Datasheet
Linear Charger for Low Voltage Battery
BD71631QWZ
General Description
Key Specifications
BD71631QWZ is a linear charger for low charge voltage
battery. The battery charge voltage, charge current,
termination current are set using external resisters.
◼ Input Voltage Range:
2.9 V to 5.5 V
◼ Adjustable Battery Voltage:
2.0 V to 4.7 V
◼ Adjustable Recharge Voltage Threshold:
Disenable or 1.8 V to 4.7 V
◼ Adjustable Charge Current:
Up to 300 mA (VIN ≥ 4 V, VIN-VOUT ≥ 1 V)
Up to 100 mA (VIN ≥ 4 V)
Up to 30 mA (2.9 V ≤ VIN ≤ 5.5 V)
◼ Adjustable Termination Current:
50 μA to 10 mA
◼ Low Quiescent Battery Current: IBATT = 0 μA (typ)
◼ Operating Temperature:
-30 °C to +105 °C
Features
◼ Adjustable Termination Current: 50 μA to 10 mA
◼ Low Quiescent Battery Current: IBATT = 0 μA (typ)
◼ NTC Thermistor Input for Temperature Qualified
Charging
◼ Open-Drain Charge indicator LED Output
◼ Fixed 10 hour Safety Timer
◼ Thermal Shutdown
◼ Under Voltage Lockout Protection
◼ Battery Over Voltage Protection
Package
UMMP10LZ1824
W (Typ) x D (Typ) x H (Max)
1.8 mm x 2.4 mm x 0.4 mm
Applications
◼ Low Voltage Battery Products
◼ Li-ion 1Cell Battery Products
Typical Application Circuit
□Low Voltage Battery Application
VIN
Battery out
VIN
VOUT
VFB
BD71631
LEDCNT
VFBG
VFBRE
ICHG
VIN
ITERM
NTC
T
GND
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 4
Recommended Operating Conditions ............................................................................................................................................. 4
Electrical Characteristics................................................................................................................................................................. 5
Typical Performance Curves ........................................................................................................................................................... 6
Figure 1. VIN Input Current vs Input Voltage ............................................................................................................................... 6
Figure 2. VOUT Input Current vs VOUT Voltage ......................................................................................................................... 6
Figure 3. Charge Current vs VOUT Voltage ................................................................................................................................ 6
Figure 4. Charge Current vs VOUT Voltage ................................................................................................................................ 6
Figure 5. Charging Voltage vs Input Voltage ............................................................................................................................... 7
Figure 6. Charging Voltage vs Input Voltage ............................................................................................................................... 7
Figure 7. VFBG ON Resistance vs Input Voltage ........................................................................................................................ 7
Figure 8. VFB Leak Current vs VFB Voltage ............................................................................................................................... 8
Figure 9. VFBRE Leak Current vs VFBRE Voltage ..................................................................................................................... 8
Figure 10. VFBG Leak Current vs VFBG Voltage ....................................................................................................................... 8
Battery Output Control .................................................................................................................................................................... 9
Charge Current vs Battery Temperature ......................................................................................................................................... 9
Peripheral Components Setting .................................................................................................................................................... 10
Charging State Control ................................................................................................................................................................. 11
Charging Timing Chart .................................................................................................................................................................. 12
I/O Equivalence Circuit ................................................................................................................................................................. 13
Operational Notes ......................................................................................................................................................................... 14
1.
Reverse Connection of Power Supply ............................................................................................................................ 14
2.
Power Supply Lines ........................................................................................................................................................ 14
3.
Ground Voltage............................................................................................................................................................... 14
4.
Ground Wiring Pattern .................................................................................................................................................... 14
5.
Recommended Operating Conditions............................................................................................................................. 14
6.
Inrush Current................................................................................................................................................................. 14
7.
Testing on Application Boards ........................................................................................................................................ 14
8.
Inter-pin Short and Mounting Errors ............................................................................................................................... 14
9.
Unused Input Pins .......................................................................................................................................................... 14
10.
Regarding the Input Pin of the IC ................................................................................................................................... 15
11.
Ceramic Capacitor .......................................................................................................................................................... 15
12.
