BD7693FJ-E2

Datasheet Boundary Conduction Mode Power Factor Correction Controller IC BD7693FJ BD7694FJ General Description Key Specifications BD7693FJ and BD7694FJ are Power Factor Correction IC for AC/DC supplies the system which is suitable for all the products needing power factor improvement. The PFC adopts boundary conduction mode (BCM), and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit lowering total harmonics distortion (THD) and can support IEC61000-3-2 Class-C. ◼ Input VCC Voltage Range: 10 V to 38 V ◼ Operating Current: 0.58 mA (Typ) ◼ Operating Temperature Range: -40 °C to +105 °C Package W (Typ) x D (Typ) x H (Max) 4.9 mm x 6.0 mm x 1.65 mm SOP-J8 Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Boundary Conduction Mode PFC Low THD Circuit Incorporation Low Power Consumption VCC UVLO Function ZCD by Auxiliary Winding Static OVP by the VS Pin Error Amplifier Input Short Protection Stable MOSFET Gate Drive Soft Start Lineup Product name BD7693FJ-E2 BD7694FJ-E2 Applications ◼ Brown Out ○ Lighting Equipment, AC Adopter, TV, Refrigerator, etc. Typical Application Circuit Diode Bridge VS MULT CS VCC 8 7 6 VCC OUT GND ZCD VS EO MULT CS 1 2 3 4 MULT CS VS 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 5 〇This product has no designed protection against radioactive rays. 1/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Pin Configuration (TOP VIEW) 8 7 6 VCC OUT GND ZCD VS EO MULT CS 1 2 3 4 5 Pin Description Pin No. Pin Name I/O 1 2 3 4 5 6 7 8 VS EO MULT CS ZCD GND OUT VCC I O I I I O I ESD Diode VCC GND ○ ○ ○ ○ ○ ○ ○ ○ Function Feedback input pin Error amplifier output pin Multiplier input pin Over current detection pin Zero current detection pin GND pin External MOSFET driver pin Power supply pin Block Diagram VOUT FUSE Diode Bridge VS MULT VCC GND + Filter Vac 1 shot + - UVLO 5.0 V Reg Timer 30 µs out reset TSD OVR Comp + - OVR OVR 0.3 V + - 2.250 V VS VS Comp 2.7 V / 2.6 V ErrAmp + EO MULT MULT + - SHORT Comp SP GCLAMP (12 V) SOVP Comp SOVP OR 2.5 V S PWM Comp 1.5 V POUT + Brown Out (BD7694 only) OUT UVLO SOVP AND R SP PRE Driver NOUT 100 kΩ TSD BROUT (BD7694 only) Multplier CS TSD Q UVLO OVR ZCD Internal Supply BGR 13.0 V / 8.0 V 0.67 V / 0.9 V BROUT www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Description of Blocks 1 VCC Protection This IC has VCC UVLO (Under Voltage Lock Out) of the VCC pin. Switching stops at the time of VCC voltage drop. In addition, when the VCC voltage becomes higher than the VCC_DIS1 (38 V Typ) voltage, it increases operating current and suppresses the rise in VCC voltage. When the VCC voltage lowers than the VCC_DIS2 (34 V Typ) voltage, the operating current becomes usual. This function assumes the case that the VCC voltage rises by startup resistance. 2 PFC: Power Factor Correction The power factor improvement circuit is a voltage control method of Boundary Conduction Mode. The outline operation circuit diagram is shown in Figure 1. The switching operation is shown in Figure 2. IL Diode Bridge Auxiliary winding for zero current detection PFC OUT AC IN Diode ZCD OUT MULT VS EO CS MOSFET PFC OUT Feedback Resistor GND RCS GND Figure 1. Operation Circuit Outline OCP Detect Resistor OUT (Gate) MOSFET (Vds) IL VCS VZCD 1 2 3 4 Figure 2. Switching Operation Timing Chart Switching Operation 1. MOSFET is turned on, and IL increases. 