Datasheet
1.5A LED Camera Flash Driver
Synchronous Rectification Step-Up DC/DC
BD7757MWX
Key Specifications
Input Voltage Range :
LED current (FLASH):
LED current (TORCH):
Switching Frequency :
Pch FET On Resistance :
Nch FET On Resistance :
Standby Current at shut down :
Operating Temperature Range:
General Description
The BD7757MWX is a 1.5A Flash LED Driver with
Synchronous rectification step up DC/DC converter that
can drive 1LED. The LED current, timer, and UVLO
threshold can be varied by using UPIC++ (Uni-Port
Interface Control ++).
Features
Synchronous rectification step-up DC/DC converter.
Control of registers via Uni-Port Interface Control ++
(UPIC)
Maximum current of 1.5A in Flash mode
(Low side LED Driver).
Lighting Mode Setup
Flash Mode…1.5A (Max)
Torch Mode…450mA (Max)
Variable LED current
Protection Circuit:
Over Current Protection Circuit (OCP)
Over Voltage Protection Circuit (OVP)
VOUT – GND Short Protection Circuit
LED Short / Open Protection Circuit
Under Voltage Lock Out Circuit (UVLO)
Thermal Shut Down Circuit (TSD)
Battery Drop Protection Circuit
Flash Timer Protection Circuit
Package
USON014X3020
2.7V to 5.0V
1.5A (Max)
450mA (Max)
2MHz (Typ)
150mΩ (Typ)
100mΩ (Typ)
0μA (Typ)
-30℃ to +85℃
W(Typ.) x D(Typ.) x H(Max.)
3.00mm x 2.00mm x 0.60mm
Pin Configuration
Applications
Flash LED Driver for camera and smart phone
DSC, DVC
Video Lighting for Digital Video Applications
Amusement accessory
Figure 2. Pin Configuration
Typical Application Circuit
Figure 1. Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed for protection against radioactive rays
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Datasheet
BD7757MWX
Pin Description
Terminal
No.
Pin Name
ESD Diode
In/
Out
For Power
Function
For GND
1
AGND
-
-
-
2
CONTROL1
In
-
GND
UPIC++ control input
GND
Flash/Torch current output
3
FL
Out
-
4
CONTROL2
In
-
GND
-
Ground
Flash ON/OFF terminal.
(Compulsive lighting, even if control1=Low state.
Output flash current set with initial state at control1=Low state.)
5
AGND
-
-
6
IN
In
-
GND
Power supply
7
PGND
-
-
-
Power ground
8
OUT
Out
-
GND
-
-
Ground
DCDC output voltage
9
NC
-
10
SW
In
-
GND
No connection
11
CONTROL3
In
-
GND
12
NC
-
-
-
No connection
-
Power ground
GND
Switching output
Flash ON/OFF terminal.
(Compulsive lighting, even if control1=Low state.
Output flash current set with initial state at control1=Low state.)
13
PGND
-
-
14
RSET
Out
-
The resistor connection terminal of output LED current setting.
Block Diagram
Figure 3. Block Diagram
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Datasheet
BD7757MWX
Absolute Maximum Ratings
Parameter
Input voltage [All Terminal]
Power Dissipation
Operating Temperature Range
Storage Temperature
Symbol
VMAX
Pd
Topr
Tstg
Limit
7
1.75 (*1)
-30 to +85
-55 to +150
Unit
V
W
o
C
o
C
Limit
2.7 to 5.0
1.5
450
Unit
V
A
mA
*1 Derate by 14mW/°C when operating above 25°C (Mount on 2-layer board)
Recommended Operating Conditions
Parameter
Supply Voltage
Maximum Output Current in Flash Mode
Maximum Output Current in Torch Mode
Symbol
VIN
IFLED_MAX
ITLED_MAX
o
Electrical Characteristics (Unless otherwise specified, Ta = +25 C, VBAT=3.6V)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Low Threshold Voltage
VIL
-0.3
-
0.4
V
CONTROL1,2,3
High Threshold Voltage
VIH
1.4
-
5.2
V
CONTROL1,2,3
CONTROLx=High Input Current
IFH
-
36
70
µA
CONTROL1,2,3=3.6V
CONTROLx=Low Input Current
IFL
-1
0
1
µA
CONTROL1,2,3=0V
Control1 High Time
tHI
1
-
100
µs
Control1 Low Time
tLO
1
-
100
µs
Access Available Time
tACC
-
-
500
µs
Control1 Off Timeout
tOFF
-
-
500
µs
Latch Time
tLAT
-
-
1
ms
IQ
-
0.1
2.0
μA
Current Consumption
IDD1
-
3.0
-
mA
ILED=100mA
SW NMOS On Resistance
RONN
-
0.10
-
Ω
VIN=3.6V, at 200mA
SW PMOS On Resistance
RONP
-
0.15
-
Ω
Inductor Current Limit
ICOIL
-
3
-
A
VOUT=3.6V at 200mA
This parameter is tested in dc
measurement.