Thermal Shutdown Circuit (TSD) .................................................................................................................................... 15
Ordering Information ..................................................................................................................................................................... 16
Marking Diagram .......................................................................................................................................................................... 16
Physical Dimension and Packing Information ............................................................................................................................... 17
Revision History ............................................................................................................................................................................ 18
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Pin Configuration
GND
VFBRE
VFBG
VFB
VOUT
5
4
3
2
1
EXP-PAD
8
9
10
ICHG
LEDCNT
VIN
NTC
7
ITERM
6
(TOP VIEW)
Pin Descriptions
Pin No.
Pin Name
1
VOUT
2
VFB
3
VFBG
4
VFBRE
5
GND
6
NTC
7
ITERM
8
ICHG
9
LEDCNT
10
VIN
-
EXP-PAD
Function
CCCV output
Feedback for full charge voltage
Ground by internal switch in charging
Unused on the VFBG pin open
Feedback for recharge voltage.
This pin should not be left floating
Tie the VFBRE pin to GND to disable recharge function
Ground
Thermistor sense input.
This pin should not be left floating
Tie the NTC pin to GND to disable thermistor sense function
Termination current setting pin
Charge current setting pin
This pin should not be connected a capacitor
Charging indicator output
Unused on the LEDCNT pin open
Power supply input
The EXP-PAD is connected to the GND Pin.
Block Diagram
VIN
IVOUT
ICHG
ITERM
VOUT
1
10
IVOUT/1000
8
7
ICHG REF
ITERM REF
VFB
CC/CV
Reguration
2
3
VFBG
UVLO,OVP
VFBRE
Control
LEDCNT
9
+
-
TSD
4
Recharge
Ref
NTC
6
OSC
5
GND
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BD71631QWZ
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Voltage Range
(with respect to GND)
Maximum Junction Temperature
Storage Temperature Range
VIN, VOUT,
VICHG, VITERM,
VLEDCNT, VFB,
VFBG, VFBRE
VNTC
Tjmax
Tstg
Rating
Unit
-0.3 to +7.0
V
+150
-55 to +150
°C
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
Unit
2s2p(Note 4)
UMMP10LZ1824
Junction to Ambient
θ JA
172.24
54.00
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
14.87
6.97
°C/W
(Note 1) Based on JESD51-2A (Still-Air), using a BD71631QWZ Chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VIN Voltage
VIN
2.9
5.0
5.5
V
Minimum I/O Voltage Difference
VDIF
0.3
-
-
V
Battery Voltage
VBAT
0
-
4.7
V
LEDCNT Current
ILED
-
-
20
mA
-
VFBG Current
IFB
-
CVIN
1.0
VOUT Capacitor without Battery
VOUTNB
10
VOUT Capacitor with Battery
VOUTB
0.1
-
-
μF
VFB Total Resistance
VFBR
100
-
1000
kΩ
VFBRER
100
5000
kΩ
Topr
-30
+105
°C
VIN Capacitor (Note 6)
VFBRE Total Resistance
Operating Temperature
-
-
5
mA
4.7
μF
-
μF
(Note 6) The Max value is for using USB output as the power supply.
