BD71L4LG-1GTR

Datasheet Voltage Detector IC Series CMOS Over Voltage Detector IC BD71L4L-1 series General Descriptions Key Specifications ROHM’s BD71L4L-1 series is highly accurate and low current Over Voltage Detector IC. It is an N-Channel Open-Drain output type with detection voltage of 4.05V and hysteresis voltage of 30mV. It is most suitable for monitoring the charge of a lithium-ion battery.     Package Features       Detection Voltage: High Accuracy Detection Voltage: Ultra-Low Current Consumption: Operating Temperature Range: High Accuracy Detection Voltage Low Current Consumption N-Channel Open Drain Output Wide Operating Temperature Range Very Small and Low Height Package Package SSOP5 is similar to SOT-23-5 (JEDEC) 4.05V (Typ.) ±0.8% 0.8μA (Typ.) -40°C to +85°C  SSOP5: W(typ) x D(typ) x H(max) 2.90mm x 2.80mm x 1.25mm  HVSOF5: 1.60mm x 1.60mm x 0.60mm Applications  All electronics equipment with lithium-ion battery  All electronics equipment that needs over-voltage protection Typical Application Circuit VDD1 VDD2 RL RST BD71L4L-1 CIN Microcontroller CL (Capacitor for noise filtering) GND ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Connection Diagram SSOP5 HVSOF5 N.C. N.C. GND VDD 4 5 L1 AR Lot. No Marking 1 2 3 OUT SUB VDD Lot. No Marking OUT VDD GND TOP VIEW TOP VIEW Pin Descriptions SSOP5 HVSOF5 Symbol PIN No. Symbol Function PIN No. 1 OUT Output pin 1 OUT Output pin 2 VDD Power Supply Voltage 2 SUB * Substrate 3 GND GND N.C. No connection pin 3 4 VDD * VDD * Power Supply Voltage 4 5 N.C. No connection pin 5 GND GND N.C. pin is electrically open and can be connected to either VDD or GND. Function Power Supply Voltage * The SUB pin (pin no. 2) and VDD pins (pin no. 3 and 4) must be wired together. Ordering Information B Part Number D x x Function 71 : Over Voltage Detector x Output logic L : Active Low www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 x x x Detection Voltage Value Package 4L : 4.05V G : SSOP5 HFV : HVSOF5 2/14 - 1 T R Packaging and forming specification Embossed tape and reel TR : The pin number 1 is the upper right : SSOP5 : HVSOF5 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Absolute Maximum Ratings Parameter Power Supply Voltage Output Voltage N-Channel Open Drain Output Output Current *1*3 SSOP5 Power *2*3 Dissipation HVSOF5 Symbol VDD-GND VOUT IO Operating Temperature Ambient Storage Temperature Pd Limits -0.3 to +7 GND-0.3 to +7 70 0.54 0.53 Unit V V mA -40 to +85 -55 to +125 °C °C Topr Tstg W *1 Reduced by 0.0054W/°C when used over 25°C. *2 Reduced by 0.0053W/°C when used over 25°C. *3 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Electrical Characteristics (Unless Otherwise Specified, Ta=0°C to 60°C, VDD=1.2V to 6.0V) Parameter Symbol Detection Voltage VDET Hysteresis Voltage ΔVDET Output Delay Time “L→H” tPLH Output Delay Time “H→L” tPHL Supply Current 1 Supply Current 2 Operating Voltage Range ‘Low’ Output Voltage(Nch) Output Leak Current IDD1 IDD2 VOPL VOL ILEAK Conditions Ta=25°C RL=470kΩ VDD=L→H Ta =0°C to 60°C VDD=L→H→L, RL=470kΩ *4 RL=100kΩ, CL=100pF VOUT＝GND→50% *5 RL=100kΩ, CL=100pF VOUT＝VDD →50% VDD= VDET + 0.2V VDD= VDET - 0.2V VOUT≧0.8V, RL=470kΩ VDD= VDET +0.2 V, ISINK=4.0mA VDD=VDS=3.8V Min 4.034 4.018 - Limit Typ 4.05 30 Max 4.066 4.083 40 - - 100 µs - - 100 µs 1.20 - 0.60 0.70 - 2.40 2.80 0.3 1.0 µA µA V V uA Unit V mV VDET ：Standard Detection Voltage（4.05V） RL ：Pull-up Resistor between VOUT and VDD. CL ：Capacitor to be connected between VOUT and GND. Design Guarantee. (Outgoing inspection is not done on all products.) *4 tPLH：VDD＝（VDET typ. + 0.5V） to （VDET typ.- 0.5V） *5 tPHL：VDD＝（VDET typ - 0.5V） to （VDET typ.