Datasheet
For Automotive 45 V Input
50 mA Fixed Output LDO Regulators
BD7xxL05G-C Series
General Description
Applications
◼ Power Train
◼ Body
◼ Car Infotainment etc.
The BD7xxL05G-C linear regulators are designed
as low current consumption products for power
supplies in various automotive applications.
These products are designed for up to 45 V
absolute maximum supply voltage and operate until
50 mA output current with low current consumption
of 6 μA (Typ). It can regulate the output at a very
high accuracy of ±2 %.
This device features an integrated Over Current
Protection to keep the device from a damage that is
caused by short-circuit or overload. This product
also integrates a Thermal Shutdown protection to
avoid the damage from overheating.
Furthermore, low ESR ceramic capacitors are
sufficiently applicable for the output phase
compensation.
Key Specifications
◼
◼
◼
◼
◼
◼
Wide Temperature Range (Tj):
-40 °C to +150 °C
Wide Operating Input Voltage Range: 3 V to 45 V
Low Current Consumption:
6 μA (Typ)
Output Current:
50 mA (Max)
Output Voltage:
2.5 V / 3 V / 3.3 V / 5.0 V (Typ)
High Output Voltage Accuracy:
±2 %
Package
W (Typ) x D (Typ) x H (Max)
◼ SSOP5:
2.9 mm x 2.8 mm x 1.25 mm
Features
◼
◼
◼
◼
◼
AEC-Q100 Qualified(Note 1)
Functional Safety Supportive Automotive Products
Qualification Planned for Automotive Application
Over Current Protection (OCP)
Thermal Shutdown Protection (TSD)
(Note 1) Grade 1
Typical Application Circuit
◼ Components Externally Connected
Capacitor(Note 2): 0.1 µF ≤ CIN (Min), 0.5 µF ≤ COUT (Min)
(Note 2) Electrolytic, tantalum, and ceramic capacitors can be used.
Input
VIN
CIN
Output
VOUT
BD7xxL05G-C
COUT
GND
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 4
Pin Descriptions .............................................................................................................................................................................. 4
Block Diagram ................................................................................................................................................................................ 5
Description of Blocks ...................................................................................................................................................................... 5
Absolute Maximum Ratings ............................................................................................................................................................ 6
Thermal Resistance(Note 6) ............................................................................................................................................................... 6
Operating Conditions ...................................................................................................................................................................... 7
Electrical Characteristics................................................................................................................................................................. 8
Typical Performance Curves (BD725L05G-C) ................................................................................................................................ 9
Figure 1. Output Voltage vs Input Voltage ................................................................................................................................... 9
Figure 2. Output Voltage vs Input Voltage - Enlarged view ......................................................................................................... 9
Figure 3. Line Regulation vs Input Voltage .................................................................................................................................. 9
Figure 4. Output Voltage vs Junction Temperature ..................................................................................................................... 9
Figure 5. Circuit Current vs Input Voltage.................................................................................................................................. 10
Figure 6. Circuit Current vs Input Voltage - Enlarged view ........................................................................................................ 10
Figure 7. Circuit Current vs Input Voltage.................................................................................................................................. 10
Figure 8. Circuit Current vs Input Voltage - Enlarged view ........................................................................................................ 10
Figure 9. Circuit Current vs Junction Temperature .................................................................................................................... 11
Figure 10. Circuit Current vs Output Current ............................................................................................................................. 11
Figure 11. Output Voltage vs Output Current ............................................................................................................................ 11
Figure 12. Load Regulation vs Output Current .......................................................................................................................... 11
Figure 13. Output Voltage vs Junction Temperature.................................................................................................................. 12
Figure 14. Ripple Rejection vs Frequency ................................................................................................................................. 12
Typical Performance Curves (BD730L05G-C) .............................................................................................................................. 13
Figure 15. Output Voltage vs Input Voltage ............................................................................................................................... 13
Figure 16. Output Voltage vs Input Voltage - Enlarged view ..................................................................................................... 13
Figure 17. Line Regulation vs Input Voltage .............................................................................................................................. 13
Figure 18. Output Voltage vs Junction Temperature.................................................................................................................. 13
Figure 19. Circuit Current vs Input Voltage................................................................................................................................ 14
Figure 20. Circuit Current vs Input Voltage - Enlarged view ...................................................................................................... 14
Figure 21. Circuit Current vs Input Voltage................................................................................................................................ 14
Figure 22. Circuit Current vs Input Voltage - Enlarged view ...................................................................................................... 14
Figure 23. Circuit Current vs Junction Temperature .................................................................................................................. 15
Figure 24. Circuit Current vs Output Current ............................................................................................................................. 15
Figure 25. Output Voltage vs Output Current ............................................................................................................................ 15
Figure 26. Load Regulation vs Output Current .......................................................................................................................... 15
Figure 27. Dropout Voltage vs Output Current .......................................................................................................................... 16
Figure 28. Output Voltage vs Junction Temperature.................................................................................................................. 16
Figure 29. Ripple Rejection vs Frequency ................................................................................................................................. 16
Typical Performance Curves (BD733L05G-C) .............................................................................................................................. 17
Figure 30. Output Voltage vs Input Voltage ............................................................................................................................... 17
Figure 31. Output Voltage vs Input Voltage - Enlarged view ..................................................................................................... 17
Figure 32. Line Regulation vs Input Voltage .............................................................................................................................. 17
Figure 33. Output Voltage vs Junction Temperature.................................................................................................................. 17
Figure 34. Circuit Current vs Input Voltage................................................................................................................................ 18
Figure 35. Circuit Current vs Input Voltage - Enlarged view ...................................................................................................... 18
Figure 36. Circuit Current vs Input Voltage................................................................................................................................ 18
Figure 37. Circuit Current vs Input Voltage - Enlarged view ...................................................................................................... 18
Figure 38. Circuit Current vs Junction Temperature .................................................................................................................. 19
Figure 39. Circuit Current vs Output Current ............................................................................................................................. 19
Figure 40. Output Voltage vs Output Current ............................................................................................................................ 19
Figure 41. Load Regulation vs Output Current .......................................................................................................................... 19
Figure 42. Dropout Voltage vs Output Current .......................................................................................................................... 20
Figure 43. Output Voltage vs Junction Temperature.................................................................................................................. 20
Figure 44. Ripple Rejection vs Frequency ................................................................................................................................. 20
Typical Performance Curves (BD750L05G-C) .............................................................................................................................. 21
Figure 45. Output Voltage vs Input Voltage ............................................................................................................................... 21
Figure 46. Output Voltage vs Input Voltage - Enlarged view ..................................................................................................... 21
Figure 47. Line Regulation vs Input Voltage .............................................................................................................................. 21
