BD7345HFV-TR

High-performance Clock Generator Series Compact 1ch Clock Generators for Digital Cameras BU7344HFV,BU7345HFV,BU7346GUL No.11005EAT06 ●Description These Clock Generators incorporates compact package compared to oscillators, which provides the generation of high-frequency CCD clocks necessary for digital still cameras and digital video cameras. ●Features 1) SEL pin allowing for the selection of frequencies 2) Selection of OE (PDB) pin enabling Power-down function 3) Crystal-oscillator-level clock precision with high C/N characteristics and low jitter 4) Micro miniature Package incorporated 5) Single power supply of 3.3 V ●Applications Digital Still Camera, Digital Video Camera, and others ●Line up matrix Parameter Supply voltage Operating temperature range Reference input clock Output clock Standby current(MAX.) Operating current (TYP) Package BU7344HFV 2.7V～3.6V -5 ℃～75 ℃ 27.0000MHz 40.5000MHz 36.0000MHz 1.0μA 4.0mA HVSOF6 BU7345HFV 2.7V～3.6V -5 ℃～75 ℃ 27.0000MHz 38.0000MHz 36.0000MHz 1.0μA 3.5mA HVSOF6 BU7346GUL 2.7V～3.6V -5 ℃～75 ℃ 27.0000MHz 38.0000MHz 36.0000MHz 1.0μA 3.5mA VCSP50L1 1.5mm×1.0mm www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Absolute maximum ratings (Ta=25 ℃) Parameter Supply voltage Input voltage Storage temperature range Technical Note Symbol VDD VIN Tstg Ratings -0.3 ~ 4.0 -0.3 ~ VDD+0.3 -55 ~ 125 410(BU7344HFV,BU7345HFV) *1 Unit V V ℃ Power dissipation *1 *2 * * Pd 460(BU7346GUL)*2 mW Mounted on 70mm * 70mm * 1.6mm Glass-epoxy PCB. Derating: 4.1mW / ℃ at Ta > 25°C Mounted on 50mm * 58mm * 1.75mm Glass-epoxy PCB. Derating: 4.6mW / ℃ at Ta > 25°C Operating is not guaranteed. The radiation-resistance design is not carried out. ●Operating conditions Parameter Supply voltage Input H voltage Input L voltage Operating temperature Output load Symbol VDD VINH VINL Topr CL Ratings 2.7 ~ 3.6 0.8VDD ~ VDD 0.0 ~ 0.2VDD -5 ~ 75 15(MAX.) Unit V V V ℃ pF ●Electrical characteristics ○BU7344HFV (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.) Parameter Output H voltage Output L voltage Standby current Consumption current 1 Consumption current 2 Pull-down load Output frequency OUT1 OUT2 * Symbol VOH VOL IDDst IDD1 IDD2 Rpd Limits Min. 2.8 0.0 50 Typ. 4.0 3.5 100 Max. VDD 0.5 1.0 5.2 4.6 200 Unit V V μA mA mA kΩ Conditions IOH = -3.0mA IOL = 3.0mA OE = L 40.5000MHz output SEL = L 36.0000MHz output SEL = H input PIN, pull-down load value CLK40.5 CLK36 40.5000 36.0000 MHz MHz IN*12/4/2, SEL = L IN*8/3/2, SEL = H The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN. If the input frequency is set to 27.0000MHz, the output frequency will be as listed above. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ○BU7345HFV (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.) Parameter Output H voltage Output L voltage Standby current Consumption current 1 Consumption current 2 Pull-down load Output frequency OUT1 OUT2 * Technical Note Symbol VOH VOL IDDst IDD1 IDD2 Rpd Limits Min. 2.8 0.0 50 Typ. 3.5 3.5 100 Max. VDD 0.5 1.0 4.6 4.6 200 Unit V V μA mA mA kΩ Conditions IOH = -3.0mA IOL = 3.0mA OE = L 38.0000MHz output SEL = L 36.0000MHz output SEL = H input PIN, pull-down load value CLK38 CLK36 38.0000 36.0000 MHz MHz IN*76/27/2, SEL = L IN*8/3/2, SEL = H The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN. If the input frequency is set to 27.0000MHz, the output frequency will be as listed above. ○BU7346GUL (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.) Parameter Output H voltage Output L voltage Standby current Consumption current 1 Consumption current 2 Pull-down load Output frequency OUT1 OUT2 * Symbol VOH VOL IDDst IDD1 IDD2 Rpd Limits Min. 2.8 0.0 50 Typ. 3.5 3.5 100 Max. VDD 0.5 1.0 4.6 4.6 200 Unit V V μA mA mA kΩ Conditions IOH = -3.0mA IOL = 3.0mA PDB = L 38.0000MHz output SEL = L 36.0000MHz output SEL = H input PIN, pull-down load value CLK38 CLK36 38.0000 36.0000 MHz MHz XIN*76/27/2, SEL = L XIN*8/3/2, SEL = H The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XIN. If the input frequency is set to 27.0000MHz, the output frequency will be as listed above. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Reference data (BU7344HFV basic data) Technical Note RBW:1kHz RBW:1kH VBW:100Hz VBW:100Hz 10dB/div 1V/div 1V/div 5nsec/div 500psec/div 10kHz/div Fig.1 40.5MHz output waveform (CL=15pF,Ta=25 ℃) Fig.2 40.5MHz Period-Jitter (CL=15pF,Ta=25 ℃) Fig.3 40.5MHz spectrum (CL=15pF,Ta=25 ℃) RBW:1kHz VBW:100Hz 5nsec/div 500psec/div 10dB/div 1V/div 1V/div 10kHz/div Fig.4 36MHz output waveform (CL=15pF,Ta=25 ℃) ●Reference data (BU7345HFV basic data) Fig.5 36MHz Period-Jitter (CL=15pF,Ta=25 ℃) Fig.6 36MHz spectrum (CL=15pF,Ta=25 ℃) RBW:1kHz VBW:100Hz 1V/div 5nsec/div 500psec/div 10dB/div 1V/div 10kHz/div Fig.7 38MHz output waveform (CL=15pF,Ta=25 ℃) Fig.8 38MHz Period-Jitter (CL=15pF,Ta=25 ℃) Fig.9 38MHz spectrum (CL=15pF,Ta=25 ℃) RBW:1kHz VBW:100Hz 1V/div 5nsec/div 500psec/div 10dB/div 1V/div 10kHz/div Fig.10 36MHz output waveform (CL=15pF,Ta=25 ℃) Fig.11 36MHz Period-Jitter (CL=15pF,Ta=25 ℃) Fig.12 36MHz spectrum (CL=15pF,Ta=25 ℃) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Reference data (BU7346GUL basic data) Technical Note RBW:1kHz VBW:100Hz 10dB/div 0.5V/div 0.5V/div 5nsec/div 500psec/div 10kHz/div Fig.13 38MHz output waveform (CL=15pF,Ta=25 ℃) Fig.14 38MHz Period-Jitter (CL=15pF,Ta=25 ℃) Fig.15 38MHz spectrum (CL=15pF,Ta=25 ℃) RBW:1kHz VBW:100Hz 0.5V/div 0.5V/div 10dB/div 5nsec/div 500psec/div 10kHz/div Fig.16 36MHz output waveform (CL=15pF,Ta=25 ℃) Fig.17 36MHz Period-Jitter (CL=15pF,Ta=25 ℃) Fig.18 36MHz spectrum (CL=15pF,Ta=25 ℃) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Reference data (BU7344HFV Temperature and Supply voltage variations data) 55 54 53 Technical Note 5 5 4 Rise time:tr [nsec] VDD=3.6 51 50 49 48 47 46 45 -25 0 25 50 VDD=3.3V 3 Fall time:tf [nsec] 52 Duty:Duty [%] VDD=2.7V 4 VDD=2.7V 3 2 VDD=3.3V VDD=3.6V 2 VDD=3.6V VDD=3.3V