Switching Frequency
fSW
1.6
2
2.4
MHz
Duty
50
80
-
%
Vo
-
-
5.1
V
Over Voltage Protection Limit
VOVP
-
5.4
5.7
V
LED Short Threshold Voltage
VSTV
1.5
1.7
1.9
V
LED Test Current during LED
Short Protect
ITLED
1
2
3
mA
Headroom Voltage
VHR
0.18
0.23
0.28
V
At step up condition
Torch LED Current Accuracy
IT-DIFF
-10
0
10
%
ILED=100mA
Flash LED Current Accuracy
IF-DIFF1
-10
0
10
%
ILED=1.0A
UVLO Cancel Voltage
VUVLO
2.4
2.5
2.6
V
VIN Sweep Up
VUVLO_HYS
0.2
0.3
0.4
V
VIN Sweep Down
Logic controller
Others
Quiescent Current
Duty Cycle Limit
Output Voltage Range
UVLO Hysteresis Voltage
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VHR=0.0V
VHR=0.0V
(VOUT-VFL) =SWEEP UP
VFL=2V
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Datasheet
BD7757MWX
Typical Performance Curves
100
100
95
95
FLASH0.75A (A2D16)
FLASH1.0A (A2D11)
90
85
85
80
80
Effeciency [%]
Effeciency [%]
90
75
FLASH1.5A (A2D1)
70
75
70
TORCH=150mA
(A3D11)
65
65
TORCH=200mA (A3D9)
60
60
55
55
50
2.7
TORCH=300mA (A3D6)
TORCH=450mA (A3D1)
50
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
4.5
2.7
2.9
3.1
3.3
IN Voltage [V]
3.5
3.7
4.1
4.3
4.5
Figure 5. Efficiency [%] vs. IN Voltage [V]
(Torch Mode)
Figure 4. Efficiency [%] vs. IN Voltage [V]
(Flash Mode)
400
3
RSET=90kohm
2.8
2.6
IN=5.0V
300
IN=3.6V
2.4
UVLO Detect
RSET Voltage [mV]
Circuit current [mA]
3.9
IN Voltage [V]
2.2
2
IN=2.7V
1.8
RSET=90kΩ
IFL=100mA
VFL=0.6V
TORCH MODE
1.6
1.4
UVLO Cancel
200
100
1.2
0
1
-40.0
-20.0
0.0
20.0
40.0
60.0
1.5
80.0
Figure 6. Circuit Current [mA] vs. Temperature [℃]
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1.7
1.9
2.1
2.3
2.5
2.7
2.9
IN Voltage [V]
Temp [℃]
4/24
Figure 7. RSET Voltage [V] vs. IN Voltage [V]
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Datasheet
BD7757MWX
Typical Performance Curves - continued
2.4
160
VBAT=3.6V
RSET=90kohm
TORCH MODE
140
VBAT=3.6V
OUT=3.6V
RSET=90kohm
2.2
100
SW Frequency [MHz]
FL output current [mA]
120
OVP Detect
80
OVP Cancel
60
2
1.8
40
20
1.6
0
5.0
5.1
5.2
5.3
5.4
-40.0
5.5
-20.0
0.0
Figure 8.
