CMOS LDO Regulator for Portable Equipments
Dual, Low-Dropout
Linear Regulator
BD7003NUX, BD7004NUX
No.12020ECT09
●Descriptions
The BD7003NUX, BD7004NUX are dual channels, 300mA low-dropout voltage regulator output at each channel. The output
voltage range is from 1.2V to 3.3V by operating range from 2.5V to 5.5V. The output voltages, VOUT1 and VOUT2, are
determined at power up by the state of P1 and P2(see the table of “Output-Voltage Programming”). The BD7003NUX,
BD7004NUX offer 1.8% accuracy and low-dropout. The shutdown current is near the zero current which is suitable for
battery powered device. The BD7003NUX, BD7004NUX are mounted on VSON008X2020(2.0mmX2.0mmX0.6mm), which
contributes to the space-saving design of set.
●Features
1) 2-channel 300mA, CMOS-type LDOs.
2) Pin-Programmable Output Voltage.
(9 steps adjustable VO；See the Table of “Output-Voltage Programming”.)
3) LDOs Power ON/OFF Enable Control.
4) 2.0mm×2.0mm Package.
5) Small Ceramic Output Capacitors(1μF).
6) Equipped with Over Current Limiter and Thermal Shutdown Circuit(TSD) .
●Applications
Battery-powered portable equipment, etc.
●Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
Ratings
Unit
VIN
-0.3 ～ 7
V
Maximum Input Voltage 1 (P1,P2,EN1,EN2)
VINMAX1
-0.3 ～ 7
V
Maximum Input Voltage 2 (Vout1,Vout2)
VINMAX2
-0.3～Vin+0.3
V
Pd
1360*1
mW
Operating Temperature Range
Topr
-40 ～ +85
℃
Storage Temperature Range
Tstg
-55 ～ +150
℃
Maximum Supply Voltage (VIN)
Power Dissipation
*
*
1
This is the allowable loss of when it is mounted on a ROHM specification board 40mm×40mm×1.5mmt
To use at temperature higher than 25C , derate 10.9mW per 1℃
This product is not especially designed to be protected from radioactivity.
●Recommended Operating Range (Ta=-40～+85℃)
Parameter
Input Power Supply Voltage Range
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© 2012 ROHM Co., Ltd. All rights reserved.
Symbol
Ratings
Unit
VIN
2.5～5.5
V
1/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Power Dissipation
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC
are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.)
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1 (Double-side Board)
Layout of Board for
Measurement
(Unit: mm)
Top Layer (Top View)
IC
Implementation
Position
Bottom Layer (Top View)
1.36W
Power Dissipation
θja=91.9℃/W
Thermal Resistance
1. 6
Evaluation Bord1
1. 4
1.36W
Power Dissipation : Pd (W)
1. 2
1. 0
0. 8
0. 6
0. 4
0. 2
0. 0
0
25
50
75
100
125
150
175
200
Ambient Temperature :Ta (℃ )
Fig.1. VSON008X2020 Power dissipation heat reduction characteristics (Reference)
* Please design the margin so that PMAX becomes is than Pd (PMAXPd)
within the usage temperature range.
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© 2012 ROHM Co., Ltd. All rights reserved.
2/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Electrical Characteristics (Vin=3.7V, EN1=EN2=Vin,Ta =+25℃, unless otherwise noted.)
Parameter
Symbol
Output Voltage range
Typ
Max
Unit
Condition
VOUT
1.2
-
3.3
V
VIN
2.5
-
5.5
V
Δvouta
-1.8
-
1.8
%
Iout=1mA, VOUT≧1.5V
Δvoutb
-30
-
+30
mV
Iout=1mA, VOUT=1.2V
Imax
300
-
-
mA
Isc
-
150
-
mA
-
55
95
-
35
65
Input Voltage range
Output Voltage Accuracy
Limits
Min
Maximum Output Current
Short Circuit Current
Ground Pin Current
Iq
Dropout Voltage
Vdrop
μA
Iout=0mA
One LDO shutdown, Iout=0mA
-
120
170
VIN=2.5V, VOUT=2.6V, Iout=100mA
-
90
140
VIN=2.7V, VOUT=2.8V, Iout=100mA
80
130
VIN=2.9V, VOUT=3.0V, Iout=100mA
-
70
120
-
360
510
-
270
420
VIN=2.7V, VOUT=2.8V, Iout=300mA
240
390
VIN=2.9V, VOUT=3.0V, Iout=300mA
mV
-
210
360
Line Regulation
ΔVLNR
-
0.02
0.2
%/V
Load Regulation
ΔVLDR
-
0.2
0.6
%
Ripple Rejection
PSRR
-
66
-
dB
en
-
150
-
μVrms
ViH
1.2
-
-
ViL
-
-
0.5
Output Noise
VOUT = 0V
VIN=3.2V, VOUT=3.3V,Iout=100mA
VIN=2.5V, VOUT=2.6V, Iout=300mA
VIN=3.2V, VOUT=3.3V, Iout=300mA
VIN=VOUT+1V to VIN=5.5V, Iout=10mA
Iout=1mA to 300mA
f=100Hz,Iout=10mA@VOUT=1.5V
fBW=10Hz to 100kHz;Iout=10mA
●EN1, EN2
Enable Input Threshold
Regulator enabled
Regulator shutdown
Ien
-
0.1
1
μA
Ven=VIN , Ta=+25℃
IQSHDN
-
0.1
1
μA
Vout=0V , Ta=+25℃
Enable Input Leakage Current
Shutdown Supply Current
V
*This product is not especially designed to be protected from radioactivity.
