BD69060GFT-TL

Datasheet DC Brushless Fan Motor Driver Series 5 V Single-phase Full-wave Fan Motor Driver BD69060GFT General Description Key Specifications The BD69060GFT is a 5 V single-phase full-wave Fan Motor Driver with the built-in hall element. It is part of the DC brushless Fan Motor Driver series. The BD69060GFT has a compact package. It has the silent drive by soft switching and the low battery consumption via its standby function. The BD69060GFT is best used for notebook PC cooling fans.    Features          Supply Voltage Range: 1.8 V to 5.5 V Operating Temperature Range: -40 °C to +105 °C Output Voltage (Upper and Lower Total): 0.16 V(Typ) at 0.2 A Package Built-in Hall Element PWM Speed Control Soft Switching Drive (PWM type) Start Duty Assist Stand-by Mode Quick Start Lock Protection and Automatic Restart Rotating Speed Pulse Signal (FG) Output Compact Package (Flat Lead Package) W(Typ) x D(Typ) x H(Max) 2.90 mm x 3.80 mm x 0.8 mm TSSOF6 Application  For Compact 5 V Fan Such as Notebook PC Cooling Fan Typical Application Circuit VCC 6 ＋ GND PWM 5 PWM OUT1 OUT2 4 SIG 1 FG － 2 3 M Figure 1. Application Circuit 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Pin Configuration Block Diagram (TOP VIEW) FG FG 1 6 VCC GND 2 5 PWM VCC SIGNAL OUTPUT 1 OSC HALL ELEMENT UVLO VCC CONTROL LOGIC GND OFFSET CANCEL 2 OUT1 3 4 6 TSD PWM FILTER 5 OUT2 PRE DRIVER VCC OUT1 Pin Description Pin No. OUT2 3 Pin Name 4 Function 1 FG 2 GND Ground 3 OUT1 Motor output 1 4 OUT2 Motor output 2 5 PWM PWM input 6 VCC Power supply FG output I/O Truth Table VOUT2 Output operation VOUT1 Supply magnetic direction (forward) S Marking BHYS BHYS N BREV BFWD BREV Magnetic flux density: B BFWD Magnetic flux density: B Figure 2. Relationship Magnetic Density and Output Operation Supply Magnetic Direction PWM OUT1 OUT2 FG S H (OPEN) H L L N H (OPEN) L H Hi-Z S L L L L N L L L Hi-Z H; High, L; Low, Hi-Z; High impedance FG output is open drain type. Motor State FG Rotating - Locking - Stand-by Hi-Z Hi-Z; High impedance .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Absolute Maximum Ratings Parameter Symbol Rating Unit Supply Voltage VCC 7 V Storage Temperature Range Tstg -55 to +150 °C Junction Temperature Tj 150 °C Motor Output Voltage VO 7 V Motor Output Current IO 1.0 A FG Output Voltage VFG 7 V FG Output Current IFG 10 mA Caution 1: Caution 2: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Thermal Resistance (Typ) Parameter Symbol Unit 1s(Note 3) 2s2p(Note 4) θJA 357.1 188.7 °C/W ΨJT 54 42 °C/W TSSOF6 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Recommended Operating Conditions Parameter Symbol Min Typ Max Unit VCC 1.8 5.0 5.5 V PWM Input Voltage VPWM 0 - 5.5 V PWM Input Frequency fPWM 5 25 50 kHz Operating Temperature Range Topr -40 - +105 °C Supply Voltage Electrical Characteristics (Unless otherwise specified VCC=5 V Ta=25 °C) Parameter Typical Performance Curves Figure 3 Symbol Min Typ Max Unit Conditions Circuit Current 1 ICC1 - 3 5 mA PWM=OPEN Circuit Current 2 (Stand-by Mode) ICC2 - 25 50 µA PWM=GND Magnetic Switch Point (Forward) BFWD - +1.5 - mT Figure 5 Magnetic Switch Point (Reverse) BREV - -1.5 - mT Figure 6 Magnetic Hysteresis BHYS - 3.0 5.0 mT Figure 7 PWM Input High Level VPWMH 2.5 - VCC V - PWM Input Low Level VPWML 0 - 0.8 V Figure 4 - VO - 0.16 0.24 FG Output Low Voltage VFGL - - 0.4 V Io=200 mA (Upper and Lower total) IFG=5 mA FG Output Leak Current IFGL - - 5 µA VFG=7 V Lock Detection ON Time tON 0.35 0.50 0.65 s Figure 17 Lock Detection OFF Time tOFF 3.5 5.0 6.5 s Figure 18 Motor Output Voltage V Figure 8 to 13 Figure 14,15 Figure 16 About current items, define the inflow current to the IC as a positive notation. .