BD7836EFV

BD7836EFV

  • 厂商:

    ROHM(罗姆)

  • 封装:

  • 描述:

    BD7836EFV - 1.9W1.9W Stereo Speaker Amplifier - Rohm

  • 数据手册
  • 价格&库存
BD7836EFV 数据手册
Class-AB Speaker Amplifiers 1.9W+1.9W Stereo Speaker Amplifier BD7836EFV No.10077EAT07 ●Description BD7836EFV is a Class-AB stereo speaker amplifier, developed for note-book PC, desktop PC, portable devices and others. Class-AB amplifier has no EMI noise. Power package HTSSOP-B20 can realize high output power. Low circuit current at active mode reduce consumption of battery. Shutdown current is 0.1µA typically, and pop noise level when shutdown turns on and off is very small. This device is suitable for the application that often changes mode between “shutdown state” and “active state”. ●Features 1) High power 1.9W typ. (VDD=5V, RL=4Ω, THD+N=1%, stereo input) High power 1.2W typ. (VDD=5V, RL=8Ω, THD+N=1%, stereo input) 2) Gain selectable by the external control (6,10,15.6,21.6dB) 3) Pop noise suppression circuitry 4) Shutdown function (also Mute function) [Isd=0.1µA(typ.)] 5) Protection circuitry (Thermal shutdown, Under voltage lockout) 6) Power Package with thermal pad HTSSOP-B20 ●Applications Note-book PC, Desktop PC, etc. ●Absolute maximum ratings (Ta=+25℃) Parameter Power Supply Voltage Power Dissipation Storage Temperature Input Terminal Input Voltage Range *3 Symbol VDDmax Pd Tstg Vin Vctl Ratings 7.0 1 *1 Unit V W W ℃ V V 3.2 *2 -55 ~ +150 -0.3~VDD+0.3 -0.3~VDD+0.3 Control Terminal Input Voltage Range *4 *1 70mm×70mm×1.6mm FR4 1-layer glass epoxy board(Copper on top layer 0%) Derating in done at 8mW/℃ for operating above Ta=25℃. There are thermal via on the board. *2 70mm×70mm×1.6mm FR4 4-layer glass epoxy board (Copper on bottom 2 and 3 layer 100%) Derating in done at 25.6mW/℃ for operating above Ta=25℃. There are thermal via on the board. *3 Input Terminal (LIN+, LIN-, RIN+, RIN-) *4 Control Terminal ( SHUTDOWN , GAIN0, GAIN1) ●Operating conditions Parameter Power Supply Voltage Temperature * Symbol VDD Topr Range +4.5 ~ +5.5 -40 ~ +85 Unit V ℃ These products aren’t designed for protection against radioactive rays. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/16 2010.07 - Rev.A BD7836EFV ●Electric characteristic (Unless otherwise specified, Ta=+25℃, VDD=+5.0V, RL=8Ω, AC stereo input) Parameter Circuit current (Active) Circuit current (Shutdown) Output power 1 Output power 2 PO1 PO2 0.7 ― 5.5 Gain GV 9.5 14.6 20.6 63 Input resistance RIN 49 31 17 Supply ripple rejection ratio Output noise S/N Output DC offset voltage PSRR Vnoise SN ⊿Vo 62 ― ― ― 1.2 1.9 6.0 10 15.6 21.6 90 70 45 25 68 16 105 0 ― ― 6.5 10.5 16.5 22.6 117 91 59 33 ― 80 ― ±25 W W dB dB dB dB kΩ kΩ kΩ kΩ dB µVrms dB mV Symbol Icc Isd Limits Min. ― ― Typ. 5 0.1 Max. 10 2.0 Unit mA µA Technical Note Condition IC active, No load SHUTDOWN =Hi IC Shutdown SHUTDOWN =Lo RL=8Ω, BTL, f=1kHz, THD+N=1% *1 RL=4Ω, BTL, f=1kHz, THD+N=1% *1 BTL, GAIN0=GAIN1=L BTL, GAIN0=L, GAIN1=H BTL, GAIN0=H, GAIN1=L BTL, GAIN0=GAIN1=H GAIN0=GAIN1=L GAIN0=L, GAIN1=H GAIN0=H, GAIN1=L GAIN0=GAIN1=H Vripple=0.2Vp-p,CBYP=0.47µF f=1kHz, BTL BTL, f=1kHz, 20-20kHz BTL, Po=1W, BTL, f=1kHz, 20-20kHz Control terminal Input voltage Hi level Lo level VIH VIL 2.0 0 ― ― VDD 0.8 V V *1: B.W.