2. The IC compares Multiplier out with VCS slope, and MOSFET is off when the VCS voltage higher than Multiplier out. 3. MOSFET is off, and IL decreases. 4. The ZCD pin detects a zero point of the IL and turns on MOSFET. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Description of Blocks - continued 3 About ErrAMP 3.1 GmAMP The VS pin monitors a divided point for resistance of the output voltage. The ripple voltage of AC frequency (50 Hz / 60 Hz) overlaps with the VS pin. GmAMP removes this ripple voltage. GmAMP compares VAMP1 (2.500 V Typ) with the removed voltage, GmAMP controls the EO voltage by this gap. When the EO pin voltage rises, ON width of the OUT pin becomes wide. When the EO voltage less than VBURST (1.9 V Typ), the IC stops switching. Therefore, it can stop switching operation when the EO pin connects to the GND. Also, you must set the error amplifier constant so that the AC frequency does not overlap on the EO pin. And, please confirm it by an actual board. PFC Output VS + 2.500 V EO Figure 3. GmAMP Block Diagram 3.2 VS Short Protection The VS pin has a short protection function. A state of the VS pin voltage < VSHORT (0.3 V Typ) continues tVS_SH (150 µs Typ) or more, it stops switching. Figure 4 shows the operation. PFC Output VOUT VS VSHORT tVS_SH OUT Switching Stop Figure 4. Operation of VS Short Protection www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ 3 BD7694FJ About ErrAMP - continued 3.3 VS Overvoltage Protection Function (SOVP) The VS pin voltage rises from VOVP1 (2.7 V Typ), it stops switching immediately. The VS pin voltage less than VOVP2 (2.6 V Typ), it starts switching. Figure 5 shows the operation. PFC Output VOVP1 VOVP2 VS OUT Switching Stop Figure 5. VS Overvoltage Protection Operation 3.4 Over Voltage Reduce Function at Start Up (OVR) When the VS pin voltage performs a rise in startup to VOVR (2.25 V Typ) (equivalent to -10 % of output voltage), it discharges the EO voltage to the VBURST forcibly. OUT pulse width is narrows when the EO voltage falls, through rate of output voltage becomes slow and reduces over voltage in the startup. This function is effective only once after VCC UVLO cancellation. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Description of Blocks - continued 4 ZCD pin The zero current detection circuit is a function to detect a zero cross of the inductor current (I L) (Figure 6, 7). If the voltage at the ZCD pin becomes lower than VZCD2 (0.67 V Typ) after becoming higher than VZCD1 (0.9 V Typ), the OUT output becomes High after the ZCD output delay time (tZCD 260 ns Typ) has elapsed. When the ZCD voltage does not reach VZCD1 (0.9 V Typ), it becomes the restart timer operation. After the OUT output became Low, OUT becomes High after tREST (30 μs Typ) progress (Figure 8). Diode T1 ZCD + - OUT Control Logic MOSFET RCS Figure 6. Zero Current Detection Circuit OUT (Gate) VZCD1 VZCD2 VZCD tZCD Figure 7. Zero Current Detection OUT (Gate) VZCD1 VZCD tREST Figure 8. Restart Timer www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Description of Blocks - continued 5 MULTIPLIER The ON width of the OUT pin is fixed in Multiplier out and V CS as it showed in Figure 2. VCS is expressed in the following formula. 