FL output current [A] vs. OUT Voltage [V]
40.0
60.0
80.0
Figure 9. SW Frequency [MHz] vs. Temperature [°C]
1.10
110.0
VBAT=3.6V
VFL=0.6V
RSET=90kohm
TORCH MODE
108.0
106.0
VBAT=3.6V
VFL=0.6V
RSET=90kohm
FLASH MODE
1.08
1.06
1.04
FL output current [A]
104.0
FL output current [mA]
20.0
Temperature [°C]
OUT Voltage [V]
102.0
100.0
98.0
1.02
1.00
0.98
96.0
0.96
94.0
0.94
92.0
0.92
90.0
0.90
-40
-20
0
20
40
60
80
Temperature [°C]
-20
0
20
40
60
80
Temperature [°C]
Figure 10. FL output current [mA] vs. Temperature [°C]
at TORCH 100mA
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Figure 11. FL output current [A] vs. Temperature [°C]
at FLASH 1.0A
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Datasheet
BD7757MWX
Functional Description
1. Maximum Flash Current setup
The maximum Flash current can be set by varying the value of RSET which is connected to RSET-GND terminal.
The resistor value can be calculated using the equation:
Flash current = 1.0 A×90 kΩ
RSET
1-1 Maximum Flash Current Setup
RSET
Flash Current
60 kΩ
ILED = 1.5A
75 kΩ
ILED = 1.2A
90 kΩ
ILED = 1.0A
If RSET is set less than 36kΩ (typ.), the LED current is stopped by internal ISET short limit circuit.
2. Register control
Flash-to-Torch ratio can be controlled by the 16-data register. The on/off control of LED current, the Flash timer, the LED
current threshold at timer start and the low battery detect can also be set through the register.
Register Map is as follows;
(N: number of edges)
2-1 Address Map (Initial Address = 1)
N
Address
Addressed register
Select Torch/FLASH mode.
1
1
Select Inhibit/AUX
2
2
FLASH current setting
3
3
TORCH current setting
4
4
LED timer setting
5
5
LED current threshold at timer start
6
6
Low Battery detection setting
Data
1-3
4- 5
1-16
1-16
1-16
1-8
1-10
Initial Data
1 (POFF)
1 (1.0A at RSET=90k)
11 (100mAat RSET=90k)
10 (1000ms)
6 (300mA)
10 (No detect)
2-2 Address Description
Address 1 : LED Mode
N
Data
Symbol
Mode Description
13
14
15
16
17
1*
2
3
4
5
POFF
TON
FON
FINH
AUX
Power OFF
Torch ON
Flash ON
Inhibit ON
AUX ON
Address 2, : Flash Current Ratio
Flash current = Maximum Flash current ×Fratio
(n≥18, NOP)
POFF…STOP LED and DCDC output.
FINH…Mode changes to torch mode correspondingly
AUX…Flash mode turns ON compulsorily with initial data
(data=1)
* Initial Data = 1
N
Data
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
1*
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Fratio
RSET
=60kΩ
RSET
=90kΩ
100.0%
96.7%
93.3%
90.0%
86.7%
83.3%
80.0%
76.7%
73.3%
70.0%
66.7%
63.3%
60.0%
56.7%
53.3%
50.0%
1500mA
1450mA
1400mA
1350mA
1300mA
1250mA
1200mA
1150mA
1100mA
1050mA
1000mA
950mA
900mA
850mA
800mA
750mA
1000mA
967mA
933mA
900mA
867mA
833mA
800mA
767mA
733mA
700mA
667mA
633mA
600mA
567mA
533mA
500mA
(n≥29, NOP)
* Initial Data = 1
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BD7757MWX
Functional Description – continued
Address 4 : Flash Timer
Address 3 : Torch Current Ratio
Torch current =Maximum Torch current×Tratio
N
Data
Tratio
RSET
=60kΩ
RSET
=90kΩ
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
8
9
10
11 *
12
13
14
15
16
100.0%
93.3%
86.7%
80.0%
73.3%
66.7%
60.0%
53.3%
46.7%
40.0%
33.3%
26.7%
20.0%
13.3%
6.7%
0%
450mA
420mA
390mA
360mA
330mA
300mA
270mA
240mA
210mA
180mA
150mA
120mA
90mA
60mA
30mA
0.0mA
300mA
280mA
260mA
240mA
220mA
200mA
180mA
160mA
140mA
120mA
100mA
80mA
60mA
40mA
20mA
0.0mA
N
Data
Flash Timer
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
8