=400~30kHz, BTL:The voltage between 4pin and 8pin, 14pin and 18pin. ●Control terminal’s settings SHUTDOWN Hi Lo IC condition Active Shutdown GAIN0 Lo Lo Hi Hi GAIN1 Lo Hi Lo Hi Gain 6dB 10dB 15.6dB 21.6dB Input resistance 90kΩ (TYP.) 70kΩ (TYP.) 45kΩ (TYP.) 25kΩ (TYP.) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/16 2010.07 - Rev.A BD7836EFV ●Package outlines Technical Note BD7836 Lot No. (unit : mm) Fig.1 HTSSOP-B20 ●Block diagram RIN- ●Pin assignment table Pin Terminal name No. ROUT+ Function Ground Bit 0 of gain select Bit 1 of gain select Left channel positive output Left channel negative differential input Supply voltage terminal Right channel negative differential input Left channel negative output Left channel positive differential input Tap to voltage divider for internal midsupply bias generator Ground No connection Ground Right channel negative output Supply voltage terminal Supply voltage terminal Right channel negative differential input Right channel positive output 1 2 3 4 GND GAIN0 GAIN1 LOUT+ LINPVDD RIN+ LOUTLIN+ BYPASS GND NC GND ROUTPVDD VDD RINROUT+ RIN+ ROUT- 5 6 7 8 9 10 GAIN0 GAIN1 Gain Control Depop Circuitry Power Management PVDD VDD BYPASS SHUTDOWN GND LIN- LOUT+ 11 12 13 LIN+ LOUT- 14 15 16 17 Fig.2 18 19 20 Places IC in shutdown mode when SHUTDOWN held low GND Ground www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/16 2010.07 - Rev.A BD7836EFV ●Measurement circuit diagram Technical Note CRIN0.47µF 17 RINRight Line Input C + RIN Signal 0.47µF + 7 RIN+ ROUT+ 18 RL ROUT- 14 PVDD 6.15 VDD 16 CSR 0.1µF CSR 0.1µF VDD VDD 2 GAIN0 3 GAIN1 Gain Control Power Management BYPASS 10 SHUTDOWN 19 GND CBYP 0.47µF To System Control 1,11, 13,20 RL CLIN0.47µF 5 LINLeft Line Input Signal + CLIN+ 0.47µF 9 LIN+ - LOUT+ 4 LOUT- 8 Fig.3 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/16 2010.07 - Rev.A BD7836EFV ●Application circuit example Right Line Input Signal CRIN0.47µF 17 RIN+ CRIN+ 0.47µF 7 RIN+ ROUT- 14 PVDD 6.15 VDD 16 CSR 0.1µF CSR 0.1µF 2 GAIN0 3 GAIN1 Left Line Input Signal Gain Control BYPASS 10 Power Management SHUTDOWN 19 GND To System Control CLIN0.47µF 1,11, 13,20 CBYP 0.47µF Technical Note ROUT+ 18 VDD VDD 5 LIN+ LOUT+ 4 CLIN+ 0.47µF 9 LIN+ LOUT- 8 Fig.4 Single Ended inputs Right Line Input Signal CRIN0.47µF 17 RIN+ CRIN+ 0.47µF 7 RIN+ ROUT+ 18 ROUT- 14 PVDD 6.15 VDD 16 CSR 0.1µF CSR 0.1µF VDD VDD 2 GAIN0 3 GAIN1 Left Line Input Signal Gain Control BYPASS 10 Power Management SHUTDOWN 19 GND To CBYP 0.47µF System Control CLIN0.47µF 1,11, 13,20 5 LIN+ LOUT+ 4 CLIN+ 0.47µF 9 LIN+ LOUT8 Fig.5 Differential inputs www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/16 2010.07 - Rev.A BD7836EFV ●Evaluation board circuit diagram CRIN0.47μF 17 RIN+ CRIN+ 0.47μF 7 RIN+ ROUT- 14 ROUT+ 18 Technical Note PVDD 6.15 CSR 0.1μF CSR 0.1μF VDD 16 2 GAIN0 3 GAIN1 Gain Control Power Management BYPASS 10 SHUTDOWN GND CBYP 0.47μF 19 CLIN0.47μF 5 LIN+ CLIN+ 0.47μF 9 LIN+ 1,11, 13,20 LOUT+ 4 LOUT- 8 Please connect speaker. Please connect to GND. Please connect to Power Supply (VDD=+4.5~5.5V) line. Please connect ito input signal line. Use these solder jumper for connecting the control terminal to GND. Use these solder jumper for connecting the control terminal to VDD. Fig .6 ●Evaluation board partts list Number 4 2 1 1 1 Part name CLIN+/-,CRIN+/CSR CBYP U1 PCB1 Type, Value