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Typical Performance Curves (Reference Data) 5.0 50 4.0 40 Circuit Current: ICC2 [µA] Circuit Current: ICC1 [mA] Supply Voltage Range Ta=-40 °C Ta=+25 °C 3.0 Ta=+105 °C 2.0 1.0 Ta=+105 °C Ta=+25 °C 30 20 Ta=-40 °C 10 Supply Voltage Range 0.0 0 1 2 3 4 5 6 1 2 Supply Voltage: VCC [V] 4 5 6 Supply Voltage: VCC [V] Figure 3. Circuit Current vs Supply Voltage Figure 4. Circuit Current vs Supply Voltage (Stand-by Mode) 2.5 Magnetic Switch Point (Reverse): BREV [mT] 2.5 Magnetic Switch Point (Forward): BFWD [mT] 3 2.0 1.5 Ta=+105 °C 1.0 Ta=+25 °C Ta=-40 °C 0.5 0.0 -0.5 -1.0 -1.5 Supply Voltage Range -2.0 -2.5 2.0 Supply Voltage Range 1.5 1.0 0.5 0.0 Ta=-40 °C Ta=+25 °C -0.5 -1.0 Ta=+105 °C -1.5 -2.0 -2.5 1 2 3 4 5 6 1 Supply Voltage: VCC [V] 3 4 5 6 Supply Voltage: VCC [V] Figure 5. Magnetic Switch Point (Forward) vs Supply Voltage .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2 Figure 6. Magnetic Switch Point (Reverse) vs Supply Voltage 5/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Typical Performance Curves - continued (Reference Data) 1.2 Motor Output High Voltage: VOH [V] Magnetic Hysteresis: BHYS [mT] 5.0 4.0 3.0 Ta=+105 °C Ta=+25 °C 2.0 Ta=-40 °C 1.0 Supply Voltage Range 0.0 1.0 0.8 Ta=+105 °C Ta=+25 °C 0.6 0.4 0.2 Ta=-40 °C 0.0 1 2 3 4 5 6 0.0 Supply Voltage: VCC [V] 0.4 0.6 0.8 1.0 Motor Output Source Current: IO [A] Figure 7. Magnetic Hysteresis vs Supply Voltage Figure 8. Motor Output High Voltage vs Motor Output Source Current (VCC=5.0 V) 1.2 1.2 1.0 1.0 Motor Output Low Voltage: VOL [V] Motor Output High Voltage: VOH [V] 0.2 VCC=1.8 V 0.8 0.6 VCC=5.0 V 0.4 VCC=5.5 V 0.2 0.0 0.8 0.6 Ta=+105 °C Ta=+25 °C 0.4 0.2 Ta=-40 °C 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.4 0.6 0.8 1.0 Motor Output Sink Current: IO [A] Motor Output Source Current: IO [A] Figure 9. Motor Output High Voltage vs Motor Output Source Current (Ta=25 °C) .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.2 Figure 10. Motor Output Low Voltage vs Motor Output Sink Current (VCC=5.0 V) 6/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Typical Performance Curves - continued 1.2 1.2 1.0 1.0 VCC=1.8 V Motor Output Voltage: VO [V] Motor Output Low Voltage: VOL [V] (Reference Data) 0.8 0.6 VCC=5.0 V 0.4 0.2 VCC=5.5 V Ta=+105 °C Ta=+25 °C 0.8 0.6 0.4 Ta=-40 °C 0.2 0.0 0.0 0.0 0.2 0.4 0.6 0.8 0.0 1.0 0.2 0.6 0.8 1.0 Motor Output Current: IO [A] Motor Output Sink Current: IO [A] Figure 11. Motor Output Low Voltage vs Motor Output Sink Current (Ta=25 °C) Figure 12. Motor Output Voltage vs Motor Output Current (Upper and Lower total) (VCC=5.0 V) 0.5 FG Output Low Voltage: VFGL [V] 1.2 1.0 Motor Output Voltage: VO [V] 0.4 VCC=1.8 V VCC=5.0 V 0.8 0.6 VCC=5.5 V 0.4 0.2 0.4 0.3 0.2 Ta=+105 °C Ta=+25 °C 0.1 Ta=-40 °C 0.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0 4 6 8 10 FG Sink Current: IFG [mA] Motor Output Current: IO [A] Figure 13. Motor Output Voltage vs Motor Output Current (Upper and Lower total)(Ta=25 °C) .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2 Figure 14. FG Output Low Voltage vs FG Sink Current (VCC=5.0 V) 7/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Typical Performance Curves - continued (Reference Data) 5.0 0.4 0.3 VCC=1.8 V 0.2 VCC=5.0 V 0.1 Supply Voltage Range 4.0 FG Output Leak Current: IFGL [µA] FG Output Low Voltage: VFGL [V] 0.5 3.0 2.0 1.0 Ta=+105 °C Ta=+25 °C Ta=-40 °C 0.0 VCC=5.5 V -1.0 0.0 0 2 4 6 8 1 10 2 FG Sink Current: IFG [mA] 4 5 6 Supply Voltage: VCC [V] Figure 15. FG Output Low Voltage vs FG Sink Current (Ta=25 °C) Figure 16. FG Output Leak Current vs Supply Voltage (VFG=7.0 V) 1.0 10 Lock Detection OFF Time: tOFF [s] Lock Detection ON Time: tON [s] 3 0.8 0.6 Ta=-40 °C Ta=+105 °C Ta=+25 °C 0.4 0.2 Supply Voltage Range 8 6 Ta=-40 °C Ta=+105 °C Ta=+25 °C 4 2 Supply Voltage Range 0 0.0 1 2 3 4 5 1 6 Supply Voltage: VCC [V] 3 4 5 6 Supply Voltage: VCC [V] Figure 17. Lock Detection ON Time vs Supply Voltage .