BD6886GUL_11

1/4 STRUCTURE PRODUCT SERIES TYPE FEATURES Silicon Monolithic Integrated Circuit 1ch Motor Driver BD6886GUL ・Built in 1 Constant-Voltage Driver Absolute maximum ratings (Ta=25°C) Parameter Symbol Limit Unit Power supply voltage VCC -0.5 to +6.5 V Motor power supply voltage VM -0.5 to +6.5 V Control input voltage VIN -0.5 to VCC+0.5 V Input voltage for VLIM -0.5 to VM+0.5 V Constant-Voltage setting 1 Power dissipation Pd 730※ mW Operating temperature range Topr -25 to +85 °C Junction temperature Tjmax 150 °C Storage temperature range Tstg -55 to +150 °C ※2 H-bridge output current Iout -200 to +200 mA/ch ※1 Reduced by 5.84mW/°C over 25°C, when mounted on a glass epoxy board (50mm  58mm  1.75mm; 8 layers) ※2 Must not exceed Pd, ASO, or Tjmax of 150°C. Operating Conditions (Ta= -25°C to +85°C) Parameter Symbol Power supply voltage VCC Motor power supply voltage VM Control input voltage VIN Input voltage for VLIM Constant-Voltage setting H-bridge output current Iout ※3 Must not exceed Pd or ASO. Min. 2.5 2.5 0 0 - Typ. 3.0 5.0 - Max. 5.5 5.5 VCC VM 150※ 3 Unit V V V V mA/ch The product described in this specification is a strategic product (and/or service) subject to COCOM regulations. It should not be exported without authorization from the appropriate government authorities. This product isn’t designed for protection against radioactive rays. REV. A 2/4 Package Outline 1PIN MARK Pin Arrangement (Top View) 1 Top View A N.C. OUTA PS N.C. 2 3 4 Lot No. 2.1 ± 0.1 0.1 ± 0.05 0.55 MAX 2.1 ± 0.1 6886 B S VM INB INA Side View C PGND VLIM SEL VCC 0.08 S 15－φ0.25 ± 0.05 φ0.05 A B 0.5 A D 0.3 ± 0.1 (φ0.15)INDEX POST C B A 1 2 3 4 B P=0.5×3 D Bottom View N.C. OUTB GND N.C. 0.3 ± 0.1 P=0.5×3 Fig.1 VCSP50L2 Package (Unit: mm) Fig.2 BD6886GUL Pin Arrangement (Top View) Block Diagram PS VCC Pin No. and Pin Name No. 1A 2A 3A 4A 1B 2B 3B 4B 1C 2C 3C 4C 1D 2D 3D 4D Pin name Thermal Shutdown & VM UVLO INA INB SEL VLIM Level Shift Logic OUTA & H Bridge OUTB Pre Driver ×2 N.C. OUTA PS N.C. VM INB INA PGND VLIM SEL VCC N.C. OUTB GND N.C. PGND GND Fig.3 BD6886GUL Block Diagram REV. A 3/4 BD6886GUL Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=3.0V, VM=5.0V) Parameter Overall Circuit current during standby operation Circuit current 1 Circuit current 2 Control input High-level input voltage Low-level input voltage High-level input current Low-level input current Pull-down resistor Input current UVLO UVLO voltage Output ON-Resistance Output high-level voltage Turn-on time Turn-off time Rise time Fall time VUVLO RON VOH ton toff tr tf 1.6 1.9VLIM Symbol Limit Min. Typ. Max. Unit Conditions ICCST ICC IM VINH VINL IINH IINL RIN IVLIM 2.0 15 -1 50 -1.5 0 0.9 0.4 30 0 100 -0.5 0.8 2.0VLIM 10 1.4 0.65 0.7 60 200 2.4 1.2 2.1VLIM μA mA mA V V μA μA kΩ μA V Ω V μs μs μs μs PS=L PS=H with no signal PS=H, and VLIM=5V with no signal INA, INB, SEL, PS INA, INB, SEL, PS INA, INB, SEL, PS; VIN=3V INA, INB, SEL, PS; VIN=0V INA, INB, SEL, PS VLIM=0V Input for Constant-Voltage setting Constant-Voltage Drive block (ch1) Io=150mA on high and low sides in total VLIM=1V with 10Ω load Io=150mA with 10Ω load※ Io=150mA with 10Ω load Io=150mA with 10Ω load Io=150mA with 10Ω load※ 4 ※4 4 - 1.5 0.1 2.0 0.05 ※4 5.0 2.0 8.0 1.0 ※4 Design target value (No total shipment inspection is made.) I/O Truth Table BD6886GUL I/O Truth Table INPUT OUTPUT Input mode PS SEL INA INB OUTxA OUTxB L X Z Z EN/IN L H L H L H H L H H H Z Z H H L H L IN/IN H L H L H L L L L L X X X Z Z L: Low, H: High, X: Don’t care, Z: High Impedance The OUTPUTs are provided with feed back resistor. This is so that GND voltage will be output, when the OUTPUT is “Z”. REV. A 4/4 Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) Ground potential Ensure a minimum GND pin potential in all operating conditions. (4) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. (7) Thermal shutdown circuit This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the following temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD ON temperature [°C] Hysteresis temperature [°C] (Typ.) (Typ.) 175 25 (8) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. 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