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Electrical Characteristics (Unless otherwise specified VIN = 5 V, Ta = 25 °C, VOUT =2.5 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
VIN UVLO Detect Voltage
VINUV
2.3
2.4
2.5
V
VINUVHYS
50
100
150
mV
-
VFB Threshold Voltage
VFBTH
0.588
0.600
0.612
V
-
Battery Charging Voltage Range
VCHG_R
2.0
-
4.7
V
-
VIN UVLO Detect Hysteresis
VIN fall detect
VFBRE Threshold Voltage
VFBRCHTH
0.588
0.600
0.612
V
-
Pre-charge Voltage Threshold
VPRETH
0.6
0.7
0.8
V
Battery rise detect
Pre-charge Voltage Hysteresis
VPREHYS
50
100
150
mV
-
VRCHG_R
1.8
-
4.7
V
-
VRECHG_DIS
VCHG
×1.01
0.20
VCHG
×1.05
0.35
VCHG
×1.10
V
VFBRE input
V
VFB monitor
Battery Recharging Voltage Range
Recharge Disenable Threshold
Battery OVP Threshold
VBOVP
Charge Current Setting Range 1
ICHG_R1
1
-
300
mA
VIN ≥ 4 V, VIN-VOUT ≥ 1 V
Charge Current Setting Range 2
ICHG_R2
1
-
100
mA
VIN ≥ 4 V
Charge Current Setting Range 3
ICHG_R3
1
-
30
mA
2.9 V ≤ VIN ≤ 5.5 V
Charge Current Accuracy 1
-
-10
-
+10
%
ICHG ≥ 100 mA
Charge Current Accuracy 2
-
-25
-
+25
%
10 mA ≤ ICHG < 100 mA
Charge Current Accuracy 3
-
-50
-
+50
%
ICHG < 10 mA
Pre-charge Current Accuracy
-
-50
-
+50
%
-
ITERM_R
0.05
-
10.00
mA
-
Termination Current Accuracy1
-
-10
-
+10
%
Termination Current Accuracy2
-
-25
-
+25
%
Termination Current Accuracy3
-
-50
-
+50
%
300 μA ≤ ITERM ≤ 800 μA
800 μA < ITERM ≤ 3 mA
ITERM < 300 μA
3 mA < ITERM ≤ 10 mA
Termination Current Accuracy4
-
-25
-
+25
μA
ITERM < 100 μA
VIN×
0.328
VIN×
0.293
VIN×
0.702
VIN×
0.655
VIN×
0.344
VIN×
0.307
VIN×
0.721
VIN×
0.675
VIN×
0.035
VIN×
0.360
VIN×
0.322
VIN×
0.739
VIN×
0.694
VIN×
0.050
V
-
V
-
V
-
V
-
V
-
Termination Current Setting Range
NTC Threshold Voltage HOT1
VNTCHOT1
NTC Threshold Voltage HOT2
VNTCHOT2
NTC Threshold Voltage COLD1
VNTCCOLD1
NTC Threshold Voltage COLD2
VNTCCOLD2
NTC Disenable Threshold Voltage
VNTCDIS
-
10 hour Safety Timer
tCHGTM
9.5
10.0
10.5
hour
Charging Termination Delay Time
tTERM
13
15
17
s
From ITERM detect
VLED_L
-
-
0.4
V
ILEDCNT = 5 mA
RVFBG
-
-
100
Ω
-
IBATT
-
0
1
μA
VIN = 0 V
LEDCNT Output Low Voltage
VFBG ON Resistance
Battery Standby Current
LEDCNT Leak Current
ILEDCNT_LEAK
-
0
1
μA
LEDCNT = 5 V
VFBG Leak Current
IVFBG
-
0
1
μA
VFBG = 5 V, VIN = 0 V
VFB Leak Current
IVFB
-
0
1
μA
VFB = 5 V
IVFBRE
-
0
1
μA
VFBRE = 5 V
INTC
-
0
1
μA
NTC = 5 V
VFBRE Leak Current
NTC Leak Current
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700
1.0
600
0.8
VOUT Input Current: IVOUT [μA]
VIN Input Current: IVIN [μA]
Typical Performance Curves
500
400
-30 °C
+25 °C
300
+105 °C
200
VIN = 5 V
-30 °C
0.6
+25 °C
+105 °C
0.4
0.2
0.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.5
Input Voltage: VIN [V]
3.0
3.5
4.0
4.5
5.0
VOUT Voltage: VOUT [V]
Figure 1. VIN Input Current vs Input Voltage
(CHG = Disenable )
Figure 2. VOUT Input Current vs VOUT Voltage
1.2
100
Charge Current: ICHG [mA]
Charge Current: ICHG [mA]
1.0
0.8
0.6
-30 °C
+25 °C
+105 °C
0.4
75
50
25
0.2
VIN = 5 V
ICHG = 1 mA Setting
VCHG = 4.5 V Setting
-30 °C
+25 °C
+105 °C
VIN = 5 V
ICHG = 100 mA Setting
VCHG = 4.5 V Setting
0
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOUT Voltage: VOUT [V]