9
10 *
11
12
13
14
15
16
20ms
40ms
60ms
80ms
100ms
200ms
400ms
600ms
800ms
1000ms
1200ms
1400ms
1600ms
1800ms
2000ms
Timer off
(n≥29, NOP)
* Initial Data = 10
(n≥29, NOP)
* Initial Data = 11
Address 5: LED Current Threshold at Timer Start
N
Data
13
14
15
16
17
18
19
20
1
2
3*
4
5
6
7
8
Address 6: Low Battery Detection
LED current threshold at timer start
N
400mA
350mA
300mA
250mA
200mA
150mA
100mA
50mA
13
14
15
16
17
18
19
20
21
22
(n≥21, NOP)
* Initial Data = 3
Data
1
2
3
4
5
6
7
8
9
10 *
Battery voltage
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.0
2.8
No detect
(n≥23, NOP)
* Initial Data = 10
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Datasheet
BD7757MWX
Functional Description – continued
3. Register Access Control Protocol
LED current is controlled through the Control1 terminal whose input is from the uni-Port interface. The register can be
accessed by using the protocol below.
(The first rising edge to Control1 from the time of shutdown is not included in address and data assignment.)
○Address / Data Selection Waveform
Control1
tHI
tLO
Figure 13. Control1 Signal Timing Diagram
item
High input time ( tHI )
Low input time ( tLO )
MIN
1us
1us
MAX
100us
100us
○Example：Address = 3・Data = 8 (changes FLASH current to 53.3%)
This edge is not
counted for “n”.
n=
1
17 18
2
19
tACC
Start
3 edges
20
tLAT
tLAT
20 edges
N = 20, Data = 8
Address
Register applies
Address
1
Data
1
.
3
8
Figure 14. Example of Control1 Signal
After the UVLO circuit is triggered, all register settings are reset. Hence, the registers has to be set again once UVLO circuit
is cancelled (VBAT>2.5V) *.
*Please refer to “Electrical Characteristics” on P.3 for the specification on each symbol.
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BD7757MWX
4. Startup and Shut Down Sequence
○Example of FLASH action using control1.
1. After power up of IN terminal, input signal to control1.
2. If none of the protection circuit is enabled, VOUT starts charging after sending the Flash or Torch lighting signal.
3. Test current (2mA, typ.) is loaded from FL current when it reaches VOUT>VIN-0.25V. At that time, output FL current, if
STV is not detected yet, Soft Start (SS:IC built-in circuit) starts to charger..
4. DCDC completes boost up and LED current is stable.
5. Setting Control1=L turns off the IC after tOFF time.
1
5
2
4
3
Figure 15. Startup and Shut down Sequence using Control1
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○FLASH Action using Control2 or Control3
1. After power up of IN terminal, input signal to control1 and next input control2 or control3. Set condition by Control1,
before input control2 or control3.
2. If none of the protection circuit is enabled, VOUT starts charging.
3. Test current (2mA, typ.) is loaded from FL current when it reaches VOUT>VIN-0.25V. At that time, output FL current, if
STV is not detected yet, Soft Start (SS:IC built-in circuit) starts to charger..
4. DCDC completes boost up and LED current is stable.
5. Setting Control2,3=L turns off the IC after tOFF Time
1
VIN
5
tOFF
Control2,3
IC State
ACT(FLASH ON BY CONTROL2,3)
SHUTDOWN
Control1
SHUTDOWN
Initial
Setting
VIN-0.25V
UVLO/Low BAT UVLO/OVP/RSET SHORT/SCP
NO detect Condition
FL
VOUT/FL
2
OUT
STV No detection
4
IFL
3
Output
SS(internal IC)
SW
Figure 16. Startup and Shut Down Sequence using Control2 or Control3
*Startup in Flash operation by Control2 or 3=H and Control1=Low state, Control1 cannot receive signal.