𝑉𝐶𝑆 = 𝐾 × 𝑉𝑀𝑈𝐿𝑇 (𝑉𝐸𝑂 − 𝑉𝐵𝑈𝑅𝑆𝑇 ) K: VMULT: VEO: VBURST: MULTIPLIER GAIN MULT pin voltage EO pin voltage Burst voltage AC voltage information is input into VMULT. The IC improves a power factor by controlling AC current with the AC voltage. In addition, VCS in AC voltage 0 V (VMULT = 0 V) is expressed in the following formula. 𝑉𝐶𝑆 = 𝐾 × 𝑉𝑀𝑈𝐿𝑇 (𝑉𝐸𝑂 − 𝑉𝐵𝑈𝑅𝑆𝑇 ) + 𝑉𝑂𝐹𝐹𝑆𝐸𝑇 = 𝑉𝑂𝐹𝐹𝑆𝐸𝑇 The ON width of the OUT pin at the age of AC voltage 0 V (VMULT = 0 V) becomes long by adding VOFFSET (25 mV Typ). Because ON width gets longer, diode bridge output voltage is discharged. As a result, an AC current distortion is improved without the current supply from a diode bridge stopping (Figure 9). Diode Bridge IL V VOFFSET less case VOFFSET case Remain voltage No remain voltage V1 V1 AC IN V OUT t t I AC current Stop ->High AC current distortion Non stop ->Improvement of the AC current distortion Figure 9. Improvement of the AC Current Distortion www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Description of Blocks - continued 6 MULT pin When the state that the MULT pin voltage is lower than VBROUT1 (0.8 V Typ) continues tBROUT (160 ms Typ) or more, the IC stops switching by a brown out function (only in BD7694). When the MULT pin voltage becomes higher than VBROUT2 (0.97 V Typ), the IC switches again. Switching OUT Stop Switching VBROUT2 VBROUT1 tBROUT VMULT Figure 10. Brown Out 7 CS pin In normal operation, turn OFF of the switching is usually decided by ON width by the EO pin and the MULT pin voltage. However, the IC is off in a pulse by pulse in overcurrent protection when the CS pin rises than VCS (1.5 V Typ). By this protection, it prevents an overcurrent to MOSFET. The overcurrent protection function limits ON width. When this protection becomes the working PFC load, PFC output voltage decreases. You must decide sense resistance of PFC so that this protection does not work in rated load with the minimum input voltage at the time of the application design. OUT Control Logic CS Over Current Protection 1.5 V Figure 11. Current Limit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Operation Mode of Protection Circuit Table 1 showed the operation mode of each protection function. Parameter Table 1. Operation Mode of Each Protective Circuit Protection Mode Contents Detection Detection Cancellation Method Operation Method Cancellation Operation VCC UVLO Under Voltage Lock Out on the VCC pin VCC < 8 V (Typ) (VCC drop) OUT OFF EO discharge VCC > 13 V (Typ) (VCC rise) Startup Operation CS OCP Over Current Protection on the CS pin CS > 1.5 V (Typ) (CS rise) OUT OFF CS < 1.5 V (Typ) (CS drop) Normal Operation VS Short Short Protection on the VS pin VS < 0.3 V (Typ) (VS drop) OUT OFF EO discharge VS > 0.3 V (Typ) (VS rise) Normal Operation VS Static OVP Over Voltage Protection on the VS pin VS > 2.7 V (Typ) (VS rise) OUT OFF VS < 2.6 V (Typ) (VS drop) Normal Operation Brown Out (Only BD7694) Low Voltage Protection on the MULT pin MULT < 0.8 V (Typ) (MULT drop) OUT OFF EO discharge MULT > 0.97 V (Typ) (MULT rise) Normal Operation www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit VMAX1 VMAX2 VMAX3 IZCD1 IOUT1 IOUT2 Tjmax Tstg -0.3 