Output-Voltage Programming
BD7003NUX
PIN Name
Set up
BD7004NUX
P1
P2
VOUT1
VOUT2
VOUT1
VOUT2
OPEN
OPEN
1.50
2.80
1.20
1.50
OPEN
GND
1.80
2.60
1.20
1.80
OPEN
VIN
1.80
2.70
1.80
1.50
GND
OPEN
1.80
2.80
1.80
1.80
GND
GND
1.80
2.90
1.80
3.00
GND
VIN
2.60
2.80
1.80
3.30
VIN
OPEN
2.80
2.80
2.80
3.00
VIN
GND
2.90
2.90
3.00
3.00
VIN
VIN
2.80
3.30
3.30
3.30
Output Voltage Programming Input (P1、P2)
Output voltages, VOUT1 and VOUT2, are determined at power up by the state of P1 and P2 (see the table of
“Output-Voltage Programming”). Subsequent charges to P1 and P2 do not change the output voltages unless the supply
power is cycled, or all EN inputs are simultaneously driven low to shutdown the device.
Shutdown (EN1, EN2)
The BD7003NUX, BD7004NUX have independent shutdown control inputs, EN1 and EN2. Driving both EN1 and EN2
low will shut down the entire device, reducing supply current to 1μA max. Connecting EN1 and EN2 to a logic-high or
VIN will enable the corresponding output(s).
It is prohibited to open EN1, EN2 switches.
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3/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Typical Application Circuit
BD7003NUX, BD7004NUX
VIN
VIN
CIN
1μF
VOUT1
COUT1
1μF
P1
P2
VIN
EN1
VIN
EN2
VOUT2
COUT2
1μF
GND
Figure2. Application Circuit
*It is prohibited to open EN1, EN2 switches.
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© 2012 ROHM Co., Ltd. All rights reserved.
4/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Package Dimensions (VSON008X2020)
Device
name
Lot No.
[Unit: mm]
Device name
Marking
BD7003NUX
BD7003
BD7004NUX
BD7004
●Pin Descriptions
PIN description (Top View)
Note : Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
PIN No.
Name
I/O
1
VIN
2
EN1
3
4
5
ESD Diode
Function
IN
GND
I
-
O
Voltage Supply
I
-
O
Enable Input1
P2
I
O
O
Control Output-Voltage PIN2
P1
I
O
O
Control Output-Voltage PIN1
EN2
I
-
O
Enable Input2
6
GND
-
O
-
GND PIN
7
VOUT2
O
-
O
LDO1 Output1
8
VOUT1
O
-
O
LDO2 Output2
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© 2012 ROHM Co., Ltd. All rights reserved.
5/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Equivalent Circuit
2pin, 5pin (EN)
3pin, 4pin (P)
3kΩ
3kΩ
3-State
Decoder
H
OPEN
L
8pin, 7pin (VOUT)
●Block Diagram
VIN
1
EN1 2
EN2 5
P1 4
P2 3
P
SHUTDOWN
AND POWER
- ON
CONTROL
ERROR
AMP
OUTPUT
VOLTAGE
CONTROL
EN1
OVER CURRENT
PROTECTION
DISCHARGE
CIRCUIT
8 VOUT1
LDO1
VIN
VREF
&
TSD
LDO2
GND 6
7 VOUT2
Fig.3. Block Diagram
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© 2012 ROHM Co., Ltd. All rights reserved.
6/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Typical Operating Characteristics
※The test conditions for the Typical Operating Characteristics are VIN=3.7V, CIN=1.0uF, COUT=1.0uF, Ta=25℃, Unless otherwise noted.