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2 Figure 18. Lock Detection OFF Time vs Supply Voltage 8/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Application Information Example (Constant Values for Reference) 1. PWM Input Application This is an example of the application to control the rotational speed by the external PWM input. Protection for the FG (open drain) FG FG VCC SIGNAL OUTPUT 1 OSC Consider protection against voltage rise due to reverse connection of the power supply and the back electromotive force ＋ 6 TSD 0 Ω to 10 kΩ 0 Ω to 4.7 Ω 1 μF to 10 μF HALL ELEMENT UVLO VCC GND － 2 OFFSET CANCEL CONTROL LOGIC PRE DRIVER PWM FILTER OUT2 3 PWM 5 VCC OUT1 4 The by-pass capacitor Place it as close as possible to the VCC pin The resistance to protect the PWM pin The capacitor to remove a noise M Figure 19. PWM Input Application Substrate Design Note (a) The IC power, motor outputs and the ground lines are wired as thick as possible. (b) The by-pass capacitor and the Zener diode are placed as close as possible to the VCC pin. .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Functional Descriptions 1. PWM Speed Control The rotation speed of the motor can be changed depending on the PWM input duty to the PWM pin. When the PWM pin is open, the PWM input duty becomes 100 % (the PWM pin is pulled up to the VCC pin with the internal resistor of 200 kΩ (Typ)). But the PWM controls by the open collector/drain which use only the internal resistor is prohibited. Because the resistor value is big, the PWM input signal becomes dull and cannot input the expected PWM duty into the IC. The characteristic of the PWM input/output duty is shown as Figure 20. PWM Output Duty [%] 100 80 60 40 20 0 0 20 40 60 80 100 PWM Input Duty [%] Figure 20. PWM Output Duty vs PWM Input Duty 2. Soft Switching Drive(PWM type) The soft switching drive is a function that the output duty changes between 0 % and the PWM output duty at the timing of the output phase change. To smooth off the current waveform, the coefficient table that the output duty gradually changes is set inside the IC. When one period of the FG signal is assumed 360°, the section of the soft switching is about 60° (Typ). As shown in Figure 21, this IC is controlled same the section of the soft switching with various magnetic waveforms, such as the rectangular wave, the trapezoidal wave and the sine wave. The output PWM frequency is 50 kHz (Typ). Hence, the input PWM frequency is not equal to the output PWM frequency. S pole Rotor Magnet +/-0 mT S pole Rotor Magnet +/-0 mT N pole N pole FG period 360° FG period 360° High High FG FG Low Low : High impedance : High impedance High High OUT1 OUT1 Low Low High High OUT2 OUT2 Low Motor Current 0A 60° Low Motor Current 60° 0A 60° Soft switching width 60° Soft switching width (a) Case 1: Trapezoidal wave (b) Case 2: Sine wave Figure 21. PWM Soft-switching Drive Waveform .