BD7931F-TR

Reversible Motor Drivers for Brush Motors 0.5A or Less Reversible Motor Drivers (Single Moter) BH6578FVM,BD7931F No.11008EBT05 ●Description The BH6578FVM and BD7931F are reversible motor drivers with a wide output dynamic range, with power MOS used for the output transistor. The motor drivers can set the output mode to four modes of normal rotation, reverse rotation, stop (idling), and braking in accordance with input logic (2 inputs). ●Features 1) Wide dynamic range loading driver with MOS output, Ron = 1.0Ω (Top+Bottom) 2) With loading driver voltage setting terminal 3) Built-in thermal shutdown circuit (TSD) 4) MSOP8 package (BH6578FVM) 5) SOP8 package (BD7931F) ●Applications Tray loading of CD/DVD, applications using DC motors ●Absolute maximum ratings (Ta=25℃) Parameter Supply Voltage Power dissipation Operating temperature Storage temperature Output current Junction temperature * ** Symbol Vcc Pd Topr Tstg Iout Tjmax Ratings BH6578FVM 7 0.55 * -35～+85 -55～+150 500 150 BD7931F 15 0.69** -40～85 Unit V W ℃ ℃ mA ℃ When 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. When used at Ta=25°C or higher, derated at 4.4 mW/°C. When 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. When used at Ta=25°C or higher, derated at 5.5 mW/°C. ●Recommended operating range Parameter Supply voltage ●Truth table BH6578FVM,BD7931F INPUT INFWD L L H H Hiz：Hi-impedance Symbol Vcc Range BH6578FVM 4.5~5.5 BD7931F 4.5 ～ 14 Unit V OUTPUT OUT+ Hi Z L H L OUTHi Z H L L INREV L H L H Function High Impedance REV mode FWD mode Brake mode www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/8 2011.05 - Rev.B BH6578FVM,BD7931F ●Electrical characteristics BH6578FVM(Unless otherwise specified, Ta=25℃, Vcc=5V) Parameter Standby current (Loading Driver) Output offset voltage Input threshold voltage H Input threshold voltage L ON resistance Voltage gain (Loading) Voltage gain difference (Loading) Input bias current LDCONT bias current VOFSL VIH VIL RON GVLD ΔGVLD IINL ILDC -15 2.0 GND － 4.5 -2.0 － － 0 － － 1.0 6.0 0 86 － +15 Vcc 0.5 1.8 7.5 2.0 120 300 mV V V Ω dB dB µA nA Symbol ICC1 Limits. Min. Typ. 0.4 Max. 0.8 Unit mA Technical Note Conditions No load Brake mode Io=500mA,Top+Bottom *1 FIN=5V,RIN=5V CONT=2V * No radiation-resistant design is adopted for the present product. *1. Let V01 denote output-to-output voltage when CONT=1V and V02 denote output-to-output voltage when CONT=3.5V, voltage gain can be expressed by the following equation:GVLD=20log|(V02-V01)/2.5| BD7931F(Unless otherwise specified, Ta=25℃, Vcc=8V) Parameter Standby current Supply current 1 Supply current 2 (Loading Driver) Output offset voltage Input threshold voltage H Input threshold voltage L ON resistance Voltage gain (Loading) Voltage gain difference (Loading) Input bias current LDCONT bias current VOFSL VIH VIL RON GVLD ΔGVLD IINL ILDC -35 2.0 GND － 4.0 -2.0 － － 0 － － 1.0 6.0 0 165 － +35 Vcc 0.5 1.8 8.0 2.0 250 300 mV V V Ω dB dB µA nA FIN=5V,RIN=5V CONT=5V Io=500mA,Top+Bottom *2 Brake mode Symbol ICC1 ICC2 ICC3 Limits. Min. Typ. 0 1.1 0.8 Max. 5 2.2 1.6 Unit µA mA mA FIN=5V,RIN=0V FIN=RIN=5V Conditions * No radiation-resistant design is adopted for the present product. *1. Let V01 denote output-to-output voltage when CONT=1V and V02 denote output-to-output voltage when CONT=3.5V, voltage gain can be expressed by the following equation:GVLD=20log|(V02-V01)/2.5| www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/8 2011.05 - Rev.B BH6578FVM,BD7931F ●Reference data 0.4 85℃ 25℃ -35℃ 0.4 5 Technical Note Output voltage[V Loss voltage[V] Loss voltage[V] 0.3 0.3 0.2 85℃ 25℃ -35℃ 4 3 2 1 0 0.2 0.1 0.1 0.0 -35℃ 25℃ 85℃ 0 1 2 3 4 5 0.0 0 100 200 300 400 500 0 100 200 300 400 500 Load current[mA] Load current[mA] Input voltage : LDCONT[V] Fig.1 Output loss voltage L(BH6578FVM) Vcc=5V, CONT=OPEN FWD mode 0.0 Fig.2 Output loss voltage L(BH6578FVM) Vcc=5V, CONT=OPEN REV mode 0.0 Fig.3 Voltage gain(BH6578FVM) Vcc=5V, CONT=SWEEP RL=8Ω+47µH 0 -1 Output voltage[V -2 -3 -4 -5 Loss voltage[V] Loss voltage[V] -0.1 -0.2 -0.1 -0.2 85℃ 25℃ -35℃ -0.3 -0.4 0 -35℃ 25℃ 85℃ -0.3 - 0.4 -35℃ 25℃ 85℃ 100 200 300 400 500 0 100 200 300 400 500 0 1 2 3 4 5 Load current[mA] Load current[mA] Input