Capacitor, 0.47μF Capacitor, 0.1μF Capacitor, 0.47μF IC, BD7836EFV, Class-AB stereo speaker Amplifier Printed-circuit board BD7836EFV Please connect speaker. SMD size 1608 1608 1608 PKG:HTSSOP-B20 ― Manufacturer/ Part number Murata GRM188R71C474KA01D Murata GRM188R71C104KA01D Murata GRM188R71C474KA01D ROHM BD7836EFV-E2 ― www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/16 2010.07 - Rev.A BD7836EFV ●Description of external parts Technical Note ①Input coupling capacitors Ci (CLIN+/-,CRIN+/-) It sets cutoff frequency fc by the following formula by input coupling capacitors Ci(CLIN+/-,CRIN+/-) and input impedance Zi. 1 [Hz] 2π  Zi  Ci It makes an input coupling capacitors of evaluation board 0.47μF on evaluation board.. Input impedance Zi and cutoff frequency fc in each gain settings are given in Table1. fc  Table1. The relations in the gain settings and cutoff frequency fc. GAIN0 Lo Lo Hi Hi GAIN1 Lo Hi Lo Hi Gain [dB] 6 12 18 24 Ri Ω] 90k 70k 45k 25k Zi [Ω] 45k 35k 22.5k 12.5k fc [Hz] 7.5 9.7 15 27 ②The power decoupling capacitors (CSR) It makes a power decoupling capacitors 0.1μF. Because power decoupling capacitors influences total harmonic distortion (THD) and some audio characteristics, please place a good low equivalent-series-resistance (ESR) capacitors as close as possible to IC. ③BYPASS capacitor (CBYP) Because BYPASS capacitor influences THD, PSRR and some audio characteristics, please place good low equivalent-series-resistance (ESR) capacitor as close as possible to IC. The value of BYPASS capacitor determines the turn on time and turn off time. Refer to the following section of “Turn ON and Turn OFF”. It makes BYPASS capacitor of evaluation board 0.47μF. ④Control terminal Each control terminal ( SHUTDOWN , GAIN0, GAIN1) don’t have pull-down resistance internal circuit. Connect to GND line or VDD line or input Low or high level voltage to terminals in order to avoid the terminals made high Impedance. Using IC under the control terminal let high impedance, operation fault may occur. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/16 2010.07 - Rev.A BD7836EFV ●Evaluation board PCB layer Technical Note Fig.7 Top layer Fig.8 Bottom Layer www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/16 2010.07 - Rev.A BD7836EFV ●Turn on and Turn off This IC has the circuit that reduces pop noise at “turn on” and “turn off”. Reducing pop noise is realized in controlling to adjust the turn on and turn off time. Technical Note SHUTDOWN 5V/div. BYPASS 1V/div. LOUT1V/div. Turn ON time (a)Turn ON Fig. 9 Turn OFF time (b)Turn OFF The following table show the Turn ON time and Turn OFF time when It makes the BYPASS capacitor 0.47uF. CBYP 0.47uF Turn ON 280ms Turn OFF 340ms Turn ON time is defined as the time until BYPASS terminal voltage reaches the 90% of VDD/2 after SHUTDOWN L→H. Turn OFF time is defined as the time until BYPASS terminal voltage reaches the 10% of VDD/2 after SHUTDOWN H→L. The values of above table are typical characteristics. These values will shift by 30% at some conditions. ●Input terminal This IC can be inputed signal by differntial inputs or single ended inputs. When sing the single ended inputs, connect the terminal of not signal inputed line to AC GND with input couppling capacitors. Please makes the value of all input capacitors same because of preventing pop noise. If they are not same value, for example, LOUT+=0.47µF, LOUT-=0.33µF, it caused pop noise increase and characteristics become worse. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/16 2010.07 - Rev.A BD7836EFV Technical Note ●About the thermal design by the IC Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two standpoints of immediate damage and long-term reliability of operation. Pay attention to points such as the following. Since an maximum junction temperature (TjMAX.)or operating temperature range (Topr) is shown in the absolute maximum ratings of the IC, to reference the value, find it using the Pd-Ta characteristic (temperature derating curve). If an input signal is too great when there is insufficient radiation, TSD (thermal shutdown) may operate. TSD, which operates at a chip temperature of approximately +180℃, is canceled when this goes below approximately +100℃. Since TSD operates persistently with the purpose of preventing chip damage, be aware that long-term use in the vicinity that TSD affects decrease IC reliability. Temperature Derating Curve Reference Data HTSSOP-B20 3.5 3.2 ④3.2W Measurement conditions: IC unit Rohm standard board mounted Board : 70mm×70mm×1.6mmt board① FR4 1-layer glass epoxy board (Copper on top layer 0%) board② FR4 2-layer glass epoxy board (Copper on top layer 0%) board③ FR4 3-layer glass epoxy board (Copper on top layer 100%) board④ FR4 4-layer glass epoxy board (Copper on top layer 100%) Power dissipation Pd(W) 2.5 2.3 2.0 ③2.3W 1.5 1.0 ②1.45W ①1W 0.5 0.0 0 25 50 75 85 100 125 150 Ambient Temperature Ta(℃) Note) Values are actual measurements and are not guaranteed. Fig.10 Power dissipation vs. Ambient temperature Power dissipation values vary according to the board on which the IC is mounted. The Power dissipation of this IC when mounted on a multilayer board designed to radiate is greater than the values in the graph above. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/16 2010.07 - Rev.A BD7836EFV ●Typical Characteristics TABLE OF GRAPHS Items Total harmonic distortion plus noise (THD+N) Supply current (Icc) Shutdown current (Isd) Gain Crosstalk Supply ripple rejection ratio Shutdown attenuation Power dissipation Efficiency Output power Parameter vs. Frequency vs. Output power vs. Supply voltage vs. Supply voltage vs. Frequency vs. Frequency vs. Frequency vs. Frequency vs. Output power vs. Output power vs. Load resistance Figure number 11, 12, 17, 18 Technical Note 13, 14, 15, 16, 19, 20, 21, 22 23 24 25 26 27 28 29 30 31 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/16 2010.07 - Rev.A BD7836EFV THD+N vs Frequency VDD=5V, RL=4Ω 400Hz-30kHz 10 Po=0.5W Po=1W Po=1.5W THD+N [%] 10 Technical Note THD+N vs Frequency VDD=5V, RL=4Ω, Po=1.5W 400Hz-30kHz 6dB 10dB 15.6dB 21.6dB THD+N [%] 1 1 0.1 0.1 0.01 10 100 1k Frequency [Hz] 10k 100k 0.01 10 100 1k Frequency [Hz] 10k 100k FFig.11 igure.1 THD+N vs Output power VDD=5V, RL=4Ω Gv=6dB, f=1kHz, 400Hz-30kHz 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) THD+N [%] 10 Fig.12 Figure.2 THD+N vs Output power VDD-5V, RL=4Ω Gv=10dB, f=1kHz, 400Hz-30kHz f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) THD+N [%] 1 1 0.1 0.1 0.01 0.01 0.1 1 Output power [W] 10 0.01 0.01 0.1 1 Output