1.6
1.4
VOUT1=1.2V
Io=300mA
Io=10mA
0.6
Io=1mA
0.4
Ｉo=0mA
Io=300mA
1
0.8
Io=10mA
0.6
Io=1mA
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
1
0
0
5.5
Io=1mA
Ｉo=0mA
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Input Voltage(V)
Input Voltage(V)
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage(V)
Fig.6. Output Voltage
(VOUT1=3.3V)
Fig.5. Output Voltage
(VOUT2=1.5V)
Fig.4. Output Voltage
(VOUT1=1.2V)
1.6
1.4
3.5
1.4
VOUT1= 1.2V
Out put Volt age(V)
Io=1mA
0.8
Io=10mA
Io=300mA
0.6
0.4
3
Ｉo=0mA
1.2
Ｉo=0mA
1
Io=1mA
1
VOUT2=1.5V
Io=10mA
0.8
Io=300mA
0.6
0.2
0
0
2 .5
3
3.5
4
4 .5
Input Volt age(V)
5
Io=0mA
2
Io=1mA
Io=10mA
1.5
Io=300mA
1
0.4
0.2
VOUT1=3.3V
2.5
Output Voltage(V)
1.2
0.5
0
3.7
5.5
2 .5
Fig.7. Line Regulation
(VOUT1=1.2V)
3
3.5
4
Input Volt age(V)
4 .5
5
100
100
P1=P2=GND
P1=P2=GND
G n d C u rre n t (u A )
7
6
5
Ta=85℃
Ta=25℃
Ta=-40℃
4
3
P1=P2=GND
P1=P2=GND
P1=P2=GND
8
2
5.2
Fig.9. Line Regulation
(VOUT1=3.3V)
P1=P2=GND
9
4.7
Input Voltage(V)
Fig.8. Line Regulation
(VOUT2=1.5V)
10
4.2
5 .5
80
60
G n d C u rre n t ( u A )
Out put Volt age(V)
Io=10mA
1.5
0
0
Io=300mA
2
0.5
0.2
0
G n d C u rre n t (u A )
2.5
Ｉo=0mA
0.4
0.2
O u tp u t V o l tag e(V)
1
0.8
VOUT1=3.3V
3
1.2
O u tp u t Vo l tag e(V)
O u tp u t V o l tag e(V )
3.5
VOUT2=1.5V
1.4
1.2
Ta=85℃
Ta=25℃
Ta=-40℃
40
20
80
Ta=85℃
Ta=25℃
Ta=-40℃
60
40
20
1
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Fig.10. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=GND
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0 0.5
Input Voltage (V)
Fig.11. Circuit Current
(VOUT1=1.8V,VOUT2=2.9
V) EN1=VIN, EN2=GND
100
0.9
P1=P2=GND
0.8
60
40
Ta=85℃
Ta=25℃
Ta=-40℃
20
0
0 0.5 1 1.5
2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
Fig.13. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=VIN
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E N C u rre n t (u A )
80
1 1.5
2
2.5
3
3.5
4 4.5
5 5.5
Inpuｔ Voltage (V)
Fig.12. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=GND, EN2=VIN
1.0
1.0
P1=P2=GND
G n d C u rre n t (u A )
0
0
5.5
Input Voltage (V)
0.9
P1=P2=GND
0.7
0.6
0.5
0.4
0.3
Ta=85℃
Ta=25℃
Ta=-40℃
0.2
E N C u rre n t (u A )
0
P1=P2=GND
0.8
0.7
0.6
0.5
0.4
0.3
Ta=85℃
0.2
0.1
0.1
0.0
0.0
Ta=25℃
Ta=-40℃
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
Input Voltage(V)
Fig.14. EN1 Input Current
7/13
Fig.15. EN2 Input Current
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
2.0
3.0
P1=P
2 GN
4
3.5
2.5
3
Ta=85℃
Ta=25℃
Ta=-40℃
1.0
2.0
1.5
Ta=85℃
Ta=25℃
Ta=-40℃
1.0
2.5
Vout1 [V]
O u tp u t V o lta g e (V )
O u tp u t V o lta g e (V )
1.5
2
1.5
1
0.5
0.5
0.0
0.5
1
1.5
0
0.5
EN Voltage (V)
1
1.5
-40
4
10
9
P1=P2=GND
80
Gnd Current (uA)
G n d C u rre n t (u A )
7
Io=0mA
2
1.5
85
P1=P2=GND
3
Io=0.1mA
60
100
P1=P2=GND
8
Vou t2 [V]
10
35
Tem p [°C]
Fig.18. VOUT - Temp
(VOUT1=1.8V)
Fig.17. EN2 Threshold
(VOUT2=2.9V)
3.5
2.5
-15
EN Voltage (V)
Fig.16. EN1 Threshold
(VOUT1=1.8V)
Io=0.1mA
0
0.0
0
Io=0mA
0.5
6
5
4
3
60
40
20
1
2
1
0.5
0
-40
0
0
-40
-40
-15
10
35
60
-15
10
85
35
60
10
Fig.20. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=GND
35
60
85
Temp (°C)
Temp (°C)
Tem p [°C]
Fig.19. VOUT – Temp
(VOUT2=3.0V)
-15
85
Fig.21.Icc- Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=VIN, EN2=GND
1.00
100
100
P1=P2=GND
P1=P2=GND
P1=P
2 GN
P1=P2=GND
80
60
40
VIN=2.7V
0.80
0.70
DropoutVoltage(V)
80
G n d C u rre n t (u A
Gnd Current (uA)
0.90
P1=P2=GND
60
40
20
20
0
0
Temp=85℃
0.60
Temp=25℃
0.50
Temp=-40℃
0.40
0.30
0.20
-40
-15
10
35
60
0.10
-40
85
-15
10
35
60
85
0.00
Temp (°C)
Temp (°C)
Fig.22. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=GND, EN2=VIN
0
Fig.23. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=VIN
VIN=2.7V
0.1
0.15
IOUT(A)
0.2
0.25
0.3
Fig.24. Drop Out Voltage
(VOUT1=2.8V)
1.00
0.90
0.05
4
4
3.5
3.5
0.80
3
3
2.5
2.5
Temp=85℃
0.50
Temp=25℃
0.40
Temp=25°C
Temp=-40°C
VOUT2 [V]
0.60
VOUT1 [V]
DropoutVoltage(V)
0.70
Temp=85°C
2
1.5
Temp=-40℃
Temp=-40°C
Temp=25°C
Temp=85°C
2
1.5
0.30
1
1
0.5
0.5
0.20
0.10
0
0
0.00
00
0
0.05
0.1
0.15
IOUT(A)
0.2
0.25
0.3
Fig.25. Drop Out Voltage
(VOUT2=2.8V)
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50
0.05
100
0.10
150
0.15
200
0.20
250
0.25
Iout1[A]
Fig.26. Load Regulation
(VOUT1=1.2V)
8/13
300
0.30
0
50
0.05
100
0.1
150
0.15
200
0.2
250
0.25
300
0.3
Iout2[A]
Fig.27. Load Regulation
(VOUT2=1.5V)
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
4
4
4
3.5
3.5
Temp=-40°C
Temp=25°C
Temp=85°C
3.5
Temp=25°C
3
3
3
2
1.5
1
0.5
2.5
2.5
VOUT2 [V]
V OUT1 [V ]
2.5
VOUT1 [V]
Temp=-40°
Temp=85°C
2
1
1
0.5
0.5
00
0
50
100
150
200
250
100
0.1
200
0.2
250
0.25
300
0.3
0
50
0.05
100
0.1
150
0.15
VOUT1
1V/div
VIN=3.7
1V/div
VIN=3.7
VIN=3.7
Fig.33. Discharge Time
(VOUT1=1.8V)
IOUT=0mA
Fig.32. Start Up Time
(VOUT2=2.9V)
IOUT=0mA
Fig.31. Start Up Time
(VOUT1=1.8V)
IOUT=0mA
300
0.3
1msec/div
1V/div
EN1
VOUT2
1V/div
250
0.25
Fig.30. Load Regulation
(VOUT2=3.3V)
10μsec/div
1V/div
EN2
200
0.2
Iout2[mA]
Fig.29. Load Regulation
(VOUT2=3.0V)
10μsec/div
1V/div
VOUT1
150
0.15
Iout1[A]
Fig.28. Load Regulation
(VOUT1=2.8V)
Temo=85℃
0
50
0.05
300
Iout1[A]
EN1
Temo=25℃
1.5
1.5
0
0
Temo=-40℃
2
1msec/div
1V/div
EN2
ch1
VOUT2
VIN
4.7V
4.7V
3.7V
3.7V
ch1
VIN
ch2
VOUT1
1V/div
ch2
VOUT1
1.2V
1.5V
VIN=3.7
Fig.35. VIN Response
(VOUT1=1.2V)
IOUT=50mA
Fig.34. Discharge Time
(VOUT2=2.9V)
IOUT=0mA
ch1
VIN
ch1
Fig.36. VIN Response
(VOUT1=1.5V)
IOUT=50mA
VIN
4.7V
4.7V
4.7V
3.7V
3.7V
3.7V
ch2
ch2
VOUT1
1.8V
VOUT1
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VIN
ch2
VOUT1
3.3V
3.0V
Fig.37. VIN Response
(VOUT1=1.8V)
IOUT=50mA
ch1
Fig.38. VIN Response
(VOUT2=3.0V)
IOUT=50mA
9/13
Fig.39. VIN Response
(VOUT2=3.3V)
IOUT=50mA
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
40μsec/div
Iout＝1mA->150mA
Vout1
40μsec/div
100mA/div
Iout＝1mA->150mA
200mV/div
1.2V
100mA/div
Iout＝150mA->1mA
100mA/div
Vout1
200mV/div
Vout1
3.3V
Fig.40. Load Response
(VOUT1=1.2V)
IOUT=1mA→150mA
40μsec/div
200mV/div
1.2V
Fig.41. Load Response
(VOUT1=3.3V)
IOUT=1mA→150mA
Fig.42. Load Response
(VOUT1=1.2V)
IOUT=150mA→1mA
40μsec/div
Iout＝150mA->1mA
100mA/div
Vout1
200mV/div
3.3V
Fig.43. Load Response
(VOUT1=3.3V)
IOUT=150mA→1mA
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© 2012 ROHM Co., Ltd. All rights reserved.