Therefore, when setting change is assumed during the compulsive flash operation by control2 or 3, first of all, please input
anything signal into control1 ( for keeping control1=H state). And control1 becomes possible receiving the signal also during
the compulsive FLASH operation by setting control2 or 3=High state.
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BD7757MWX
5. Flash or Torch Mode Selection
Switching between Flash and Torch mode can be done using Control1, 2 or 3
Control terminal name
Input signal
Function
A1/D1
LED/DCDC=OFF
A1/D2
Torch Mode
A1/D3
Flash Mode
Control1
A1/D4
Forcibly changes to Torch Mode (FINH)
A1/D5
FLASH turn ON forcibly with initial data (AUX)
Forced Flash lighting (output in address/data assigned current)
Control2*
High
Forced Flash even when Control1=Low state
Forced Flash lighting (output in address/data assigned current)
Control3*
High
Forced Flash even when Control1=Low state
※Control2,3 are the same function
○Priority number of FLASH/TORCH selection
Priority 1
Priority 2
Priority 3
Control2
Control1：A1/D4 (FINH)
Control1：A1/D5 (AUX)
Compulsive FLASH operation
Compulsive TORCH
Compulsive FLASH operation with
Control3
operation
initial condition data
Compulsive FLASH operation
For example, when specifying A1/D4 by Control1 and switching to TORCH mode,
TORCH state is continued even if Control3=High
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Priority 4
Control1：A1/D2
(TORCH operation)
Control1：A1/D3
(FLASH operation)
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Datasheet
BD7757MWX
6. Regarding LED output current
○FLASH Control
When the setting changes to Flash mode, the maximum output current can be set up to 1.5A
The control method for setting FLASH mode
Control terminal name
Input signal
Control Function
A1/D3
FLASH mode
Control1
A1/D5
FLASH turn ON forcibly with initial data (AUX)
Forced Flash lighting (output in address/data assigned current)
Control2
High
Forced Flash even when Control1=Low state
Forced Flash lighting (output in address/data assigned current)
Control3
High
Forced Flash even when Control1=Low state
If the setting continues to send high current to the LED for an extended period of time, it will generate heat to the IC and will
cause lower luminance. In order to prevent this, FLASH TIMER function is built in and that time can be changed by setting
the register (Typ 1.0s).
Please refer to the maximum LED current specification (p.6) and set up LED timer (p.7).
○LED Timer Function
LED current threshold at timer start
This setting can be set by register 5
50mA~400mA (Initial setting=300mA)
・LED Timer
This setting can be set by register 4
20ms~2000ms
NO TIMER can also be selected (Initial setting=1000ms)
Figure 17. Timer Operation 1
By setting the register, BD7757MWX can change the LED current threshold at timer start and the LED timer. Timer
operation is applicable in both Flash and Torch mode.
When the light on the LED’s turn off because the timer finished, the following sequences are required in order to make the
light re-switch back on.
・Re-lighting by control1
1. Input Address=1/Data=1 -> turn off LED/DCDC operation. -> Input Re-lighting signal.
2. Control1= Low during TOFF -> input re-start signal
・Re-lighting by control2 or control3
1. Control2 or control3=Low -> Input Control2 or control3=Low→High.
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Datasheet
BD7757MWX
Counter is reset when LED current crosses the threshold during a timer count. While, when LED current goes over the
LED current threshold,it counts back from the start.
LED current threshold at timer start
Figure 18. Timer Operation 2
Moreover, Counter is reset when LED current is set to turn off by control1,2 or 3 during a count.
○Forced Flash (Control2,3)
Flash is turned on forcibly by sending a high signal to Control2 or Control3(Control2 and control3 are of the same
function). During Flash mode, LED’s can be turned off by control2 or control3 by
・Control2 or control3=Low
・Timer END
The sequence of FLASH operation by control2 or control 3 is shown below.