power [W] 10 Fig.13 Figure.3 THD+N vs Output power VDD=5V, RL=4Ω Gv=15.6dB, f=1kHz, 400Hz-30kHz 10 Fig.14 Figure.4 THD+N vs Output power VDD=5V, RL=4Ω Gv=21.6dB, f=1kHz, 400Hz-30kHz 10 THD+N [%] 0.1 THD+N [%] 1 1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.1 1 10 0.1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.1 1 10 0.01 0.01 0.01 0.01 Output power [W] Output power [W] Fig.15 Figure.5 THD+N vs Frequency VDD=5V, RL=8Ω, Po=1W 400Hz-30kHz 10 Po=0.25W Po=0.5W Po=1W THD+N [%] Fig.16 Figure.6 THD+N vs Frequency VDD=5V, RL=8Ω, Po=1W 400Hz-30kHz 10 6dB 10dB 15.6dB 21.6dB THD+N [%] 1 1 0.1 0.1 0.01 10 100 1k Frequency [Hz] 10k 100k 0.01 10 100 1k Frequency [Hz] 10k 100k Fig.17 Figure.7 Fig.18 Figure.8 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/16 2010.07 - Rev.A BD7836EFV THD+N vs Output power VDD=5V, RL=8Ω Gv=6dB, f=1kHz, 400Hz-30kHz 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) THD+N [%] 1 Technical Note THD+N vs Output power VDD=5V, RL=8Ω Gv=10dB, f=1kHz, 400Hz-30kHz THD+N [%] 1 0.1 0.1 0.01 0.01 0.1 1 Output power [W] 10 0.01 0.01 0.1 1 Outpupower [W] 10 Fig.19 Figure.9 THD+N vs Output power VDD-5V, RL=8Ω Gv=15.6dB, f=1kHz, 400Hz-30kHz 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) THD+N [%] THD+N [%] 1 Fig.20 Figure.10 THD+N vs Output power VDD-5V, RL=8Ω Gv=21.6dB, f=1kHz, 400Hz-30kHz 10 1 0.1 0.1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.01 0.01 0.1 1 Outpu power [W] 10 0.01 0.01 0.1 1 Output power [W] 10 Fig.21 Figure.11 Icc-VDD Noload, No signal 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 VDD [V] 4 5 6 0.5 0.4 Icd [uA] 0.3 0.2 0.1 0 0 1 2 Fig.22 Figure.12 Isd vs VDD Noload, No signal Icc [mA] 3 VDD[V] 4 5 6 Fig.23 Figure.13 Gain vs Frequency VDD=5V, RL=8Ω 10Hz-500kHz 35 30 25 gain [dB] 20 15 10 5 0 10 100 1k Frequency [Hz] 10k 100k -120 10 100 6dB 10dB 15.6dB 21.6dB gain [dB] 0 -20 -40 -60 -80 -100 Fig.24 Figure.14 Cross talk vs Frequency VDD=5V, RL=8Ω, Gv=6dB 80kHz LPF Left to Right Right to Left 1k Frequency [Hz] 10k 100k Fig.25 Figure.15 Fig.26 Figure.16 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/16 2010.07 - Rev.A BD7836EFV PSRR vs Frequency VDD-5V, RL=8 Ω,CBYP=0.47uF Vripple=0.2Vpp, 10Hz-500kHz Bandpass 6dB 10dB 15.6dB 21.6dB Technical Note SHUTDOWN attenuation vs Frequency VDD=5V RL=8Ω, Vin=1Vrms(2Vrms@BTL), 10Hz-500kHz SHUTDOWN attnuation [dB] 0 -20 PSRR [dB] -40 -60 -80 0 -20 -40 -60 -80 -100 -120 -100 -120 10 100 1k Frequency [Hz] 10k 100k 10 100 1k 10k Frequency [Hz] 100k Figure.17 Fig.27 Output power vs Power Dissipation VDD=5V, Gv=6dB, f=1kHz 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 Output power [W] 100 90 80 70 60 50 40 30 20 10 0 0 0.5 Fig.28 Figure.18 Output power vs Efficiency VDD=5V, Gv=6dB, f=1kHz Power Dissipation [W] RL=8Ω RL=4Ω RL=3Ω Efficiency [%] RL=8Ω RL=4Ω RL=3Ω 2 2.5 1 1.5 Outputpower [W] 2 2.5 Fig.29 Figure.19 Output power vs Load Resisitance VDD=5V, Gv=6dB, f=1kHz Fig.30 Figure.20 3.5 3 Output power[%] 2.5 2 1.5 1 0.5 0 0 THD=1% THD=10% 8 16 24 32 40 48 Load Resistance[Ω] 56 64 Fig.31 Figure.20 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/16 2010.07 - Rev.A BD7836EFV ●Notes for use Technical Note (1) Absolute maximum ratings This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other parameters