Figure 48. Output Voltage vs Junction Temperature.................................................................................................................. 21
Figure 49. Circuit Current vs Input Voltage................................................................................................................................ 22
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Figure 50. Circuit Current vs Input Voltage - Enlarged view ...................................................................................................... 22
Figure 51. Circuit Current vs Input Voltage................................................................................................................................ 22
Figure 52. Circuit Current vs Input Voltage - Enlarged view ...................................................................................................... 22
Figure 53. Circuit Current vs Junction Temperature .................................................................................................................. 23
Figure 54. Circuit Current vs Output Current ............................................................................................................................. 23
Figure 55. Output Voltage vs Output Current ............................................................................................................................ 23
Figure 56. Load Regulation vs Output Current .......................................................................................................................... 23
Figure 57. Dropout Voltage vs Output Current .......................................................................................................................... 24
Figure 58. Output Voltage vs Junction Temperature.................................................................................................................. 24
Figure 59. Ripple Rejection vs Frequency................................................................................................................................. 24
Measurement Circuit for Typical Performance Curves .................................................................................................................. 25
Application and Implementation .................................................................................................................................................... 26
Selection of External Components ............................................................................................................................................ 26
Input Pin Capacitor ................................................................................................................................................................ 26
Output Pin Capacitor ............................................................................................................................................................. 26
Typical Application and Layout Example ................................................................................................................................... 28
Surge Voltage Protection for Linear Regulators ........................................................................................................................ 29
Positive surge to the input ..................................................................................................................................................... 29
Negative surge to the input .................................................................................................................................................... 29
Reverse Voltage Protection for Linear Regulators .................................................................................................................... 29
Protection against Reverse Input/Output Voltage .................................................................................................................. 29
Protection against Input Reverse Voltage .............................................................................................................................. 30
Protection against Reverse Output Voltage when the Output is connected to an Inductor .................................................... 31
Power Dissipation ......................................................................................................................................................................... 32
Thermal Design ............................................................................................................................................................................ 33
I/O Equivalence Circuit(Note 1) ......................................................................................................................................................... 34
Operational Notes ......................................................................................................................................................................... 35
1.
Reverse Connection of Power Supply ............................................................................................................................ 35
2.
Power Supply Lines ........................................................................................................................................................ 35
3.
Ground Voltage............................................................................................................................................................... 35
4.
Ground Wiring Pattern .................................................................................................................................................... 35
5.
Operating Conditions ...................................................................................................................................................... 35
6.
Inrush Current................................................................................................................................................................. 35
7.
Testing on Application Boards ........................................................................................................................................ 35
8.
Inter-pin Short and Mounting Errors ............................................................................................................................... 35
9.
Regarding the Input Pin of the IC ................................................................................................................................... 36
10.
Ceramic Capacitor .......................................................................................................................................................... 36
11.
Thermal Shutdown Circuit (TSD) .................................................................................................................................... 36
12.
Over Current Protection Circuit (OCP) ........................................................................................................................... 36
13.
Thermal Consideration ................................................................................................................................................... 36
14.
Functional Safety ............................................................................................................................................................ 36
Ordering Information ..................................................................................................................................................................... 37
Marking Diagram .......................................................................................................................................................................... 37
Lineup ........................................................................................................................................................................................... 37
Physical Dimension and Packing Information ............................................................................................................................... 38
Revision History ............................................................................................................................................................................ 39
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Pin Configuration
4 VIN
3 N.C.
2 GND
1 N.C.
5 VOUT
SSOP5
(Top View)
Pin Descriptions
Pin No.
Pin Name
Function
1
N.C.
Not Connected
2
GND
Ground Pin
3
N.C.
Not Connected
4
5
VIN
VOUT
Descriptions
This pin is not connected to the chip.
It can kept open or it’s also possible to connect to GND.
This is the Ground pin.
It should be connected to the lowest potential.
This pin is not connected to the chip.
It can kept open or it’s also possible to connect to GND.
Supply Voltage Input Pin
This pin supplies the input voltage.
It is necessary to connect a capacitor which is 0.1 μF (Min) or higher
between VIN pin and GND.
The detailed selecting guide is described in Selection of External
Components.
Output Pin
This pin outputs the voltage setting.
It is necessary to connect a capacitor which is 0.5 μF (Min) or higher
between the VOUT pin and GND.
The detailed selecting guide is described in Selection of External
Components.
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Block Diagram
N.C. ( 3Pin )
GND ( 2Pin )
N.C. ( 1Pin )
OCP
PREREG
VREF
AMP
DRIVER
TSD
VIN ( 4Pin )
VOUT ( 5Pin )
Description of Blocks
Block Name
Function
PREREG
Internal Power Supply
Description of Blocks
Provides Power Supply for the Internal Circuit.
TSD
Thermal Shutdown
In case maximum power dissipation is exceeded or the ambient
temperature is higher than the Maximum Junction Temperature,
overheating causes the chip temperature (Tj) to rise.
The TSD protection circuit detects this and forces the output to turn off in
order to protect the device from overheating.
When the junction temperature decreases, the output turns on
automatically.
Output pin is discharged when the TSD protection circuit is operating.
VREF
Reference Voltage
Generates the Reference Voltage.
AMP
Error Amplifier
DRIVER
Output MOSFET Driver
Drives the Output MOSFET (Power Tr.).
Over Current Protection
If the output current increases higher than the maximum Output Current,
it will be limited by the Over Current Protection in order to protect the
device from damage that will be caused by over current.
At this operating condition, the output voltage may decrease because the
output current is limited.
If an abnormal state is removed, and the output current value returns
normally, the output voltage will also return to normal state.
OCP
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The Error Amplifier amplifies the difference between the divided feedback
voltage and the reference voltage, and then it regulates Output Power Tr.
via the DRIVER.
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BD7xxL05G-C Series
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Input Supply Voltage(Note 1)
VIN
-0.3 to +45
V
Voltage(Note 2)
VOUT
-0.3 to +18
V
Junction Temperature Range
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Output
Maximum Junction Temperature
Tjmax
150
°C
(Note 3)
VESD_HBM
± 2000
V
ESD Withstand Voltage (CDM) (Note 4)
VESD_CDM
± 750
V
ESD Withstand Voltage (HBM)
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Tjmax.
(Note 2) Do not exceed VIN + 0.3 V.
(Note 3) ESD susceptibility Human Body Model “HBM”; base on ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF).
(Note 4) ESD susceptibility Charged Device Model “CDM”; base on JEDEC JESD22-C101.
