BD68888MUV-E2

Datasheet 36V 2ch Stepping Motor Driver BD68888MUV General Description Key Specifications BD68888MUV is a bipolar low-consumption driver that driven by PWM constant current. Rated power supply voltage of the device is 36 V, and rated output current is 1.65 A. PARA-IN drive mode is adopted for input interface. This motor driver can drive 2ch bipolar stepping motors. In addition, the power supply can be driven by one single system, which simplifies the design. ■ ■ ■ ■ Package ■ ■ ■ ■ ■ ■ ■ ■ ■ Two bipolar stepping motors can be driven Rated Output Current 1.65 A/Phase Low ON Resistance DMOS Output PARA-IN Drive Mode correspondence PWM Constant Current control (the other excitation method) Built-in Spike Noise Blanking Function (external noise filter is unnecessary) Full-, Half (two kinds)-, Quarter-step correspondence Power Save Function Built-in Logic Input Pull-down Resistor Thermal Shutdown Circuit (TSD) Over-current Protection Circuit (OCP) Under Voltage Lockout Circuit (UVLO) Over Voltage Lockout Circuit (OVLO) Ghost Supply Prevention (protects against malfunction when power supply is disconnected) Typical Application Circuit PHASE1 PHASE2 I01 I11 I02 I12 Application ■ W (Typ) x D (Typ)x H (Max) 6.0 mm x 6.0 mm x 1.0 mm VQFN036V6060 Features ■ ■ ■ ■ ■ Range of Power Supply Voltage 8 V to 28 V Rated Output Current 1.65 A/Phase Range of Operating Temperature -25 °C to +85 °C Output ON Resistance 1.0 Ω (Typ) (total of upper and lower resistors) Monitoring Camera, WEB Camera, PPC, Multi-function Printer, Laser Beam Printer, Ink-jet Printer, Sewing Machine, Photo Printer, FAX, Scanner, Mini Printer, Toy and Robot OUT1A OUT1B SENSE1 VBB1 OUT2A VREF1 OUT2B SENSE2 VREF2 VREF3 VREF4 OUT3A OUT3B SENSE3 PHASE3 PHASE4 I03 I13 I04 I14 PS VBB2 OUT4A OUT4B SENSE4 GND GND ○Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•14•001 ○This product has no designed protection against radioactive rays 1/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Pin Configuration Block Diagram PHASE1 PHASE2 I01 I11 I02 I12 I14 OUT4A OUT4B SENSE4 VBB2 OUT3B OUT3A SENSE3 I13 [TOP VIEW] Regulator RESET UVLO Interface OVLO TSD OCP VREF1 2bit DAC 27 26 25 24 23 22 21 20 19 VBB1 SENSE1 VREF2 2bit DAC OUT1A OUT1B SENSE2 I12 28 18 PHASE1 I11 29 17 PHASE2 GND 30 Blank time PWM control SENSE1 Control logic Predriver VBB1 OSC OUT2A OUT2B 16 GND N.C. 31 15 VREF4 TEST1 32 14 VREF3 TEST2 33 13 VREF2 EXP-PAD I01 34 SENSE2 Interface PS VREF3 2bit DAC 2bit DAC 11 PS I03 36 10 PHASE3 OUT3A OUT3B SENSE4 12 VREF1 I02 35 VBB2 SENSE3 VREF4 Blank time PWM control SENSE3 Control logic Predriver VBB2 OSC OUT4A OUT4B I04 SENSE1 OUT1B VBB1 6 7 8 9 OUT2A 5 PHASE4 4 OUT2B 3 SENSE2 2 OUT1A SENSE4 1 PHASE3 PHASE4 I03 I13 I04 I14 Interface GND GND Pin Descriptions Pin No. Pin Name 1 I04 2 OUT1A 3 SENSE1 4 OUT1B 5 VBB1 6 OUT2B Pin No. Pin name VREF division ratio setting pin 19 I14 H bridge output pin 20 OUT4A Connection pin of resistor for output current detection 21 SENSE4 H bridge output pin 22 OUT4B Power supply pin 23 VBB2 H bridge output pin 24 OUT3B Connection pin of resistor for output current detection 25 SENSE3 Function 7 SENSE2 8 OUT2A H bridge output pin 26 OUT3A Function VREF division ratio setting pin H bridge output pin Connection pin of resistor for output current detection H bridge output pin Power supply pin H bridge output pin Connection pin of resistor for output current detection H bridge output pin 9 PHASE4 Phase selection pin 27 I13 VREF division ratio setting pin 10 PHASE3 Phase selection pin 28 I12 VREF division ratio setting pin 11 PS Power save pin 29 I11 VREF division ratio setting pin 12 VREF1 Output current value setting pin 30 GND 13 VREF2 Output current value setting pin 31 NC 14 VREF3 Output current value setting pin 32 TEST1 Pin for testing 15 VREF4 Output current value setting pin 33 TEST2 Pin for testing 16 GND Ground pin 34 I01 VREF division ratio setting pin 17 PHASE2 Phase selection pin 35 I02 VREF division ratio setting pin 18 PHASE1 Phase selection pin 36 I03 VREF division ratio setting pin - EXP-PAD The EXP-PAD connect to GND. - - www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 2/20 Ground pin Non connection - TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Absolute Maximum Ratings (Ta = 25 °C) Item Symbol Rated Value Unit VBB1,VBB2 -0.2 to +36.0 V VIN -0.2 to +5.5 V VSENSE 0.7 V Output Current IOUT 1.65(Note 3) A/Phase Storage Temperature Range Tstg -55 to +150 °C Tjmax +150 °C Supply Voltage Input Voltage for Control Pin(Note 1) SENSEx(Note 2) Maximum Input Voltage Maximum Junction Temperature (Note 1) Control pin = PHASE1, PHASE2, PHASE3, PHASE4, VREF1, VREF2, VREF3, VREF4, I01, I02, I03, I04, I11, I12, I13, I14. (Note 2) x = 1, 2, 3 or 4 (Note 3) Do not exceed Tjmax = 150 °C. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Conditions Item Symbol Min Typ Max Unit Operating Temperature Topr -25 +25 +85 °C VBB1,VBB2 +8 +24 +28 V IOUT - - +1.2(Note 4) A/ Phase Supply Voltage Maximum Output Current (DC) (Note 4) Do not exceed Tjmax = 150 °C. Thermal Resistance(Note 5) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 7) 2s2p(Note 8) θJA 103.9 24.5 °C/W ΨJT 4 2 °C/W VQFN036V6060 Junction to Ambient Junction to Top Characterization Parameter(Note 6) (Note 5) Based on JESD51-2A (Still-Air). (Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 7) Using a PCB board based on JESD51-3. (Note 8) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 9) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 9) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 3/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VBB1, VBB2 = 24 V) Item Symbol Limit Unit Condition Min Typ Max ICCST - 0 10 µA PS = L ICC - 5.0 8.0 mA PS = H, VREFx = 1.5 V H-level Input Voltage VINH 2.0 - - V L-level Input Voltage VINL - - 0.8 V H-level Input Current IINH 35 50 100 µA VIN = 5 V L-level Input Current IINL -10 0 - µA VIN = 0 V Output ON Resistance RON - 1.0 1.4 Ω IOUT = ±1.0 A (total of upper and lower) Output Leak Current ILEAK - - 10 µA SENSEx(Note 3) Input Current ISENSE -80 -40 - µA SENSEx = 0 V VREFx(Note 3) Input Current IVREF -2.0 -0.1 - µA VREFx = 0 V VREFx(Note 3) Input Voltage Range VVREF 0 - 1.5 V Minimum ON Time (Blank Time) tONMIN 0.3 1.0 1.5 µs Comparator Threshold VCTH 0.48 0.50 0.52 V [Whole] Circuit Current at Standby Circuit Current [Control Logic Input(Note 1)] [Output(Note 2)] [Current Control] VREFx = 1.5 V (Note 1) Control Logic input = PHASE1, PHASE2, PHASE3, PHASE4, I01, I02, I03, I04, I11, I12, I13, I14 (Note 2) Output = OUT1A, OUT1B, OUT2A, OUT2B, OUT3A, OUT3B, OUT4A, OUT4B (Note 3) x = 1, 2, 3 or 4 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 4/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Function Explanation 1 PS/Power Save Pin The PS pin can make the circuit standby state and make the motor output OPEN. When PS = L→H, be careful because there is a delay of 40 µs (Max) before it is returned from standby state to normal state and the motor output becomes ACTIVE. PS Status L H 2 Standby state ACTIVE PHASEx (Note 1)/Phase Selection Pin These pins determine output state. OUTxA(Note 1) OUTxB(Note 1) PHASEx L H L H H L (Note 1) x = 1, 2, 3 or 4 3 I0x (Note 2), I1x(Note 2)/VREF Division Ratio Setting Pin Although VREF pins voltage is input to 2bit-DAC, these pins set the split ratio of 2bit-DAC output voltage. I0x I1x Output Current Level (%) L H L L L H H H (I0x, I1x) = (H, H): motor outputs are open. 100 67 33 0 (Note 2) x = 1, 2, 3 or 4 4 VBB1, VBB2/Power Supply Pin The wire should be thick, short and has low impedance, because Motor’s drive current is flowing in it. The VBB1 pin and the VBB2 pin voltage may have great fluctuation, so arrange the bypass capacitor of about 100 µF to 470 µF as close to the pin as possible and adjust the VBB1 pin and the VBB2 pin voltage is stable. Increase the capacity as needed especially, when a large current is used or those motors that have great back electromotive force are used. In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel connection of multi-layered ceramic capacitor of 0.01 µF to 0.1 µF etc. Extreme care must be used to make sure that the VBB1 pin and the VBB2 pin voltage do not exceed the rating even for a moment. The VBB1 pin and the VBB2 pin are shorted inside the IC, but be sure to short externally the VBB1 pin and the VBB2 pin when using. If used without shorting, malfunction or destruction may occur because of concentration of current routes etc. Still more, in the power supply pin, there is built-in clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component operates, and the IC might be destroyed as