VDD=2.7V 1 1 0 75 100 0 -25 0 temperature:T [℃] 25 50 75 temperature:T [℃] 100 -25 0 25 50 temperature:T [℃] 75 100 Fig.19 40.5MHz Temperature－Duty 100 Period-Jitter MIN-MAX:JsABS [psec] 600 500 400 300 200 100 0 Fig.20 40.5MHz Temperature－Rise-time Fig.21 40.5MHz Temperature－Fall-time 90 Period-Jitter 1s :JsSD [psec] 80 70 60 50 40 30 20 10 0 -25 0 25 50 temperature:T [℃] 75 100 VDD=3.6V VDD=2.7V VDD=3.3V VDD=2.7V VDD=3.3V VDD=3.6V -25 0 25 50 temperature:T [℃] 75 100 Fig.22 40.5MHz Temperature－Period-Jitter 1σ 55 54 53 Fig.23 40.5MHz Temperature－Period-Jitter MIN-MAX 5 VDD=2.7V 5 4 Rise time:tr [nsec] 4 Fall time:tf [nsec] VDD=2.7V 52 Duty:Duty [%] 51 50 49 48 47 46 45 -25 0 25 50 temperature:T [℃] 75 100 VDD=3.3V VDD=2.7V VDD=3.6V 3 3 2 VDD=3.6V VDD=3.3V 2 VDD=3.6V VDD=3.3V 1 1 0 -25 0 25 50 75 temperature:T [℃] 100 0 -25 0 25 50 temperature:T [℃] 75 100 Fig.24 36MHz Temperature－Duty 100 Period-Jitter MIN-MAX:JsABS [psec] 600 500 400 300 200 100 0 Fig.25 36MHz Temperature－Rise-time Fig.26 36MHz Temperature－Fall-time 90 Period-Jitter 1s :JsSD [psec] 80 70 60 50 40 30 20 10 0 -25 0 25 50 temperature:T [℃] 75 100 VDD=3.6V VDD=2.7V VDD=3.3V VDD=2.7V VDD=3.3V VDD=3.6V -25 0 25 50 temperature:T [℃] 75 100 Fig.27 36MHz Temperature－Period-Jitter 1σ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig.28 36MHz Temperature－Period-Jitter MIN-MAX 6/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Reference data (BU7345HFV Temperature and Supply voltage variations data) 55 54 53 Technical Note 5 VDD=2.7V 5 4 Rise time:tr [nsec] 4 Fall time:tf [nsec] VDD=2.7V VDD=3.3V 52 Duty: Duty [%] 51 50 49 48 47 46 45 -25 0 25 50 75 temperature:T [℃] 100 VDD=3.3V VDD=2.7V VDD=3.6V 3 3 2 VDD=3.6V VDD=3.3V 2 VDD=3.6V 1 1 0 -25 0 25 50 75 100 temperature:T [℃] 0 -25 0 25 50 temperature:T [℃] 75 100 Fig.29 38MHz Temperature－Duty 100 90 Period-Jitter 1s:JsSD [psec] 80 70 60 50 40 30 20 10 0 -25 0 25 50 temperature:T [℃] 75 100 VDD=3.6V VDD=2.7V VDD=3.3V Fig.30 38MHz Temperature－Rise-time 600 Period-Jitter MIN-MAX:JsABS [psec] 500 400 300 200 100 0 -25 0 25 50 temperature:T [℃] 75 100 VDD=2.7V Fig.31 38MHz Temperature－Fall-time VDD=3.3V VDD=3.6V Fig.32 38MHz Temperature－Period-Jitter 1σ 55 54 53 Fig.33 38MHz Temperature－Period-Jitter MIN-MAX 5 VDD=2.7V 5 4 Rise time:tr [nsec] 4 VDD=2.7V 51 50 49 48 47 46 45 -25 0 VDD=3.3V VDD=3.6V Fall time:tf [nsec] 52 Duty: Duty [%] 3 3 2 VDD=3.6V VDD=3.3V 2 VDD=3.6V VDD=3.3V VDD=2.7V 1 1 0 25 50 75 temperature:T [℃] 100 0 -25 0 25 50 75 temperature:T [℃] 100 -25 0 25 50 temperature:T [℃] 75 100 Fig.34 36MHz Temperature－Duty 100 Period-Jitter MIN-MAX:JsABS [psec] 90 Period-Jitter 1s :JsSD [psec] 80 70 60 50 40 30 20 10 0 -25 0 25 50 temperature:T [℃] 75 100 VDD=3.6V VDD=2.7V VDD=3.3V Fig.35 36MHz Temperature－Rise-time 600 500 400 300 200 100 0 -25 0 25 50 75 temperature:T [℃] 100 Fig.36 36MHz Temperature－Fall-time VDD=2.7V VDD=3.3V VDD=3.6V Fig.37 36MHz Temperature－Period-Jitter 1σ Fig.38 