BD7830NUV-TR

Class-AB Speaker Amplifiers 1.1W to1.5W Monaural Speaker Amplifier BD7830NUV No.10077EAT03 ●Description The BD7830NUV is a monaural speaker amplifier that operates at low voltage and was developed for portable navigation and mobile audio products. When in standby mode, its current consumption is 0 µA, and since it switches quickly and quietly from standby to ON, it is especially well suited for applications where there is frequent switching between standby and ON. ●Features 1) BTL monaural audio power amplifier 2) High power 2.25W 4Ωat Vcc=5V ,THD+N=10% High power 1.55W 8Ω at Vcc=5V ,THD+N=10% High power 0.77W 8Ω at Vcc=3.6V ,THD+N=10% 3) Wide operating supply voltage range: 2.4～5.5V 4) Low standby current: 0µA 5) Fast turn on/off time: 46msec 6) Built-in Fade-in/out function 7) Built-in anti-pop function 8) Built-in thermal shutdown function 9) Very small package (VSON008V2030) ●Applications Mobile phones, Mobile electronics applications ●Absolute Maximum Ratings(Ta=+25℃) Parameter Symbol Ratings Unit Supply voltage VCC 6.0 V Power dissipation Pd 530 *1 mW Storage temperature range Tstg -55～+150 ℃ STBY input range VSTBY -0.1～Vcc+0.1 V *1 ROHM standard one layer board (70mm×70mm×1.6mmt) mounted, deratings is done at 4.24mW/℃ above Ta=+25℃. ●Operating Range Parameter Symbol Ratings Unit Temperature range Topr -40～+85 ℃ Supply voltage VCC +2.4～+5.5 V ※ This product is not designed for protection against radioactive rays. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/17 2010.06 - Rev.A Technical Note BD7830NUV ●Electrical characteristics (Unless otherwise noted, Ta=+25℃, VCC=+3.0V, f=1kHz, RL=8Ω) Limit Monitor Parameter Symbol Unit pin MIN. TYP. MAX. Supply current Condition ICC ― 3.2 6.8 mA 6 Active mode ISTBY ― 0 2 µA 6 Standby mode PO 280 420 ― mW 5&8 BTL, THD+N=1% *1 THD+N ― 0.1 0.5 % 5&8 BTL, Po=150mW *1 Voltage gain1 AV1 -1 0 +1 dB 5 Vin=-20dBV, 1stAmp Voltage gain2 AV2 -1 0 +1 dB 8 Vin=-20dBV, 2ndAmp Power supply rejection ratio PSRR 40 57 ― dB 5&8 BTL, Vripple=0.2Vpp *2 Mute attenuation MUTE 60 80 ― dB 5&8 BTL, Vin=-20dBV Vo 1.35 1.5 1.65 V 5&8 Vin=0V Output offset voltage ΔVo -40 0 +40 mV 5&8 ΔVo=|Vo1-Vo2| STBY release voltage VSTBYH 1.4 ― Vcc+0.1 V 1 Active mode STBY hold voltage VSTBYL -0.1 ― 0.4 V 1 Standby mode STBY input current H ISTBYH 20 30 40 µA 1 VSTBY =3V STBY input current L ISTBYL -2 0 ― µA 1 VSTBY =0V Standby supply current Output power Total harmonic distortion Output voltage *1:B.W.=400～30kHz, *2:DIN AUDIO, SE:Single End, BTL:The voltage between 5pin and 8pin ●Application Circuit Example OUT2 8 STB H : ACTIVE L : STBY VCC 0.01uF Audio Input 1 BIAS 2 Bias SOFT 3 SOFT 1μF 1 2 ? GND 7 2ndAmp 8Ω V DD 6 1μF IN－ 4 0.1uF 20kΩ OUT1 5 1stAmp 20kΩ ※3pin SOFT terminal 1 : Usually 2 : Enable to adjust fade in/out time by external capacitor www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/17 2010.06 - Rev.A Technical Note BD7830NUV ●Outer dimension D78 30 ●Reference land pattern (adapt as necessary to suit conditions during actual design.) PKG type L2 VSON008V2030 Unit: mm Land Lead pitch Gap Length Width e MD1 L2 b2 0.50 2.20 0.70 0.27 Central pad D3 MD1 PKG type VSON008V2030 Length Width D3 E3 1.20 1.60 Thermal via Pitch Diameter ― φ0.300 E3 ※ This package is a non-lead type, so solderability of the lead ends and sides are not guaranteed. e www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. b2 Thermal via 3/17 2010.06 - Rev.A Technical Note BD7830NUV ●Measurement Circuit Diagram VSTBY STBY 1 A BIAS 2 OUT2 8 GND 7 Bias V 600 100μ 1μ VCC 1 0.01μ Vripple 2nd Amp VCC 6 SOFT 2 IN－ 4 0.1μ Vin SOFT 3 OUT1 5 20k 8 50 VCC A 1μ V 1st Amp 600 20k ※3pin SOFT terminal 1 : Usually 2 : Enable to adjust fade in/out time by external capacitor ●Block diagram ●Pin assignment STBY 1 OUT2 8 BIAS GND 7 2 SOFT 3 Bias 2nd SOFT IN－ 4 VCC 6 OUT1 5 1st Amp www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/17 PIN No. PIN Name 1 STBY 2 BIAS 3 SOFT 4 IN- 5 OUT1 6 VCC 7 GND 