+ 0.5V） Block Diagram VDD VOUT Vref GND Figure 1. BD71L4L-1 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Typical Performance Curves 1.0 5.0 0.9 4.0 Circuit Current : IDD[µA] Detection Voltage : VDET[V] 【BD71L4LG-1】 【BD71L4L-1】 3.0 Ta=60°C 2.0 Ta=25°C 1.0 Ta=0°C 【BD71L4L-1】 0.8 0.7 Ta=60°C 0.6 0.5 0.4 Ta=0°C 0.3 Ta=25°C 0.2 0.1 0.0 0.0 1 110 100 90 80 70 60 50 40 30 20 10 0 2 3 4 5 6 7 0 1 2 3 4 5 Supply Voltage : VDD[V] Supply Voltage : VDD[V] Figure 2. Detection Voltage Figure 3. Circuit Current 6 7 1.0 Operating Voltage Range :VOPL[V] Low Output Voltage : VOL[mV] 0 【BD71L4L-1】 Ta=60°C Ta=25°C Ta=0°C 0 5 【BD71L4L-1】 0.8 Ta=0°C Ta=25°C 0.6 Ta=60°C 0.4 0.2 0.0 10 15 0.2 20 0.3 0.4 0.5 0.6 0.7 Supply Voltage:VDD[V] Isink[mA] Figure 5. Operating Voltage Range Figure 4. Low Output Voltage VDD=4.0V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 0.8 BD71L4L-1 series Typical Performance Curves – continued 1.0 Operating Voltage Range : VOPL[V] Detection Voltage : VDET[V] 4.20 【BD71L4L-1】 4.15 High to Low (VDET) 4.10 4.05 4.00 Low to High (VDET-ΔVDET) 3.95 3.90 3.85 3.80 0.9 【BD71L4L-1】 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 10 20 30 40 50 60 0 10 Temperature : Ta[°C] 20 30 40 50 60 Temperature : Ta[°C] Figure 7. Operating Voltage Range vs. Temperature Figure 6. Detection Voltage vs. Temperature 3.0 1.0 0.9 Circuit Current when On : IDD[µA] Circuit Current when Off : IDD[µA] 1.0 【BD71L4L-1】 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.9 【BD71L4L-1】 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 10 20 30 40 50 60 0 10 20 30 40 50 60 Temperature : Ta[°C] Figure 8. Supply Current when Off vs. Temperature Temperature : Ta[°C] Figure 9. Supply Current when On vs. Temperature VDD=VDET-0.2V VDD=VDET+0.2V VDD=3.85V VDD=4.25V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Typical Performance Curves – continued 20 19 36 【BD71L4L-1】 Output Delay Time : tPLH[µs] Output Delay Time : tPHL[µs] 40 32 28 24 20 16 【BD71L4L-1】 18 17 16 15 14 13 12 11 10 12 0 10 20 30 40 50 0 60 10 Temperature : Ta[°C] 30 40 50 Figure 10. Output Delay Time (tPHL) Figure 11. Output Delay Time(tPLH) VDD=VDET-0.5V to VDET+0.5V VDD=VDET+0.5V to VDET-0.5V VDD=3.55V to 4.55V VDD=4.55V to 3.55V 100 60 100 90 90 【BD71L4L-1】 80 Pulse WIidth High : Wd[µs] Pulse Width High : Wd[µs] 20 Temperature : Ta[°C] 70 60 50 40 30 Output will not change when pulse width is lower or equal to these results. Pulse width above the results will cause the output to change. 20 10 【BD71L4L-1】 80 70 60 50 40 Output will not change when pulse width is lower or equal to these results. Pulse width above the results will cause the output to change. 30 20 10 0 0 0 10 20 30 40 50 60 0.8 1.2 1.6 2 2.4 2.8 Temperature : Ta[°C] Figure 12. Pulse Width vs. Temperature VDD-LOW : VDD[V] Figure 13. Pulse Width vs. Voltage Level VDD-LOW=1.2V, VDD-HIGH=4.2V, CIN=0.1uF VDD-HIGH=4.2V, CIN=0.1uF, Ta=25°C www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Application Information 1. Explanation of Operation The detection and release voltages are used as threshold voltages. When the voltage applied to VDD pin reaches the appropriate threshold voltage, OUT pin voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical Characteristics for information on hysteresis. Because the BD71L4L-1 uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD R1 RL Vref VOUT R2 Q1 R3 GND Figure 14. Internal Block Diagram 2. Timing Waveform Example: the following shows the relationship between the input voltage (VDD) and the output voltage (VOUT) when the input power supply voltage (VDD) swept up and down (the circuit is shown in Figure 14). 1 VDD VDET VDET -ΔVDET 0V ⑤ VOPL VOUT VOH tPHL VOL tPLH ① tPHL tPLH ② ③ ④ Figure 15. Timing Waveform www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPLH. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPLH. 2 When VDD is greater than VOPL but less than the reset detection voltage (VDET), the output voltage will switch to High. 3 If VDD exceeds the reset detection voltage (VDET) when the power supply is powered up, VOUT switches from H to L (with a delay of tPHL). 4 If VDD drops below the release voltage (VDET - ∆ VDET) when the power supply is powered down, VOUT switches to H (with a delay of tPLH). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). 7/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series 3. Circuit Applications (1) Example of common power supply detection reset circuit. VDD1 VDD2 RL BD71L4L-1 CIN Microcontroller RST CASE1: Power supply of the microcontroller (VDD2) differs from the power supply of the reset detection IC (VDD1). Attach a load resistance RL between output of reset detection IC and VDD2 as shown in Figure 16. CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection IC (VDD1). Connect a pull up resistor between output and VDD1. CL ( capacitor is for noise filtering ） GND This IC’s hysteresis between detection voltage and release voltage is 30mV(typ), so when the VOUT logic changes, chattering occurs. CIN value needs more than 0.1uF to eliminate this. Figure 16. Open Drain Output Type When a capacitance CL for noise filtering is connected to the OUT pin (the reset signal input terminal of the microcontroller), please take into account the rise and fall waveform of the output voltage (VOUT). (2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL Microcontroller BD71L4L-1 BD71L4L-1 RST GND Figure 17. OR Circuit Connection Application To reset the microcontroller when many independent power supplies are used in the system, OR connect the device to microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Figure 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Circuit Applications (continued) (3) Example of power supply with resistor dividers In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an inrush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. Inrush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 R1 (Note1) CIN CIN≥0.1µF VDD BD71L4L-1 VOUT CL GND Figure 18. Resistor Divider Connection Application Input voltage will decrease by a drop of [Inrush current (I1)] × [input resistor (R2)] because of the inrush current at the time when the output switches from “High” to “Low”. When the input voltage decreases and falls below the release voltage [VDET - ΔVDET], the output voltage switches from “Low” to “High”. At this time, the inrush current stops flowing through output “High”, and the voltage drop is reduced. As a result, the output switches from “High” to “Low”, which again causes the inrush current to flow and the voltage to drop. This operation repeats and will result to oscillation. In case resistor divider will not use and only R2 will use, same response will happen. Note1: The circuit connection mentioned above does not guarantee successful operation. Please perform thorough evaluation using the actual application and set countermeasures. IDD Inrush Current 0 VDD VDET Figure 19. Current Consumption vs. Power Supply Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Operational Notes – continued 12. Regarding Input Pins of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 15. Bypass Capacitor for Noise Rejection To help reject noise, put more than 0.1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 16. The VDD line impedance might cause oscillation because of the detection current. 17. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 18. External Parameters The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Operating beyond the recommended values does not guarantee correct operation. Please verify and confirm using practical applications. 19. When VDD falls below the minimum operating voltage, output becomes unstable. When output is connected to pull-up voltage, output will be equivalent to pull-up voltage. 20. Power-on Reset Operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 21. This IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT pin and the GND pin, consider to set the value of pull up resistor lower than 1/10 of the impedance of assumed leakage route. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP5 12/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HVSOF5 13/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 BD71L4L-1 series Revision History Date Revision 20.May.2013 001 24.July.2013 002 24.Oct.2013 003 31.Jan.2014 004 08.Jun.2016 005 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release Modify the general description and applications on page 1 Changed VDET spec on pages 1 ~ 3 Changed IDD1 and IDD2 spec on page 3 Changed Ileak condition on page 3 Add 1 packages as following:HVSOF5 Modify the package on page 1 and the connection diagram on page 2 Add note of HVSOF5 on page 2 Add package dimension on page 1 Add note for SSOP5 NC pin on page 2 Updated application information on page 7 ~ 9 Updated operational notes on page 10 ~ 11 14/14 TSZ02201-0R7R0G300030-1-2 08.Jun.2016.Rev.005 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). 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