36MHz Temperature－Period-Jitter MIN-MAX www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Reference data (BU7346GUL Temperature and Supply voltage variations data) 55 54 53 Duty:Duty [%] VDD=3.6V Technical Note 5 VDD=2.7V 5 4 Ris e t ime:t r [ns ec] 4 Fall time:tf [nsec] VDD=2.7V 52 51 50 49 48 47 46 45 -25 0 25 50 75 temperature:T [℃] 100 VDD=3.3V VDD=2.7V 3 3 2 VDD=3.6V VDD=3.3V 2 VDD=3.6V VDD=3.3V 1 1 0 -25 0 25 50 75 temperature:T [℃] 100 0 -25 0 25 50 temperature:T [℃] 75 100 Fig.39 38MHz Temperature－Duty 100 Period-Jitter MIN-MAX:JsABS [psec] 90 Period-Jitter 1s :JsSD [psec] 80 70 60 50 40 30 20 10 0 -25 0 25 50 75 temperature:T [℃] 100 VDD=3.3V VDD=3.6V VDD=2.7V Fig.40 38MHz Temperature－Rise-time 600 500 400 VDD=3.6V Fig.41 38MHz Temperature－Fall-time 300 200 100 0 -25 0 VDD=2.7V VDD=3.3V 25 50 temperature:T [℃] 75 100 Fig.42 38MHz Temperature－Period-Jitter 1σ 55 54 53 Fig.43 38MHz Temperature－Period-Jitter MIN-MAX 5 VDD=2.7V 5 4 Rise time:tr [nsec] 4 VDD=2.7V 52 Duty:Duty [%] 51 50 49 48 47 46 45 -25 0 25 50 75 100 temperature:T [℃] VDD=3.3V VDD=2.7V VDD=3.6V Fall time:tf [ns ec] 3 3 2 VDD=3.6V VDD=3.3V 2 VDD=3.6V VDD=3.3V 1 1 0 -25 0 25 50 temperature:T [℃] 75 100 0 -25 0 25 50 75 temperature: T [℃] 100 Fig.44 36MHz Temperature－Duty 100 Period-Jitter MIN-MAX:JsABS [psec] 600 500 400 300 200 100 0 -25 Fig.45 36MHz Temperature－Rise-time Fig.46 36MHz Temperature－Fall-time 90 Period-Jitter 1s :JsSD [psec] 80 70 60 50 40 30 20 10 0 -25 0 25 50 temperature:T [℃] 75 100 VDD=3.3V VDD=3.6V VDD=2.7V VDD=2.7V VDD=3.3V VDD=3.6V 0 25 50 75 temperature:T [℃] 100 Fig.47 36MHz Temperature－Period-Jitter 1σ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig.48 36MHz Temperature－Period-Jitter MIN-MAX 8/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Block diagram, pin assignment/functions ○BU7344HFV PLL 6pin:IN 1 :VDD 2:VSS 3:OUT 6:IN 5： SEL 4： OE DATA1 DATA2 Technical Note 1/2 3pin:OUT 5pin:SEL 4pin:OE Fig.49 Pin assignment PIN No. 1 2 3 4 5 6 ○BU7345HFV PIN Name VDD VSS OUT OE SEL IN Fig.50 Block diagram Function Power supply GND Clock output terminal (SEL=L:40.5000MHz, SEL=H:36.0000MHz) Power-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L at disable Output selection (L:40.5000MHz, H:36.0000MHz) Clock input pin (27.0000MHz input) PLL 1:VDD 2:VSS 3:OUT 6:IN 5： SEL 4： OE 6pin:IN DATA1 DATA2 1/2 3pin:OUT 5pin:SEL 4pin:OE Fig.51 Pin assignment PIN No. 1 2 3 4 5 6 ○BU7346GUL A1:XIN Fig.52 Block diagram Function PIN Name VDD VSS OUT OE SEL IN Power supply GND Clock output terminal (SEL=L:38.0000MHz, SEL=H:36.0000MHz) Power-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L at disable Output selection (L:38.0000MHz, H:36.0000MHz) Clock input pin (27.0000MHz input) PLL B VDD VSS OUT DATA1 DATA2 1/2 B3:OUT A XIN 1 SEL 2 PDB 3 A2:SEL A3:PDB Fig.53 Pin assignment PIN No. A1 A2 A3 B1 B2 B3 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Bottom view Fig.54 Block diagram PIN Name XIN SEL PDB VDD VSS