TORCH⇒Control2,3=ON⇒Control2,3=OFF
OFF⇒Control2,3=ON⇒Control2,3=OFF
TORCH⇒Control2,3=ON⇒Timer END⇒Control2,3=OFF
Timmer
OFF⇒Control2,3=ON⇒Timer END⇒Control2,3=OFF
Timmer
Timer Count
Control2 or 3
Control2 or 3
IFL
IFL
Timer Count
FLASH
0A
0A
Figure 19. LED Current Operation by Control2, 3
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○Forced Torch (FINH)
Setting address=1 and data=4 through control1, LED current will enter Torch mode correspondingly
This mode has the highest priority, and makes the light switch on in TORCH mode even in lighting state at all times.
Compulsorily TORCH ON
FLASH ON
FLASH ON
Figure 20. LED current operation by FINH (A1/D4)
Therefore, even if the mode is set Flash mode by Control2 or 3, the output remains at Torch mode.
Startup in compulsive Flash operation by Control2 or 3=H and Control1=Low state, Control1 cannot receive signal while
Control2 or 3=H. Therefore, when FINH setting is assumed during the compulsive flash operation by control2 or 3, first of all,
please input anything signal into control1 ( for keeping control1=H state). And control1 becomes possible receiving the
FINH signal also during the compulsive FLASH operation by setting control2 or 3=High state.
○Torch mode
To go to Torch mode, Control1 sets data=2 in address 1.
TORCH current can be set by 0% to 100% with 16steps.
In addition, sending Address=1 and data=4 through Control1, IC goes to Torch mode forcibly
(Please refer to [forced TORCH])
Control2,3
A1/D4
Control1
TACC
Forced TORCH ON
FLASH current does not flow for forced TORCH mode.
IFL
TORCH
TORCH ON
OFF
A1/D1
A1/D2
Control1
IFL
TORCH
Figure 21. LED Current Operation (Torch Mode)
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7. Protect function
Condition
for
releasing latch
FAILURE
MODE
DETECTION MODE
LED
Current
DCDC
Action
After Release
Failure
Register
State
LED Open
OVP Detect
Stop
Stop
Auto return
Keep
LED Short
LED Short Detect
Stop
Stop
Latch
Keep
RSET Short
COUT Short
High
Temperature
Low Battery
Low Battery
ISET Short Detect
Output Short Detect
Stop
Stop
Stop
Stop
Auto return
Auto return
Keep
Keep
TSD Detect
Stop
Stop
Latch
Reset
UVLO Detect
Low Battery Detect
Stop
Stop
Stop
Stop
Auto return
Auto return
Reset
Reset by Control1,2,3
or UVLO
Reset by Control1
or UVLO
-
Keep
-
○ Over Voltage Protection (OVP) / LED Open Protection (LOP)
Whenever the LED is not connected to FL or OUT terminal, FL terminal voltage becomes Low. Therefore, DC/DC voltage
will increase drastically and the VOUT terminal voltage will detect OVP. Then, LED and DCDC driver will stop and output
voltage will decrease by discharging. When the output voltage reaches under the OVP hysteresis, DCDC will boost up
again and will detect OVP. The over voltage during LED open mode is protected by this operation.
Figure 22. OVP and LOP Operation
○Output Short Protection
When OUT pin voltage becomes 1.0V or less, the DCDC/LED driver stops and flowing of large current can be prevented in
breakdown caused by short mode of output capacitance. This time, constant current of 100mA from OUT pin is sourced.
This returns to normal, if short mode is released.
○LED Short protection
At start up timing, VOUT is charged until VOUT=VIN state, and LED / DCDC driver starts operating. A test current (2mA
typ.) flows from FL terminal before it supplies the LED current. LED is short at this time, If the voltage between FL-OUT pins
becomes 1.7V or less, then it becomes latch stop. To release the latch, in the case of lighting by Control1, input
Control1=Low or POFF (Address 1 / Data1). In the case of lighting byControl2 or 3, set Control2 or 3 to low
○Thermal shutdown
If the chip temperature amounts to 155°C or more, thermal shutdown circuit will be enabled and latched. To release the
latch, in the case of lighting by Control1, input Control1=Low or POFF (Address 1 / Data1). In the case of lighting
byControl2 or 3, set Control2 or 3 to low.