8 OUT2 2010.06 - Rev.A Technical Note BD7830NUV ●Input/output equivalent circuit PIN No. 1 PIN Name STBY PIN description Equivalent circuit STBY Active/Standby Control pin STBY=H → Active STBY=L → Standby 50k 1 100k BIAS 2 BIAS Bias capacitor Connection pin 25k 600k 2 20k SOFT 3 SOFT IN- 100k 1k 1k 3 Fade-in/out Adjustment pin 10k IN- 4 100k 1k 4 Input pin 1k OUT1 (OUT2) 5 8 OUT1 OUT2 5 Output pin (8) 60k VCC 6 VCC Power supply pin 6 7 7 GND GND GND pin Notes) The above numerical values are typical values for the design, which are not guaranteed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/17 2010.06 - Rev.A Technical Note BD7830NUV ●Description of operations ①ON/OFF operation by STBY pin VCC Standby Active Standby STBY BIAS Delay (internally fixed OUT FADE IN FADE OUT Normal input mode Audio Input Once VCC = H, when STBY = L → H then BIAS and output (OUT) are activated. Once BIAS has become stable (= 1/2 VCC), output (OUT) fades in (FADE IN). Once STBY = H → L, output (OUT) starts to fade out (FADE OUT), and when fade-out ends, the BIAS falls. ②ON/OFF control by shorting of VCC and STBY pins VCC STBY Under voltage protection 1.78V (typ) BIAS Delay (internally fixed) OUT Audio Input When VCC = STBY = L → H, BIAS is activated. During low power mode (VCC < 1.78 V) protection is used to keep output (OUT) at low level, and FADE IN occurs when this protection is canceled. When VCC = STBY = H → L, output (OUT) falls without FADE OUT. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/17 2010.06 - Rev.A Technical Note BD7830NUV ●External components and cautions points Setting of external components STBY STBY OUT2 8 1 2 SPEAKER GND BIAS 7 Bias Cb 3 1μ 2ndAmp SOFT 8Ω VCC 6 SOFT Cs SP_IN IN－ OUT1 5 4 Ci Ri 1stAmp Rf Cf ●Cb This is a bypass capacitor, which is used for bias voltage stabilization. When a larger capacitor is used, the efficiency of voltage ripple rejection can be improved. When tuning, note with caution that Cb can affect the activation time. Cb – Power Supply Ripple Rejection Ratio Cb – Turn-on Time Cb-PSRR Vcc=3V, Vripple=200mVpp, RL=8Ω Cb-ton 0 70 -20 60 Cb=0.1uF -30 ton[ms] Power Supply Rejection Ratio[dB] 80 -10 Cb=0.47uF -40 Cb=1uF 50 40 30 -50 20 Cb=2.2uF -60 10 -70 0 10 100 1k Frequency[Hz] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10k 100k 0 0.5 1 1.5 2 2.5 Cb[uF] 7/17 2010.06 - Rev.A Technical Note BD7830NUV ●Cs This capacitor is for adjustment of the FADE IN/OUT times. The FADE IN/OUT functions soften the operation (IN and OUT) of BTL output when switching between standby and active modes. When a capacitor is connected to the SOFT pin (pin 3), the FADE IN/OUT functions are valid. When the capacitor rating is increased, the FADE IN/OUT effect is also increased, but note with caution when setting this that it also affects the activation time. If the FADE IN/OUT functions are not being used, connect the SOFT pin (pin 3) to VCC. ・ Fade-in/out waveforms Active → Standby → Active Standby STBY 2V/div Ton Toff BTL output 0.5V/div Cs - Fade-in/out Time Cs-ton,toff 140 ton,toff[ms] 120 100 ton 80 60 40 toff 20 0 0 0.02 0.04 0.06 0.08 0.1 Cs[uF] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/17 2010.06 - Rev.A Technical Note BD7830NUV ●Ci This is a DC cut-off input coupling capacitor for the amp input pin. This includes an Ri and a high-pass filter. The cut-off frequency is calculated as follows. 