Thermal Resistance(Note 6)
Thermal Resistance (Typ)
Parameter
Symbol
1s(Note 8)
2s2p(Note 9)
Unit
SSOP5
Junction to Ambient
θJA
247.3
155.5
°C/W
Junction to Top Characterization Parameter(Note 7)
ΨJT
43
33
°C/W
(Note 6) Based on JESD51-2A (Still-Air). Using BD750L05G-C Chips.
(Note 7) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 8) Using a PCB board based on JESD51-3.
(Note 9) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
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BD7xxL05G-C Series
Operating Conditions
Parameter
Voltage(Note 1)
Input Supply
( IOUT ≤ 50 mA )
Symbol
Min
Max
Unit
BD725L05G-C /
BD730L05G-C
VIN
3.5
42.0
V
BD733L05G-C
VIN
3.8
42.0
V
BD750L05G-C
VIN
5.6
42.0
V
VIN Start-up
3
-
V
IOUT
0
50
mA
CIN
0.1
-
µF
COUT
0.5
1000
µF
ESR (COUT)
-
100
Ω
Ta
-40
+125
°C
Start-up Voltage(Note 2)
Output Current
Input
Capacitor(Note 3)
Output Capacitor(Note 4)
Output Capacitor Equivalent Series Resistance(Note 5)
Operating Temperature
(Note 1) Minimum Input Supply Voltage must be VIN Start-up = 3 V or more.
Consider that the output voltage would be reduced (Dropout Voltage) by the output current.
(Note 2) When IOUT = 0 mA
(Note 3) If the inductance of power supply line is high, adjust input capacitor value.
(Note 4) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics and DC device
characteristics.
(Note 5) Refer to Selection of External Components and select the parts.
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BD7xxL05G-C Series
Electrical Characteristics
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA
Typical values are defined at Tj = 25 °C, VIN = 13.5 V, IOUT = 0 mA.
Limits
Parameter
Symbol
Unit
Min
Typ
Max
Circuit Current
Output Voltage Accuracy
Dropout Voltage(Note 1)
(BD730L05G-C / BD733L05G-C)
Dropout Voltage
(BD750L05G-C)
-
6
9
μA
-
6
12
μA
-
6
13
μA
-
6
15
μA
-2
-
+2
%
-2
-
+2
%
-
100
200
mV
-
180
280
mV
-
300
400
mV
-
200
350
mV
-
260
410
mV
-
350
500
mV
dB
ICC
ΔVOUT
ΔVd
ΔVd
Conditions
IOUT = 0 mA
Tj ≤ +25 °C
IOUT = 0 mA
Tj ≤ +105 °C
IOUT = 0 mA
Tj ≤ +125 °C
IOUT ≤ 50 mA
Tj ≤ +150 °C
VOUT + 1 V ≤ VIN ≤ 42 V
100 μA ≤ IOUT ≤ 50 mA
VOUT + 1 V ≤ VIN ≤ 42 V
IOUT ≤ 100 μA
Tj ≤ +125 °C
VIN = VOUT × 0.95 (= 2.85 V / 3.135 V)
IOUT = 0.1 mA
VIN = VOUT × 0.95 (= 2.85 V / 3.135 V)
IOUT = 20 mA
VIN = VOUT × 0.95 (= 2.85 V / 3.135 V)
IOUT = 50 mA
VIN = VOUT × 0.95 (= 4.75 V)
IOUT = 0.1 mA
VIN = VOUT × 0.95 (= 4.75 V)
IOUT = 20 mA
VIN = VOUT × 0.95 (= 4.75 V)
IOUT = 50 mA
f = 120 Hz
Vripple = 1 Vrms
IOUT = 50 mA
Ripple Rejection
R.R.
55
60
-
Line Regulation
Reg.I
-
0.1
0.6
% × VOUT VOUT + 1 V ≤ VIN ≤ 42 V
Load Regulation
Reg.L
-
0.1
0.6
% × VOUT 100 μA ≤ IOUT ≤ 50 mA
Thermal Shutdown
TSD
151
175
-
°C
Over Current Protection
IOCP
51
120
-
mA
Tj at TSD ON
(Note 1) Minimum Input Supply Voltage of BD725L05G-C must be VIN Start-up = 3 V or more.
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Typical Performance Curves (BD725L05G-C)
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
6
6
5
Tj = -40 °C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
5
Tj = +25 °C
4
Tj = +150 °C
3
2
Tj = +25 °C
4
Tj = +150 °C
3
2
1
1
0
0
0
10
20
30
40
Input Voltage: VIN [V]
0
50
Figure 1. Output Voltage vs Input Voltage
1
2
3
Input Voltage: VIN [V]
4
5
Figure 2. Output Voltage vs Input Voltage - Enlarged view
0.6
2.56
0.5
Output Voltage: VOUT [V]
Line Regulation: Reg.I [% x VOUT]
Tj = -40 °C
0.4
Tj = -40 °C
0.3
Tj = +25 °C
Tj = +150 °C
0.2
2.53
2.50
2.47
0.1
0.0
2.44
0
10
20
30
Input Voltage: VIN [V]
40
50
-40
Figure 3. Line Regulation vs Input Voltage
(VIN = 3.5 V to 45 V)
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0
40
80
120
Junction Temperature: Tj [°C]
160
Figure 4. Output Voltage vs Junction Temperature
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Typical Performance Curves (BD725L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
15
30
12
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
20
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
25
15
10
6
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
3
5
0
0
0
10
20
30
Input Voltage: VIN [V]
40
50
0
10
20
30
Input Voltage: VIN [V]
40
50
Figure 6. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 0 mA)
Figure 5. Circuit Current vs Input Voltage
(IOUT = 0 mA)
15
60
50
12
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
9
40
Tj = -40 °C
30
Tj = +25 °C
Tj = +150 °C
20
9
6
Tj = -40 °C
3
10
Tj = +25 °C
Tj = +150 °C
0
0
0
10
20
30
40
Input Voltage: VIN [V]
0
50
20
30
Input Voltage: VIN [V]
40
50
Figure 8. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 50 mA)
Figure 7. Circuit Current vs Input Voltage
(IOUT = 50 mA)
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Typical Performance Curves (BD725L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
12
12
Circuit Current: ICC [μA]
15
Circuit Current: ICC [μA]
15
9
6
9
6
Tj = -40 °C
3
3
Tj = +25 °C
Tj = +150 °C
0
0
-40
0
40
80
120
Junction Temperature: Tj [°C]
0
160
Figure 9. Circuit Current vs Junction Temperature
(IOUT = 0 mA)
20
30
40
Output Current: IOUT [mA]
50
Figure 10. Circuit Current vs Output Current
6
Load Regulation: Reg.L [% x VOUT]
0.0
5
Output Voltage: VOUT [V]
10
Tj = -40 °C
4
Tj = +25 °C
Tj = +150 °C
3
2
1
0
0
50
100
150
Output Current: IOUT [mA]
Tj = -40 ℃
Tj = +25 ℃
-0.2
Tj = +150 ℃
-0.3
-0.4
-0.5
-0.6
200
0
Figure 11. Output Voltage vs Output Current
(Over Current Protection)
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-0.1
10
20
30
40
Output Current: IOUT [mA]
50
Figure 12. Load Regulation vs Output Current
(IOUT = 100 μA to 50 mA)
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Typical Performance Curves (BD725L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
100
6
Tj = -40 °C
Ripple Rejection: R.R. [dB]
Output Voltage: VOUT [V]
5
4
3
2
1
120
140
160
180
Junction Temperature: Tj [°C]
200
Figure 13. Output Voltage vs Junction Temperature