a result. Be sure that the maximum absolute rating must not be exceeded. It is effective to mount a Zener diode of about the maximum absolute rating. Moreover, the diode for preventing electrostatic destruction is inserted between the VBB1 pin, the VBB2 pin and the GND pin. Be careful about the reverse voltage because the IC might be destroyed as a result if reverse voltage is applied to the VBB1 pin, the VBB2 pin and the GND pin. 5 GND/Ground Pin In order to reduce the electric noise by switching current and to stabilize the internal reference voltage of the IC, make the wiring impedance from this pin as low as possible to achieve the lowest electrical potential no matter what operating state it can be. Moreover, design the patterns not to have any common impedance with other GND patterns. 6 OUTxA(Note 3), OUTxB(Note 3)/H Bridge Output Pin Motor’s drive current is flowing in it, so the wire should be thick, short and has low impedance. It is also effective to add a schottky diode if output has positive or negative great fluctuation when large current is used. For example, counter electromotive voltage etc. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component operates, and the IC might be destroyed in the end. Be sure that the maximum absolute rating must not exceeded. (Note 3) x = 1, 2, 3 or 4 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 5/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Function Explanation – continued 7 SENSEx(Note 1)/Connection Pin of Resistor for Detecting of Output Current Connect the resistor of 0.1 Ω to 0.3 Ω for current detection between this pin and GND. Determine the resistor so that power consumption W = IOUT2•R [W] of the current-detecting resistor does not exceed the maximum absolute rating of the resistor. In addition, it has a low impedance and does not have a common impedance with other GND patterns because motor’s drive current flows in the pattern through the SENSEX pin to current-detecting resistor to GND. Do not exceed the rating because there is the possibility of circuits’ malfunction etc., if the SENSE pin voltage exceeds the maximum rating (0.7V). Moreover, be careful because if the SENSEx pin is shorted to GND, large current flows without normal PWM constant current control, and OCP or TSD might operate. If there is a possibility of malfunction, such as output does not flow even when the SENSEx pin is open, please do not put to such a state. (Note 1) x = 1, 2, 3 or 4 8 VREFx(Note 2)/Output Current Value Setting Pin This is the pin to set the output current value. It can be set by the VREF pin voltage and current-detecting resistor (SENSE resistor). 𝐼𝑂𝑈𝑇 = 𝑉𝑅𝐸𝐹𝑥 3 / 𝑆𝐸𝑁𝑆𝐸𝑥 [A] Where IOUT : The output current. VREFx : The voltage of output current value-setting pin. SENSEx : The current-detecting resistor. Avoid using the IC with the VREFx pin is open because if it is open, it may have malfunctions such as flowing a large current by unstable input, the increased the VREFx pin voltage and increased setting current. The input voltage range must be kept because a large current might flow to output and OCP or TSD might operate if the voltage of over 1.5 V is applied on the VREFx pin. Besides, select the resistance value in consideration of the outflow current (Max 2 µA) if it is inputted by resistance division. The minimum current, which can be controlled by the VREFx pin voltage, is determined by motor coil’s L, R values and minimum ON time because there is a minimum ON time in PWM drive. (Note 2) x = 1, 2, 3 or 4 9 TESTx(Note 3)/Pin for Inspection This pin is used for delivery inspection of the IC, and shall be grounded before use. In addition, malfunctions can be caused by application without grounding. (Note 3) x = 1 or 2 10 NC Pin This pin is unconnected electrically with the IC internal circuit. 11 EXP-PAD For VQFN036V6060 package, the heat-radiating metal is mounted on the IC’s backside. It is the precondition that making the heat-radiating treatment when in use. Therefore, it must be connected by solder with the GND plane on the board and ensure the sufficient heat-radiation area by taking the GND pattern as wide as possible. Moreover, the back side metal is shorted with IC chip’s back side and becomes the GND potential, so there is the danger of malfunction and destruction if shorted with potentials other than GND. Never design any wiring patterns other than GND through the IC’s backside. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 6/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Protection Circuits 1 Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises to 175 °C (Typ) or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it automatically returns to normal operation. However, if heat is continued to be added externally even while TSD is in operation, heat overdrive can lead to destruction. 2 Over Current Protection (OCP) This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or VBB1, VBB2-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition when the regulated current flows for 4 µs (Typ). It returns with power reactivation or a reset of the PS pin. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return by power reactivation or a reset of the PS pin is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long of faults, ground faults and shorting, there is a possibility of destruction after the over current has flowed and the output pin voltage jumps up and the absolute maximum values can be exceeded. Also, when current which is the output current rating or more and the OCP detection current or less flows, the IC can heat up to over Tjmax = 150 °C and can deteriorate, so current which exceeds the output rating should not be applied. 3 Under Voltage Lock Out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage. When the applied voltage to the VBB1 pin and the VBB2 pin goes 5 V (Typ) or less, the motor output is set to OPEN. This switching voltage has a 1 V (Typ) hysteresis to prevent malfunction due to noise etc. Be aware that this circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates. 4 Over Voltage Lock Out (OVLO) This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage. When the applied voltage to the VBB1 pin and the VBB2 pin goes 32 V (Typ) or more, the motor output is set to OPEN. This switching voltage has a 1 V (Typ) hysteresis and a 4 µs (Typ) mask time to prevent malfunction due to noise etc. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Be aware that this circuit does not operate during power save mode. 5 Ghost Supply Prevention (protects against malfunction when power supply is disconnected) If a control signal (logic input, VREFx(Note 1)) is input when there is no power supplied to this IC, there is a function which prevents a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction prevention diode from these input pins to the VBB1 pin and the VBB2 pin. Therefore, there is no malfunction of the circuit even when voltage is supplied to these input pins while there is no power supply. (Note 1) x = 1, 2, 3 or 4 6 Operation Under Strong Electromagnetic Field The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is found when using the IC in a strong electromagnetic field. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 7/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV PWM Constant Current Control 1 Current control operation The output current increases due to the output transistor turned on. When the voltage on the SENSEx(Note 1) pin, the output current is converted voltage due to connect the external resistance to the SENSEx pin, reaches the voltage value set by the internal 2-bit DAC and the VREFx(Note 1) input voltage, the current limit comparator engages and enters current decay mode. Thereafter the output turned on again after a period of time determined the internal timer. The process repeats itself constantly. (Note 1) x = 1, 2, 3 or 4 2 Noise-masking function In order to avoid misdetection of current detection comparator due to SENSEx spike noise that may occur when the output turns on, the IC employs the minimum ON-time (tONMIN). It invalids the current detection for the minimum ON-time of 1 µs (Typ) from the output transistor turned on. This allows constant-current drive without the need for an external filter. 