resistor is connected externally to the RNF pin.
If the VLIMH and VLIML pins (VLIM pin in the case of the BD6889GU) are shorted to the VCC pin (or the same voltage
level as the VCC is applied) and the SENSE and RNF pins are shorted to the ground, this channel can be used as a
Full-ON Drive H-bridge like the other six channels.
5) Charge pump (BD6757KN)
Each output H-bridge of the BD6757KN on the high and low sides consists of Nch DMOS. Therefore, the gate voltage VG
should be higher than the VM voltage to drive the Nch DMOS on the high side.
The BD6757KN has a built-in charge pump circuit that generates VG voltage by connecting an external capacitor (0.01μF
to 0.1μF).
If a 0.1μF capacitor is connected between: CP1 and CP2, CP3 and CP4, VG and GND
Then, VG pin output voltage will be:
VM1 + (VCC 2)
If a 0.1μF capacitor is connected between: CP1 and CP2, VG and GND
CP4 and VG pins are shorted, and CP3 pin is open
Then, VG pin output voltage will be:
VM1 + VCC
The VM1 to VM4 respectively can be set to voltages different to one another. In order to ensure better performance, the
voltage differential between VG and VM must be 4.5V or higher, and the VG voltage must not exceed the absolute
maximum rating of 15V.
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9/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
6) Digital transistor for photo-interrupter waveform shaping (BD6757KN and BD6889GU)
The BD6757KN, and BD6889GU build in two digital NPN transistor circuits, and eight digital NPN and PNP transistor
circuits for photo-interrupter waveform shaping, respectively. The sensor signal, for lens position detection, is reshaped
and output to the DSP. The input (SIx pin) is a dividing resistance type, and provided with NPN output (SOxN pin) pull-up
resistor and PNP output (SOxP pin) pull-down resistor. This is so that VCC, and GND voltage will be NPN output, and
PNP output, respectively, when the input is open. In the case of the BD6889GU, DSW, DSEL1, and DSEL2 pins can
control the switching of NPN and PNP transistor. The inputs are provided with input pull-down resistor. This is so that
GND voltage will be input, when these three pins are open. (See I/O Truth Table; P.12/16)
7) Voltage-regulator for photo-interrupter (BD6889GU)
The BD6889GU builds in voltage-regulator circuits for photo-interrupter. When High-level voltage is applied to SW pin,
the REG pin will be turned on. The input is provided with input pull-down resistor. This is so that REG pin will be turn off,
when the input is open.
●I/O Truth Table
BD6757KN and BD6889GU Full-ON Driver ch1 to ch6 I/O Truth Table
INPUT
OUTPUT
Drive mode
INxA
INxB
OUTxA
OUTxB
L
L
Z
Z
H
L
H
L
IN/IN
L
H
L
H
H
H
L
L
Output mode
Standby
CW
CCW
Brake
L: Low, H: High, X: Don't care, Z: High impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
BD6757KN and BD6889GU Linear Constant-Current Driver ch7 I/O Truth Table
INPUT
OUTPUT
Drive mode
Output mode
IN7A
IN7B
OUT7A
OUT7B
L
X
Z
Z
Standby
EN/IN
H
L
H
L
CW
H
H
L
H
CCW
L: Low, H: High, X: Don't care, Z: High impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
BD6889GU Digital Transistor I/O Truth Table
INPUT
DSW
DSEL1
DSEL2
L
X
X
H
L
L
Logic
H
L
H
H
H
L
H
H
H
PNP1
OFF
OFF
OFF
ON
ON
NPN1
OFF
ON
ON
OFF
OFF
PNP2
OFF
OFF
OFF
ON
ON
OUTPUT
NPN2
PNP3
OFF
OFF
ON
OFF
ON
ON
OFF
OFF
OFF
ON
NPN3
OFF
ON
OFF
ON
OFF
PNP4
OFF
OFF
ON
OFF
ON
NPN4
OFF
ON
OFF
ON
OFF
L: Low, H: High, X: Don’t care, OFF: GND (in the case of PNP), VCC (in the case of NPN)