1 [Hz] fCL = 2π×Ri×Ci Ci – Low Frequency Characteristics Ci-Frequency characteristic 4 2 Gain [dB] 0 -2 -4 Ci:0.047uF -6 Ci:0.1uF Ci:0.22uF -8 -10 10 100 1k Frequency[Hz] 10k 100k Capacitors of a certain size are required for coupling without attenuation of low frequencies, but in most cases of speakers used in portable equipment, it is nearly impossible to reproduce signals in the 100 to 200 Hz range or below. Even when a larger capacitor is used instead, it may not improve system performance. Also, pop sounds can affect the capacitance (Ci) of the capacitor. A larger coupling capacitor requires a greater charge to reach the bias DC voltage (normally 1/2 VCC). Because this charge current is supplied from the output due to routing of feedback, pop sounds occur easily at startup. Consequently, pop sounds can be minimized by selecting the smallest capacitor that still has the required low-frequency response. ●Ri This is inverting input resistance, which sets the closed loop gain in conjunction with Rf. ●Rf This is feedback resistance, which sets closed loop gain in conjunction with Rf. The amp gain is set using the following formula. Gain = 20log Rf Ri [dB] ●Cf This is a feedback capacitor, which is used to cut high frequencies. This includes Rf and a low-pass filter. The cut-off frequency is calculated as follows. fCL= 1 2π×Ri×Ci www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. [Hz] 9/17 2010.06 - Rev.A Technical Note BD7830NUV ●Selection of external components ①Setting gain from desired output Output Po is determined via the following formula, from which the required gain Av can also be obtained. 2 Po [W] = Vo [Vrms] / RL [Ω] Vo = Av ・ Vin Av ≧ Po・RL / Vin ②Setting input resistance and feedback resistance from gain Gain Av is determined via the following formula, from which input resistance Rin and feedback resistance Rf can be set. Av = (Rf / Rin) ・ 2 Rin is set with the input side's drive capacity taken into account. ③Setting input coupling capacitor from low-range cut-off frequency Low-range cut-off frequency fc is determined via the following formula, from which input coupling capacitor Cin can be set. fc [Hz] = 1 / (2π ・ Rin ・ Cin) Cin ≧ 1 / (2π ・ Rin ・ fc) ④Setting bias capacitor and SOFT capacitor to minimize pops It is recommended that the capacitance of the bias capacitor CB be set to at least 10 times that of the input coupling capacitor Cin, in order to soften the rise of the bias voltage while improving the Cin following ability. Also, when a higher gain is used, the capacitance of the SOFT capacitor Cs can be raised to control pop sounds. Av = 2 (6 dB at BTL) → Cs ・ (80 / fc) ≧ 0.01 µF Av = 4 (12 dB at BTL) → Cs ・ (80 / fc) ≧ 0.022 µF Av = 8 (18 dB at BTL) → Cs ・ (80 / fc) ≧ 0.033 µF Av = 20 (26 dB at BTL) → Cs ・ (80 / fc) ≧ 0.068 µF ●Use when VCC = STBY short Since this IC is designed on the assumption that it will be used to switch standby mode ON and OFF while the power supply remains ON, normally STBY should be switched from H to L and the SOFT voltage should be discharged before powering down. When used while VCC = STBY short, pop sounds may occur if the IC's power supply is reduced prior to discharging the SOFT voltage. To prevent pop sounds, you must ① set STBY = H→L before setting VCC = H→L, and ② forcibly discharge the SOFT voltage. A sample circuit in which VCC = STBY short is used is shown below. ・Sample circuit configuration when VCC = STBY short ① STBY = H → L at power-off STBY 1 BIAS 2 OUT2 8 GND 7 Bias 1μ SOFT 3 ② Fast discharge of SOFT voltage at power-off 2nd Amp SOFT CD VCC 6 CS VCC IN－ 4 Cin Rin OUT1 5 1st Amp Slow power-off of IC itself Rf www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/17 2010.06 - Rev.A Technical Note BD7830NUV ●Mechanism of pop sounds Cin is low Gain is low (Rf) STBY BIAS BIAS IN- IN- About 25 0.6 VCC SOFT No pops OUT Cin is high Gain is high (Rf) STBY BIAS BIAS IN- When SOFT voltage reaches 0.6 VCC, if there is a potential difference between BIAS and IN-, pop sounds will occur. Potential difference At startup, the input coupling Cin is charged from output OUT via the feedback resistance Rf, so when Cin and Rf are high, charging takes longer and pop sounds can easily occur. IN- About The rise of the SOFT voltage is changed by CS, so pop sounds an be reduced by setting CS high. 25 ms SOFT 0.6 VCC OUT POP sounds STBY OUT2 8 1 GND BIAS 2 Bias 7 1μ SOFT 3 2nd Amp SOFT 1μ CS VCC IN－ Cin OUT1 5 4 600 RL VCC 6 Ri 1st Amp Rf www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/17 2010.06 - Rev.A