are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings. if it is possible that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and determine ways to avoid exceeding the IC’s absolute maximum ratings. (2) GND terminal’s potential Try to set the minimum voltage for GND terminal’s potential, regardless of the operation mode. (3) Shorting between pins and mounting errors When mounting the IC chip on a board, be very careful to set the chip’s orientation and position precisely. When the power is turned on, the IC may be damaged if it is not mounted correctly. The IC may also be damaged if a short occurs (due to a foreign object, etc.) between two pins, between a pin and the power supply, or between a pin and the GND. (4) Operation in strong magnetic fields Note with caution that operation faults may occur when this IC operates in a strong magnetic field. (5) Thermal design Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use modes, because this IC is power amp. When excessive signal inputs which the heat dissipation is insufficient condition, it is possible that thermal shutdown circuit is active (6) Thermal shutdown circuit This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output transistors are placed under open status. The thermal shutdown circuit is primarily intended to shutdown the IC avoiding thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = +150℃, and is not intended to protect and secure an electrical appliance (7) Load of the output terminal This IC corresponds to dynamic speaker load, and doesn't correspond to the load except for dynamic speakers. (8) The short protection of the output terminal This IC has short protection circuit. The function protects the IC from rash current on road. (9) Operating ranges The rated operating power supply voltage range (VDD=+4.5V ~ +5.5V) and the rated operating temperature range (Ta=-40℃~+85℃) are the range by which basic circuit functions is operated. Characteristics and rated output power are not guaranteed in all power supply voltage ranges or temperature ranges. (10) Electrical characteristics Electrical characteristics show the typical performance of device and depend on board layout, parts, power supply. The standard value is in mounting device and parts on surface of ROHM’s board directly. (11) Maximum output power When stereo inputs at RL=4Ω, maximum output power may not achieve up to typical value because the device heats. Ensure sufficient margins to the thermal design to get larger output power. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/16 2010.07 - Rev.A BD7836EFV ●Ordering part number Technical Note B D 7 Part No. 7836 8 3 6 E F V - E 2 Part No. Package EFV:HTSSOP-B20 Packaging and forming specification E2: Embossed tape ad reel HTSSOP-B20 6.5±0.1 (MAX 6.85 include BURR) (4.0) 20 11 Tape Quantity 0.5±0.15 1.0±0.2 Embossed carrier tape (with dry pack) 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.4±0.2 4.4±0.1 Direction of feed (2.4) ( reel on the left hand and you pull out the tape on the right hand ) 1 10 0.325 1.0MAX +0.05 0.17 -0.03 S 0.85±0.05 0.08±0.05 0.65 +0.05 0.24 -0.04 0.08 S 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/16 2010.07 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A
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