voltage : LDCONT[V] Fig.4 Output loss voltage H(BH6578FVM) Vcc=5V, CONT=OPEN FWD mode Fig.5 Output loss voltage H(BH6578FVM) Vcc=5V, CONT=OPEN REV mode 0.4 Fig.6 Voltage gain (BH6578FVM) Vcc=5V, CONT=SWEEP RL=8Ω+47µH 10 8 Output voltage[V 6 4 2 0 0.4 Loss voltage[V] Loss voltage[V] 0.3 85℃ 25℃ -35℃ 0.3 85℃ 25℃ -35℃ 0.2 0.2 0.1 0.0 0 100 200 300 400 500 Load current[mA] 0.1 -40℃ 25℃ 85℃ 0 1 2 3 4 5 0.0 0 100 200 300 400 500 Load current[mA] Input voltage : LDCONT[V] Fig.7 Output loss voltage L(BD7931F) Vcc=8V, CONT=OPEN FWD mode Fig.8 Output loss voltage L(BD7931F) Vcc=8V, CONT=OPEN REV mode 0.0 Fig.9 Voltage gain (BD7931F) Vcc=8V, CONT=SWEEP RL=20Ω+47µH 0 -2 Output voltage[V -4 -6 -8 -10 0.0 Loss voltage[V] Loss voltage[V] -0.1 -0.1 85℃ 25℃ -40℃ -0.2 -0.2 -0.3 -0.4 0 40℃ 25℃ 85℃ 100 200 300 400 500 -0.3 40℃ 25℃ 85℃ 0 100 200 300 400 500 -0.4 Load current[mA] Load current[mA] 0 1 2 3 4 5 Input voltage : LDCONT[V] Fig.10 Output loss voltage H(BD7931F) Vcc=8V, CONT=OPEN FWD mode www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig.11 Output loss voltage H(BD7931F) Vcc=8V, CONT=OPEN REV mode Fig.12 Voltage gain(BD7931F) Vcc=8V, CONT=SWEEP RL=20Ω+47µH 3/8 2011.05 - Rev.B BH6578FVM,BD7931F ●Thermal derating curves BH6578FVM 0.8 0.6 [W] [W] Technical Note BD7931F 0.8 0.6 0.4 Pd 0.4 Pd 0.2 0 0.2 0 0 25 50 75 85 100 125 : 150 Ta [℃] 175 0 25 50 75 85 100 125 : 150 Ta [℃] 175 AMBIENT TEMPERATURE AMBIENT TEMPERATURE Pd : Power Dissipation * when 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. Pd : Power Dissipation ●Block diagram, applied circuit diagram example BH6578FVM, BD7931F (in common) FWD IN REV IN LDCONT PREGND 8 F 7 R 6 5 PRE GND Control Logic + - LDCONT T.S.D POW CMOS H-Bridge POW GND 4 1 2 M 3 Vcc 0.1µF Bypass capacitor POWG T.S.D: Thermal shutdown Fig.13 ●Pin descriptions Pin No. Pin Name 1 2 3 4 Vcc OUT+ OUTGND Function Supply voltage FWD output REV output Power ground Pin No. 5 6 7 8 PinName GND_S LDCONT INREV INFWD Signal ground Loading driver voltage setting pin REV input FWD input Function www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/8 2011.05 - Rev.B BH6578FVM,BD7931F ●Interfaces BH6578FVM LDCONT Technical Note BD7931F LDCONT VCC 10KΩ 10KΩ 6 39KΩ 6 49.6KΩ Fig.14 OUT+/OUTINFWD/INREV OUT+/OUT- Fig.17 FIN/RIN VCC VCC VCC VCC 200KΩ 200KΩ 7 2 3 8 50KΩ 2 3 7 8 50KΩ 50KΩ 50KΩ 50KΩ 50KΩ Fig.15 Fig.16 Fig.18 Fig.19 ●Operations (1) CONTROL LOGIC Operation of each mode is carried out as follows: + When INFWD is “H” and INREV is “L,” the normal rotation mode is achieved and current flows from OUT to OUT . When both INFWD and INREV are “H,” the brake mode is achieved. Operation in such event is described as follows: the top-side transistor turns OFF to stop supplying motor drive current, the bottom-side transistor turns ON to absorb + reverse EMF of motor and applies brake to motor. When both INFWD and INREV are “L,” OUT and OUT potentials become open and the motor stops. (2) LOADING CONT Controlling the output voltage can vary voltage applied to the motor and can control the motor speed. By the voltage entered to the CONT terminal, the output H voltage can be controlled (gain 6dB Typ.). Even if the voltage entered is increased more than necessary (Vcc Max), the output voltage never exceeds the power supply voltage. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/8 2011.05 - Rev.B BH6578FVM,BD7931F Technical Note ●Notes for use (1) Absolute maximum ratings In the event that applied voltage (VCC, VM), working temperature range (Topr), and other absolute maximum rating are exceeded, the IC may be destroyed. Because it is unable to identify the short-circuit mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. (2) Reverse connection of power supply connector Reverse connection of power supply connector may destroy the IC. Take necessary measures to protect the IC from reverse connection breakage such as externally inserting diodes across power supply and IC power supply terminal as well as across power supply and motor coil. (3) Power supply line Because return of current regenerated by reverse EMF of a motor occurs, take necessary measures such as inserting capacitors across the power supply and GND