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BD6941FM

BD6941FM

  • 厂商:

    ROHM(罗姆)

  • 封装:

  • 描述:

    BD6941FM - Power Management IC Series for Automotive Body Control Motor Driver - Rohm

  • 数据手册
  • 价格&库存
BD6941FM 数据手册
Power Management IC Series for Automotive Body Control Motor Driver BD6941FM No.09039EAT02 ●Description BD6941FM is the reversible motor driver for output 1.25A (1Motor), and can control a DC motor in four modes (Forward, Reverse, Standby, Brake) corresponding to two control logic inputs. ●Features 1) 1ch DMOS H bridge output 2) Four output states ( Forward,Reverse,Standby,Brake ) by two control logic 3) Built-in surge-absorbing diodes 4) Low standby current 5) Output overcurrent protection with timer. 6) Over voltage detection switch off 7) TSD detects junction temperature and circuitry switches off the outputs at high temperature. 8) Built-in protection monitor pin (PO) ●Applications Onboard devices(Vehicle equipment etc) ●Absolute Maximum Ratings(Ta=25℃) PARAMETER SUPPLY VOLTAGE INPUT VOLTAGE OUTPUT CURRENT POWER DISSIPATION OPERATING TEMPERATURE STORAGE TEMPERATURE JUNCTION TEMPERATURE *1 Not to exceed Pd and ASO. *2 Mounted on a glass epoxy PCB (70mm×70mm×1.6mm). To use at temperature above Ta=25℃ reduce 22.4mW/℃. SYMBOL Vcc VINP, VINN IO Pd Topr Tstg Tjmax LIMIT 50 -0.3~20 1.25 2.8 -40~105 -55~150 150 (*1) (*2) UNIT V V A W ℃ ℃ ℃ ●Operating Range PARAMETER SUPPLY VOLTAGE SYMBOL Vcc LIMIT 8.0~16.0 UNIT V www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/8 2009.06 - Rev.A BD6941FM Technical Note ●Electrical Characteristics(Unless otherwise specified, Vcc=8V~16V, Ta=-40℃~105℃) LIMIT PARAMETER SYMBOL UNIT CONDITIONS MIN. TYP. MAX Circuit current 1 Icc1 0 10 μA Standby mode Circuit current 2 Icc2 3 8 mA Forward or reverse mode Circuit current 3 Icc3 3 8 mA Brake mode Input Voltage “H” level VIH 3.0 V Input Voltage “L” level VIL 1.0 V “H” level input current IIH 50 100 μA VIN=5.0V, flowing in current “L” level input current IIL 0 10 μA VIN=0V, flowing out current Output on voltage 1 VON1 0.84 1.5 V Vcc=12V, Iout =0.5A, total drop Vcc=8~16V, Iout=0.5A, Output on voltage 2 VON2 1.7 V total drop Output leakage current “H” ILH 0 10 μA VOUT=0V Output leakage current “L” ILL 0 10 μA VOUT=Vcc Upper free-wheeling VFH 0.3 1.0 1.5 V IF=0.6A diode forward voltage Lower free-wheeling VFL 0.3 1.0 1.5 V IF=0.6A diode forward voltage Protection monitor voltage VLPO 0.6 V IPO=3mA Protection monitor ILPO 0 10 μA VPO=Vcc leakage current Over current protection switch IOCP 1.5 3.5 A on current Over Voltage Lockout VOVP 25 30 35 V lockout switch on voltage ●Heat Reduction Curve Pd(W) 3.0 2.8 2.0 1.0 0 50 75 100 105 125 150 Ta(℃) Mounted on a glass epoxy PCB (70mm×70mm×1.6mm) To use at temperature above Ta=25℃ reduce 22.4mW/℃. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/8 2009.06 - Rev.A BD6941FM ●Reference Data 8 Technical Note 20 200 6 15 Ta=25℃ 150 Icc[ mA] VOUT [V] IIN [ μA] Ta=105℃ Ta=105℃ Ta=105℃ 100 Ta=25℃ Ta=-40℃ 50 4 Ta=-40℃ 10 Ta=25℃ Ta=-40℃ 2 5 0 8 10 12 14 16 0 0 1 2 3 4 0 0 4 8 12 16 Vcc[V] VIN[V] VIN [V] Fig.1 Circuit current (Forward・Reverse・Brake) 3 Ta=105℃ Fig.2 Input voltage vs. Output voltage Fig.3 Input H current 1.2 1.2 2.5 2 Ta=25℃ 0.9 Ta=105℃ 0.9 Ta=105℃ Ta=25℃ Ta=-40℃ V ON [V ] V FH [V ] 1.5 Ta=-40℃ 1 0.6 V FL[V ] 0.6 Ta=25℃ Ta=-40℃ 0.3 0.5 0 0 0.4 0.8 1.2 1.6 0.3 0.0 0.0 0.4 0.8 1.2 1.6 0.0 0.0 0.4 0.8 1.2 1.6 IOUT[A ] IOUT[A ] IOUT[A ] Fig.4 Output on voltage(Vcc=12V) 0.16 Fig.5 Upper free-wheeling diode forward voltage H 4 Fig.6 Upper free-wheeling diode forward voltage L 