BD70H38G-2CTR

Nano EnergyTM Datasheet Voltage Detector (Reset) IC Series for Automotive Application Supervisory IC BD70Hxx-xC Series BD73Hxx-2C Series General Description Key Specifications ROHM's Supervisory ICs are highly accurate, with ultralow current consumption feature that uses CMOS process. The lineup includes N-channel open drain output (BD70Hxx-xC) and CMOS output (BD73Hxx-2C) so that the users can select depending on the application. Because there is no hysteresis, the Release Voltage is set to same value of Detection Voltage. ◼ Release Voltage: 3.76 V, 3.66 V, 3.56 V, 3.46 V, 3.06 V, 1.20V ◼ Ultra-Low Current Consumption: 270 nA (Typ) ◼ Operation Temperature Range: -40 °C to +125 °C Special Characteristics ◼ Release Voltage Accuracy: ±50 mV (-40 °C to +125 °C) Features ◼ AEC-Q100 Qualified (Note 1) ◼ No Hysteresis ◼ Two Output Types (Nch Open Drain and CMOS Output) ◼ Nano Energy ◼ Very Small, Lightweight and Thin Package ◼ Package SSOP5 is similar to SOT-23-5 (JEDEC) Package W (Typ) x D (Typ) x H (Max) 2.90 mm x 2.80 mm x 1.25 mm SSOP5: Application (Note 1) Grade 1 All automotive devices that requires voltage detection Typical Application Circuits VDD1 VDD2 VDD1 RL Microcontroller Microcontroller CVDD BD70Hxx-xC RST CVDD (Noise-reduction CL BD73Hxx-2C RST (Noise-reduction Capacitor) CL Capacitor) GND GND Figure 1. Open Drain Output Type BD70Hxx-xC Series Figure 2. CMOS Output Type BD73Hxx-2C Series Pin Configuration SSOP5 TOP VIEW N.C. Pin Description PIN No. 1 2 3 4 5 N.C. VOUT VDD GND SSOP5 PIN NAME Function VOUT Output pin VDD Power supply voltage GND GND N.C. No connection pin N.C. No connection pin The no connection pin is electrically open and can be connected to either VDD or GND. Nano Energy™ is a trademark or a registered trademark of ROHM Co., Ltd. ○Product structure：Silicon integrated circuit ○This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0GIG2G300030-1-2 © 2017 ROHM Co., Ltd. All rights reserved. 1/17 TSZ22111 • 14 • 001 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Block Diagrams VDD VOUT Vref (Note) (Note) GND (Note) Parasitic Diode Figure 3. BD70Hxx-xC Series (Note) VDD Vref VOUT (Note) (Note) GND (Note) Parasitic Diode Figure 4. BD73Hxx-2C Series www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Ordering Information B Part Number D 7 x Output Type 0: Nch Open Drain 3: CMOS Lineup H x G x - x C T Output Logic Release Voltage Package Product Rank G: SSOP5 H: Active 38: 3.76 V C: for Automotive High 37: 3.66 V Process Code 36: 3.56 V 35: 3.46 V 31: 3.06 V 12: 1.20 V Output Type Open Drain Release Voltage Marking Part Number 3.76 V 9E 3.66 V 9F 3.56 V 3.46 V 3.06 V 1.20 V R Packing and Forming Specification TR: Embossed tape and reel CMOS Marking Part Number BD70H38G-2CTR 5P BD73H38G-2CTR BD70H37G-2CTR 5Q BD73H37G-2CTR 5M BD70H36G-2CTR 5R BD73H36G-2CTR 5N BD70H35G-2CTR 5S BD73H35G-2CTR 9N BD70H31G-CTR - - dh BD70H12G-2CTR - - Marking Diagram SSOP5 (TOP VIEW) Part Number Marking LOT Number www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Absolute Maximum Ratings (Ta = 25 °C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current Maximum Junction Temperature Storage Temperature Range Symbol VDD - GND Limit -0.3 to +7 GND - 0.3 to +7 GND - 0.3 to VDD + 0.3 70 +150 -55 to +150 VOUT IO Tjmax Tstg Unit V V mA °C °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 3) 2s2p (Note 4) θJA 376.5 185.4 °C/W ΨJT 40 30 °C/W SSOP5 Junction to Ambient Junction to Top Characterization Parameter (Note 2) (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Operating Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Symbol Topr 4/17 Min -40 Typ +25 Max +125 Unit °C TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Electrical Characteristics (Unless otherwise specified Ta = -40 °C to +125 °C, VDD = 0.8 V to 6.0 V) Parameter Release Voltage Symbol VR Condition BD70H38G-2C, BD73H38G-2C BD70H37G-2C, BD73H37G-2C BD70H36G-2C, BD73H36G-2C BD70H35G-2C, BD73H35G-2C BD70H31G-C BD70H12G-2C Circuit Current when ON Circuit Current when OFF Minimum Operating Voltage IDD1 IDD2 VOPL “High” Output Voltage (Pch) VOH “Low” Output Voltage (Nch) VOL Output