to +40 -0.3 to +14 -0.3 to +6.5 -10 to +10 -0.5 +1 +150 -55 to +150 V V V mA A A °C °C Maximum Voltage 1 Maximum Voltage 2 Maximum Voltage 3 Maximum Current 1 OUT Pin Output Peak Current 1 OUT Pin Output Peak Current 2 Maximum Junction Temperature Storage Temperature Range Condition VCC OUT CS, MULT, VS, EO ZCD current Source current Sink current Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Thermal Resistance (Typ) Symbol Unit 1s(Note 3) 2s2p(Note 4) θJA 149.3 76.9 °C/W ΨJT 18 11 °C/W SOP-J8 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Symbol Min Typ Max Unit VCC Topr 10 -40 15 +25 38 +105 V °C Supply Voltage Operating Temperature Condition VCC Voltage Recommended Range of the External Component (Ta = 25 °C) Parameter Symbol Rating Unit CVCC 22 or more μF VCC Pin Connection Capacity www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C) Parameter Symbol Min Typ Max Unit Condition Circuit Current (ON) 1 ION1 - 0.58 1.20 mA VS = 0 V Circuit Current (ON) 2 ION2 - 0.95 2.00 mA 50 kHz switching Circuit Current (ON) 3 ION3 4.5 9.0 13.5 mA VCC discharge Switching stop ISTART - 100 200 µA VCC = 12 V VUVLO1 VUVLO2 VUVLO3 VCC_DIS1 VCC_DIS2 12 7 3.8 - 13 8 5.0 38 34 14 9 6.2 - V V V V V VCC rise VCC drop VUVLO3 = VUVLO1 -VUVLO2 VCC rise VCC drop IVS - 0.1 0.5 µA VS = 0 V VAMP1 2.465 2.500 2.535 V Ta = 25 °C VAMP2 2.44 - 2.54 V Ta = -40 °C to +105 °C [Circuit Current] Start Up Current [VCC Pin Protection] VCC UVLO Voltage1 VCC UVLO Voltage2 VCC UVLO Hysteresis VCC Discharge Voltage1 VCC Discharge Voltage2 [Gm Amplifier Block] VS Pin Pull-up Current Gm Amplifier Reference Voltage1 Gm Amplifier Reference Voltage2 Gm Amplifier Line Regulation Gm Amplifier Trans Conductance Gm Amplifier Source Current Gm Amplifier Sink Current [EO Block] EO L Voltage Burst Voltage EO Discharge Current [MULT Block] MULT Pin Pull-up Current MULT Pin Dynamic Range VAMP_LINE - 1 10 mV TVS 80 100 130 µA/V IEO_SOURCE IEO_SINK 5 5 10 10 20 20 µA µA VS = 2.3 V VS = 2.7 V VEOL VBURST IEO 1.8 0.8 1.6 1.9 1.8 1.8 3.0 V V mA VS = 2.7 V IMULT VMULT 0.1 0 to 3.5 VBURST to 3.4 0.65 0.5 - µA V MULT = 0 V - V K 0 to 2.5 VBURST to 2.9 0.43 0.87 1/V Brown Out Detect Voltage1 VBROUT1 0.7 0.8 0.9 V Brown Out Detect Voltage2 VBROUT2 0.87 0.97 1.07 V tBROUT 80 160 320 ms VZCD1 VZCD2 tZCD VIH VIL tREST 0.8 0.55 6.1 -0.3 15 0.9 0.67 260 6.7 -0.1 30 1.0 0.79 520 45 V V ns V V µs VSHORT 0.2 0.3 0.4 V tVS_SH 50 150 300 µs VOVR - - V EO Pin Dynamic Range VEOD MULTIPLIER Gain Brown Out Detect Timer [ZCD Block] ZCD Threshold Voltage1 ZCD Threshold Voltage2 ZCD Output Delay Input H Clamp Voltage Input L Clamp Voltage Restart Timer [VS Protection Block] VS Short Protection Detection Voltage VS Shortstop Protection Detection Time Over Voltage Reduce Detection Voltage VS Overvoltage Protection Detection Voltage 1 VS Overvoltage Protection Detection Voltage 2 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VOVP1 VOVP2 1.065 x VAMP1 1.020 x VAMP1 0.9 x VAMP1 1.080 x VAMP1 1.040 x VAMP1 11/22 1.095 x VAMP1 1.060 x VAMP1 VCC = 10 V to 38 V EO = 2.5 V, Ta = 25 °C VCC = 12 V, EO = 1.0 V MULT = 0.5 V, EO = 3.0 V MULT drop BD7694FJ Only MULT rise BD7694FJ Only BD7694FJ Only ZCD rise ZCD drop Isink = 3 mA Isource = -3 mA V VS rise Ta = 25 °C V VS drop Ta = 25 °C TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C) - continued Parameter Symbol Min Typ Max Unit VCS tDELAY ICS VOFFSET 1.3 - 1.5 150 0.15 25 1.8 300 1.00 - V ns µA mV VPOUTH VPOUTL 9.0 - 10.2 - 11.4 0.8 V V Rise Time tr - 50 - ns Fall Time tf - 50 - ns RPDOUT 50 100 150 kΩ [CS Block] CS Threshold Voltage Output Delay Time CS Pin Pull-up Current CS Offset Voltage [OUT Block] OUT H Voltage OUT L Voltage OUT Pull-down Resistance www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/22 Condition CS = 0 V MULT = 0 V OUT = -20 mA OUT = +20 mA OUT load capacitor = 1000 pF OUT L Voltage to 5 V OUT load capacitor = 1000 pF OUT H Voltage to 5 V TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Typical Performance Curves (Reference data) 1.6 VEO = 4.50 V 1.4 VEO = 3.50 V VEO = 4.00 V VEO = 3.00 V 1.2 VEO = 2.75 V VEO = 2.50 V VCS[V] 1 0.8 VEO = 2.25 V 0.6 0.4 0.2 VEO = 2.00 V 0 0 1 2 3 4 VMULT[V] 2.535 2.530 2.525 2.520 2.515 2.510 2.505 2.500 2.495 2.490 2.485 2.480 2.475 2.470 2.465 -40 -10 20 50 80 Temperature: Ta[˚C] 110 Figure 13. Gm Amplifier Reference Voltage1 vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Gm Amplifier Reference Voltage1: VAMP1[V] Gm Amplifier Reference Voltage1: VAMP1[V] Figure 12. VCS vs VMULT 2.535 2.530 2.525 2.520 2.515 2.510 2.505 2.500 2.495 2.490 2.485 2.480 2.475 2.470 2.465 10 15 20 25 30 35 VCC Supply Voltage: VCC[V] Figure 14. Gm Amplifier Reference Voltage1 vs VCC 13/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Typical Performance Curves - continued 200 180 Start Up Current: ISTART[µA] VS Overvoltage Protection Detection Voltage1: VOVP1[V] 1.095 1.090 1.085 1.080 1.075 160 140 120 100 80 60 40 1.070 20 0 1.065 -40 -10 20 50 80 Temperature: Ta[˚C] -40 110 Figure 15. VS Overvoltage Protection Detection Voltage1 vs Temperature 20 50 80 Temperature: Ta[˚C] 110 Figure 16. Start Up Current vs Temperature 12 14 VUVLO1 13 10 OUT H Voltage: VPOUTH[V] VCC UVLO Voltage: VUVLO[V] -10 12 11 10 9 VUVLO2 8 6 4 2 8 7 0 -40 -10 20 50 80 Temperature: Ta[˚C] 110 10 Figure 17. VCC UVLO Voltage vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16 22 28 34 VCC Supply Voltage: VCC[V] 40 Figure 18. OUT H Voltage vs VCC 14/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Application Example F1 D3 L LF1 R1 R2 DB1 C3 ZNR1 R3 R16 N VOUT + D4 T1 C4 C16 R7 C1 C2 R4 D1 C5 D2 R9 R17 M1 R10 R11 R15 C15 R12 C14 R5 VCC OUT R18 GND ZCD BD7693FJ/BD7694FJ C6 C17 IC1 VS EO MULT CS R13 R8 R6 C7 C8 C10 C9 R19 C13 C11 R20 R14 C12 GND Figure 19. Application Example 1 Output Voltage Setting The output voltage is decided on feedback resistance by the VS pin. (𝑅 +𝑅 ) 𝑉𝑂𝑈𝑇 = (1 + (𝑅 17//𝑅18 )) × 𝑉𝐴𝑀𝑃 = (1 + 19 𝑅17 + 𝑅18 : 𝑅19 //𝑅20 : 𝑉𝐴𝑀𝑃 : 2 20 1582 𝑘𝛺 10 𝑘𝛺 ) × 2.5 𝑉 = 398 [V] Upper side resister of the output feedback Bottom side resister of the output feedback Gm amplifier reference voltage1 Calculation of the Inductance Reference value in case of VOUT = 400 V, Output power = 200 W 𝐿 = 250 [μH] Setting a large value of inductance will reduce the THD but increase the component size. 3 External Parts of VCC The VCC pin can reduce VCC voltage change at the time of the switching by attaching capacitor. This IC drives gate capacitor of the external MOSFET by the OUT pin. The VCC capacitor recommends electric field capacitor 22 µF or more withstand pressure 50 V or more. In addition, you must confirm VCC voltage evaluation at the time of startup and the protection detection with an actual board when VCC is generated by startup resistance and the auxiliary winding of the transformer. Because the consumption current of the IC decreases when an IC becomes the switching stop state after startup, the VCC voltage may rise by startup resistance. The overvoltage destruction of VCC is prevented by VCC voltage discharge function. The startup resistor value makes small by this function, boot-time becomes fast. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Attention in the Board Design About parts placement You must locate the parts in the Figure 20 inside dot line near the IC. In addition, please do parts placement to avoid the interference with switching lines and high current lines such as inductor, DRAIN. F1 D3 L R2 DB1 LF1 R1 C3 ZNR1 R3 R16 N VOUT + D4 T1 C4 C16 R7 C1 C2 R4 D1 C5 D2 R9 R17 M1 R10 R11 R15 C15 R12 C14 R5 VCC OUT R18 GND ZCD BD7693FJ/BD7694FJ C6 C17 IC1 VS EO CS MULT R13 R8 R6 C7 C8 C9 C10 R19 C13 C11 R20 R14 C12 GND Figure 20. Parts Placement About GND wiring guidance The red line of Figure 21 is the GND lines which large current flows. Draw each line as an independent wire. In addition, pull the wiring thick and short. The blue line is the GND of the IC. Make the GND of the IC and the GND of the peripheral parts common. F1 D3 L LF1 R1 R2 DB1 ZNR1 C3 R3 R16 N VOUT + D4 T1 C4 C16 R7 C1 C2 R4 D1 C5 D2 R9 R17 M1 R10 R11 R15 C15 R12 C14 R5 VCC OUT R18 GND ZCD BD7693FJ/BD7694FJ C6 C17 IC1 VS EO MULT CS R13 R8 R6 C7 C8 C9 C10 R19 C13 C11 R20 R14 C12 GND Figure 21. GND Line Layout www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Attention in the Board – continued About large current line Large circuit current flows through the part of the red line of Figure 22. You must wire it short and thickly. Do not place IC and high impedance line near the red line because it has large noise. F1 D3 L LF1 R1 R2 DB1 C3 ZNR1 R3 R16 N VOUT + D4 T1 C4 C16 R7 C1 C2 R4 D1 C5 D2 R9 R17 M1 R10 R11 R15 C15 R12 C14 R5 VCC OUT R18 GND ZCD BD7693FJ/BD7694FJ C6 C17 IC1 VS EO MULT CS R13 R8 R6 C7 C8 C9 C10 R19 C13 C11 R20 R14 C12 GND Figure 22. High Current Line Layout I/O Equivalence Circuits VS 1 2 EO Internal Reg 5 ZCD MULT 3 Internal Reg 6 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 GND 7 17/22 4 CS Internal Reg OUT 8 VCC TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 23. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Ordering Information B D 7 6 9 x F J E2 - x: Brown Out Package 3: NoneFJ: SOP-J8 4: With Packaging and forming specification E2: Embossed tape and reel Marking Diagram SOP-J8 (TOP VIEW) Part Number Marking LOT Number Pin 1 Mark Product name BD7693FJ-E2 BD7694FJ-E2 Part Number Marking D7693 D7694 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SOP-J8 21/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 BD7693FJ BD7694FJ Revision History Date Revision 25.Nov.2020 001 Changes New Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/22 TSZ02201-0F1F0A200730-1-2 25.Nov.2020 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001