(Thermal Shutdown Protection)
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Tj = +25 °C
Tj = +150 °C
60
40
20
0
0.01
0
100
80
0.1
1
10
Frequency: f [kHz]
100
1000
Figure 14. Ripple Rejection vs Frequency
(IOUT = 50 mA)
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BD7xxL05G-C Series
Typical Performance Curves (BD730L05G-C)
6
6
5
5
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
4
3
Tj = -40 °C
2
Tj = +25 °C
1
Tj = +25 °C
4
Tj = +150 °C
3
2
1
Tj = +150 °C
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 15. Output Voltage vs Input Voltage
1
2
3
Input Voltage: VIN [V]
4
5
Figure 16. Output Voltage vs Input Voltage - Enlarged view
3.06
0.6
0.5
Output Voltage: VOUT [V]
Line Regulation: Reg.I [% x VOUT]
Tj = -40 °C
0.4
Tj = -40 °C
Tj = +25 °C
0.3
Tj = +150 °C
0.2
3.03
3.00
2.97
0.1
0.0
2.94
0
10
20
30
40
Input Voltage: VIN [V]
50
-40
Figure 17. Line Regulation vs Input Voltage
(VIN = 4 V to 45 V)
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TSZ22111 • 15 • 001
0
40
80
120
Junction Temperature: Tj [°C]
160
Figure 18. Output Voltage vs Junction Temperature
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BD7xxL05G-C Series
Typical Performance Curves (BD730L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
30
15
12
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
20
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
25
15
10
6
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
3
5
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 19. Circuit Current vs Input Voltage
(IOUT = 0 mA)
10
20
30
40
Input Voltage: VIN [V]
50
Figure 20. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 0 mA)
15
60
50
12
Tj = -40 °C
40
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
9
Tj = +25 °C
Tj = +150 °C
30
20
9
6
Tj = -40 °C
3
10
Tj = +25 °C
Tj = +150 °C
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 21. Circuit Current vs Input Voltage
(IOUT = 50 mA)
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TSZ22111 • 15 • 001
10
20
30
40
Input Voltage: VIN [V]
50
Figure 22. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 50 mA)
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BD7xxL05G-C Series
Typical Performance Curves (BD730L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
12
12
Circuit Current: ICC [μA]
15
Circuit Current: ICC [μA]
15
9
6
9
6
Tj = -40 °C
3
3
Tj = +25 °C
Tj= +150 °C
0
0
-40
0
40
80
120
Junction Temperature: Tj [°C]
0
160
Figure 23. Circuit Current vs Junction Temperature
(IOUT = 0 mA)
20
30
40
Output Current: IOUT [mA]
50
Figure 24. Circuit Current vs Output Current
0.0
5
Load Regulation: Reg.L [% x VOUT]
6
Output Voltage: VOUT [V]
10
Tj = -40 °C
Tj = +25 °C
4
Tj = +150 °C
3
2
1
0
-0.1
Tj = -40 °C
-0.2
Tj = +25 °C
Tj = +150 °C
-0.3
-0.4
-0.5
-0.6
0
50
100
150
Output Current: IOUT [mA]
200
0
Figure 25. Output Voltage vs Output Current
(Over Current Protection)
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10
20
30
40
Output Current: IOUT [mA]
50
Figure 26. Load Regulation vs Output Current
(IOUT = 100 μA to 50 mA)
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BD7xxL05G-C Series
Typical Performance Curves (BD730L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
0.5
6
Tj = -40 °C
5
Tj = +25 °C
Output Voltage: VOUT [V]
Dropout Voltage: ΔVd [V]
0.4
Tj = +150 °C
0.3
0.2
0.1
4
3
2
1
0.0
0
0
10
20
30
40
Output Current: IOUT [mA]
50
100
Figure 27. Dropout Voltage vs Output Current
(VIN = VOUT × 0.95 = 2.85 V)
120
140
160
180
Junction Temperature: Tj [°C]
200
Figure 28. Output Voltage vs Junction Temperature
(Thermal Shutdown Protection)
100
Ripple Rejection: R.R. [dB]
Tj = -40 °C
80
Tj = +25 °C
Tj = +150 °C
60
40
20
0
0.01
0.1
1
10
Frequency: f [kHz]
100
1000
Figure 29. Ripple Rejection vs Frequency
(IOUT = 50 mA)
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TSZ22111 • 15 • 001
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD733L05G-C)
6
6
5
5
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
4
3
Tj = -40 °C
2
Tj = +25 °C
Tj = +150 °C
1
Tj = +25 °C
4
Tj = +150 °C
3
2
1
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 30. Output Voltage vs Input Voltage
1
2
3
Input Voltage: VIN [V]
4
5
Figure 31. Output Voltage vs Input Voltage - Enlarged view
3.36
0.6
0.5
Output Voltage: VOUT [V]
Line Regulation: Reg.I [% x VOUT]
Tj = -40 °C
0.4
Tj = -40 °C
0.3
Tj = +25 °C
Tj = +150 °C
0.2
3.33
3.30
3.27
0.1
0.0
3.24
0
10
20
30
40
Input Voltage: VIN [V]
50
-40
Figure 32. Line Regulation vs Input Voltage
(VIN = 4.3 V to 45 V)
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TSZ22111 • 15 • 001
0
40
80
120
Junction Temperature: Tj [°C]
160
Figure 33. Output Voltage vs Junction Temperature
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD733L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
15
30
12
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
20
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
25
15
10
6
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
3
5
0
0
0
10
20
30
Input Voltage: VIN [V]
40
0
50
Figure 34. Circuit Current vs Input Voltage
(IOUT = 0 mA)
10
20
30
Input Voltage: VIN [V]
40
50
Figure 35. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 0 mA)
60
15
50
12
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
9
40
Tj = -40 °C
30
Tj = +25 °C
Tj = +150 °C
20
9
6
Tj = -40 °C
3
10
Tj = +25 °C
Tj = +150 °C
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 36. Circuit Current vs Input Voltage
(IOUT = 50 mA)
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TSZ22111 • 15 • 001
10
20
30
40
Input Voltage: VIN [V]
50
Figure 37. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 50 mA)
18/39
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD733L05G-C) – continued
15
15
12
12
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
9
6
9
6
Tj = -40 °C
3
3
Tj = +25 °C
Tj= +150 °C
0
0
-40
0
40