Leak Curent (BD70Hxx-xC) ILEAK Delay Time (H → L) tPHL Delay Time (L → H) tPLH Ta = -30 to +70 °C Ta = -40 to +125 °C Ta = -30 to +70 °C Ta = -40 to +125 °C Ta = -30 to +70 °C Ta = -40 to +125 °C Ta = -30 to +70 °C Ta = -40 to +125 °C Ta = -30 to +70 °C Ta = -40 to +125 °C Ta = -30 to +70 °C Ta = -40 to +125 °C VDD = VR - 0.2 V VDD = VR + 0.5 V VOL ≤ 0.4 V, RL = 100 kΩ (Note 1) VDD = 4.0 V, ISOURCE = 4.0 mA VDD = 6.0 V, ISOURCE = 2.5 mA VDD = 0.8 V, ISINK = 0.17 mA, VR = 1.2V VDD = 1.2 V, ISINK = 1.0 mA, VR = 3.06V to 3.76V VDD = 2.4 V, ISINK = 2.0 mA, VR = 3.06V to 3.76V VDD = VDS = 6 V VOUT = VDD → 50 %, RL = 100 kΩ (Note 1) (Note 2) VOUT = GND → 50 %, RL = 100 kΩ (Note 1) (Note 2) Min 3.72 3.71 3.62 3.61 3.52 3.51 3.42 3.41 3.02 3.01 1.16 1.15 0.80 VDD - 0.4 VDD - 0.4 Limit Typ Unit 0.27 0.30 - Max 3.80 3.81 3.70 3.71 3.60 3.61 3.50 3.51 3.10 3.11 1.24 1.25 1.50 1.60 - - - 0.4 - - 0.4 - - 0.4 - - 1.0 µA 20 50 200 µs 15 40 100 µs 3.76 3.66 3.56 3.46 3.06 1.20 V µA µA V V V (Note 1) RL: Pull-up resistor connected between VOUT and power supply. (Note 2) tPLH: VDD = (VR - 0.5 V) → (VR + 0.5 V) tPHL: VDD = (VR + 0.5 V) → (VR - 0.5 V) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Typical Performance Curves 0.6 1.0 BD70H38G-2C BD70H38G-2C 0.9 0.5 Circuit Current: IDD [µA] Circuit Current: IDD [µA] 0.8 0.7 Ta = +125 °C 0.6 Ta = +70 °C 0.5 Ta = +25 °C 0.4 0.3 0.2 Ta = -30 °C 0.4 VDD = VR + 0.5 V 0.3 VDD = VR - 0.2 V 0.2 0.1 Ta = -40 °C 0.1 0.0 0.0 0 1 2 3 4 5 Power Supply Voltage: VDD [V] -40 -25 -10 5 6 20 35 50 65 80 95 110 125 Temperature: Ta [°C] Figure 6. Circuit Current vs Temperature Figure 5. Circuit Current vs Power Supply Voltage 6.0 3.85 BD70H38G-2C BD70H38G-2C Release Voltage: VR [V] Release Voltage: VR [V] 5.0 4.0 3.0 2.0 3.80 3.75 3.70 1.0 0.0 3.65 3.5 3.6 3.7 3.8 3.9 Power Supply Voltage: VDD [V] 4.0 -40 -25 -10 5 Figure 8. Release Voltage vs Temperature Figure 7. Release Voltage vs Power Supply Voltage www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20 35 50 65 80 95 110 125 Temperature: Ta [°C] 6/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Typical Performance Curves - continued 6.0 6.0 BD70H38G-2C BD70H38G-2C 5.0 Ta = +125 °C Output Voltage: VOUT [V] Output Voltage: VOUT [V] 5.0 Ta = +70 °C 4.0 Ta = +25 °C Ta = -30 °C 3.0 Ta = -40 °C 2.0 4.0 3.0 Ta = +125 °C 2.0 Ta = +70 °C 1.0 1.0 0.0 0.0 Ta = +25 °C Ta = -30 °C Ta = -40 °C 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Power Supply Voltage: VDD [V] 4.0 0.0 4.5 4.0 4.5 1.0 1.0 BD70H38G-2C Minimum Operating Voltage: VOPL [V] Minimum Operating Voltage: VOPL [V] 1.0 1.5 2.0 2.5 3.0 3.5 Power Supply Voltage: VDD [V] Figure 10. I/O Characteristics (VOUT Pull-up to VDD, RL = 100 kΩ) Figure 9. I/O Characteristics (VOUT Pull-up to 5 V, RL = 100 kΩ) 0.9 0.5 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.9 BD70H38G-2C 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 -40 -25 -10 5 -40 -25 -10 20 35 50 65 80 95 110 125 Temperature: Ta [°C] 20 35 50 65 80 95 110 125 Temperature: Ta [°C] Figure 12. Minimum Operating Voltage vs Temperature (VOUT Pull-up to VDD, RL = 100 kΩ) Figure 11. Minimum Operating Voltage vs Temperature (VOUT Pull-up to 5 V, RL = 100 kΩ) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 7/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series 70 70 60 60 "Low" Output Current: IOL [mA] "High" Output Current: IOH [mA] Typical Performance Curves - continued VDD = 4.8 V 50 40 VDD = 4.0 V 30 20 VDD = 2.0 V 50 VDD = 1.8 V 40 30 VDD = 1.2 V 20 10 10 VDD = 0.8 V BD73H35G-2C 0 1 2 3 4 5 Drain-Source Voltage: VDS [V] 0.0 6 0.5 1.0 1.5 2.0 Drain-Source Voltage: VDS [V] 2.5 Figure 14. “Low” Output Current vs Drain-Source Voltage Figure 13. “High” Output Current vs Drain-Source Voltage 140 35 BD73H35G-2C BD70H38G-2C 120 "Low" Output Current: IOL [mA] 30 "High" Output Current: IOH [mA] BD70H38G-2C 0 0 Ta = -30 °C Ta = -40 °C 25 20 15 Ta = +70 °C 10 Ta = +125 °C Ta = +25 °C Ta = -30 °C 100 Ta = +25 °C 80 60 40 Ta = +70 °C 20 5 Ta = -40 °C Ta = +125 °C 0 0 3.5 4 4.5 5 5.5 Power Supply Voltage: VDD [V] 0.0 6 Figure 15. “High” Output Current vs Power Supply Voltage (VDS = 0.5 V) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Power Supply Voltage: VDD [V] 4.0 Figure 16. “Low” Output Current vs Power Supply Voltage (VDS = 0.5 V) 8/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Typical Performance Curves - continued 70 100 BD70H38G-2C 90 Delay Time (H → L): tPHL [µs] Delay Time (L → H): tPLH [μs] 60 50 40 30 20 BD70H38G-2C 80 70 60 50 40 30 20 10 10 0 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature: Ta [°C] -40 -25 -10 20 35 50 65 80 95 110 125 Temperature: Ta [°C] Figure 18. Output Delay Time (H → L) vs Temperature Figure 17. Output Delay Time (L → H) vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 9/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Application Information Operation Description Consider the release voltage is same as the threshold voltage. When the voltage applied to VDD reaches the respective threshold voltage, VOUT level will change from "H" to "L" and from “L" to "H". Since the output pattern in BD70Hxx-xC is an open-drain system, a pull-up resistor has to be connected to VDD or other power supply. (The output (VOUT) “H” voltage in this case becomes VDD or other power supply voltage.) Timing Waveform The following shows the relationship between the input voltage VDD and the output voltage VOUT when the power supply voltage VDD is swept up and swept down. VDD RL VDD Vref VOUT CVDD CL GND Figure 19. BD70Hxx-xC Set-up VDD VR VOPL: < 0.8 V t 1 2 3 4 5 2 3 4 5 2 1 VOUT undefined tPLH tPHL tPLH tPHL t undefined Figure 20. Timing Diagram Operating Conditions Explanation 1. When the power supply turns on, the Output Voltage (VOUT) becomes unstable until VDD exceeds the Minimum Operating Voltage (VOPL). 2. VOUT changes to “L”. However, this change depends on the VOUT rise time when the power supply starts up, so thorough confirmation is required. 3. When VDD exceeds the Release Voltage (VR), delay time (tPLH) happens, then VOUT switches from “L” to “H”. 4. VOUT keeps “H”. 5. When VDD drops below Release Voltage (VR), delay time (tPHL) happens, then VOUT switches from “H” to “L”. Since this IC does not have hysteresis width, when VDD fluctuates near VR, VOUT switches repeatedly with “H” → “L” → “H” → “L”. As a counter measure, it is recommended to use capacitor (CVDD). Perform sufficient evaluation before deciding the capacitor value since the capacitance needs to be adjusted according to the amount of power supply voltage fluctuation. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/17 TSZ02201-0GIG2G300030-1-2 28.Jun.2021 Rev.004 BD70Hxx-xC Series BD73Hxx-2C Series Application Information – continued Bypass Capacitor for Noise Rejection For the stable operation of the IC, put capacitor between the VDD and GND pin and connect it closer to the pin as possible. When using extremely big capacitors, the transient response speed becomes slow so please thoroughly check. External Parameters The recommended value of pull-up resistance value is 50 kΩ to 1 MΩ. Since the changes are brought by many factors (circuit configuration, board layout, etc.) when using, ensure that confirmation of the real function was carried out. In addition, this IC has high impedance design. So depending on the condition of use, this may be affected by small leak current due to the uncleanness of PCB surface. For example, if a 10 MΩ leakage is assumed between the VOUT and GND pin, it is recommended to set the value of pull up resistor less than or equal to 1/10 of the impedance of assumed leakage route. Behavior at less than the Operating Voltage Limit When VDD falls less than the minimum operating voltage, output will be undefined. When output is connected to pull-up voltage, output will be equivalent to pull-up voltage. Precautions when Steep Power Supply Rise In case of a steep power supply rise, the output may toggle to “High” once like as shown in Figure 21. This is due to the undefined output when the supply is less than the minimum operating voltage of the IC. When this waveform affects the application, make the rise time slower by attaching capacitor to VDD (CVDD). As a reference value, the recommended VDD Rise Time is 200 μs or more. VDD VR VOPL: