BD7281YG-CTR

Nano CapTM Datasheet Operational Amplifier Automotive Low Noise & Rail-to-Rail Input/Output High Speed CMOS Operational Amplifiers BD728xY-C Series General Description Key Specifications This product are Rail-to-Rail Input/Output CMOS operational amplifiers. These feature high slew rate, low noise and low input bias current. It is suitable for automotive requirements such as engine control unit, electric power steering, anti-lock braking system, sensor amplifier, and so on. Furthermore, this circuit type does not oscillate even with a capacitance of 1 nF. Set design is possible without worrying about oscillation due to output capacitance. ◼ Input Offset Voltage: 2 mV (Max) ◼ Slew Rate: 10 V/μs (Typ) ◼ Input-referred Noise Voltage Density f = 1 kHz: 12 nV/√Hz (Typ) ◼ Common-mode Input Voltage Range: VSS to VDD ◼ Input Bias Current: 0.5 pA (Typ) ◼ Operating Supply Voltage Range Single Supply: 2.5 V to 5.5 V Dual Supply: ±1.25 V to ±2.75 V ◼ Operating Temperature Range: -40 °C to +125 °C Features ◼ ◼ ◼ ◼ ◼ Nano Cap™ Integrated OPAMP AEC-Q100 Qualified(Note 1) Low Input-referred Noise Voltage Density Rail-to-Rail Input/Output Shutdown Function (BD7280YG-C) Package W (Typ) x D (Typ) x H (Max) 2.9 mm x 2.8 mm x 1.25 mm 2.9 mm x 2.8 mm x 1.25 mm SSOP5 SSOP6 (Note 1) Grade 1 Applications ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Engine Control Unit Electric Power Steering (EPS) Anti-lock Braking System (ABS) Automotive Electronics Sensor Amplifiers Battery-powered Equipment Current Monitoring Amplifier ADC Front Ends, Buffer Amplifier Photodiode Amplifier Amplifiers SSOP5 SSOP6 Typical Application Circuit RF = 10 kΩ VDD = +2.5 V RIN = 100 Ω VIN VOUT 𝑉𝑂𝑈𝑇 = − 𝑅𝐹 𝑉 𝑅𝐼𝑁 𝐼𝑁 VSS = -2.5 V Nano Cap™ is a trademark or a registered trademark of ROHM Co., Ltd. 〇Product structure : Silicon integrated circuit www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Pin Configuration BD7280YG-C (SSOP6) (TOP VIEW) OUT 1 VSS 2 +IN 3 6 5 + 4 VDD SDNB Pin No. Pin Name 1 OUT 2 VSS Function Output (Shutdown mode : Hi-Z) Negative power supply / Ground 3 +IN Non-inverting input 4 -IN 5 SDNB 6 VDD Inverting input Shutdown setting (VSDNB = H : Active mode / VSDNB = L or OPEN : Shutdown mode) Positive power supply Pin No. Pin Name 1 OUT Output 2 VSS Negative power supply / Ground 3 +IN Non-inverting input 4 -IN Inverting input 5 VDD -IN BD7281YG-C (SSOP5) (TOP VIEW) OUT VSS 1 5 VDD 2 + +IN 3 www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4 -IN 2/25 Function Positive power supply TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Block Diagram BD7280YG-C VDD Iref +IN + -IN - OUT AMP SDNB VSS BD7281YG-C VDD Iref +IN + -IN - AMP OUT VSS Description of Blocks 1. AMP: This block is a full-swing output operational amplifier with class-AB output circuit and high-precision-Rail-to-Rail differential input stage. 2. Iref: This block supplies reference current which is needed to operate AMP block. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Supply Voltage (VDD - VSS) VS 7.0 V Input Pin Voltage (+IN, -IN, SDNB) VI (VSS - 0.3) to (VSS + 7.0) V Input Pin Current (+IN, -IN, SDNB) II ±10 mA Tjmax 150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operate over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit SSOP5 Junction to Ambient θJA 376.5 185.4 °C/W Parameter(Note 2) ΨJT 40 30 °C/W Junction to Ambient θJA 376.5 185.4 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 40 30 °C/W Junction to Top Characterization SSOP6 (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Symbol Single Supply Supply Voltage (VDD - VSS) Min Typ Max 2.5 5.0 5.5 ±1.25 ±2.50 ±2.75 -40 +25 +125 VS Dual Supply Operating Temperature www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Topr 4/25 Unit V °C TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Function Explanation 1. Nano Cap™ Nano Cap™ is a combination of technologies which allow stable operation even if output capacitance is connected with the range of nF unit. This circuit type does not oscillate even with a capacitance of 1 nF. Set design is possible without worrying about oscillation due to output capacitance. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Electrical Characteristics (Unless otherwise specified VS = 5 V, VSS = 0 V, VICM = 2.5 V, RL = 10 kΩ to VICM, VSDNB = VDD, Ta = 25 °C) Limit Parameter Symbol Input Offset Voltage Unit Min Typ Max - 0.01 1.60 - - 2 VIO Conditions No load, Absolute value mV No load, Absolute value, Ta = -40 °C to +125 °C Input Offset Voltage Temperature Drift ΔVIO/ΔT - 0.1 4.0 μV/°C Input Offset Current IIO - 0 - pA Absolute value Input Bias Current IB - 0.5 - pA Absolute value VICMR 0 - 5 V VSS to VDD - 1.7 2.6 - - 2.8 - 10 30 Common-mode Input Voltage Range Supply Current IDD Output Voltage High Output Voltage Low No load, G = 0 dB mA VOH No load, Absolute value, Ta = -40 °C to +125 °C No load, G = 0 dB, Ta = -40 °C to +125 °C VOH = VDD - VOUT mV - - 50 VOH = VDD - VOUT Ta = -40 °C to +125 °C - 10 30 - - - 50 VOL mV Ta = -40 °C to +125 °C Output Source Current (Note 1) IOH 25 50 - mA VOUT = VSS, Absolute value Output Sink Current (Note 1) IOL 25 50 - mA VOUT = VDD, Absolute value 95 115 - Large Signal Voltage Gain AV dB 75 - - GBW - 7 - MHz G = 40 dB, CL = 25 pF θ - 65 - deg G = 40 dB, CL = 25 pF Common-mode Rejection Ratio CMRR 65 100 - dB - Power Supply Rejection Ratio PSRR 65 100 - dB - - 10 - Gain Bandwidth Product Phase Margin Slew Rate SR Ta = -40 °C to +125 °C CL = 100 pF V/μs 5 - - Input-referred Noise Voltage Density Vn - 12 - nV/√Hz Total Harmonic Distortion + Noise THD+N - 0.001 - % CL = 100 pF, Ta = -40 °C to +125 °C f = 1 kHz VOUT = 4 Vp-p, f = 1 kHz (Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Electrical Characteristics - continued (Unless otherwise specified VS = 5 V, VSS = 0 V, VICM = 2.5 V, RL = 10 kΩ to VICM, VSDNB = VDD, Ta = 25 °C) Parameter Limit Symbol Unit Min Typ Max Conditions Shutdown Current IDD_SD - 0.1 1.5 μA VSDNB = VSS SDNB Input Current High ISDNB_H - 50 100 μA VSDNB = VDD SDNB Input Current Low ISDNB_L - 0 - μA VSDNB = VSS Turn On Time tON - 9 - μs - Turn Off Time tOFF - 0.8 - μs - Input Voltage High (Note 1,2) VH 2.5 - 5.0 V - Output Voltage Low (Note 1,3) VL 0.0 - 0.7 V - (Note 1) When the SDNB is not connected, the terminal is pull down to VSS by the IC internal circuit, it will be in the shutdown state. (Note 2) SDNB input voltage that activates the IC. (Note 3) SDNB input voltage that shutdown the IC. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves 3.0 3.0 2.5 2.5 Supply Current: IDD [mA] Supply Current: IDD [mA] VSS = 0 V Ta = +125 °C 2.0 1.5 Ta = -40 °C Ta = +25 °C 1.0 VS = 5.0 V 1.5 VS = 2.5 V 1.0 0.5 0.5 0.0 0.0 2 3 4 5 Supply Voltage: VS [V] -50 6 0 25 50 75 100 125 150 Figure 2. Supply Current vs Ambient Temperature 20 16 16 Output Voltage High: VOH [mV] 20 Ta = +125 °C 12 -25 Ambient Temperature: Ta [°C] Figure 1. Supply Current vs Supply Voltage Output Voltage High: VOH [mV] VS = 5.5 V 2.0 Ta = +25 °C 8 Ta = -40 °C 4 12 8 4 0 0 2 3 4 5 -50 6 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Supply Voltage: VS [V] Figure 3. Output Voltage High vs Supply Voltage (RL = 10 kΩ) Figure 4. Output Voltage High vs Ambient Temperature (VS = 5 V, RL = 10 kΩ) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued 20 20 16 16 Output Voltage Low: VOL [mV] Output Voltage Low: VOL [mV] VSS = 0 V Ta = +125 °C 12 Ta = +25 °C 8 Ta = -40 °C 4 12 8 4 0 0 2 3 4 5 -50 6 -25 0 75 100 125 150 Figure 6. Output Voltage Low vs Ambient Temperature (VS = 5 V, RL = 10 kΩ) 80 80 70 70 60 60 Output Sink Current: IOL [mA] Output Source Current: IOH [mA] Figure 5. Output Voltage Low vs Supply Voltage (RL = 10 kΩ) Ta = -40 °C 40 50 Ambient Temperature: Ta [°C] Supply Voltage: VS [V] 50 25 Ta = +25 °C 30 Ta = +125 °C 20 10 -40°C Ta = -40 °C 50 +25°C Ta = +25 °C 40 +125°C Ta = +125 °C 30 20 10 0 0 0 1 2 3 4 5 6 Output Voltage: VOUT [V] 0 1 2 3 4 5 6 Output Voltage: VOUT [V] Figure 7. Output Source Current vs Output Voltage (VS = 5 V) Figure 8. Output Sink Current vs Output Voltage (VS = 5 V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued 500 500 400 400 300 300 200 Input Offset Voltage: VIO [µV] Input Offset Voltage: VIO [µV] VSS = 0 V Ta = +125 °C 100 0 Ta = -40 °C -100 Ta = +25 °C VS = 5.5 V 200 VS = 5.0 V 100 0 -100 VS = 2.5 V -200 -200 -300 -300 -400 -400 -500 -500 2 3 4 5 -50 6 Supply Voltage: VS [V] 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Figure 9. Input Offset Voltage vs Supply Voltage Figure 10. Input Offset Voltage vs Ambient Temperature 5.0 150 Ta = -40 °C 4.0 140 3.0 Ta = +25 °C Large Signal Voltage Gain: AV [dB] Input Offset Voltage: VIO [mV] -25 2.0 1.0 0.0 Ta = +125 °C -1.0 -2.0 -3.0 -4.0 130 Ta = +125 °C 120 110 Ta = +25 °C Ta = -40 °C 100 90 80 -5.0 -1 0 1 2 3 4 5 6 2 3 4 5 6 Supply Voltage: VS [V] Common-mode Input Voltage: VICM [V] Figure 11. Input Offset Voltage vs Common-mode Input Voltage (VS = 5 V) Figure 12. Large Signal Voltage Gain vs Supply Voltage (RL = 10 kΩ) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued VSS = 0 V 150 Common-mode Rejection Ratio: CMRR [dB] 160 Large Signal Voltage Gain: AV [dB] 140 130 VS = 5.5 V VS = 5.0 V 120 110 VS = 2.5 V 100 90 80 -50 -25 0 25 50 75 100 125 140 Ta = +125 °C 120 Ta = +25 °C 100 80 Ta = -40 °C 60 40 20 0 150 2 3 Ambient Temperature: Ta [°C] 5 6 Supply Voltage: VS [V] Figure 13. Large Signal Voltage Gain vs Ambient Temperature Figure 14. Common-mode Rejection Ratio vs Supply Voltage 200 Power Supply Rejection Ratio: PSRR [dB] 160 Common-mode Rejection Ratio: CMRR [dB] 4 140 VS = 5.5 V 120 VS = 5.0 V 100 80 VS = 2.5 V 60 40 20 0 -50 -25 0 25 50 75 100 125 150 180 160 140 120 100 80 60 40 20 0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Ambient Temperature: Ta [°C] Figure 15. Common-mode Rejection Ratio vs Ambient Temperature Figure 16. Power Supply Rejection Ratio vs Ambient Temperature (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued VSS = 0 V 40 Input-referred Noise Voltage Density: Vn [nV/√Hz] 1500 Input Bias Current: IB [pA] 1200 900 600 300 35 30 25 20 15 10 5 0 0 -50 -25 0 25 50 75 100 125 10 150 100 10000 100000 Frequency: f [Hz] Ambient Temperature: Ta [°C] Figure 17. Input Bias Current vs Ambient Temperature (VS = 5 V) Figure 18. Input-referred Noise Voltage Density vs Frequency (VS = 5 V) 25 25 Fall 20 20 Fall 15 Fall Fall Fall Slew Rate: SR [V/µs] Slew Rate: SR [V/µs] 1000 RiseRise 10 15 Rise Rise 10 Rise Rise 5 2 3 4 5 6 5 -50 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Supply Voltage: VS [V] Figure 19. Slew Rate vs Supply Voltage Figure 20. Slew Rate vs Ambient Temperature (VS = 5 V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued 12 90 11 80 10 70 Phase Margin: θ [deg] Gain Bandwidth Product: GBW [MHz] VSS = 0 V 9 8 VS = 2.5 V 7 VS = 5.5 V 6 VS = 5.0 V 5 60 50 40 30 20 4 10 3 0 -50 -25 0 25 50 75 100 125 150 10 100 Ambient Temperature: Ta [°C] 1000 Load Capacitance: CL [pF] Figure 21. Gain Bandwidth Product vs Ambient Temperature Figure 22. Phase Margin vs Load Capacitance (VS = 5 V, RF = 10 kΩ, G = 40 dB) 180 80 135 40 90 Gain 20 Input Voltage [2 V/div] 60 Phase: θ [deg] Voltage Gain: G [dB] Phase Output 45 0 100 1k 10k 100k 1M 10M 100M Time [1 μs/div] Frequency: f [Hz] Figure 23. Voltage Gain, Phase vs Frequency (VS = 5 V) Figure 24. Large-Signal Step Response (VS = 5 V, G = 0 dB, RL = 10 kΩ, CL = 100 pF) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued 20 2.0 16 1.6 Turn Off Time: tOFF [us] Turn On Time: tON [us] VSS = 0 V 12 8 4 1.2 0.8 0.4 0.0 0 -50 -25 0 25 50 75 100 125 -50 150 0 25 50 75 100 125 150 Ambient Temparature: Ta [°C] Ambient Temperature: Ta [°C] Figure 25. Turn On Time vs Temperature (VS = 5 V) Figure 26. Turn Off Time vs Temperature (VS = 5 V) 0.5 3.0 VS = 5.5 V 2.5 Output Voltage: VOUT [V] 0.4 Shutdown Current: IDD_SD [µA] -25 0.3 0.2 0.1 VS = 5.0 V 2.0 VS = 2.5 V 1.5 1.0 0.5 0.0 0.0 -50 -25 0 25 50 75 100 125 150 0.5 1.0 1.5 2.0 SDNB Voltage: VSDNB [V] Ambient Temperature: Ta [°C] Figure 27. Shutdown Current vs Temperature (VS = 5 V) Figure 28. Output Voltage vs SDNB Voltage (VICM = VS/2, G = 0 dB) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Typical Performance Curves - continued VSS = 0 V Supply Current: IDD [mA] 3.0 2.0 1.0 0.0 0 1 2 3 4 5 SDNB Voltage: VSDNB [V] Figure 29. Supply Current vs SDNB Voltage (VS = 5 V, VICM = 2.5V, G = 0 dB) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Application Examples ○Voltage Follower Using this circuit, the output voltage (VOUT) is configured to be equal to the input voltage (VIN). This circuit also stabilizes the output voltage due to high input impedance and low output impedance. Computation for output voltage is shown below. VDD VOUT VIN 𝑉𝑂𝑈𝑇 = 𝑉𝐼𝑁 VSS Figure 30. Voltage Follower Circuit ○Inverting Amplifier RF For inverting amplifier, input voltage (VIN) is amplified by a voltage gain which depends on the ratio of RIN and RF, and then it outputs phase-inverted voltage. The output voltage is shown in the next expression. VDD VIN RIN VOUT 𝑉𝑂𝑈𝑇 = − 𝑅𝐹 𝑉 𝑅𝐼𝑁 𝐼𝑁 This circuit has input impedance equal to RIN. VSS Figure 31. Inverting Amplifier Circuit ○Non-inverting Amplifier RIN RF For non-inverting amplifier, input voltage (VIN) is amplified by a voltage gain, which depends on the ratio of RIN and RF. The output voltage (VOUT) is in-phase with the input voltage and is shown in the next expression. VDD VOUT VIN 𝑉𝑂𝑈𝑇 = (1 + 𝑅𝐹 )𝑉 𝑅𝐼𝑁 𝐼𝑁 Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. VSS Figure 32. Non-inverting Amplifier Circuit www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series I/O Equivalence Circuits ○BD7280YG-C Pin No. Pin Name Pin Description Equivalence Circuit 6 1 OUT Output 1 2 3 4 +IN -IN 3, 4 Input 2 5 SDNB Shutdown Input 5 100 kΩ (Typ) 2 www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series I/O Equivalence Circuits– continued ○BD7281YG-C Pin No. Pin Name Pin Description Equivalence Circuit 5 1 OUT Output 1 2 3 4 +IN -IN 3, 4 Input 2 www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 33. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Ordering Information B D 7 2 8 x Part Number 0: Single Op-Amp with Shutdown function 1: Single Op-Amp Y G - Package G: SSOP5, SSOP6 C x x Product Rank C: for Automotive applications Packaging and forming specification TR: Embossed tape and reel TL: Embossed tape and reel Lineup Number of Channels Package Single (Shutdown function) SSOP6 Reel of 3000 Single SSOP5 Reel of 3000 Orderable Part Number BD7280YG-CTR BD7280YG-CTL BD7281YG-CTR Marking Diagram SSOP5 (TOP VIEW) SSOP6 (TOP VIEW) G g d LOT Number www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Part Number Marking D Part Number Marking 21/25 Pin 1 Mark LOT Number TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Physical Dimension and Packing Information Package Name www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP5 22/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Physical Dimension and Packing Information - continued Package Name www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP6 23/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Physical Dimension and Packing Information - continued Package Name www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP6 24/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 BD728xY-C Series Revision History Date Revision 08.Apr.2022 001 29.Nov.2022 002 30.Jun.2023 003 Changes New Release Add Lineup Change limit notation, etc. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Add Packaging and forming specification 25/25 TSZ02201-0GLG2G500070-1-2 30.Jun.2023 Rev.003 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001