80
120
Junction Temperature: Tj [°C]
0
160
Figure 38. Circuit Current vs Junction Temperature
(IOUT = 0 mA)
20
30
40
Output Current: IOUT [mA]
50
Figure 39. Circuit Current vs Output Current
(IOUT = 0 mA)
6
0.0
Load Regulation: Reg.L [% x VOUT]
Tj = -40 °C
5
Output Voltage: VOUT [V]
10
Tj = +25 °C
Tj = +150 °C
4
3
2
1
0
-0.1
Tj = -40 ℃
Tj = +25 ℃
-0.2
Tj = +150 ℃
-0.3
-0.4
-0.5
-0.6
0
50
100
150
Output Current: IOUT [mA]
200
0
Figure 40. Output Voltage vs Output Current
(Over Current Protection)
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TSZ22111 • 15 • 001
10
20
30
40
Output Current: IOUT [mA]
50
Figure 41. Load Regulation vs Output Current
(IOUT = 100 μA to 50 mA)
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD733L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
6
0.5
5
Output Voltage: VOUT [V]
Dropout Voltage: ΔVd [V]
0.4
0.3
0.2
Tj = -40 °C
0.1
Tj = +25 °C
4
3
2
1
Tj = +150 °C
0.0
0
0
10
20
30
40
Output Current: IOUT [mA]
50
100
Figure 42. Dropout Voltage vs Output Current
(VIN = VOUT × 0.95 V = 3.135 V)
120
140
160
180
Junction Temperature: Tj [°C]
200
Figure 43. Output Voltage vs Junction Temperature
(Thermal Shutdown Protection)
100
Ripple Rejection: R.R. [dB]
Tj = -40 °C
Tj = +25 °C
80
Tj = +150 °C
60
40
20
0
0.01
0.1
1
10
Frequency: f [kHz]
100
1000
Figure 44. Ripple Rejection vs Frequency
(IOUT = 50 mA)
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TSZ22111 • 15 • 001
20/39
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD750L05G-C)
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
6
6
5
5
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Tj = -40 °C
4
3
Tj = -40 °C
2
Tj = +25 °C
1
Tj = +150 °C
4
3
2
1
Tj = +150 °C
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 45. Output Voltage vs Input Voltage
1
2
3
Input Voltage: VIN [V]
4
5
Figure 46. Output Voltage vs Input Voltage - Enlarged view
5.10
0.6
0.5
Output Voltage: VOUT [V]
Line Regulation: Reg.I [% x VOUT]
Tj = +25 °C
0.4
0.3
Tj = -40 °C
0.2
Tj = +25 °C
Tj = +150 °C
5.05
5.00
4.95
0.1
4.90
0.0
0
10
20
30
Input Voltage: VIN [V]
40
-40
50
Figure 47. Line Regulation vs Input Voltage
(VIN = 6 V to 45 V)
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TSZ22111 • 15 • 001
0
40
80
120
Junction Temperature: Tj [°C]
160
Figure 48. Output Voltage vs Junction Temperature
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD750L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
30
15
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
20
12
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
25
15
10
6
Tj = -40 °C
Tj = +25 °C
Tj = +125 °C
Tj = +150 °C
3
5
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 49. Circuit Current vs Input Voltage
(IOUT = 0 mA)
10
20
30
40
Input Voltage: VIN [V]
50
Figure 50. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 0 mA)
60
15
50
12
Tj = -40 °C
Circuit Current: ICC [μA]
Circuit Current: ICC [μA]
9
Tj = +25 °C
40
Tj = +150 °C
30
20
9
6
Tj = -40 °C
3
10
Tj = +25 °C
Tj = +150 °C
0
0
0
10
20
30
40
Input Voltage: VIN [V]
50
0
Figure 51. Circuit Current vs Input Voltage
(IOUT = 50 mA)
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TSZ22111 • 15 • 001
10
20
30
40
Input Voltage: VIN [V]
50
Figure 52. Circuit Current vs Input Voltage - Enlarged view
(IOUT = 50 mA)
22/39
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD750L05G-C) – continued
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
12
12
Circuit Current: ICC [μA]
15
Circuit Current: ICC [μA]
15
9
6
3
9
6
Tj = -40 °C
3
Tj = +25 °C
Tj= +150 °C
0
0
-40
0
40
80
120
Junction Temperature: Tj [°C]
160
0
Figure 53. Circuit Current vs Junction Temperature
(IOUT = 0 mA)
20
30
40
Output Current: IOUT [mA]
50
Figure 54. Circuit Current vs Output Current
6
Load Regulation: Reg.L [% x VOUT]
0.0
5
Output Voltage: VOUT [V]
10
4
3
2
Tj = -40 °C
Tj = +25 °C
1
Tj = +150 °C
0
-0.1
Tj = -40 ℃
Tj = +25 ℃
-0.2
Tj = +150 ℃
-0.3
-0.4
-0.5
-0.6
0
50
100
150
Output Current: IOUT [mA]
200
0
Figure 55. Output Voltage vs Output Current
(Over Current Protection)
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10
20
30
40
Output Current: IOUT [mA]
50
Figure 56. Load Regulation vs Output Current
(IOUT = 100 μA to 50 mA)
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Typical Performance Curves (BD750L05G-C) – continued
0.5
6
0.4
5
Output Voltage: VOUT [V]
Dropout Voltage: ΔVd [V]
Unless otherwise specified, VIN = 13.5 V, IOUT = 0 mA, CIN = 0.1 μF, COUT = 1.0 μF
0.3
0.2
Tj = -40 °C
4
3
2
Tj = +25 °C
0.1
1
Tj = +150 °C
0.0
0
0
10
20
30
40
Output Current: IOUT [mA]
50
100
Figure 57. Dropout Voltage vs Output Current
(VIN = VOUT × 0.95 V = 4.75 V)
120
140
160
180
Junction Temperature: Tj [°C]
200
Figure 58. Output Voltage vs Junction Temperature
(Thermal Shutdown Protection)
100
Ripple Rejection: R.R. [dB]
Tj = -40 °C
80
Tj = +25 °C
Tj = +150 °C
60
40
20
0
0.01
0.1
1
10
Frequency: f [kHz]
100
1000
Figure 59. Ripple Rejection vs Frequency
(IOUT = 50 mA)
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TSZ22111 • 15 • 001
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18.Nov.2022 Rev.002
BD7xxL05G-C Series
Measurement Circuit for Typical Performance Curves
VIN
VIN
CIN
VIN
VOUT
COUT
GND
IOUT
VIN
CIN
VOUT
COUT
GND
V
IOUT
A
Measurement Setup for
Figure 1, 2, 3, 4, 13,
Figure 15, 16, 17, 18, 28,
Figure 30, 31, 32, 33, 43,
Figure 45, 46, 47, 48, 58
VIN
Measurement Setup for
Figure 5, 6, 7, 8, 9,
Figure 19, 20, 21, 22, 23,
Figure 34, 35, 36, 37, 38,
Figure 49, 50, 51, 52, 53
VOUT
VIN
VIN
CIN
COUT
GND
VOUT
IOUT
VIN
CIN
COUT
GND
IOUT
V
A
Measurement Setup for
Figure 10, 24, 39, 54
Measurement Setup for
Figure 11, 12, 25, 26,
Figure 40, 41, 55, 56
V
VIN
VOUT
VIN
VIN
CIN
GND
COUT
IOUT
VOUT
1 Vrms
CIN
GND
COUT
IOUT
VIN
Measurement Setup for
Figure 27, 42, 57
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TSZ22111 • 15 • 001
Measurement Setup for