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOUT Voltage: VOUT [V]
Figure 3. Charge Current vs VOUT Voltage
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Figure 4. Charge Current vs VOUT Voltage
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BD71631QWZ
2.5
5.2
2.4
5.1
2.3
5.0
Charging Voltage: VCHG [V]
Charging Voltage: VCHG [V]
Typical Performance Curves - continued
VCHG = 2.0 V Setting
2.2
2.1
2.0
1.9
1.8
-30 °C
1.7
+25 °C
1.6
+105 °C
VCHG = 4.7 V Setting
4.9
4.8
4.7
4.6
4.5
-30 °C
4.4
+25 °C
4.3
+105 °C
4.2
1.5
2.5
3.5
4.5
5.5
Input Voltage: VIN [V]
4.8
6.5
Figure 5. Charging Voltage vs Input Voltage
5.0
5.2
5.4
Input Voltage: VIN [V]
5.6
Figure 6. Charging Voltage vs Input Voltage
VFBG ON Resistance: RVFBG [Ω]
25
20
-30 °C
15
+25 °C
+105 °C
10
5
0
2.5
3.5
4.5
Input Voltage: VIN [V]
5.5
Figure 7. VFBG ON Resistance vs Input Voltage
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1.0
1.0
0.9
0.9
0.8
0.8
VFBRE Leak Current: IVFBRE [μA]
VFB Leak Current: IVFB [μA]
Typical Performance Curves - continued
0.7
0.6
0.5
0.4
0.3
-30 °C
0.2
+25 °C
0.1
+105 °C
0.0
0.7
0.6
0.5
0.4
0.3
-30 °C
0.2
+25 °C
0.1
+105 °C
0.0
0
1
2
3
4
5
VFB Voltage: VFB [V]
6
7
0
Figure 8. VFB Leak Current vs VFB Voltage
1
2
3
4
5
VFBRE Voltage: VFBRE [V]
6
7
Figure 9. VFBRE Leak Current vs VFBRE Voltage
1.0
VFBG Leak Current: IVFBG [μA]
0.9
0.8
0.7
0.6
0.5
0.4
-30 ˚C
0.3
+25 ˚C
0.2
+105 ˚C
0.1
0.0
0
1
2
3
4
5
VFBG Voltage: VFBG [V]
6
7
Figure 10. VFBG Leak Current vs VFBG Voltage
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BD71631QWZ
Battery Output Control
LEDCNT
LED_ON
LED_OFF
LED_OFF
VBAT
IBAT
VCHG
Battery Voltage
ICHG
Charge Current
VPRE
IPRE
= ICHG / 2
ITERM
Time
(CC)
Charge
Stop
(CV)
Charge
15 s
Charge Stop
10 hour Safety Timer Counting
Charge Current vs Battery Temperature
Charge current
[mA]
ICHG
Hys
2
Hys
7
43
48
NTC Temp [
]
VIN = 5 V
NTC pin voltage
10 kΩ
NTC
T
Battery
2 °C: 3.605 V
7 °C: 3.375 V
43 °C: 1.720 V
48 °C: 1.535 V
NCP03XH103F05RL
(25/50 = 3380 k 10 kΩ)
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BD71631QWZ
Peripheral Components Setting
1.
Charging voltage (VCHG), Recharge voltage (VRECHG) setting
VCHG
VOUT
CSPU
R1
R3
R2
R4
Battery
VFB
VFBG
VFBRE
The battery charge voltage is determined as follows :
𝑉𝐶𝐻𝐺 = (𝑅1 + 𝑅2 )⁄𝑅2 × 0.6 [𝑉]
The battery re-charge voltage is determined as follows :
𝑉𝑅𝐸𝐶𝐻𝐺 = (𝑅3 + 𝑅4 )⁄𝑅4 × 0.6 [𝑉]
About total feedback resistance, follow the Recommended Operating Conditions.
Resister reference value
VCHG = 2.2 V
VRECHG = Disenable
Resistor
VCHG = 4.2 V
VRECHG = 3.9 V
Resistor value [Ω]
R1
200 k
600 k
R2
75 k
100 k
R3
-*
1.1 M
R4
-*
200 k
*VFBRE pin connect to GND
Connect CSPU for feedback stability when Battery is no connected or the battery capacity is too small.
The capacitance of CSPU is determined as follows :
𝐶𝑆𝑃𝑈 = 1⁄(2𝜋 × 300 × 𝑅1 ) [𝐹]
2.
Charge current, Termination current setting
ICHG
R5
ITERM
R6
ICHG = (500000 / R5 [Ω]) [mA]
ITERM = (50000 / R6 [Ω]) [mA]
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BD71631QWZ
Charging State Control
ALL State
SUSPEND
⑨
①
⑧
CHARGE
TEMP_ERROR_1
⑦
⑥
⑤
⑤
BATTERY_ERROR
DONE
③
②
⑤
⑤
④
⑧
TOP_OFF
No.