10/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Example of EN1&EN2 used (P1=GND,P2=OPEN, VOUT1=1.8V, VOUT2=2.8V)
Output overshoot conditions
Whenever the LDO is turned ON, LDO1 output overshoot occurs in certain boot conditions.
In CASE2, the overshoot value is minimum, which boot order is EN1→EN2.
The maximum over shoot occurs in CASE3, which boot order is EN2→EN1.
The overshoot value differs between input voltages(VIN), output voltage setting and EN1, EN2 input timing interval.
CASE1: EN1 & EN2 Pins are shorted
VIN=5.5V,EN2=EN1
VIN=3.7V,EN2=EN1
EN1(5V/div)
EN1(5V/div)
VOUT2(0.5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
VOUT1(0.5V/div)
20ms/div
20ms/div
EN1 & EN2 Pins are independent
CASE2: EN1→EN2 operation(L→H)
VIN=5.5V,EN2=L(OFF)
VIN=3.7V,EN2=L(OFF)
EN1(5V/div)
EN1(5V/div)
VOUT1(0.5V/div)
VOUT1(0.5V/div)
VOUT2(0.5V/div)
VOUT2(0.5V/div)
20ms/div
20ms/div
CASE3: EN2→EN1 operation(L→H)
VIN=3.7V,EN2=H(ON)
EN1(5V/div)
VIN=5.5V,EN2=H(ON)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
20ms/div
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© 2012 ROHM Co., Ltd. All rights reserved.
11/13
EN1(5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
20ms/div
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Notes for use
(1) Absolute maximum ratings
If applied voltage (VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is
a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics,
it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the IC by reverse connection of the power supply connector. For protection from reverse
connection, take measures such as externally placing a diode between the power supply and the power supply pin of
the IC.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital
power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due
to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the IC, in conjunction with inserting capacitors between power supply and GND
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss
occurring at low temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition,
confirm that there are no pins for which the potential becomes less than a GND by actually including transition
phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the IC. If it is
installed erroneously, there is a risk of IC damage. There also is a risk of damage if it is shorted by a foreign substance
getting between pins , between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the IC in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the IC in the set board, since there is a risk of stress to the IC when capacitors are connected to low
impedance IC pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the
assembly process and take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an IC structure due to potential relationships. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the IC in other ways such that
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not
being applied to the IC. Furthermore, when the power supply voltage is being applied, make each input pin a voltage
less than the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND
voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal shutdown circuit (TSD)
When the junction temperature becomes 180℃ (typ) or higher, the thermal shutdown circuit operates and turns the
switch OFF. The thermal shutdown circuit, which is aimed at isolating the IC from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the IC. Therefore, do not continuously use the IC with this circuit
operating or use the IC assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
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© 2012 ROHM Co., Ltd. All rights reserved.
12/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Ordering part number
B
D
7
Part No.
0
0
3
N
Part No.
7003
7004
U
X
Package
NUX: VSON008X2020
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
VSON008X2020
2.0±0.05
2.0±0.05
0.6MAX
1.5±0.1
0.5±0.1
1
4
8
5
4000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
+0.03
0.02 −0.02
0.8±0.1
(0.12)
S
0.3±0.1
C0.25
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.05 S
Tape
+0.05
0.25 −0.04
1.5±0.1
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
1pin
(Unit : mm)
Reel
13/13
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.01 - Rev.C
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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