PNPx output to SOxP terminal, NPNx output to SOxN terminal
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10/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
In the case of drive the Stepping Motor using ch1 and ch2 IN/IN input mode of the BD6757KN and BD6889GU
2 Phases
INPUT
OUTPUT
Output mode
ch1 / ch2
IN1A
IN1B
IN2A
IN2B
OUT1A OUT1B OUT2A OUT2B
L
H
L
L
H
L
L
H
H
L
L
H
H
L
L
L
L
L
H
H
Z
H
L
L
H
Z
L
H
H
L
Z
H
H
L
L
Z
L
L
H
H
Stand by
1. CW / CW
3. CCW / CW
5. CCW / CCW
7. CW / CCW
L: Low, H: High, X: Don't care, Z: High impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
1-2 Phases
IN1A
L
H
L
L
L
L
L
H
H
INPUT
IN1B
IN2A
L
L
L
H
L
H
H
H
H
L
H
L
L
L
L
L
L
L
IN2B
L
L
L
L
L
H
H
H
L
OUTPUT
OUT1B OUT2A
Z
Z
L
H
Z
H
H
H
H
Z
H
L
Z
L
L
L
L
Z
OUT1A
Z
H
Z
L
L
L
Z
H
H
OUT2B
Z
L
L
L
Z
H
H
H
Z
Output mode
ch1 / ch2
Stand by
1. CW / CW
2. Z / CW
3. CCW / CW
4. CCW / Z
5. CCW / CCW
6. Z / CCW
7. CW / CCW
8. CW / Z
L: Low, H: High, X: Don't care, Z: High impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
IN1A
IN1B
IN2A
IN2B
H
L
H
L
H
L
H
L
IN1A
IN1B
IN2A
IN2B
H
L
H
L
H
L
H
L
OUT1A
OUT1B
H
L
H
L
OUT1A
OUT1B
H
L
H
L
OUT2A
OUT2B
H
L
H
L
OUT2A
OUT2B
H
L
H
L
1
3
5
7
1
3
5
7
1
2
3
4
5
6
7
8
：High impedance
Fig.14 2 Phases Timing Sequence with IN/IN Input
CW
OUT2A
3
CW
OUT2A
Forward
1
OUT1B
CCW
3
OUT1A
CW
5
Reverse
Fig.15 1-2 Phases Timing Sequence with IN/IN Input
OUT1B
CCW
7
OUT2B
CCW
Reverse
Fig.16 Torque Vector of 2 Phases Mode
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1
2
4
5
Forward
OUT1A
CW
8
6
7
OUT2B
CCW
Fig.17 Torque Vector of 1-2 Phases Mode
11/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●I/O Circuit Diagram
PS, INxA, INxB, LIMSW
VCC
VMx, OUTxA, OUTxB, PGNDx, RNF
VREF
VMx
VCC
10kΩ
VLIMH, VLIML, SENSE
VCC
VCC
VCC
10kΩ
OUTxA
OUTxB
50kΩ
100kΩ
PGNDx
RNF
CP3, CP1
VG, CP4, CP2
VCC
SIx
SOx
VG
VCC
VCC
VCC
VCC
10kΩ
100kΩ
CP4
CP2
100kΩ
VM1
Fig.18 BD6757KN I/O Circuit Diagram (Resistance values are typical ones)
PS, INxA, INxB, SW, DSW, DSEL1,
DSEL2
VCC
VMx, OUTxA, OUTxB, PGNDx, RNF
VREF
VMx
VCC
10kΩ
VLIM, SENSE
VCC
VCC
VCC
1kΩ
OUTxA
OUTxB
100kΩ
100kΩ
PGNDx
RNF
SIx
REG
VCC
SOxN
SOxP
VCC
VCC
100kΩ
VCC
VCC
VCC
VCC
33kΩ
33kΩ
VCC
100kΩ
100kΩ
100kΩ
Fig.19 BD6889GU I/O Circuit Diagram (Resistance values are typical ones)
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12/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Heat Dissipation
1) Power Consumption
The power consumption of the IC (Pw) is expressed by the following formula.
Pw[W] = VCC[V] ICC[A] + Iout [A ] RON[Ω] (Full-ON Drive block and PWM Constant-Current Drive block)
2
2
= VCC[V] ICC[A] + Iout[A] (VM[V] - VRNF[V] - Iout[A] Rm[Ω]) (Linear Constant-Current Drive block)
･･････(2)
･･････(3)
Pw: Power consumption of the IC
VCC: Power supply voltage on the VCC pin
ICC: Current consumption of the VCC pin
Iout: Current consumption of the VM pin on the drive channel
RON: Total ON-Resistance on the high and low drive channel
VM: Power supply voltage on the VM pin on the drive channel
VRNF: Voltage on the RNF pin on the drive channel
Rm: Resistance on the motor on the drive channel
While in operation, check that the junction temperature (Tjmax) of the IC will not be in excess of 150℃, in consideration
of formula (2), formula (3), the package power (Pd), and ambient temperature (Ta). If the junction temperature exceeds
150℃, the IC will not work as a properly. This can cause problems, such as parasitic oscillation and temperature leakage.