OUT Function Clock input pin (27.0000MHz input) Output selection (L:38.0000MHz, H:36.0000MHz) Power-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L at disable Power supply GND Clock output terminal (SEL=L:38.0000MHz, SEL=H:36.0000MHz) 9/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Application circuit example Technical Note VDD IN 27.0000MHz L : 40.5000MHz H : 36.0000MHz VSS SEL L : disable H : enable L : 40.5000MHz H : 36.0000MHz OUT OE Fig.55 Application circuit example(BU7344HFV) * For VDD and VSS, insert a bypass capacitor of approx. 0.1μF as close as possible to the pin.Bypass capacitors with good high-frequency characteristics are recommended. Even though we believe that the typical application circuit is worth of a recommendation, please be sure to thoroughly recheck the characteristics before use. ●Equivalent circuit Pin name Pin number Equivalent circuit OUT 3, B3 IFrom the inside of IC C内部から OE(PDB) SEL 4, A2 5, A3 To the inside of IC IC内部へ From the IC内部から inside of IC IN(XIN) 6, A1 To the inside of IC IC内部へ From the IC内部から inside of IC www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Appearance of Marker (Dimension including burr: Max. 1.8) 1.6±0.1 Technical Note Marker (Dimension including burr: Max. 2.8) 3.0±0.1 2.6±0.1 (1.4) (0.15) (1.2) (1.5) ○○ (0.45) 0.145±0.05 0.75MAX LOT No. 0.5 0.22±0.05 (Unit：mm) Fig.56 HVSOF6 Appearance of Marker Marker lists product name BU7344HFV BU7345HFV marker AN AP Marker ○○○ LOT No. Marker lists product name BU7346GUL marker AA8 (Unit：mm) Fig.57 VCSP50L1 Appearance of Marker www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as applied voltage (VDD or VIN), operating temperature range (Topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Recommended operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/13 2011.01 - Rev.A BU7344HFV,BU7345HFV,BU7346GUL ●Ordering part number Technical Note B Part No D 7 3 4 4 H F V - T R Part No 7344 7345 7346 Package HFV: HVSOF6 GUL: VCSP50L1 Packaging and forming specification TR: Embossed tape and reel (HVSOF6) E2: Embossed tape and reel (VCSP50L1) HVSOF6 1.6±0.1 (MAX 1.8 include BURR) 2.6±0.1 (MAX 2.8 include BURR) (1.5) Tape Quantity (0.45) Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold 654 3.0±0.1 Direction of feed (1.2) (1.4) 123 ( reel on the left hand and you pull out the tape on the right hand 1pin ) (0.15) 0.145±0.05 S 0.1 S 0.22±0.05 0.5 0.75Max. Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. VCSP50L1(BU7346GUL) 1.00±0.05 Tape Quantity 0.10±0.05 0.55MAX 1PIN MARK Embossed carrier tape 3000pcs E2 The direction is the 1pin of product is at the upper left when you hold 1.50±0.05 Direction of feed S ( reel on the left hand and you pull out the tape on the right hand ) 6-φ0.25±0.05 0.05 A B BB A 1 2 A 0.5 0.25±0.05 (φ0.15)INDEX POST 0.06 S 3 0.25±0.05 P=0.5×2 1pin Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/13 2011.01 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A