Technical Note BD7830NUV ●Bass boost function External components can be added to this chip to provide a bass boost function. BIAS OUT IN- 5 4 Ci Ri Rfb Rf Cfb Gain fC2  1 2  Cfb  Rf [Hz] fC1  1 2  Cfb  (Rf // Rfb ) [Hz] Low frequency gain up GC1 GC2 fC1 fC2 f GC1  20 log Rf  Rfb Ri [dB] GC2  20 log Rf (normal use) Ri [dB] ●Thermal shutdown function When the chip exceeds the Tjmax (150°C) temperature by reaching a temperature of 180℃ or above, the protection function is activated. High impedance is for OUT1 and OUT2 during protected mode. Protection is canceled and normal operation is resumed when the chip's temperature falls to 120℃ or below. 180°C 120°C Chip Protection start temperature: 180°C (typ) or more Protection cancels temperature: 120°C (typ) or less Output Normal www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Protected operation Normal 12/17 2010.06 - Rev.A Technical Note BD7830NUV ●Thermal design of chip The characteristics of the IC vary greatly depending on the use temperature, and when the maximum allowable junction temperature is exceeded, components may deteriorate or become damaged. Thermal considerations are needed for this chip from two standpoints: preventing instantaneous damage and improving long-term reliability. Note the following points with caution. The absolute maximum ratings for each chip include the maximum junction temperature (TjMAX) and operating temperature rate (Topr), and these values should be referred to when using the Pd-Ta characteristics (thermal dissipation curve). Since the IC itself is designed with full consideration of thermal balance, there are no problems in terms of circuit operations, but even when a more-than-adequate thermal design is implemented in order to get full use of the IC's performance features, some moderation is often required for the sake of practical usage. If there is an excessive input signal due to insufficient thermal dissipation, a TSD (thermal shutdown) operation may occur. Thermal Dissipation Curve Reference data VSON008V2030 ① When mounted on ROHM standard 1-layer board Size: 70 mm × 70 mm × 1.6 mmt No copper heat sink (only mounting pattern) 1.0 0.85W ② When mounted on 4-layer board Size: 76.2 mm × 76.2 mm × 1.6 mmt Layers 2 & 3 Copper foil No connection via thermal via Allowable loss Pd (W) ② 0.53W 0.5 ① 0 0 25 50 75 100 125 150 Ambient temperature Ta (°C) (Note) These are measured values. They are not guaranteed. The allowable loss value varies depending on the type of board used for mounting. When this chip is mounted on a multi-layer board that is designed for thermal dissipation, the allowable loss becomes greater than shown in the above figure. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/17 2010.06 - Rev.A Technical Note BD7830NUV ●Typical Characteristics (1) BD7830NUV f-THD+N VCC=3V,Ta=25℃,Po=150mW,RL=8Ω 10 10 1 1 THD+N[%] THD+N[%] BD7830NUV f-THD+N VCC=5V,Ta=25℃,Po=150mW,RL=8Ω 0.1 0.1 0.01 0.01 10 100 1k 10k 10 100k 100 1k 10k 100k f[Hz] f[Hz] BD7830NUV 　VCC-Po 　Ta=25℃ f=1kHz 400～30kBPF THD+N=1.0% BD7830NUV Po-THD Ta=25℃,f=1kHz,RL=8Ω 10 10000 RL=4Ω 1 VCC=3V Po[mW] THD[%] RL=8Ω 1000 VCC=5V 0.1 RL=16Ω 0.01 0.01 100 0.1 1 10 2 3 Po[W] 5 6 BD7830NUV frequency characteristic VCC=3V,Ta=25℃,Vin=-20dBV,RL=8Ω BD7830NUV frequency characteristic VCC=5V,Ta=25℃,Vin=-20dBV,RL=8Ω 10 10 5 Gain[dB] 5 Gain[dB] 4 Vcc[V] 0 -5 -10 0 -5 -10 -15 -15 10 100 1k 10k 100k f[Hz] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10 100 1k 10k 100k f[Hz] 14/17 2010.06 - Rev.A Technical Note BD7830NUV ●Typical Characteristics (2) 0 0 -10 Power Supply Rejection Ratio[dB] Power Supply Rejection Ratio [dB] BD7830NUV f-PSRR Ta=25℃, VCC=3V,Vripple=200mVpp,30kLPF BD7830NUV f-PSRR Ta=25℃,VCC=5V, Vripple=200mVpp,30kLPF -20 -30 -40 -50 -60 -70 10 100 1k 10k -10 -20 -30 -40 -50 -60 -70 100k 10 f[Hz] 100 1k 10k f[Hz] 100k BD7830NUV Circuit current (STBY) Ta=25℃, RL=8Ω BD7830NUV Circuit current (ACT) Ta=25℃,RL=8Ω 8 0.10 Circuit current (STBY)[μA] Circuit current (ACT)[ｍA] 0.09 6 4 2 0 2 3 4 5 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 6 2 3 VCC[V] 4 5 6 VCC[V] BD7830NUV RL-Po Ta=25℃, f=1kHz, THD+N=1% BD7830NUV Po-Pd 0.7 10.00 0.6 VCC=5.5V VCC=5V VCC=3V 1.00 0.4 Po Pd[W] 0.5 VCC=3V 0.3 0.10 0.2 VCC=2.4V 0.1 0.0 0.01 0.0 0.5 1.0 1.5 1 Po[W] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10 100 RL[Ω] 15/17 2010.06 - Rev.A Technical Note BD7830NUV ●Notes for use 1) The above numerical values and data are typical values for the design, which are not guaranteed. 