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Functional Descriptions - continued 3. Start Duty Assist The start duty assist can secure a constant starting torque even at the low input duty. The IC is driven by a constant output duty (DOHL; Typ 50 %) until detection of motor rotation from startup. When the output ON duty is less than 50 % (Typ), the start duty assist function operates under the following conditions: (1) Power ON (2) Automatic Restart after Lock Protection (3) Quick Start ON DOH Motor Output ON Duty [%] Power 100 OFF DOHL (Typ 50 %) Motor Output ON Duty DOHL (Typ 50 %) 50 Power ON Input PWM Duty [%] 0 50 100 % 50 % Input duty 0% Detect of Motor Rotation 100 : Startup Duty Assist Figure 22. I/O Duty Characteristic at Start Duty Assist 4. Figure 23. Timing Chart of Power ON Stand-by Mode and Quick Start When the BD69060GFT detects that the input PWM duty is 0 %, the internal state changes to the stand-by mode. The circuit current during the stand-by mode is specified at the parameter of the Circuit Current 2 in the electrical characteristics. And when the PWM signal is input while the stand-by mode, the motor can restart immediately after 10 ms (Typ) of startup time without being affected by the lock protection function. (Quick Start) Timing chart of the stand-by mode and the quick start is shown as Figure 24. PWM Quick Start (Motor Start) 0 % Detection Time: t0 ms IC Internal Stand-by Signal ON OFF OFF HALL Amplifier Gain Select Time: 10 ms (Typ) Figure 24. Timing Chart of Stand-by Mode and Quick Start The PWM pin has a built-in digital low pass filter. The detection time of the input PWM duty 0 % (t0) varies depending on the input PWM duty just before input 0 %. Relationship between the input PWM duty (frequency is 25 kHz) just before input 0 % and 0 % detection time is shown as Figure 25. 100 PWM Input Duty [%] 80 60 40 20 0 0 10 20 30 0 % Detection Time: t0 [ms] Figure 25. PWM Input Duty (25 kHz) vs 0 % Detection Time .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Functional Descriptions - continued 5. Lock Protection and Automatic Restart The motor rotation is detected by the hall signal, while the lock detection ON time (tON) and the lock detection OFF time (tOFF) are set by the IC internal counter. Timing chart is shown as Figure 26. Motor Idling Magnetic Field S N S N S N S N S N S N S Direction tON (Typ 0.5 s) tOFF (Typ 5.0 s) tON tOFF tON tOFF High OUT1 Low High OUT2 Low High FG Low Instruction Torque Motor Output ON Duty 0% Motor Lock Lock Detection Lock Release : High Impedance Figure 26. Timing Chart of Lock Protection .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Safety Measures 1. Reverse Connection Protection Diode The reverse connection of the power results in the IC destruction as shown in Figure 27. When the reverse connection is possible, the reverse connection protection diode must be added between the power supply and the VCC pin. In normal energization After reverse connection Destruction prevention Reverse power connection VCC VCC Circuit I/O VCC Circuit Block I/O GND Block GND Internal circuit impedance is high  Amperage is small I/O Circuit Block GND Large current flows  Thermal destruction No destruction Figure 27. Flow of Current When the Power is Connected Reversely 2. Protection against VCC Voltage Rise by Back Electromotive Force The back electromotive force (Back EMF) generates regenerative current to the power supply. However, ON when the reverse connection protection diode is Phase connected to the power supply line as shown in Switching Figure 28, the VCC voltage rises because the diode ON prevents current flow to the power supply. When the absolute maximum rated voltage may be exceeded due to the voltage rise by the back electromotive force, place a (A) capacitor or (B) ON ON Zener diode between the VCC pin and the GND pin for regenerative current path as shown in Figure 29. If further measures are necessary, use measures of (A) and (B) together like as (C). The capacitor and Figure 28. VCC Voltage Rise by Back Electromotive the resistor can be used to have better voltage surge protection like as (D). (A) Capacitor (B) Zener Diode ON (C) Capacitor & Zener Diode ON ON ON (D) Capacitor & Resistor ON ON ON ON Figure 29. Measure Against VCC and Motor Driving Outputs Voltage 3. PWM Switching of GND Line Do not perform the PWM switching of the GND line because the GND pin potential cannot be kept to a minimum. 