Figure 14, 29, 44, 59
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18.Nov.2022 Rev.002
M
BD7xxL05G-C Series
Application and Implementation
Notice: The following information is given as a reference or hint for the application and the implementation. Therefore, it does
not guarantee its operation on the specific function, accuracy or external components in the application. In the
application, it shall be designed with sufficient margin by enough understanding about characteristics of the external
components, e.g. capacitor, and also by appropriate verification in the actual operating conditions.
Selection of External Components
Input Pin Capacitor
If the battery is placed far from the regulator or the impedance of the input-side is high, higher capacitance is required for
the input capacitor in order to prevent the voltage-drop at the input line. The input capacitor and its capacitance should be
selected depending on the line impedance which is between the input pin and the smoothing filter circuit of the power
supply. At this time, the capacitance value setting is different each application. Generally, the capacitor with capacitance
value of 0.1 µF (Min) or more with good high frequency characteristic is recommended for this regulator.
In addition, to prevent an influence to the regulator’s characteristic from the deviation or the variation of the external
capacitor’s characteristic. All input capacitors mentioned above are recommended to have a good DC bias characteristic
and a temperature characteristic (approximately ±15 %, e.g. X7R, X8R) with being satisfied high absolute maximum
voltage rating based on EIA standard. These capacitors should be placed close to the input pin and mounted on the same
board side of the regulator not to be influenced by implementation impedance.
Output Pin Capacitor
The output capacitor is mandatory that stop oscillation for the regulator in order to realize stable operation. The output
capacitor with effective capacitance value ≥ 0.5 µF (Min) and ESR up to 100 Ω (Max) must be required between the output
pin and the GND pin. By using a ceramic capacitor, enables to expect smaller set and long-life.
A proper selection of appropriate both the capacitance value and ESR for the output capacitor can improve the transient
response of the regulator and can also keep the stability with better regulation loop. The correlation of the output
capacitance value and ESR is shown in the graph (Figure 60 Output Capacitance COUT, ESR Stable Available Area) on the
next page as the output capacitor’s capacitance value and the stability region for ESR. As described in this graph, this
regulator is designed to be stable with ceramic capacitors as of MLCC, with the capacitance value from 0.5 µF to 1000 µF
and with ESR value within almost 0 Ω to 100 Ω. The frequency range of ESR can be generally considered as within about
10 kHz to 100 kHz.
Note that the provided the stable area of the capacitance value and ESR in the graph is obtained under a specific set of
conditions which is based on the measurement result in single IC on our board with a resistive load. In the actual
environment, the stability is affected by wire impedance on the board, input power supply impedance and also loads
impedance. Therefore, note that a careful evaluation of the actual application, the actual usage environment and the
actual conditions should be done to confirm the actual stability of the system.
Generally, in the transient event which is caused by the input voltage fluctuation or the load fluctuation beyond the gain
bandwidth of the regulation loop, the transient response ability of the regulator depends on the capacitance value of the
output capacitor. Basically the capacitance value of ≥ 1.0 µF (Typ) for the output capacitor is recommended. Using bigger
capacitance value can be expected to improve better the output voltage fluctuation in a high frequency. Various types of
capacitors can be used for the output capacitor with high capacity which includes electrolytic capacitor, electro-conductive
polymer capacitor and tantalum capacitor. Noted that, depending on the type of capacitors, its characteristics such as ESR
(≤ 100 Ω) absolute value range, a temperature dependency of capacitance value and increased ESR at cold temperature
needs to be taken into consideration. Especially when the ESR is large, the voltage generated by charge current and
discharge current to capacitor and ESR are large. When transient response such that charge current and discharge
current flow, noted that output voltage fluctuation.
In addition, the same consideration should be taken as the input pin capacitor, to prevent an influence to the regulator’s
characteristic from the deviation or the variation of the external capacitor’s characteristic. All output capacitors mentioned
above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %,
e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors
should be placed close to the output pin and mounted on the same board side of the regulator not to be influenced by
implementation impedance.
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Output Pin Capacitor - continued
120
Unstable Available Area
100
ESR [Ω]
80
Stable Available Area
0.5 μF ≤ COUT
ESR (COUT) ≤ 100 Ω
60
40
20
0
0.1
1
10
100
1000
Output Capacitance COUT [μF]
Figure 60. Output Capacitance COUT, ESR Stable Available Area
Parameter
Input Supply Voltage
Symbol
Conditions
BD725L05G-C /
BD730L05G-C
VIN
3.5 V ≤ VIN ≤ 42.0 V
BD733L05G-C
VIN
3.8 V ≤ VIN ≤ 42.0 V
BD750L05G-C
VIN
5.6 V ≤ VIN ≤ 42.0 V
IOUT
0 mA ≤ IOUT ≤ 50 mA
Tj
-40 °C ≤ Tj ≤ +150 °C
Output Current
Junction Temperature
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Typical Application and Layout Example
Input Voltage
Output Voltage
Ground
VOUT
VIN
COUT
CIN
5:VOUT
4:VIN
BD7xxL05G-C
1:N.C.