as a path for regenerated current, and determine the capacity value after thoroughly confirming that there would be no problems in various characteristics such as capacitance drop at low temperature which may occur with electrolytic capacitors. (4) Ground potential Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check if there is actually any terminal which provides voltage below GND including transient phenomena. (5) Thermal design Consider permissible dissipation (Pd) under actual working condition and carry out thermal design with sufficient margin provided. (6) Terminal-to-terminal short-circuit and erroneous mounting When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that enters in a clearance between outputs or output and power-GND, the IC may be destroyed. (7) Operation in strong electromagnetic field The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken. (8) ASO When IC is used, design in such a manner that the output transistor to a motor does not exceed absolute maximum ratings and ASO. (9) Thermal shutdown circuit (TSD) (common) When junction temperature (Tj) becomes thermal shutdown ON temperature 175°C, the thermal shutdown circuit (TSD circuit) is activated and driver output current is shorted. There is 25°C temperature hysteresis. The thermal shutdown protection circuit is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. (10) Capacitor across output and GND In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 0.1 µF between output and GND. (11) Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/8 2011.05 - Rev.B BH6578FVM,BD7931F Technical Note (12) IC terminal input The present IC is a monolithic IC and has P+ isolation and a P substrate between elements to separate elements. With this P layer and N layer of each element, PN junction is formed, and various parasitic elements are formed. For example, when resistors and transistors are connected to terminals as is the case of Fig.20, where in the case of resistor, the potential difference satisfies the relation of ground (GND)>(terminal A), and in the case of transistor (NPN), the potential difference satisfies the relation of ground (GND)>(terminal B), PN junction works as a diode. Furthermore, in the case of transistor (NPN), a parasitic NPN transistor operates by the N-layer of other elements adjacent to the parasitic diode. The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to the input terminal. In addition, when the power supply voltage is not applied to IC, do not apply voltage to the input terminal, either. Similarly, when the power supply voltage is applied, each input terminals shall be the voltage below the power supply voltage or within the guaranteed values of electrical properties. Resistor Terminal A Terminal A P+ N P P+ Parasitic element N P+ N P P+ N Transistor(NPN) Terminal B C B E B C E Parasitic element GND Terminal B N N P-sub P-sub Parasitic element GND GND GND Parasitic element Fig.20 Example of the basic structure of a bipolar IC (13) GND wiring pattern If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/8 2011.05 - Rev.B BH6578FVM,BD7931F ●Operating part numer Technical Note B Part No BH BD H 6 Part No 6578 7931 5 7 8 F V M - T R Package FVM : MSOP8 F : SOP8 Packaging and forming specification E2: Embossed tape and reel (SOP8) TR: Embossed tape and reel (MSOP8) MSOP8 2.9±0.1 (MAX 3.25 include BURR) 8765 Tape 0.29±0.15 0.6±0.2 Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold +6° 4° −4° Quantity Direction of feed 4.0±0.2 2.8±0.1 ( reel on the left hand and you pull out the tape on the right hand 1pin ) 1 234 1PIN MARK 0.475 0.9MAX +0.05 0.145 −0.03 S 0.75±0.05 0.08±0.05 +0.05 0.22 −0.04 0.08 S 0.65 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. SOP8 5.0±0.2 (MAX 5.35 include BURR) 8 7 6 5 +6° 4° −4° 0.9±0.15 0.3MIN Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.2±0.3 4.4±0.2 ( reel on the left hand and you pull out the tape on the right hand ) 12 3 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S 0.1 0.11 S 1.27 0.42±0.1 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. 8/8 Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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