4. Protection of Input Pin and Output Pin Misconnecting of the external connector from the motor PCB or plugging and unplugging the hot connector may cause damage to the IC by the rush current or the over voltage surge. About the input pin and the output pin except the VCC pin and the GND pin, please take measures such as using the protection resistor so that the IC is not affected by the over voltage or the over current as shown in Figure 31. ＋ VCC Controller Motor Driver Motor PCB VCC Protection Resistor M PWM IC FG Protection Resistor PWM GND GND PWM Input － Prohibition FG Figure 30. Prohibition of the GND Line PWM Switching .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 31. Protection of the PWM Pin and the FG pin 13/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Power Consumption 1 Current Path The current pathways that relates to the driver IC are following, and shown as Figure 32. (1) Circuit Current(ICC) (2) Motor Current (IM) (3) FG Output Sink Current (IFG) ICC FG FG VCC SIGNAL OUTPUT 1 OSC IM IFG HALL ELEMENT GND － ＋ 6 TSD 2 OFFSET CANCEL UVLO VCC CONTROL LOGIC PRE DRIVER PWM FILTER 5 PWM VCC OUT1 OUT2 3 4 M Figure 32. Current Paths of the IC 2 Calculation of Power Consumption (1) Circuit Current (ICC) 𝑃𝑊𝐴 = 𝑉𝐶𝐶 [V] × 𝐼𝐶𝐶 [A] [W] (ICC Current does not include IM) (ex.) 𝑉𝐶𝐶 = 5.0 V, 𝐼𝐶𝐶 = 2.5 mA 𝑃𝑊𝐴 = 5.0 × 2.5 = 12.5 mW (2) Motor Driving Current (IM) The VOH is the output saturation voltage of the OUT1 or the OUT2 high side, the VOL is the other low side voltage, 𝑃𝑊𝐵 = (𝑉𝑂𝐻 [V]+𝑉𝑂𝐿 [V]) × 𝐼𝑀 [A] [W] (ex.) 𝑉𝑂𝐻 = 0.08 V, 𝑉𝑂𝐿 = 0.08 V, 𝐼𝑀 = 200 mA 𝑃𝑊𝐵 = (0.08 + 0.08) × 200 = 32.0 mW (3) FG Output Sink Current (IFG) 𝑃𝑊𝐶 = 𝑉𝐹𝐺 [V] × 𝐼𝐹𝐺 [A] [W] (ex.) 𝑉𝐹𝐺 = 0.05 V, 𝐼𝐹𝐺 = 5.0 mA 𝑃𝑊𝐶 = 0.05 × 5.0 = 0.25 mW The power consumption of the driver IC totaled the above (1) to (3) is the following. 𝑃 = 𝑃𝑊𝐴 + 𝑃𝑊𝐵 + 𝑃𝑊𝐶 [W] (ex.) 𝑃 = 12.5 + 32.0 + 0.25 = 44.75 mW .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT I/O Equivalence Circuit (Resistance Values are Typical) 1. Supply voltage, Ground 2. PWM signal input VCC VCC VCC 200 kΩ PWM 10 kΩ GND 3. FG output 4. Motor outputs VCC FG OUT1 OUT2 Hall Position (Reference data) 2.9 ± 0.1 MAX 3.25 (Including BURR) 1.45 1.00 5 0.20 (Reference data) 4 0.80 1.6 ± 0.1 3.8± 0.2 6 0.75 ± 0.05 HALL position (Reference data） 1 2 3 HALL position (Reference data） .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/20 +0.05 0.13 ｰ0.04 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Interpin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 33. Example of Monolithic IC Structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Ordering Information B D 6 9 0 6 0 Part Number G F T Package GFT: TSSOF6 - TL Packaging and forming specification TL: Embossed tape and reel Marking Diagram TSSOF6(TOP VIEW) AE LOT Number Part Number Marking Pin 1 Mark .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Physical Dimension and Packing Information Package Name TSSOF6 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TL (The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand.) .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 BD69060GFT Revision History Date Revision 18.Apr.2018 001 Changes New Release .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/20 TSZ02201-0H1H0C102200-1-2 18.Apr.2018 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001