①
State transition
SUSPEND -> CHARGE
②
CHARGE -> TOP_OFF
③
TOP_OFF -> CHARGE
④
⑤
TOP_OFF -> DONE
CHARGE or TOP_OFF or
TEMP_ERROR_1 or
TEMP_ERROR_2
-> BATTERY ERROR
DONE -> CHARGE
⑥
⑦
⑧
⑨
Condition
UVLO, TSD not detect
and VIN > BATT+0.3 V
and BATT OVP not detect
and Temp Error not detect
Continue to satisfy the condition for 25 ms
Charge current < ITERM
Continue to satisfy the condition for 25 ms
Charge current > ITERM
Continue to satisfy the condition for 25 ms
Continue to satisfy the condition for 15 s
BATT OVP detect
or 10 hours safety timer expired
CHARGE -> TEMP_ERROR_1 or
TOP_OFF -> TEMP_ERROR_2
TEMP_ERROR_1 -> CHARGE or
TEMP_ERROR_2 -> TOP_OFF
ALL State -> SUSPEND
State
SUSPEND
TEMP_ERROR_2
⑦
BATT < Re-charge voltage
Continue to satisfy the condition for 25 ms
Temp Error detect
Continue to satisfy the condition for 25 ms
Temp Error not detect
Continue to satisfy the condition for 25 ms
UVLO, TSD detect
or VIN < BATT+0.3 V
10 hours safety timer
Battery charge
LEDCNT
Stop
Stop and reset
OFF
CHARGE
Charge
Count
ON
TOP_OFF
Charge
Count
ON
DONE
Stop
Stop and reset
OFF
BATTERY_ERROR
Stop
Stop and reset
OFF
TEMP_ERROR_1
Stop
Count
OFF
TEMP_ERROR_2
Stop
Count
OFF
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BD71631QWZ
Charging Timing Chart
Normal operation
VIN
0V
UVLO Release
Meet the transition
condition
UVLO
Detect
BATT < Re-charge
Threshold
Detect
BATT < Pre-charge
Threshold
BATT
Detect
Charge current <
ITERM Threshold
Detect
Charge current <
ITERM Threshold
ICHG
15 s
25 ms
CHG_STATE
RESET
SUSPEND
15 s
25 ms
25 ms
CHARGE
TOP_OFF
DONE
25 ms
CHARGE
TOP_OFF
DONE
Error operation
UVLO
Detect
Temperature Error
UVLO Detect
Release
Temperature Error
UVLO Release
Temperature flag
Detect
Battery Error
Release
Battery Error
Battery Error flag
BATT
ICHG
25 ms
CHARGE
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TSZ22111 • 15 • 001
25 ms
TEMP_ERROR_1
CHARGE
12/18
BATTERY_ERROR
RESET
SUSPEND
TSZ02201-0V1V0A700020-1-2
24.Mar.2021 Rev.001
BD71631QWZ
I/O Equivalence Circuit
VIN, VOUT
ICHG, ITERM
VIN
100 Ω
VOUT
○
○
ICHG
ITERM
30 kΩ
30 kΩ
VFB, VFBRE, NTC
LEDCNT, VFBG
LEDCNT
VFBG
○
○
VFB
VFBRE
NTC
30 kΩ
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TSZ22111 • 15 • 001
13/18
TSZ02201-0V1V0A700020-1-2
24.Mar.2021 Rev.001
BD71631QWZ
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting
the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power
supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground
voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The
characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the
IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage
from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging
the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could
be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely
low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this
way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the
IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.
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TSZ22111 • 15 • 001
14/18
TSZ02201-0V1V0A700020-1-2
24.Mar.2021 Rev.001
BD71631QWZ
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as
applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 11. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and
the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within
the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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TSZ22111 • 15 • 001
15/18
TSZ02201-0V1V0A700020-1-2
24.Mar.2021 Rev.001
BD71631QWZ
Ordering Information
B
D
7
1
6
3
1
Q
W
Z
-
Package
QWZ: UMMP10LZ1824
TR
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
UMMP10LZ1824 (TOP VIEW)
Part Number Marking
D 7 1
6 3 1
LOT Number
Pin 1 Mark
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© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/18
TSZ02201-0V1V0A700020-1-2
24.Mar.2021 Rev.001
BD71631QWZ
Physical Dimension and Packing Information
Package Name
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© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
UMMP10LZ1824
17/18
TSZ02201-0V1V0A700020-1-2
24.Mar.2021 Rev.001
BD71631QWZ
Revision History
Date
Revision
24.Mar.2021
001
Changes
New Release
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TSZ22111 • 15 • 001
18/18
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24.Mar.2021 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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