○Under Voltage Lock Out (UVLO)
If the VIN voltage decreases under 2.2V, UVLO circuit will be enabled. Only when VIN voltage increases over 2.5V will
UVLO be cancelled. When the UVLO circuit is enabled, all the systems and register setup will also be reset.
○Low Battery UVLO
Low Battery UVLO can set the threshold from 2.8V to 3.8V using the register. In addition, It can be set to no detect mode.
The registers are not reset when the protection circuit is triggered. When IN voltage increases to more than the hysteresis
level (0.1V typ.), it will re-start.
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Application Circuit
Figure 23. Application Circuit
※It is recommended to connect the R_RSET resistance, which sets up the LED current between pin14:RSET and
pin1:AGND. Moreover, do not connect pin1 to GND of the DUT board. (Pin1 AGND and pin5 AGND is shorted inside the
IC)
Selection of Components Externally Connected
Parts Name
Input Capacitor
Inductor
Output Capacitor
LED Current
Setting Resistor
Symbol
CIN
L
COUT
MIN
1.0
1.8
R_RSET
60
Value
TYP
2.2
1.0
4.7
-
MAX
-
Unit
Product Number
μF
μH
μF
MURATA : GRM188B31A225KE33
TDK : VLF403210MT-1R0N
MURATA : GRM188B30J475KE18
kΩ
(60kΩ) ROHM : MCR006YZPD1203 //2
120
○Inductor
As an important characteristic of an inductor, it increases the allowable current and serial resistive components. The step up
ratio is high. Thus, when the output LED current is high, the current which flows into the inductor becomes very high.
Therefore, it is necessary to select an inductor with high maximum allowable current. Moreover, efficiency is affected by the
series resistance components. Therefore, it is recommended that there is a margin to the maximum allowable current.
Selecting the inductor with a small series resistance value is also suggested.
・Inductor Current Calculation
The current which flows into the inductor is determined by the following conditions:
Output voltage=VOUT [V]
LED current=ILED [A]
Input voltage=VIN [V]
PMOS ONR=PONR[Ω]
Feed Back voltage=VFB[V]
Inductor series resistance value=RL[Ω]
efficiency=η [%]
The average current needed for the application is called for using the formula.
IIN[ A]
( VOUT[ V] PONR ILED VFB RL[] ILED) ILED[ A]
VIN[ V] [%]
In the driver operation with DCDC switching frequency=fsw[Hz],
The ripple current⊿IL[A] which occurs in inductor L [H] is described
by the formula:
Δ IL
( VOUT [ V ] VIN [ V ]) VIN [ V ]
L[H] VOUT [ V ] f SW [Hz ]
[A ]
Therefore, the peak current of the inductor becomes,
Ipeak I IN [ A]
IL[ A]
2
Figure 24. Inductor current
[ A] (1)
(1) Formula of the inductor current at DCDC operation. The inductor current DCDC stops, becomes the current running
through the LED.
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・Example computation
Output voltage=4V
LED current=1.0 [A]
Input voltage=3.6 [V]
Efficiency=85 [%]
L=1.0[μH]
Freq=2[MHz]
PMOS ONR=0.15[Ω]
Feed Back voltage=0.23[V]
Inductor series resistor value=0.05[Ω]
The peak current of the inductor in this condition is computed.
IIN[ A]
Δ IL
(4[ V] 0.15[] 1.0[ A] 0.23[ V] 0.05[] 1.0[ A]) 1.0[ A]
1.17[ A]
3.6[ V] 85[%]
( 4 .0[ V ] 3 .6[ V ]) 3 .6[ V ]
0 .18
1 .0E 6 [H] 4 .0[ V ] 2E 6 [Hz ]
Ipeak 1 .17 [ A ]
0 .18 [ A ]
1 .26
2
[A]
[A]
○Input /Output Capacitor
High current is charged and discharged to the input / output capacitor at that time of DCDC switching operation. Therefore,
if a capacitor of high ESR is used, ripple will occur and efficiency will get worse. It is recommended to use a ceramic
capacitor of small ESR.
○Resistor for LED current
LED current is set by the resistor which is connecting RSET and AGND terminal. Since the temperature characteristics
and variation of the resistance influences the LED current directly, It is recommend to use a resistance of low temperature
characteristics and variation.