3 Internal Timer IC internal voltage repeat charging and discharging between VL to VH. The detection of the internal comparator is masked while charging from VL to VH. This period defines the minimum ON-time (tONMIN). The internal voltage begins discharging once the voltage reaches VH. When the output current reaches the current limit during this period, then the IC enters decay mode. It reaches VL, at which point the IC internal voltage is switched back ON. The current output and internal terminal begin charging simultaneously. Spike Noise Current Limit Value Output Current 0 mA Current Limit Value SENSE Voltage GND VH IC Internal Voltage VL GND Minimum ON Time Chopping Period tCHOP tONMIN Figure 1. Timing Chart of IC Internal Voltage, the SENSEx pin voltage and Output Current www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 8/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV PWM Constant Current Control – continued 4 Current Decay Mode The current decay method is SLOW DECAY for PWM Constant Current Control. The following diagrams show the state of each transistor and the regenerative current path during the current decay for SLOW DECAY mode: OFF→OFF ON→OFF M OFF→ON ON→ON Output ON Time Current Decay Time Figure 2. Route of Regenerated Current during Current Decay www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 9/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV PARALLEL-IN Drive Mode - Description for CH1 (CH2: same as CH1)- It is possible to drive stepping motor with FULL STEP, HALF STEP, and QUARTER STEP by inputting the following motor control signals using PARALLEL-IN drive mode. Examples of control sequence and torque vector FULL STEP Controlled by 2 logic signals of PHASE1 and PHASE2 1 2 3 4 OUT1A 100% PHASE1 PHASE2 67% I01 33% I11 OUT2B 4 1 OUT2A I02 I12 IOUT (CH1) 2 3 100% 67% 33% OUT1B -33% -67% -100% 100% 67% 33% IOUT (CH2) -33% -67% -100% HALF STEP A Controlled by 4 logic signals of PHASE1, PHASE2, I01 (I11), and I02 (I12) OUT1A 1 2 3 4 5 6 7 100% 8 PHASE1 67% PHASE2 1 8 33% I01 OUT2B I11 2 7 3 OUT2A I02 I12 IOUT (CH1) 100% 67% 33% -33% -67% -100% 6 4 5 OUT1B 100% 67% 33% IOUT (CH2) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -33% -67% -100% 10/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV PARALLEL-IN Drive Mode – continued HALF STEP B Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02 and I12 1 2 3 4 5 6 7 OUT1A 8 100% PHASE1 67% PHASE2 1 33% I01 OUT2B I11 2 8 7 3 OUT2A I02 6 I12 IOUT (CH1) 4 100% 67% 33% 5 -33% -67% -100% OUT1B 100% 67% 33% IOUT (CH2) -33% -67% -100% QUARTER STEP Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02 and I12 1 2 3 4 5 6 7 8 OUT1A 9 10 11 12 13 14 15 16 100% PHASE1 67% PHASE2 I11 OUT2B I02 22 3 14 4 13 5 11 100% 67% 33% -33% -67% -100% OUT2A 6 12 I12 IOUT (CH2) 1 15 33% I01 IOUT (CH1) 16 7 10 9 8 OUT1B 100% 67% 33% -33% -67% -100% www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 11/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Power Dissipation Confirm that the IC’s chip temperature Tj is not over 150 °C in consideration of the IC’s power consumption (W), thermal resistance (°C/W) and ambient temperature (Ta). When Tj = 150 °C is exceeded, the functions as a semiconductor do not operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration and eventually destruction of the IC. Tjmax = 150 °C must be strictly obeyed under all circumstances. 1 Thermal Calculation The IC’s consumed power can be estimated roughly with the power supply voltage (VBB1 and VBB2), circuit current (ICC), output ON resistance (RONH, RONL) and motor output current value (IOUT). The calculation method during FULL STEP drive, SLOW DECAY mode is shown here: 𝑊𝑉𝐵𝐵 = 𝑉𝐵𝐵 × 𝐼𝐶𝐶 [W] where: WVBB is the consumed power of the VBB. VBB is the power supply voltage. ICC is the circuit current. 𝑊𝐷𝑀𝑂𝑆 = 𝑊𝑂𝑁 + 𝑊𝐷𝐸𝐶𝐴𝑌 [W] 𝑊𝑂𝑁 = (𝑅𝑂𝑁𝐻 + 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × 2 × 𝑜𝑛_𝑑𝑢𝑡𝑦 [W] 𝑊𝐷𝐸𝐶𝐴𝑌 = (2 × 𝑅𝑂𝑁𝐿 ) × 𝐼𝑂𝑈𝑇 2 × 2 × (1 − 𝑜𝑛_𝑑𝑢𝑡𝑦) [W] where: WDMOS is the consumed power of the output DMOS. WON is the consumed power during output ON. WDECAY is the consumed power during current decay. RONH is the upper P-channel DMOS ON-resistance. RONL is the lower N-channel DMOS ON-resistance. IOUT is the motor output current value. on_duty PWM on duty=𝑡_𝑂𝑁 ⁄ 𝑡_𝐶𝐻𝑂𝑃 “ 2 ” is the H bridge A and B. tON varies depending on the L and R values of the motor coil and the current set value. Confirm by actual measurement, or make an approximate calculation. tCHOP is the chopping period, which is determined by the internal timer. Refer to P.8, 9 for details. IC number BD68888MUV Upper Pch DMOS ON Resistance RONH[Ω] (Typ) 0.70 Lower Nch DMOS ON Resistance RONL[Ω] (Typ) 0.30 𝑊_𝑡𝑜𝑡𝑎𝑙 = 𝑊𝑉𝐵𝐵 + 𝑊𝐷𝑀𝑂𝑆 [W] 𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑊_𝑡𝑜𝑡𝑎𝑙 [°C] where: W_total is the consumed total power of IC. Tj is the junction temperature. Ta is the air temperature. θja is the thermal resistance value. However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application board used, and create the thermal design with enough margin not to exceed Tjmax = 150 °C. Although unnecessary with normal use, if the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky diode between the motor output pin and GND to abate heat from the IC. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 12/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Power Dissipation – continued 2 Temperature Monitoring In respect of BD68888MUV, there is a way to directly measure the approximate chip temperature by using the LOGIC pin (I0x(Note 1 or I1x(Note 1)) with a protection diode for prevention from electrostatic discharge. However, temperature monitor using this LOGIC pin is only for evaluation and experimenting, and must not be used in actual usage conditions. (Note 1) x = 1, 2, 3 or 4 Process 1 Measure the pin voltage when a current of IDIODE = 50 μA flows from the LOGIC pin to the GND, without supplying VBB1 and VBB2 to the IC. This measurement is of the VF voltage inside the diode. Process 2 Measure the temperature characteristics of this pin voltage. (VF has a linear negative temperature factor against the temperature.) With the results of these temperature characteristics, chip temperature may be calibrated from the LOGIC pin voltage. Process 3 Supply VBB1 and VBB2, confirm the LOGIC pin voltage while running the motor, and calculate approximately the chip temperature from the results of Process 2. -VF[mV] LOGIC pin IDIODE Internal Circuit VF 25 150 Chip Temperature Tj[°C] Figure 3. Model Diagram for Measuring Chip Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 13/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Application Example Logic input pin See P.5 PHASEx for detail. Bypass capacitor. Setting range is 100 μF to 470 μF (electrolytic) 0.01 μF to 0.1 μF (multilayer ceramic etc.) Refer to P.5 VBB1,VBB2 for detail. Be sure to short VBB1 & VBB2. Regulator PHASE1 PHASE2 I01 I11 I02 I12 RESET UVLO Interface OVLO TSD OCP VREF1 2bit DAC VBB1 SENSE1 VREF2 OUT1A 2bit DAC SENSE2 Set the output current. Input by resistor divider. Refer to P.6 VREFx for detail. Blank time PWM control 0.1 µF 100 µF OUT1B SENSE1 Control logic Predriver VBB1 OSC OUT2A OUT2B SENSE2 Interface PS VREF3 2bit DAC VBB2 SENSE3 VREF4 2bit DAC OUT3A SENSE4 Blank time PWM control OUT3B SENSE3 Control logic Predriver VBB2 OSC OUT4A Logic input pin See P.5 PHASEx for detail. PHASE3 PHASE4 I03 I13 I04 I14 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 OUT4B SENSE4 Interface GND Resistor for current detection Setting range is 0.1 Ω to 0.3 Ω. Refer to P.6 SENSEx for detail. GND 14/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV I/O Equivalence Circuit PHASEx(Note 1) PS I0x(Note 1) I1x(Note 1) Internal Circuit 215 kΩ VREFx(Note 1) 5 kΩ 10 kΩ SENSEx(Note 1) 5 kΩ 100 kΩ VBB1, VBB2 OUTxA(Note 1) OUTxB(Note 1) SENSEx Internal Circuit 5 kΩ (Note 1) x = 1, 2, 3 or 4 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 15/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 16/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 4. Example of monolithic IC structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 17/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Ordering Information B D 6 8 8 8 8 M U V - Package MUV:VQFN036V6060 Part Number E2 Packing and Forming specification E2 : Embossed tape and reel Marking Diagram VQFN036V6060 (TOP VIEW) Part Number Marking BD68888 LOT Number Pin 1 Mark www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 18/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 VQFN036V6060 19/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 BD68888MUV Revision History Date Revision 14.Sep.2020 001 Changes New Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 20/20 TSZ02201-0S2S0C700240-1-2 14.Sep.2020 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. 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Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001