2:GND
3:N.C.
Ground
Parameter
Symbol
Recommended Value
Output Current Range
IOUT
IOUT ≤ 50 mA
Output Capacitor
COUT
1 μF ≤ COUT ≤ 1000 μF
ESR (COUT)
ESR ≤ 100 Ω
BD725L05G-C /
BD730L05G-C
VIN
3.5 V ≤ VIN ≤ 42.0 V
BD733L05G-C
VIN
3.8 V ≤ VIN ≤ 42.0 V
BD750L05G-C
VIN
5.6 V ≤ VIN ≤ 42.0 V
CIN
0.1 µF ≤ CIN
Output Capacitor ESR for stability(Note 1)
Input Voltage Range(Note 2)
Input Capacitor(Note 3)
(Note 1) Refer to Selection of External Components and select the parts.
(Note 2) Minimum Input Supply Voltage must be VIN Start-up = 3 V or more.
Consider that the output voltage would be reduced (Dropout Voltage) by the output current.
(Note 3) If the inductance of power supply line is high, adjust input capacitor value.
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Application and Implementation - continued
Surge Voltage Protection for Linear Regulators
The following shows some helpful tips to protect ICs from possible inputting surge voltage which exceeds absolute maximum
ratings.
Positive surge to the input
If there is any potential risk that positive surges higher than absolute maximum ratings 45 V, it is applied to the input, a
Zener Diode should be inserted between the VIN pin and the GND to protect the device as shown in Figure 61.
VIN
VIN
D1
VOUT
GND
CIN
VOUT
COUT
Figure 61. Surges Higher than 45 V is Applied to the Input
Negative surge to the input
If there is any potential risk that negative surges below the absolute maximum ratings, (e.g.) -0.3 V, is applied to the input,
a Schottky barrier diode should be inserted between the VIN pin and the GND to protect the device as shown in Figure
62.
VIN
VIN
D1
VOUT
GND
CIN
VOUT
COUT
Figure 62. Surges Lower than -0.3 V is Applied to the Input
Reverse Voltage Protection for Linear Regulators
A linear regulator integrated circuit (IC) requires the input voltage to be always higher than the regulated voltage. Output
voltage, however, may become higher than the input voltage under specific situations or circuit configurations. In such
circumstances reverse voltage and current may cause damage to the IC. A reverse polarity connection of power supply or
certain inductor components can also cause a polarity reversal between the input and output pins. The following provides
instructions on reversed voltage polarity protection for ICs.
Protection against Reverse Input/Output Voltage
In the MOS linear regulator, a parasitic body diode between the drain-source of MOSFET generally exists. If the output
voltage becomes higher than the input voltage and if its voltage difference exceeds V F of the body diode, a reverse current
flows from the output to the input through the body diode as shown in Figure 63. The current flows in the parasitic body
diode is not limited in the protection circuit because it is the parasitic element, therefore too much reverse current may
cause damage to degrade or destroy the semiconductor elements of the regulator.
Reverse Current
VOUT
VIN
Error
AMP.
VREF
Figure 63. Reverse Current Path in a MOS Linear Regulator
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Protection against Reverse Input/Output Voltage – continued
An effective solution for this problem is to implement an external bypass diode in order to prevent the reverse current flow
inside the IC as shown in Figure 64. Note that the bypass diode must be turned on prior to the internal body diode of the IC.
This external bypass diode should be chosen as being lower forward voltage VF than the internal body diode. If the reverse
current of this bypass diode is large, even if the output is OFF, a lot of diode leakage current flows from the input to the
output, so it is necessary to select one with a small value. It should to be selected a diode which has a rated reverse
voltage greater than the IC’s input maximum voltage and also which has a rated forward current greater than the
anticipated reverse current in the actual application.
D1
VIN
VIN
VOUT
VOUT
GND
CIN
COUT
Figure 64. Bypass Diode for Reverse Current Diversion
A Schottky barrier diode which has a characteristic of low forward voltage (VF) can meet to the requirement for the external
diode to protect the IC from the reverse current. However, it also has a characteristic that the leakage (I R) caused by the
reverse voltage is bigger than other diodes. Therefore, it should be taken into the consideration to choose it because if IR is
large, it may cause increase of the current consumption, or raise of the output voltage in the light-load current condition. IR
characteristic of Schottky diode has positive temperature characteristic, which the details shall be checked with the
datasheet of the products, and the careful confirmation of behavior in the actual application is mandatory.
Even in the condition when the input/output voltage is inverted, if the VIN pin is open as shown in Figure 65, or if the VIN
pin becomes high-impedance condition as designed in the system, it cannot damage or degrade the parasitic element. It's
because a reverse current via the pass transistor becomes extremely low. In this case, therefore, the protection external
diode is not necessary.
ON→OFF
IBIAS
VIN
VIN
CIN
VOUT
VOUT
GND
COUT
Figure 65. Open VIN
Protection against Input Reverse Voltage
When the input of the IC is connected to the power supply, accidentally if plus and minus are routed in reverse, or if there
is a possibility that the input may become lower than the GND pin, it may cause to destroy the IC because a large current
passes via the internal electrostatic breakdown prevention diode between the input pin and the GND pin inside the IC as
shown in Figure 66.
The simplest solution to avoid this problem is to connect a Schottky barrier diode or a rectifier diode in series to the power
supply line as shown in Figure 67. However, it causes the voltage drop by a forward voltage VF at the supply voltage while
normal operation.
Generally, since the Schottky barrier diode has lower VF, so it contributes to rather smaller power loss than rectifier diodes.
If IC has load currents, this external diode generates heat more, therefore select a diode with enough margin in power
dissipation. On the other hand, a reverse current passes this diode in the reverse connection condition, however, it is
negligible because its small amount.
VIN
VIN
VOUT
VOUT
D1
CIN
GND
VIN
COUT
VIN
CIN
+
GND
VOUT
COUT
GND
Figure 66. Current Path in Reverse Input Connection
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GND
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Figure 67. Protection against Reverse Polarity 1
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Protection against Input Reverse Voltage - continued
Figure 68 shows a circuit in which a P-channel MOSFET is connected in series to the power. The body diode (parasitic
element) is located in the drain-source junction area of the MOSFET. Since the Pch MOSFET is turned on in the correct
connection, the drop voltage in a forward connection is calculated from the on state resistance of the MOSFET and the
output current IOUT. It is smaller than the drop voltage by the diode as shown in Figure 67 and results in less of a power
loss. No current flows in a reverse connection where the MOSFET remains off in Figure 68.