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BD7757MWX
Power Dissipation
2.4
Pd=1.75W at 25℃
2.2
2
Board material: grass epoxy
Layer: 2 layers
Power dissipation [W]
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
Temperature [℃]
Figure 25. Power Dissipation [W] vs. Temperature [℃]
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BD7757MWX
I/O Equivalent Circuits
1.AGND / 5.AGND / 6.IN / 7.PGND
8.OUT / 10.SW / 13.PGND
2.Control1 / 4.Control2 / 11.Control3
3.FL
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Notice for PCB layout
Since high current flows into the DUT during FLASH lighting, the ground voltage is changed by the very small impedance
of the PCB pattern. Moreover, PCB layout is very important because it changes with PCB patterns. The voltage drop across
the pattern also affects the efficiency and ripple.
D
D
A
C
B
B
D
Figure 26. Application Circuit for PCB
○Power GND wire
“A” line is Power GND wire. High current flows through this wire from 7Pin-PGND and 13Pin-PGND. Therefore, by wiring it
shortly and as thickly as possible, the potential difference across the wiring will not affect the operation.
Please short the patterns of the following pin directly 5Pin: AGND, 7Pin: PGND, 13Pin: PGND.
Addition of a heat sink to this GND pattern is also recommended. The heat dissipation of IC is high thus wiring area has to
be large.
○LED wire
The LED current flows through the “B” line. Since a high current (LED maximum current is 1.5A ) flows into this line, it is
necessary to make it as thick as possible. The impedance across the line will cause a decrease in efficiency.
○DCDC wire
“C” line is a course which the current passes through the inductor. Since the high current of LED current and DCDC step-up
current flows into this line, it is necessary to make it as thick as possible. The impedance across the line will cause a
decrease in efficiency.
○Analog wire
“D” line is an analog line. Since high current does not flow into this wiring, it is acceptable to use thin wiring. However, since
RSET terminal is very weak to a switching noise, Precautions must be taken to avoid crosstalk with SW terminal. As a
recommendation, R_RSET has to be placed immediately near the terminal. By shortening distance between resistance
R_RSET and RSET terminal (about under 5mm), crosstalk can be avoided.
○Regarding capacitor
Output capacitor has to be placed near the OUT terminal and connect GND to Power GND.
Input capacitor has to be place near the inductor and connect GND to Power GND.
If the wiring impedance against the capacitance serially attaches, it becomes ripple factors of VIN voltage and OUT voltage.
It also causes a decrease in efficiency.
The example of a layout of ROHM evaluation board (2 layers) is shown as reference below.
1st Layer
2nd Layer
SILK
Figure 27. Example of PCB
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 28. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins and latch.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Datasheet
BD7757MWX
●Ordering Information
B
D
7
7
5
Part Number
7
M
W
X
-
Package
MWX : USON014X3020
E2
Packaging and forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
●Marking Diagram
USON014X3020
(TOP VIEW)
1PIN MARK
LOT Number
Part Number Marking
1 2 3 4
5 6 7 8
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BD7757MWX
●Revision History
Date
Revision
Changes
OCT.25.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
NOV.07.2013
DEC.03.2014
DEC.03.2014
DEC.03.2014
DEC.03.2014
002
003
003
003
003
003
003
003
003
003
004
004
004
004
P14 / Modify Indication of FINH data A1D5->A1D4
P3 P8 P9 P12 /Modify Symbol
P3 /Modify MIN Limit of MAX DUTY
P10 /Modify the instruction of startup and shut down sequence
P11 /Delete the (data=1) comment in table
P12 / Delete the (data=1) comment in table
P14 /Modify the instruction of Forced Torch (FINH)
P15 /Modify the instruction of LED Short Protection, Thermal shutdown, and Battery UVLO
P20 /Modify the instruction of Analog wire
P21,22 /Modify Operation Notes
P2 /Modify the instruction of Control2 and Control3
P10 /Modify the instruction of FLASH Action using Control2 or Control3
P16 /Modify Selection of Components Externally Connected Limit.
P1 /Modify Operating Temperature Range
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