If the IC is used under such conditions, it will result in characteristic degradation and eventually fail. Be sure to keep the
junction temperature lower than 150℃.
2) Measurement Method of Junction Temperature
The junction temperature can be measured by the following method.
By using the diode temperature characteristics of the control input pin, on a
channel that is not driven, the junction temperature X can be measured in a
pseudo manner.
VIN
V
GND
50μA
The junction temperature X[℃] under certain conditions is expressed by formula
(4), provided that the temperature characteristic of the diode is -2 mV/℃
X[°C] =
a - b[mV]
･･････(4)
+ 25[°C]
-2 [mV/°C]
Fig.20 Tjmax Measurement Circuit Diagram
X: Junction temperature
a: The voltmeter V value at a junction temperature of 25℃
b: The voltmeter V value at a junction temperature of X℃
-2: Temperature characteristic of diode
If the exact junction temperature is desired, it is necessary to measure the specific temperature characteristic of the
internal diode, of each IC.
●Notes for use
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when
use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
2) Storage temperature range
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply pins and lines
None of the VM line for the H-bridges is internally connected to the VCC power supply line, which is only for the control
logic or analog circuit. Therefore, the VM and VCC lines can be driven at different voltages. Although these lines can be
connected to a common power supply, do not open the power supply pin but connect it to the power supply externally.
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power
supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all
the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low
temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current
will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may
exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion
of a voltage clamp diode between the power supply and ground pins.
For this IC with several power supplies and a part consists of the CMOS block, it is possible that rush current may flow
instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively. Therefore,
give special consideration to power coupling capacitance, width of power and ground wirings, and routing of wiring.
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13/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
4) Ground pins and lines
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND
at any time, regardless of whether it is a transient signal or not.
When using both small signal GND and large current MGND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and
voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Pin short and wrong direction assembly of the device
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are
shorted together or are shorted to other circuit’s power lines.
7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.
9) Thermal shutdown circuit
If the junction temperature (Tjmax) reaches 175°C, the TSD circuit will operate, and the coil output circuit of the motor will
open. There is a temperature hysteresis of approximately 20°C (BD6757KN Typ.) and 25°C (BD6889GU Typ.). The TSD
circuit is designed only to shut off the IC in order to prevent runaway thermal operation. It is not designed to protect the IC
or guarantee its operation. The performance of the IC’s characteristics is not guaranteed and it is recommended that the
device is replaced after the TSD is activated.
10) Testing on application board
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or
removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting and storing the IC.
11) Application example
The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using
the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components
including static and transitional characteristics as well as dispersion of the IC.
12) Regarding input pin of the IC
+
This monolithic IC contains P isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic elements
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor
Pin A
Pin B
C
Transistor (NPN)
B
Pin A
N
N
N
P
+
P
P
+
N
Parasitic
element
P+
P substrate
Parasitic element
GND
Pin B
E
B
N
P
P
C
+
N
E
Parasitic
element
P substrate
Parasitic element
GND
GND
Other adjacent
elements
GND
Fig.21 Example of Simple IC Architecture
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14/15
2009.06 - Rev.A
Technical Note
BD6757KN, BD6889GU
●Ordering part number
B
D
6
Part No.
7
5
7
K
Part No.
6757 : Wide power supply
voltage range
6889 : Subminiature package
N
-
E
2
Package
Packaging and forming specification
KN : UQFN52
E2: Embossed tape and reel
GU : VBGA063T050
UQFN52
7.0±0.1
39
7.2±0.1
7.2 ± 0.1
7.0 ± 0.1
(1.2)
27
26
40
14
52
0.05
2500pcs
Direction
of feed
13
0.2 ± 0.05
Embossed carrier tape (with dry pack)
Quantity
M
0.22±0.05
+0.03
0.02 -0.02
0.95MAX
1
Tape
+0.1
0.6 -0.3
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.05
5)
.5
(0
.4
(0
35)
(0
.2
)
Notice :
Do not use the dotted line area
for soldering
0.4
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
VBGA063T050
0.08 S
63- φ 0.3±0.05
φ 0.05 M S AB
P=0.5×7
0.5
0.23
1.2MAX
5.0±0.1
5.0 ± 0.1
1PIN MARK
Tape
Embossed carrier tape (with dry pack)
Quantity
2500pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.75±0.1
0.5
B
12345678
0.75± 0.1
H
G
F
E
D
C
B
A
P=0.5× 7
A
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
1pin
(Unit : mm)
Reel
15/15
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.06 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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