35 33 0.12 Ta=105℃ 3 Iocp[A] VPO[V] 0.08 2 Ta=-40℃ 0.04 VOV[V] Ta=25℃ 31 29 27 25 -40 1 0 0 1 2 3 4 0 -40 -10 20 50 80 0 40 80 IPO[mA] Ta[℃] Ta[℃] Fig.7 Protection monitor voltage Fig.8 Over current protection switch on current Fig.9 Over Voltage Lockout lockout switch on voltage 20 20 400 15 300 15 TOFF[μs] TON[μs] VOUT[V] 10 200 10 5 100 5 0 -40 0 40 80 0 -40 0 40 80 0 0 50 100 150 200 Fig.10 Over current protection monitor on time Ta[℃] Fig.11 Over current protection monitor off time Ta[℃] Fig.12 TSD temperature Ta[℃] www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/8 2009.06 - Rev.A BD6941FM ●Block Diagram M Technical Note ●Terminal Function Table PIN No. Terminal Name N.C. SGND MN MN FIN Vcc Vcc N.C. SGND PO INP INN SGND N.C. FIN MP MP PGND PGND N.C. Function N.C. Signal GND Pin Motor Output Pin Motor Output Pin FIN Power Supply Pin Power Supply Pin N.C. Signal GND Pin Protection Monitor Pin(Open drain) 19 20 21 22-27 FIN 28 29 30 31 32-36 Logic Input Pin Logic Input Pin Signal GND Pin N.C. FIN Motor Output Pin Motor Output Pin Power GND Pin Power GND Pin N.C. N.C. 1 N.C. 2 N.C. 3 N.C. 4 N.C. 5 N.C. 6 SGND 7 MN 8 36 N.C. 35 N.C. 34 N.C. 1-6 7 8 9 FIN 10 11 12-16 17 OVER VOLTAGE PROTECTION 33 N.C. 32 N.C. 31 PGND 30 PGND 29 MP MN 9 OVER CURRENT PROTECTION 28 MP Vcc 10 CONTROL LOGIC TSD 27 N.C. 26 N.C.. 25 N.C. 24 N.C. 23 N.C. 22 N.C. 21 SGND 20 19 18 Vcc 11 N.C. 12 N.C. 13 N.C. 14 N.C. 15 PROTECTION N.C. 16 MONITOR SGND 17 PO 18 INN INP ●Package Max 18.75 (include BURR) BD6941FM 1 PIN mark Lot No. HSOP-M36(Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/8 2009.06 - Rev.A BD6941FM ●Signal Table Technical Note Input/Output Truth Table IN INP H H L L INN H L H L MP L H L Open OUT MN L L H Open MODE BRAKE FORWARD REVERSE STANDBY Output Condition IN INP H INN H MODE BRAKE FORWARD/ REVERSE STANDBY OUT LOAD NORMAL SHORT NORMAL SHORT PO H L *2 H L *2 H *2 refer to timing chart H/L L L/H L ●PO Output Timing Chart normal IOCP Output current 0 MP/MN over current detection normal Active Open PO TOFF TON TON ≒ 10μsec TOFF ≒ 290μsec www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/8 2009.06 - Rev.A BD6941FM ●I/O Circuit Diagram 1) INP, INN Vcc 2) PO Technical Note Vcc INP INN 100K PO SGND 3) MP, MN Vcc SGND MP, MN PGND ●Operating Notes 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measuresuch as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) GND potential Ensure a minimum GND pin potential in all operating conditions. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin short and mistake mounting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC.Shorts between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. Ensure a minimum GND pin potential in all operating conditions. 5) Actions in strong magnetic field Keep in mind that the IC may malfunction in strong magnetic fields. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/8 2009.06 - Rev.A BD6941FM Technical Note 7) IC terminal input voltage This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when the resistors and transistors are connected to the pins as shown in the following figure, The P/N junction functions as a parasitic diode when GND > Pin A for the resistor or GND > Pin B for the transistor(NPN). Similarly, when GND > Pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of other adjacent elements to operate as a parasitic NPN transistor. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Transistor (NPN) (Pin A) Resistor (Pin B) C B E B N C (Pin B) P+ N P N P P+ N N P+ N P P+ N (Pin A) GND Parasitic elements or Parasitic elements GND Parasitic elements or Transistors P substrate GND Parasitic elements 8) Input terminals Do not apply the voltage to input pin when the Vcc is not applied. And when the Vcc is applied, the voltage of input pin must not exceed Vcc. It is feared that output get malfunction, as input voltage is sweeped slowly near the H, L threshold voltage. Please pay attention to input slew rate. 9) Back electro motive force (BEMF) There is a possibility that the BEMF is changed by use of the operating condition, environment and the individual characteristics of motor. Please make sure there is no problem of operating the IC although the BEMF is occurred. 10) The note of pattern design at printed circuit This IC flows large current between power supply for motor division and GND. So, it is feared that get undesirable result malfunction, oscillation and so on, as input lines is affected by large output current. Please consider pattern design at printed circuit doesn’t have common impedance on output large current lines-input lines. Please consider to keep low impedance of power supply for fear of oscillation from power supply high impedance, also. 11) Rash current This IC doesn’t have current limit circuit for rash current. Therefore physical security countermeasure, like current limit resistor is to be given. 12) Thermal shutdown circuit This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits , the attendant rise in the junction temperature (Tj) will trigger the TSD circuit to turn off all output power elements. The circuit automatically resets once the junction temperature (Tj) drops. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit. 13) Over voltage lock out function This IC has the function of turning off the output when detecting the over voltage. More than 30V(typ.) triggers this function. But in the standby mode, this function does not work. Although this IC has over voltage lockout function, the voltage that exceeds absolute maximum ratings might destroy the IC. Please do not exceed the absolute maximum ratings. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/8 2009.06 - Rev.A BD6941FM Technical Note 14)Over current protection This IC has the function of turning off the output when detecting the over current. More than 2.25A(typ.) triggers this function. When detecting the over current for 10μsec(typ.), this function turns off the output(output terminals become Hi-impedance) for 290μsec(typ.). After the period of turning off time (290μsec) , the output current recovers. But if the over current is still detected, this function will work again.This function is for protecting IC because of the output short etc. but the continuing detection of over current might cause the extreme heat and damage the IC. It is recommended to change the IC’s state to standby mode by the application. And please pay attention to the power dissipation. ●Ordering part number B D 6 Part No. 9 4 1 F M - E 2 Part No. Package FM : HSOP-M36 Packaging and forming specification E2: Embossed tape and reel HSOP-M36 18.5 ± 0.1 (MAX 18.75 include BURR) 2.77± 0.1 36 28 27 19 Tape +6 4 –4 Embossed carrier tape (with dry pack) 1500pcs E2 The direction is the 1pin of product is at the upper left when you hold Quantity Direction of feed 1.2 ± 0.2 9.9 ± 0.2 7.5 ± 0.1 1 9 10 18 0.85 2.4MAX 2.2 ± 0.05 1PIN MARK +0.055 0.27 –0.045 0.1 ± 0.05 0.8 +0.05 0.37 –0.04 0.08 S 0.08 M 0.5 ± 0.15 ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/8 2009.06 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A
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