2) The application circuit examples can be reliably recommended, but their characteristics should be checked carefully before use. When using external component constants that have been modified, determine an ample margin that takes into consideration variation among the external components and Rohm's LSI IC chips, including variation in static characteristics and transient characteristics. 3) Absolute maximum ratings This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other parameters are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings. If it is possible that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and determine ways to avoid exceeding the IC's absolute maximum ratings. The above numerical values and data are typical values for the design, which are not guaranteed. 4) GND pin's potential Try to set the minimum voltage for GND pin's potential, regardless of the operation mode. Check that the voltage of each pin does not go below GND pin's voltage, including transient phenomena. 5) Shorting between pins and mounting errors When mounting the IC chip on a board, be very careful to set the chip's orientation and position precisely. When the power is turned on, the IC may be damaged if it is not mounted correctly. The IC may also be damaged if a short occurs (due to a foreign object, etc.) between two pins, between a pin and the power supply, or between a pin and the GND. 6) Shorting output pin When output pin (5,8pin) is shorted to VCC or GND, the IC may be damaged by over current, so be careful in operation. 7) Thermal design Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use modes, because this IC is power amp. When excessive signal inputs which the heat dissipation is insufficient condition, it is possible that TSD (thermal shutdown circuit) is active. TSD is protection of the heat by excessive signal inputs, it is not protection of the shorting output to VCC or GND. 8) Shorted pins and mounting errors When the output pins (pins 5 and 8) are connected to VCC and GND, the thermal shutdown function repeatedly switches between shutdown (OFF) and cancel (ON). Note with caution that chip damage may occur if these connections remain for a long time. 9) Operating range The rated operating power supply voltage range(VCC=+2.4 ～ +5.5V) and the rated operation temperature range (Ta=-40～+85℃) are the range by which basic circuit functions is operated. It is not guaranteed a specification and a rated output power about all operating power supply voltage range or operation temperature range. 10) Operation in strong magnetic fields Note with caution that operation faults may occur when this IC operates in a strong magnetic field. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/17 2010.06 - Rev.A Technical Note BD7830NUV ●Ordering part number B D 7 Part No. 8 3 0 Part No. N U V - Package NUV:VSON008V2030 T R Packaging and forming specification TR: Embossed tape and reel VSON008V2030 3.0±0.1 2.0±0.1 1.0MAX 0.25 3000pcs TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) (0.22) +0.03 0.02 -0.02 S 1.5±0.1 0.5 1 4 8 5 1.4±0.1 0.3±0.1 C0.25 Embossed carrier tape Quantity Direction of feed 1PIN MARK 0.08 S Tape +0.05 0.25 -0.04 1pin Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/17 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.06 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. 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