If the gate-source voltage exceeds maximum rating of MOSFET gate-source junction with derating curve in consideration,
reduce the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 69.
Q1
VIN
Q1
VIN
VIN
VOUT
GND
CIN
VOUT
VOUT
VIN
R1
R2
COUT
Figure 68. Protection against Reverse Polarity 2
CIN
VOUT
GND
COUT
Figure 69. Protection against Reverse Polarity 3
Protection against Reverse Output Voltage when the Output is connected to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground at the moment
that the output voltage is turned off. IC integrates ESD protection diodes between the IC output and ground pins. A large
current may flow in such condition finally resulting on destruction of the IC. To prevent this situation, connect a Schottky
barrier diode in parallel to the integrated diodes as shown in Figure 70.
Further, if a long wire is in use for the connection between the output pin of the IC and the load, confirm that the negative
voltage is not generated at the VOUT pin when the output voltage is turned off by observation of the waveform on an
oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for a motor load that is
affected by its counter electromotive force, as it produces an electrical current in a similar way.
VIN
VIN
VOUT
VOUT
GND
CIN
COUT
GND
D1
XLL
GND
Figure 70. Current Path in Inductive Load (Output: Off)
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Power Dissipation
SSOP5
0.9
(1): 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR-4
Board size: 114.3 mm × 76.2 mm × 1.57 mmt
Top copper foil: Footprints and Traces, 70 μm copper.
(2) 0.80 W
Power Dissipation: Pd [W]
0.8
0.7
0.6
(1) 0.51 W
(2): 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm)
Board material: FR-4
Board size: 114.3 mm × 76.2 mm × 1.6 mmt
Top copper foil: Footprints and Traces, 70 μm copper.
2 inner layers copper foil area of PCB:
74.2 mm × 74.2 mm, 35 μm copper.
Bottom copper foil area of PCB:
74.2 mm × 74.2 mm, 70 μm copper.
0.5
0.4
0.3
0.2
0.1
0.0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Condition (1): θJA = 247.3 °C/W, ΨJT (top center) = 43 °C/W
Condition (2): θJA = 155.5 °C/W, ΨJT (top center) = 33 °C/W
Figure 71. Power Dissipation Graph (SSOP5)
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Thermal Design
The power consumption of the IC is decided by the dropout voltage condition, the load current and the current consumption.
Refer to power dissipation curves illustrated in Figure 71 when using the IC in an environment of Ta ≥ +25 °C. Even if the
ambient temperature Ta is at +25 °C, chip junction temperature (Tj) can be very high depending on the input voltage and the
load current. Consider the design to be Tj ≤ Tjmax = +150 °C in whole operating temperature range.
Should by any condition the maximum junction temperature Tjmax = +150 °C rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal resistance in this specification is
based on recommended PCB and measurement condition by JEDEC standard. Therefore, need to be careful because it
might be different from the actual use condition. Verify the application and allow sufficient margins in the thermal design by
the following method to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj with ambient temperature Ta.
𝑇𝑗 = 𝑇𝑎 + 𝑃𝐶 × 𝜃𝐽𝐴 [°C]
Where:
𝑇𝑗
𝑇𝑎
𝑃𝐶
𝜃𝐽𝐴
is the Junction Temperature
is the Ambient Temperature
is the Power Consumption
is the Thermal Resistance (Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj with top center of case’s (mold) temperature TT.
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇 [°C]
Where:
𝑇𝑗
𝑇𝑇
𝑃𝐶
𝛹𝐽𝑇
is the Junction Temperature
is the Top Center of Case’s (mold) Temperature
is the Power consumption
is the Thermal Resistance (Junction to Top Center of Case)
3. The following method is used to calculate the power consumption PC (W).
𝑃𝑐 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶 [W]
Where:
𝑃𝑐
𝑉𝐼𝑁
𝑉𝑂𝑈𝑇
𝐼𝑂𝑈𝑇
𝐼𝐶𝐶
is the Power Consumption
is the Input Voltage
is the Output Voltage
is the Load Current
is the Current Consumption
Calculation Example
If VIN = 13.5 V, VOUT = 3.0 V, IOUT = 10 mA, ICC = 6 μA, the power consumption PC can be calculated as follows:
𝑃𝐶 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶
= (13.5 𝑉 – 3.0 𝑉) × 10 𝑚𝐴 + 13.5 𝑉 × 6 𝜇𝐴
≂ 0.11 𝑊
At the maximum ambient temperature Tamax = 85 °C,
the thermal resistance (Junction to Ambient) θJA = 155.5 °C/W (4-layer PCB)
𝑇𝑗 = 𝑇𝑎𝑚𝑎𝑥 + 𝑃𝐶 × 𝜃𝐽𝐴
= 85 °𝐶 + 0.11 𝑊 × 155.5 °𝐶/𝑊
≂ 102.1 °𝐶
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 43 °C/W (1-layer PCB)
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇
= 100 °𝐶 + 0.11 𝑊 × 43 °𝐶/𝑊
= 104.7 °𝐶
If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the board,
increasing the layer and thermal via between thermal land pad for optimum thermal performance.
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I/O Equivalence Circuit(Note 1)
VIN Pin
VOUT Pin
VIN
VIN
VOUT
VOUT
2.5 V: 10.3 MΩ
3.0 V: 13.0 MΩ
3.3 V: 14.8 MΩ
5.0 V: 24.1 MΩ
3.6 MΩ
(Note 1) Resistance value is Typical.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
9.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 72. Example of Monolithic IC Structure
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
12. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
13. Thermal Consideration
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input
and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat
does not exceed the Pd rating. If Junction temperature is over Tjmax (= 150 °C), IC characteristics may be worse due
to rising chip temperature. Heat resistance in specification is measurement under PCB condition and environment
recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment.
14. Functional Safety
“ISO 26262 process compliant to support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety mechanism is implemented to support functional safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional safety supportive automotive products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BD7xxL05G-C Series
Ordering Information
B
D
7
Part Number
x
x
L
0
Output Voltage
25: 2.5 V
30: 3.0 V
33: 3.3 V
50: 5.0 V
5
G
Package
G: SSOP5
C
-
T
R
Product Rank
C: for Automotive
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
Lineup
Part Number Marking
Output Voltage
Orderable Part Number
dq
2.5 V
BD725L05G-CTR
du
3.0 V
BD730L05G-CTR
dr
3.3 V
BD733L05G-CTR
dy
5.0 V
BD750L05G-CTR
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
Changes
29.Mar.2022
001
New Release
18.Nov.2022
002
Added about functional safety
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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