BD6971FV-E2

Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6971FV ●General description BD6971FV is a 1chip driver that composes H-bridge of power DMOS FET. It is possible to correspond to a small motor by starting from 3.5V and installing in the SSOP small package. ●Package SSOP-B14 ●Features „ SSOP small package „ Driver including power DMOS FET „ Speed controllable by DC / direct PWM input „ PWM soft switching „ Quick start „ Current limit „ Lock protection and automatic restart „ Rotation speed pulse signal (FG) output W (Typ.) x D (Typ.) x H (Max.) 5.00mm x 6.40mm x 1.35mm SSOP-B14 ●Application „ Fan motors for general consumer equipment of desktop PC, and Projector, etc. ●Absolute maximum ratings Parameter Supply voltage Power dissipation Operating temperature range Storage temperature range Output voltage Output current Rotation speed pulse signal (FG) output voltage Rotation speed pulse signal (FG) output current Reference voltage (REF) output current Hall bias (HB) output current 1 Hall bias (HB) output current 2 Input voltage (H+, H–, TH, MIN, CS) Junction temperature *1 *2 *3 Symbol Vcc Pd Topr Tstg Vo Io Vfg Ifg Iref Ihb1 Ihb2 Vin Tj Limit 20 874.7 *1 –40 to +100 –55 to +150 20 1.0 *2 20 10 5 5 10 *3 7 150 Unit V mW °C °C V A V mA mA mA mA V °C Reduce by 7.0mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. The condition of Ta=25°C and Vcc=12V ●Recommended operating conditions Parameter Operating supply voltage range Operating input voltage range 1 (H+, H–) (more than Vcc=9V) Operating input voltage range 1 (H+, H–) (less than Vcc=9V) Operating input voltage range 2 (TH, MIN) ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Symbol Vcc Limit Unit 3.5 to 17.0 V 0 to 7 V 0 to Vcc–2 V 0 to Vref V Vin1 Vin2 ○This product is not designed protection against radioactive rays 1/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Pin configuration ●Pin description FG 1 14 GND H– 2 13 OSC HB 3 12 MIN P/No. 1 2 3 4 5 6 H+ 4 11 TH 7 RNF REF 8 9 10 11 12 OUT1 Vcc REF TH MIN 13 OSC 14 GND (TOP VIEW) CS 5 10 OUT2 6 9 Vcc RNF 7 8 OUT1 Fig.1 Pin configuration T/Name FG H– HB H+ CS OUT2 Function Speed pulse signal output terminal Hall – input terminal Hall bias terminal Hall + input terminal Output current detection terminal Motor output terminal 2 Output current detecting resistor connecting terminal (motor ground) Motor output terminal 1 Power supply terminal Reference voltage output terminal Output duty controllable input terminal Minimum output duty setting terminal Oscillating capacitor connecting terminal Ground terminal (signal ground) ●Block diagram 1 FG SIGNAL OUTPUT PWM SOFT SWITCHING TSD GND 14 HALL AMP 2 H– OSC OSC 13 HALL COMP 3 4 HB HALL BIAS H+ CONTROL LOGIC MIN PWM COMP LOCK PROTECT Vcl PWM COMP TH 12 11 QUICK START 5 6 7 CS REF CURRENT LIMIT COMP PREDRIVER Vcc OUT2 RNF 10 REF OUT1 9 8 Fig.2 Block diagram ●I/O truth table Hall input H+ H– H L L H OUT1 L H Driver output OUT2 H L FG Hi-Z L H; High, L; Low, Hi-Z; High impedance FG output is open-drain type. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Electrical characteristics(Unless otherwise specified Ta=25°C, Vcc=12V) Parameter Symbol Min. 3 4 –18 Limit Typ. 5 9 –13 Max. 8 16 –8 - 0.6 0.9 V Unit Circuit current Hall input hysteresis + voltage Hall input hysteresis – voltage Icc Vhys+ Vhys– Output voltage Vo Lock detection ON time Lock detection OFF time FG output low voltage FG output leak current OSC high voltage OSC low voltage OSC charge current OSC discharge current Ton Toff Vfgl Ifgl Vosch Voscl Icosc Idosc 0.3 3.0 2.3 0.8 –16 4 0.5 5.0 0.15 2.5 1.0 –8 8 0.7 7.0 0.30 10 2.7 1.2 –4 16 s s V µA V V µA µA Output ON duty 1 Poh1 75 80 85 % Output ON duty 2 Poh2 45 50 55 % Output ON duty 3 Poh3 15 20 25 % Reference voltage Hall bias voltage 1 Hall bias voltage 2 Current limit setting voltage TH input bias current MIN input bias current CS input bias current Vref Vhb1 Vhb2 Vcl Ith Imin Ics 5.8 1.10 1.05 280 - 6.0 1.30 1.25 310 - 6.2 1.50 1.48 340 –0.2 –0.2 –0.2 V V V mV µA µA µA Ref. data Conditions mA mV mV Fig.3 Fig.4 Fig.4 Io=±200mA, High and low side total Ifg=2mA Vfg=17V Vth=Vref x 0.222 Output 1kΩ, OSC=100pF Vth=Vref x 0.294 Output 1kΩ, OSC=100pF Vth=Vref x 0.367 Output 1kΩ, OSC=100pF Iref=–2mA Ihb=–2mA Ihb=–10mA Vth=0V Vmin=0V Vcs=0V Fig.5 to 8 Fig.9 Fig.10 Fig.11, 12 Fig.13 Fig.14 Fig.14 Fig.15 Fig.15 Fig.16, 17 Fig.18, 19 Fig.19 Fig.20 Fig.21 Fig.22 Fig.23 About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Typical performance curves(Reference data) 10 Hall input hysteresis voltage: Vhys[mV] 20 Circuit current: Icc[mA] 8 6 100°C 25°C –40°C 4 2 Operating range 100°C 25°C 10 –40°C 0 Operating range –40°C -10 25°C 100°C -20 0 0 5 10 15 0 20 5 15 20 Supply voltage: Vcc[V] Supply voltage: Vcc[V] Fig.3 Circuit current Fig.4 Hall input hysteresis voltage 0.0 0.0 -0.2 -0.2 Output high voltage: Voh[V] Output high voltage: Voh[V] 10 -0.4 -0.6 -0.8 -0.4 -0.6 -0.8 100°C -1.0 0.0 0.2 0.4 25°C 0.6 0.8 –40°C 3.5V -1.0 1.0 0.0 12V 0.2 0.4 0.6 0.8 Output source current: Io[A] Output source current: Io[A] Fig.5 Output high voltage (Vcc=12V) Fig.6 Output high voltage (Ta=25°C) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/12 17V 1.0 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Typical performance curves(Reference data) 1.0 100°C 1.0 25°C –40°C 0.6 0.4 0.2 17V 0.6 0.4 0.2 0.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 Output sink current: Io[A] 0.6 0.8 1.0 Output sink current: Io[A] Fig.7 Output low voltage (Vcc=12V) Fig.8 Output low voltage (Ta=25°C) 7.0 Lock detection OFF time: Toff[s] 0.7 Lock detection ON time: Ton[s] 12V 0.8 Output low voltage: Vol[V] Output low voltage: Vol[V] 0.8 3.5V 0.6 0.5 –40°C 25°C 100°C 0.4 6.0 5.0 –40°C 25°C 100°C 4.0 Operating range Operating range 0.3 3.0 0 5 10 15 20 Supply voltage: Vcc[V] 5 10 15 20 Supply voltage: Vcc[V] Fig.9 Lock detection ON time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.10 Lock detection OFF time 5/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Typical performance curves(Reference data) 0.8 0.8 3.5V FG output low voltage: Vfgl[V] FG output low voltage: Vfgl[V] 100°C 0.6 25°C 0.4 –40°C 0.2 0.0 12V 0.6 17V 0.4 0.2 0.0 0 2 4 6 8 10 0 Output sink current: Ifg[mA] 2 4 6 8 10 Output sink current: Ifg[mA] Fig.11 FG output low voltage (Vcc=12V) Fig.12 FG output low voltage (Ta=25°C) 8 3.0 OSC high/low voltage: Vosch/Voscl [V] FG output leak current: Ifgl[uA] Operating range 6 4 2 100°C 25°C –40°C 0 Operating range -2 100°C 25°C –40°C 2.5 2.0 1.5 100°C 25°C –40°C 1.0 0.5 0 5 10 15 20 Supply voltage: Vcc[V] 5 10 15 20 Supply voltage: Vcc[V] Fig.13 FG output leak current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.14 OSC high/low voltage 6/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Typical performance curves(Reference data) 7 8 0 Operating range –40°C 25°C 100°C -8 100°C 25°C –40°C 6 100°C 25°C –40°C Reference voltage: Vref[V] OSC charge/discharge current: Icosc/Idosc [uA] 16 5 4 3 Operating range -16 2 0 5 10 15 0 20 5 15 20 Supply voltage: Vcc[V] Supply voltage: Vcc[V] Fig.15 OSC charge/discharge current Fig.16 Reference voltage 6.4 1.5 6.2 1.4 100°C 6.0 25°C 5.8 Hall bias voltage: Vhb1[V] Reference voltage: Vref[V] 10 100°C 25°C –40°C 1.3 1.2 –40°C Operating range 5.6 1.1 0 1 2 3 4 5 0 Output source current: Iref[mA] 10 15 20 Supply voltage: Vcc[V] Fig.17 Reference voltage current ability (Vcc=12V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 Fig.18 Hall bias voltage 1 7/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Typical performance curves(Reference data) 340 Current limit setting voltage: Vcl[mV] Hall bias voltage: Vhb[V] 1.5 1.4 100°C 1.3 25°C –40°C 1.2 1.1 325 100°C 25°C 310 –40°C 295 Operating range 280 0 2 4 6 8 10 0 5 Output source current: Ihb[mA] 10 15 20 Supply voltage: Vcc[V] Fig.19 Hall bias voltage current ability (Vcc=12V) Fig.20 Current limit setting voltage 0.05 0.05 0.00 0.00 -0.05 100°C 25°C –40°C MIN bias current: Imin[uA] TH bias current: Ith[uA] 100°C 25°C –40°C -0.05 -0.10 -0.10 -0.15 -0.15 Operating range Operating range -0.20 -0.20 0 5 10 15 20 Supply voltage: Vcc[V] 5 10 15 20 Supply voltage: Vcc[V] Fig.21 TH bias current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.22 MIN bias current 8/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Typical performance curves(Reference data) 0.05 0.00 CS bias current: Ics[uA] 100°C 25°C –40°C -0.05 -0.10 -0.15 Operating range -0.20 0 5 10 15 20 Supply voltage: Vcc[V] Fig.23 CS bias current ●Application circuit example(Constant values are for reference) Protection of FG open-drain Output PWM frequency setting SIG 1 FG 0Ω to SIGNAL OUTPUT PWM SOFT SWITCHING TSD GND 2 Noise measures of substrate H– OSC OSC Minimum output duty setting 14 HALL AMP 47pF to 220pF 13 Circuit that converts PWM duty into DC voltage HALL COMP H 3 HB 0Ω to Hall bias is set according to the amplitude of hall element output and hall input voltage range. 4 Vcl CONTROL LOGIC TH 12 11 PWM QUICK START 5 Low-pass filter for RNF voltage smoothing MIN PWM COMP LOCK PROTECT 100pF to 0.01µF 200Ω to 20kΩ To limit motor current, the current is detected. Note the power consumption of detection resistance. H+ HALL BIAS PWM COMP 6 7 CS REF CURRENT LIMIT COMP PREDRIVER OUT2 Stabilization of REF voltage 0.1µF to Vcc RNF 10 REF OUT1 ＋ 9 1µF to 8 Reverse-connected prevention of the FAN connector 0.33Ω to M － Measure against back EMF Maximum output voltage and current are 20V and 1.0A. So bypass capacitor, arrangement near to Vcc terminal as much as possible Fig.24 PWM controllable 4 wires type motor application circuit Substrate design note a) IC power, motor outputs, and motor ground lines are made as fat as possible. b) IC ground (signal ground) line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to (–) land. c) The bypass capacitor and/or Zenner diode are arrangement near to Vcc terminal. d) H+ and H– lines are arranged side by side and made from the hall element to IC as shorter as possible, because it is easy for the noise to influence the hall lines. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.25 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj – Ta) / P [°C/W] Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value measured at a specified condition. Fig.26 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board 70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance θjc from IC chip joint part to the package surface part of mounting the above-mentioned same substrate is shown in the following as a reference value. θjc = 40 [°C/W] (reference value) Pd[mW] θja = (Tj – Ta) / P [°C/W] θjc = (Tj – Tc) / P [°C/W] 874.7 750 θja=142.9 [°C/W] Ambient temperature Ta[°C] Package surface temperature Tc[°C] 500 250 0 25 50 75 100 125 150 Ta[° C] ＊Reduce by 7.0mW/°C over 25°C (On 70.0mm x 70.0mm x 1.6mm glass epoxy board) Chip surface temperature Tj[°C] Power consumption P[W] Fig.25 Thermal resistance Fig.26 Thermal de-rating curve ●I/O equivalence circuit(Resistance values are typical) 1) Power supply terminal, and Ground terminal 2) Hall input terminals, 3) Minimum output duty setting Output duty controllable input terminal terminal, and Output current detection terminal 4) Motor output terminals, and Output current detecting resistor connecting terminal Vcc Vcc Vcc OUT1 OUT2 Vcc MIN H+ H– TH CS 1kΩ 30Ω RNF 1kΩ GND 5) Reference voltage output terminal, and Hall bias terminal Vcc 6) Speed pulse signal output terminal Vcc 7) Oscillating capacitor connecting terminal Vcc REF HB 46kΩ 46kΩ Vcc FG 10Ω 1kΩ 1kΩ OSC www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Operational Notes 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (When applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100µF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. 14) In use We are sure that the example of application circuit is preferable, but please check the character further more in application to a part that requires high precision. In using the unit with external circuit constant changed, consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining. ●Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/12 TSZ02201-0H1H0B100150-1-2 28.JUL.2012 Rev.002 Datasheet BD6971FV ●Physical dimension tape and reel information SSOP-B14 5.0 ± 0.2 8 0.3Min. 4.4 ± 0.2 6.4 ± 0.3 14 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 7 0.10 1.15 ± 0.1 0.15 ± 0.1 0.1 0.65 0.22 ± 0.1 Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking diagram SSOP-B14 (TOP VIEW) D 6 9 7 1 Part Number LOT Number 1PIN Mark ●Revision history Date Revision 07.JUL.2012 28.JUL.2012 001 002 Comments New Release Color appearance change (There is no change in the content.) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 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